Irradiation device for wafer dispergation

Abstract

The utility model provides an irradiation device for wafer dispergation, and the device comprises a frame body which is provided with an irradiation cavity, the side wall of the irradiation cavity is provided with a feeding port, and the feeding port is provided with a feeding station; a light outlet is formed in the top wall of the irradiation cavity, and an irradiation station is arranged under the light outlet; the irradiation assembly comprises a light emitting assembly and a shutter assembly, the light emitting assembly is arranged over the light outlet, and the shutter assembly is movably arranged at the light outlet to open and close the light outlet; the transferring assembly is movably arranged in the irradiation cavity, and the transferring assembly is used for fixing the wafer and moves between the feeding station and the irradiation station; and the light leakage preventing assembly is movably arranged on the side wall of the feeding opening and used for opening and closing the feeding opening. The structure of the irradiation device is optimized to prevent leakage of ultraviolet rays in the working process, and the working sealing performance of the irradiation device is improved, so that the use safety of the irradiation device is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, relates to an irradiation device for wafer debonding. Background Art

[0002] In the manufacturing process of semiconductor chips, before the grinding and thinning process, a protective film needs to be attached to the front side of the wafer (i.e. the surface with circuits) to protect the circuits and prevent the wafer from cracking, breaking and being contaminated during grinding. After the grinding and thinning process is completed, the protective film needs to be torn off. Before tearing off the film, the film is UV-debonded to make it easier to tear off from the wafer surface.

[0003] In the prior art, UV debonding usually uses a UV mercury lamp to irradiate a stationary workpiece. The irradiation stability and uniformity are relatively poor, the work efficiency is low, the debonding effect is uneven, and residual glue is easily left on the wafer, seriously affecting the product quality. In addition, because the mercury lamp needs to be preheated before use, it cannot be turned on and off frequently. The mercury lamp needs to be kept working continuously to continuously irradiate and debond the film. At the same time, the continuously working mercury lamp needs to be shielded to prevent the UV light from causing adverse effects on the operator or the environment. The prior art mostly uses manual wafer placement, and the operator is easily harmed by UV light during the placement process. Utility Model Content

[0004] The purpose of the embodiment of the present application is to provide an irradiation device for wafer debonding, which supports the wafer to move by a transfer assembly, evenly irradiates the protective film on the surface of the wafer in a scanning manner, and measures and controls the ultraviolet illuminance and light intensity in real time by a light meter to improve the quality and efficiency of debonding. The structure of the irradiation device is optimized to prevent ultraviolet rays from leaking during operation, improve the sealing of the irradiation device, and thus improve the safety of the use of the irradiation device.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide an irradiation device for wafer debonding, which includes: a frame, the frame is provided with an irradiation chamber, the side wall of the irradiation chamber is provided with a feed port, and a loading station is arranged at the feed port; the top wall of the irradiation chamber is provided with a light outlet, and an irradiation station is arranged directly below the light outlet; an irradiation component, the irradiation component includes a light outlet component and a shutter component, the light outlet component is arranged directly above the light outlet, and the shutter component is movably arranged at the light outlet to open and close the light outlet; a transfer component, the transfer component is movably arranged in the irradiation chamber, the transfer component is used to fix the wafer and move it between the loading station and the irradiation station; an anti-light leakage component, the anti-light leakage component is movably arranged on the side wall at the feed port, and the anti-light leakage component is used to open and close the feed port.

[0006] Optionally, the anti-light leakage component includes a light-shielding cylinder and a light-shielding plate, the light-shielding cylinder is arranged on the side wall of the irradiation chamber, and the driving end of the light-shielding cylinder is fixedly connected to the light-shielding plate to drive the light-shielding plate to slide and open and close the feed port.

[0007] Optionally, at least two groups of the light-shielding cylinders are provided and are symmetrically arranged on two sides directly opposite to the feed port.

[0008] Optionally, the shutter assembly includes a shutter cylinder and a shutter, the shutter cylinder is arranged on the top wall of the irradiation chamber, and the driving end of the shutter cylinder is fixedly connected to the shutter to drive the shutter to slide and open and close the light outlet.

[0009] Optionally, the anti-light leakage component further includes a light shield, and the light shield is respectively arranged on both sides of the light output component.

[0010] Optionally, the feed port is connected to several side walls of the irradiation chamber.

[0011] Optionally, the transfer assembly includes a linear module and a moving part, the linear module is arranged on the bottom wall of the irradiation chamber, and the driving end of the linear module is fixed to the moving part to drive the moving part to move between the loading station and the irradiation station.

[0012] Optionally, the moving part includes a lifting cylinder and an adsorption platform, the lifting cylinder is arranged at the driving end of the linear module, and the driving end of the lifting cylinder is fixedly connected to the adsorption platform to drive the adsorption platform to move up and down.

[0013] Optionally, the irradiation device further comprises a measuring component, wherein the measuring component comprises a display and a probe, wherein the display is disposed on the frame, and the probe is disposed on the transfer assembly.

[0014] Optionally, the irradiation device further comprises a heat sink, wherein the heat sink connects the irradiation component with the external environment.

[0015] An irradiation device for wafer debonding provided in an embodiment of the present application has at least the following beneficial effects:

[0016] When the irradiation device is used to irradiate the protective film on the surface of the wafer, the loading component first sends the wafer into the transfer component at the loading station through the feed port, so that the wafer is positioned and placed on the transfer component; then, the anti-light leakage component is driven to move to close the feed port, thereby sealing the irradiation chamber to prevent ultraviolet rays from leaking out during operation; at this time, the light output component is started, and the shutter component is driven to open the light output port, and the transfer component is driven to move from the loading station to the irradiation station at the same time, so that the wafer passes through the light output port, and the light output component evenly irradiates the protective film on the surface of the wafer to reduce the viscosity of the protective film layer; after the irradiation is completed, the shutter component is driven to close the light output port, and the transfer component is driven to move from the irradiation station to the loading station, and the anti-light leakage component is driven to open the feed port, so that the loading component can take out the wafer from the transfer component for the subsequent film tearing process.

[0017] Here, when the wafer is loaded or unloaded, the feed port is in an open state and the light outlet is in a closed state; when the wafer is irradiated with ultraviolet light, the feed port is in a closed state and the light outlet is in an open state. Compared with the prior art, the present application optimizes the structure of the irradiation device, and seals the irradiation cavity by an anti-light leakage component to prevent ultraviolet light from leaking out during operation, thereby improving the sealing of the irradiation device and improving the safety of the irradiation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A three-dimensional diagram of a wafer debonding and irradiation device in some embodiments of the present application;

[0020] Figure 2 It is a partial structural schematic diagram of a wafer debonding and irradiation device in some embodiments of the present application;

[0021] Figure 3 This is a cross-sectional view of a wafer debonding irradiation device in some embodiments of the present application.

[0022] Explanation of the reference numerals in the accompanying drawings: 1. frame; 11. irradiation chamber; 12. feed port; 13. light outlet; 14. top plate; 15. side plate; 16. bottom plate; 2. irradiation assembly; 21. light outlet assembly; 22. shutter assembly; 221. shutter cylinder; 222. shutter; 3. transfer assembly; 31. linear module; 32. moving part; 321. lifting cylinder; 322. adsorption platform; 4. anti-light leakage assembly; 41. shading cylinder; 42. shading plate; 43. shading cover; 431. first cover body; 432. second cover body; 5. measuring part; 51. probe; 6. heat sink. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0026] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0029] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0030] Please also read Figures 1 to 3Now, an irradiation device for wafer dissolution provided in an embodiment of the present application is described. The irradiation device can be arranged in a film peeling machine to irradiate the protective film on the surface of the wafer, reduce the viscosity of the protective film layer, and facilitate the subsequent film peeling process.

[0031] See also Figure 1 The irradiation device for wafer dissolution in the present application comprises a frame 1, and an irradiation component 2, a transfer component 3 and a light leakage prevention component 4 arranged on the frame 1. The frame 1 is provided with an irradiation chamber 11, a feed port 12 is provided on the side wall of the irradiation chamber 11, and a loading station is provided at the feed port 12; a light outlet 13 is provided on the top wall of the irradiation chamber 11, and an irradiation station is provided directly below the light outlet 13. A loading component for loading wafers to the loading station is also provided in the film tearing machine to realize automatic wafer loading.

[0032] In a specific embodiment, the irradiation assembly 2 includes a light emitting assembly 21 and a shutter assembly 22. The light emitting assembly 21 is arranged directly above the light outlet 13, and the light emitting assembly 21 is used to emit light. The shutter assembly 22 is movably arranged at the light outlet 13 to open and close the light outlet 13. The transfer assembly 3 is movably arranged in the irradiation chamber 11, and the transfer assembly 3 is used to fix the wafer and drive the wafer to move between the loading station and the irradiation station. The anti-light leakage assembly 4 is movably arranged on the side wall at the feed port 12, and the anti-light leakage assembly 4 is used to open and close the feed port 12.

[0033] When the irradiation device is used to irradiate the protective film on the surface of the wafer, the loading component first sends the wafer into the transfer component 3 at the loading station through the feed port 12, so that the wafer is positioned and placed on the transfer component 3; then, the anti-light leakage component 4 is driven to move to close the feed port 12, thereby sealing the irradiation chamber 11 to prevent ultraviolet rays from leaking during operation; at this time, the light output component 21 is started, and the shutter component 22 is driven to open the light output port 13, and the transfer component 3 is driven to move from the loading station to the irradiation station, so that the wafer passes through the light output port 13, and the light output component 21 evenly irradiates the protective film on the surface of the wafer to reduce the viscosity of the protective film layer; after the irradiation is completed, the shutter component 22 is driven to close the light output port 13, and the transfer component 3 is driven to move from the irradiation station to the loading station, and the anti-light leakage component 4 is driven to open the feed port 12, so that the loading component can take out the wafer from the transfer component 3 for the subsequent film tearing process.

[0034] Here, when the wafer is loaded or unloaded, the feed port 12 is in an open state and the light outlet 13 is in a closed state; when the wafer is irradiated with ultraviolet light, the feed port 12 is in a closed state and the light outlet 13 is in an open state. Compared with the prior art, the present application optimizes the structure of the irradiation device, and seals the irradiation cavity 11 by the anti-light leakage component 4 to prevent ultraviolet light from leaking out during operation, improve the sealing of the irradiation device, and thus improve the safety of the irradiation device.

[0035] See also Figure 2 and Figure 3 In a specific embodiment, the frame 1 includes a top plate 14, a side plate 15 and a bottom plate 16. The top plate 14, the side plate 15 and the bottom plate 16 are arranged to form an irradiation chamber 11, the top plate 14 is the top wall of the irradiation chamber 11, the side plate 15 is the side wall of the irradiation chamber 11, and the bottom plate 16 is the bottom wall of the irradiation chamber 11. In this embodiment, there are four side plates 15, which are arranged to form a cubic irradiation chamber 11; in other embodiments, the side plates 15 can also be five, six or seven. Here, the feed port 12 is formed on the top of the side plate 15, and is connected to the three connected side plates 15, that is, the three side walls of the irradiation chamber 11, so that the wafer can enter the irradiation chamber 11 from at least three directions; the light outlet 13 is formed through the top plate 14, so that the light emitted by the light output component 21 enters the irradiation chamber 11.

[0036] In a specific embodiment, the light leakage prevention component 4 includes a light shielding cylinder 41 and a light shielding plate 42. The light shielding plate 42 is large enough to completely cover the opening of the feed port 12, the light shielding cylinder 41 is fixedly arranged on the side plate 15, and the driving end of the light shielding cylinder 41 is fixedly connected to the light shielding plate 42 to drive the light shielding plate 42 to slide along the side plate 15 to open and close the feed port 12.

[0037] In this embodiment, the shading plate 42 is formed by splicing three plates or integrally formed, so that the shape of the shading plate 42 is adapted to the feed port 12. In this embodiment, at least two groups of shading cylinders 41 are provided, and the two groups of shading cylinders 41 are symmetrically provided on the side panels 15 on both sides opposite to the feed port 12, thereby improving the driving force and stability of the movement of the shading plate 42. In other embodiments, the shading cylinders 41 can also be provided in one or three groups; when the shading cylinders 41 are provided in one group, the shading cylinders 41 are preferably provided on the side panels 15 in the middle of the feed port 12, and when the shading cylinders 41 are provided in three groups, the shading cylinders 41 are respectively provided on the three side panels 15 on the sides of the feed port 12.

[0038] In a specific embodiment, the light emitting component 21 is arranged on the side of the top plate 14 away from the irradiation cavity 11, and the light emitting component 21 is a mercury lamp box. The mercury lamp box is provided with a light source and a reflector, and a backlight sheet for transmitting light is provided at the light outlet of the mercury lamp box, and the backlight sheet is directly opposite to the light outlet 13 of the top plate 14. When the power is turned on, the light source in the mercury lamp box can be activated to emit ultraviolet rays, which are refracted to the backlight sheet through the reflector, and then irradiated downward through the backlight sheet and through the light outlet 13.

[0039] In a specific embodiment, the shutter assembly 22 includes a shutter cylinder 221 and a shutter 222. The shutter cylinder 221 is fixedly disposed on a side of the top plate 14 away from the irradiation chamber 11, and a driving end of the shutter cylinder 221 is fixedly connected to the shutter 222, so that the shutter cylinder 221 drives the shutter 222 to slide and open and close the light outlet 13.

[0040] Furthermore, the light leakage prevention component 4 also includes a light shield 43, which is respectively arranged on both sides of the light output component 21. The light shield 43 includes a first cover body 431 and a second cover body 432. In this embodiment, the first cover body 431 is arranged on the side of the light output component 21 close to the fastener component to block the ultraviolet rays leaked from the backlight sheet of the light output component 21, and the shutter 222 slides in the first cover body 431; the first cover body 431 is arranged on the side of the light output component 21 away from the fastener component to block the ultraviolet rays leaked from the other side of the backlight sheet of the light output component 21, thereby further preventing the ultraviolet rays from leaking during operation and improving the sealing of the irradiation device.

[0041] In a specific embodiment, the transfer assembly 3 includes a linear module 31 and a moving part 32. The linear module 31 is fixedly arranged on the bottom plate 16 along the length direction of the irradiation chamber 11, and the driving end of the linear module 31 is fixed to the moving part 32. The wafer is adsorbed and positioned on the moving part 32. The linear module 31 drives the moving part 32 and the wafer to move between the loading station and the irradiation station, so that the wafer passes through the light outlet 13, and the light outlet assembly 21 evenly irradiates the protective film on the surface of the wafer, thereby reducing the viscosity of the protective film adhesive layer.

[0042] In a specific embodiment, the moving part 32 includes a lifting cylinder 321 and an adsorption platform 322. The lifting cylinder 321 is fixedly arranged at the driving end of the linear module 31, and the driving end of the lifting cylinder 321 is fixedly connected to the adsorption platform 322 to drive the adsorption platform 322 to move up and down, so that the wafer can be loaded and unloaded; the adsorption platform 322 fixes the wafer by vacuum adsorption to improve the stability of the wafer during the horizontal movement process and the lifting process.

[0043] In a specific embodiment, the irradiation device further includes a measuring member 5, which is a light meter. The measuring member 5 includes a display and a probe 51, and the display is fixed on the top plate 14 so that the staff can monitor the measurement data in real time; the probe 51 is fixed on the driving end of the lifting cylinder 321, and the probe 51 moves with the moving member 32, and measures the light intensity in real time during the irradiation process to maintain a constant light intensity, so as to achieve uniform irradiation of the grinding protective film on the surface of the wafer, thereby improving the effect of reducing the viscosity of the protective film adhesive layer.

[0044] In a specific embodiment, the irradiation device further includes a heat sink 6. Here, the heat sink 6 connects the light output component 21 with the external environment to extract air from the light output component 21 to dissipate heat, thereby improving the safety and service life of the light output component 21.

[0045] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An irradiation device for wafer debonding, characterized in that: include, A frame, wherein the frame is provided with an irradiation cavity, a feed port is provided on the side wall of the irradiation cavity, and a loading station is provided at the feed port; a light outlet is provided on the top wall of the irradiation cavity, and an irradiation station is provided directly below the light outlet; An irradiation assembly, the irradiation assembly comprising a light emitting assembly and a shutter assembly, the light emitting assembly being arranged directly above the light emitting port, and the shutter assembly being movably arranged at the light emitting port to open and close the light emitting port; A transfer assembly, the transfer assembly is movably disposed in the irradiation chamber, and the transfer assembly is used to fix the wafer and move between the loading station and the irradiation station; A light leakage prevention component is movably arranged on the side wall at the feed inlet, and is used for opening and closing the feed inlet.

2. The irradiation device for wafer debonding according to claim 1, characterized in that: The anti-light leakage component includes a light-shielding cylinder and a light-shielding plate. The light-shielding cylinder is arranged on the side wall of the irradiation chamber. The driving end of the light-shielding cylinder is fixedly connected to the light-shielding plate to drive the light-shielding plate to slide and open and close the feed port.

3. The irradiation device for wafer debonding according to claim 2, characterized in that: At least two groups of the light-shielding cylinders are provided, and are symmetrically arranged on two sides directly opposite to the feed port.

4. An irradiation device for wafer debonding according to claim 1 or 2, characterized in that: The shutter assembly includes a shutter cylinder and a shutter. The shutter cylinder is arranged on the top wall of the irradiation chamber. The driving end of the shutter cylinder is fixedly connected to the shutter to drive the shutter to slide and open and close the light outlet.

5. The irradiation device for wafer debonding according to claim 1 or 2, characterized in that: The anti-light leakage component also includes a light shield, and the light shield is respectively arranged on both sides of the light output component.

6. The irradiation device for wafer debonding according to claim 1 or 2, characterized in that: The feed port is connected to a plurality of side walls of the irradiation chamber.

7. An irradiation device for wafer debonding according to claim 1 or 2, characterized in that: The transfer assembly includes a linear module and a moving part. The linear module is arranged on the bottom wall of the irradiation chamber, and the driving end of the linear module is fixed to the moving part to drive the moving part to move between the loading station and the irradiation station.

8. The irradiation device for wafer debonding according to claim 7, characterized in that: The moving part includes a lifting cylinder and an adsorption platform. The lifting cylinder is arranged at the driving end of the linear module. The driving end of the lifting cylinder is fixedly connected to the adsorption platform to drive the adsorption platform to move up and down.

9. The irradiation device for wafer debonding according to claim 1, characterized in that: The irradiation device also includes a measuring piece, which includes a display and a probe. The display is arranged on the frame, and the probe is arranged on the transfer assembly.

10. The irradiation device for wafer debonding according to claim 1, characterized in that: The irradiation device also includes a heat sink, which connects the irradiation component with the external environment.

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