Wafer pre-alignment device
By designing a wafer pre-alignment device including position correction clamp, adjustment screw and DC motor, the problem of wafer placement position and processing equipment position error is solved, and high-precision pre-alignment of wafers is achieved.
Patent Information
- Application Number
- CN202421326905.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-06-12
AI Technical Summary
During the wafer processing process, there are often certain errors in the position of the wafer placed and the position where the processing equipment needs to be processed, and it is impossible to judge the position of the wafer pre-aligned.
A wafer pre-alignment device is designed, including a wafer pre-alignment workbench, position correction clamp, adjustment screw and DC motor. By adjusting the coordination between the screw and the DC motor, automatic adjustment of the position correction clamp is achieved to ensure that the wafer is located in the center of the workbench.
The device can automatically center, quickly determine the clamping range, improve the accuracy of the wafer pre-alignment position, reduce errors, and improve the accuracy of the wafer processing position.
Smart Images
Figure CN222749468U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field related to wafer processing, in particular to a wafer pre-alignment device. Background Art
[0002] The raw material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust. The silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to make high-purity polysilicon. The wafer manufacturing plant then melts the polysilicon, plants seed crystals in the melt, and then slowly pulls them out to form a cylindrical single crystal silicon rod. Since the silicon rod is gradually generated from a seed crystal with a determined crystal plane orientation in the molten silicon raw material, this process is called crystal growth. The silicon rod is then cut, rolled, sliced, chamfered, polished, laser engraved, and packaged to become the basic raw material for the integrated circuit factory - silicon wafer, which is the wafer.
[0003] In the prior art, during the wafer processing, the wafer is generally placed directly at the processing position using a loading device. However, there is often a certain error between the position where the wafer is placed and the position where the processing equipment needs to process, and the pre-alignment position of the wafer cannot be judged. Utility Model Content
[0004] The purpose of the utility model is to provide a wafer pre-alignment device to solve the problem raised in the above background technology that during the wafer processing process, the wafer is generally placed directly at the processing position by a loading device, and there is often a certain error between the position where the wafer is placed and the position required to be processed by the processing equipment, making it impossible to judge the pre-alignment position of the wafer.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer pre-alignment device, comprising a wafer pre-alignment workbench, a position correction clamping plate is provided on the surface of the wafer pre-alignment workbench, an adjusting screw is provided at the central position below the wafer pre-alignment workbench, an adjusting screw sleeve is provided on the adjusting screw, clamping plate position adjustment struts are provided above both sides of the adjusting screw sleeve, the bottom end of the adjusting screw is connected to a DC motor, the DC motor is arranged inside a motor cover, heat dissipation ports are provided on both sides of the motor cover, the motor cover is arranged above a fixed base plate, and the fixed base plate is connected to the wafer pre-alignment workbench through a fixed rod.
[0006] In a further embodiment, the inner side surface of the position correction clamp is provided with rubber anti-skid protrusions, and the outer shape of the position correction clamp is set to a fan-shaped structure.
[0007] In a further embodiment, the number of the position correction clamps is three, and the position correction clamps are connected to the surface of the wafer pre-alignment workbench through a fixed block and a fixed slot, and the position correction clamps are slidably connected to the bottom surface of the wafer pre-alignment workbench through a positioning slide and a positioning slot.
[0008] In a further embodiment, the positioning slide plate is connected to the bottom surface of the positioning slot via a limiting slide buckle and the limiting slot, and the top end of the splint position adjustment strut is hingedly connected to the positioning slide plate via a spherical hinge.
[0009] In a further embodiment, the bottom end of the splint position adjustment strut is connected to the adjusting screw sleeve via a U-shaped connector, the splint position adjustment strut and the U-shaped connector are hingedly connected via a fixed hinge, and the U-shaped connector and the adjusting screw sleeve are fixedly connected via screws.
[0010] In a further embodiment, the top end of the adjusting screw and the bottom surface of the wafer pre-alignment workbench are fixedly connected via an assembly mounting head and an assembly mounting opening, and the assembly mounting head and the assembly mounting opening are rotatably connected via a bearing.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] 1. In the utility model, three position correction clamps are provided above the wafer pre-alignment workbench. The advantage of setting three of them is that they can be automatically centered, the clamping range can be quickly determined, and the accuracy of the wafer pre-alignment position can be improved. The position correction clamps adjust the angle of support of the clamp position adjustment struts by threaded transmission, so that the three position correction clamps can be opened or tightened outward or inward at the same time, ensuring that the wafer is located at the center position of the wafer pre-alignment workbench. It has a better pre-alignment effect on the wafer deviating from the center position, and improves the accuracy of the wafer processing position. The structural principle is simple and easier to operate and use. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a structural schematic diagram of a wafer pre-alignment device of the utility model;
[0014] Figure 2 A top view of a wafer pre-alignment device of the utility model;
[0015] Figure 3 It is a side view of the position correction splint of the utility model;
[0016] Figure 4 This is a schematic diagram of the bottom structure of the wafer pre-alignment workbench of the utility model;
[0017] Figure 5 It is a structural schematic diagram of the positioning slideway of the utility model;
[0018] Figure 6 It is the front view of the adjusting screw of the utility model.
[0019] In the figure: 1. Position correction clamp; 2. Wafer pre-alignment workbench; 3. Positioning slide; 4. Fixing rod; 5. Clamp position adjustment strut; 6. U-shaped connector; 7. Adjusting screw sleeve; 8. Motor cover; 9. Heat dissipation port; 10. Fixed base plate; 11. Fixed slot; 12. Rubber anti-skid bumps; 13. Fixed block; 14. Positioning slide; 15. Fixed hinge; 16. Limiting slide; 17. Limiting buckle; 18. Ball hinge; 19. Assembly inlay port; 20. Bearing; 21. Assembly inlay head; 22. Adjusting screw; 23. DC motor. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0021] See also Figure 1-6 The utility model provides an embodiment: a wafer pre-alignment device, comprising a wafer pre-alignment workbench 2, a position correction clamping plate 1 is arranged on the surface of the wafer pre-alignment workbench 2, an adjusting screw 22 is arranged at the central position below the wafer pre-alignment workbench 2, an adjusting screw sleeve 7 is arranged on the adjusting screw 22, and clamping plate position adjustment struts 5 are arranged above both sides of the adjusting screw sleeve 7, the bottom end of the adjusting screw 22 is connected to a DC motor 23, the DC motor 23 is arranged inside a motor cover 8, heat dissipation ports 9 are arranged on both sides of the motor cover 8, the motor cover 8 is arranged above a fixed bottom plate 10, and the fixed bottom plate 1 0 is connected to the wafer pre-alignment workbench 2 through a fixing rod 4, the wafer pre-alignment workbench 2 is used to place the wafer, the adjusting screw 22 is used to move the position of the adjusting screw sleeve 7 up and down in a threaded manner, the adjusting screw sleeve 7 is used to adjust the angle of the clamping plate position adjusting support rod 5, the clamping plate position adjusting support rod 5 is used to adjust and support the position of the position correction clamping plate 1, the position correction clamping plate 1 is used to clamp and position the wafer placement position, the motor cover 8 is used to install and protect the DC motor 23, and the fixed bottom plate 10 is used to increase the stability of the bottom.
[0022] The inner side of the position correction clamp plate 1 is provided with rubber anti-skid protrusions 12 , and the outer shape of the position correction clamp plate 1 is set as a fan-shaped structure. The rubber anti-skid protrusions 12 are used to increase the anti-skid property of the inner side of the position correction clamp plate 1 .
[0023] There are three position correction clamps 1 in total. The surface of the position correction clamp 1 and the wafer pre-alignment workbench 2 are inlaid and connected through a fixed block 13 and a fixed slot 11, and the bottom surface of the position correction clamp 1 and the wafer pre-alignment workbench 2 are slidably connected through a positioning slide 14 and a positioning slot 3. The connection between the fixed block 13 and the fixed slot 11 is used for installing the position correction clamp 1 and the wafer pre-alignment workbench 2. The positioning slide 14 is used to increase the sliding property of the position correction clamp 1, so as to facilitate the movement of the position of the position correction clamp 1; the positioning slide 14 and the bottom surface of the positioning slot 3 are connected to the limiting slide 16 through a limiting slide buckle 17, and the top end of the clamp position adjustment strut 5 is hingedly connected to the positioning clamp 14 through a spherical hinge 18, and the limiting slide buckle 17 is used to limit the moving range of the positioning clamp 14.
[0024] The bottom end of the splint position adjusting strut 5 is connected to the adjusting screw sleeve 7 via a U-shaped connecting piece 6, the splint position adjusting strut 5 and the U-shaped connecting piece 6 are hingedly connected via a fixed hinge 15, and the U-shaped connecting piece 6 and the adjusting screw sleeve 7 are fixedly connected via screws, the U-shaped connecting piece 6 is used to increase the stability of the bottom end of the splint position adjusting strut 5, and the fixed hinge 15 is used to increase the coordination of the connection between the splint position adjusting strut 5 and the U-shaped connecting piece 6.
[0025] The top end of the adjusting screw 22 is fixedly connected to the bottom surface of the wafer pre-alignment workbench 2 via an assembly inserting head 21 and an assembly inserting opening 19, and the assembly inserting head 21 and the assembly inserting opening 19 are rotationally connected via a bearing 20. The connection between the assembly inserting head 21 and the assembly inserting opening 19 is used to increase the firmness of the installation of the top end of the adjusting screw 22.
[0026] Working principle: When in use, install the wafer pre-alignment workbench 2 on the required equipment, align the center of the wafer pre-alignment workbench 2 with the position required for processing by the equipment, place the wafer on the surface of the wafer pre-alignment workbench 2 through the loading device, and convert the electrical energy into mechanical energy through the DC motor 23 to drive the adjusting screw 22 to rotate clockwise, so that the adjusting screw sleeve 7 moves downward, and at the same time, drives the clamping plate position adjustment strut 5 to move downward, and the required clamping plate position adjustment angle between the strut 5 and the adjusting screw sleeve 7 causes the positioning slide 14 to slide inward, thereby moving the position of the position correction clamp 1, and correcting the deviation of the wafer through the position correction clamp 1 so that it is located in the pre-aligned position.
[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A wafer pre-alignment device, comprising a wafer pre-alignment workbench (2), characterized in that: A position correction clamping plate (1) is provided on the surface of the wafer pre-alignment workbench (2); an adjusting screw (22) is provided at the central position below the wafer pre-alignment workbench (2); an adjusting screw sleeve (7) is provided on the adjusting screw (22); clamping plate position adjustment struts (5) are provided above both sides of the adjusting screw sleeve (7); the bottom end of the adjusting screw (22) is connected to a DC motor (23); the DC motor (23) is arranged inside a motor cover (8); heat dissipation ports (9) are provided on both sides of the motor cover (8); the motor cover (8) is arranged above a fixed base plate (10); and the fixed base plate (10) is connected to the wafer pre-alignment workbench (2) via a fixed rod (4).
2. A wafer pre-alignment device according to claim 1, characterized in that: The inner side surface of the position correction clamping plate (1) is provided with rubber anti-skid protrusions (12), and the outer shape of the position correction clamping plate (1) is set as a fan-shaped structure.
3. The wafer pre-alignment device according to claim 1, characterized in that: The position correction clamping plates (1) are provided in three numbers in total. The position correction clamping plates (1) are connected to the surface of the wafer pre-alignment workbench (2) by being embedded in a fixed clamping block (13) and a fixed clamping groove (11), and the position correction clamping plates (1) are connected to the bottom surface of the wafer pre-alignment workbench (2) by being slidably connected to the positioning slide plate (14) and the positioning slide groove (3).
4. A wafer pre-alignment device according to claim 3, characterized in that: The bottom surface of the positioning slide plate (14) and the positioning slide groove (3) are connected to the limiting slide groove (16) via a limiting slide buckle (17), and the top end of the clamping plate position adjustment support rod (5) is hingedly connected to the positioning slide plate (14) via a spherical hinge (18).
5. The wafer pre-alignment device according to claim 1, characterized in that: The bottom end of the clamping plate position adjustment support rod (5) is connected to the adjustment screw sleeve (7) via a U-shaped connecting piece (6), the clamping plate position adjustment support rod (5) and the U-shaped connecting piece (6) are hingedly connected via a fixed hinge (15), and the U-shaped connecting piece (6) and the adjustment screw sleeve (7) are fixedly connected via screws.
6. The wafer pre-alignment device according to claim 1, characterized in that: The top end of the adjusting screw (22) and the bottom surface of the wafer pre-alignment workbench (2) are fixedly connected to the assembly mounting opening (19) via an assembly mounting head (21), and the assembly mounting head (21) and the assembly mounting opening (19) are rotationally connected via a bearing (20).