Wafer turnover device

Abstract

The utility model discloses a wafer turnover device. The wafer turnover device comprises a base; the rotating mechanism is mounted on the base; the clamping mechanism is installed on the rotating mechanism, the clamping mechanism comprises two symmetrical clamping arms, clamping grooves are formed in the clamping arms, second driving parts are installed on the clamping arms, lead screws are arranged at the output ends of the second driving parts, connecting plates are in threaded connection with the peripheries of the lead screws, through holes are formed in the clamping arms, and the connecting plates are in threaded connection with the clamping arms. The connecting plate extends into the clamping groove, an upper clamping plate is fixed to the connecting plate, and the upper clamping plate is located in the clamping groove. According to the utility model, the clamping arms and the upper clamping plate are arranged, and the clamping arms and the upper clamping plate are used for limiting and protecting the side surfaces of the wafer and clamping the upper surface and the lower surface of the wafer, so that the clamping stability can be improved through up-down and left-right clamping, the side surfaces of the wafer are protected, and the wafer is not easy to damage.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer turning device. Background Art

[0002] During the wafer processing process, since different processes have different processing angles for the wafer, the wafer needs to be rotated to meet the processing angle.

[0003] Currently, a flipping device is required to rotate the wafer. The flipping device clamps the wafer through a clamping mechanism. Some clamping mechanisms clamp the side of the wafer. If the clamping force is too strong, the wafer is easily damaged. If the clamping force is too weak, the wafer is loose and the processing angle of the wafer is inaccurate during processing. Some clamping mechanisms clamp the upper and lower surfaces of the wafer. The sides of the wafer are not protected and are easily damaged after being subjected to external force. Utility Model Content

[0004] The utility model aims at solving the problems existing in the prior art and proposes the following technical solutions:

[0005] Wafer flipping device, comprising:

[0006] Base;

[0007] A rotating mechanism, wherein the rotating mechanism is mounted on a base;

[0008] The clamping mechanism is installed on the rotating mechanism, and the clamping mechanism includes two symmetrical clamping arms, a clamping groove is provided in the clamping arm, a driving member 2 is installed on the clamping arm, a screw rod is provided at the output end of the driving member 2, a connecting plate is threadedly connected to the outer periphery of the screw rod, a through hole is provided on the clamping arm, the connecting plate extends into the clamping groove, an upper clamping plate is fixed on the connecting plate, and the upper clamping plate is located in the clamping groove.

[0009] As a preferred embodiment of the above technical solution, the clamping mechanism also includes a mounting plate, which is mounted on the rotating mechanism, and a driving member 1 is mounted on the mounting plate. A bidirectional screw is provided at the output end of the driving member 1, and a clamping arm is symmetrically threadedly connected to the outer periphery of the bidirectional screw. A slide is provided at one end of the clamping arm, and a corresponding sliding groove is opened on the mounting plate, and the slide is slidably installed in the sliding groove.

[0010] As a preferred embodiment of the above technical solution, gaskets are provided at the bottom of the upper clamping plate and the top of the clamping groove.

[0011] As a preferred embodiment of the above technical solution, a buffer pad is provided on the inner side of the clamping groove.

[0012] As a preferred embodiment of the above technical solution, a movable cavity is opened in the base corresponding to the extension line below the clamping mechanism, and a lifting mechanism is installed in the movable cavity. The lifting mechanism includes a telescopic part 1, and the telescopic part 1 is installed in the movable cavity. A support plate is provided at the output end of the telescopic part 1.

[0013] As a preferred embodiment of the above technical solution, a telescopic member 2 is symmetrically mounted on the base, an arc plate is provided at the output end of the telescopic member 2, and the arc plate matches the lifting mechanism.

[0014] The beneficial effects of the utility model are:

[0015] 1. The utility model is provided with a clamping arm and an upper clamping plate, which are used to limit the side of the wafer and clamp the upper and lower sides of the wafer. In this way, the clamping stability can be improved by clamping up and down, left and right, while protecting the side of the wafer and not easily damaging the wafer.

[0016] 2. The utility model is provided with a lifting mechanism, a second telescopic member and an arc plate, so that the wafer is located at the center of the two clamping arms after being lifted up, which facilitates the clamping arms to clamp the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the clamping mechanism structure;

[0019] Figure 3 is a schematic diagram of the clamping arm structure;

[0020] Figure 4 It is a schematic diagram of the enlarged structure at A;

[0021] Figure 5 This is a schematic diagram of the cross-sectional structure of the base.

[0022] In the figure:

[0023] 1. Base; 11. Movable cavity; 2. Rotating mechanism; 3. Clamping mechanism; 31. Mounting plate; 311. Slide groove; 32. Clamping arm; 321. Clamping groove; 322. Upper clamping plate; 3221. Connecting plate; 323. Gasket; 324. Buffer pad; 325. Through hole; 33. Driving member 1; 331. Bidirectional screw rod; 34. Driving member 2; 341. Screw rod; 35. Slide plate; 4. Lifting mechanism; 41. Telescopic member 1; 42. Support plate; 5. Telescopic member 2; 6. Arc plate. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solution of the present utility model will be clearly and completely described below in conjunction with the embodiments.

[0025] Example

[0026] like Figure 1-4 As shown;

[0027] The wafer flipping device includes a base 1; a rotating mechanism 2 is installed on the base 1, and the rotating mechanism 2 is mainly composed of a rotating motor; a clamping mechanism 3 is installed on the rotating mechanism 2, and the clamping mechanism 3 rotates when the rotating mechanism 2 is passed, so that the wafer clamped by the clamping mechanism 3 is rotated to adjust the processing angle, and the clamping mechanism 3 includes two symmetrical clamping arms 32, and a clamping groove 321 is opened in the clamping arm 32, and a driving member 34 is installed on the clamping arm 32, and the driving member 34 can be a micro motor. The output end of the driving member 34 is provided with a screw rod 341, and the outer periphery of the screw rod 341 is threadedly connected to a connecting plate 3221, and the clamping mechanism 3 includes two symmetrical clamping arms 32, and a clamping groove 321 is opened in the clamping arm 32. A driving member 34 is installed on the clamping arm 32, and the driving member 34 can be a micro motor. The output end of the driving member 34 is provided with a screw rod 341, and the outer periphery of the screw rod 341 is threadedly connected to a connecting plate 3221. A through hole 325 is provided on the holding arm 32, and the connecting plate 3221 extends into the clamping groove 321. An upper clamping plate 322 is fixed on the connecting plate 3221, and the upper clamping plate 322 is located in the clamping groove 321. When clamping the wafer, the clamping arm 32 is first used to initially clamp and limit the side of the wafer, and the side of the wafer is protected at the same time. Then, the driving member 34 is started to rotate the screw rod 341, so that the upper clamping plate 322 is driven by the connecting plate 3221 to move and clamp the upper and lower surfaces of the wafer, so as to achieve the purpose of clamping the wafer. In this way, the clamping can improve the clamping stability by clamping up, down, left and right, and it is not easy to damage the wafer.

[0028] Furthermore, the clamping mechanism 3 also includes a mounting plate 31, which is mounted on the rotating mechanism 2, and a driving member 33 is mounted on the mounting plate 31, which can be a motor, and a bidirectional screw rod 331 is provided at the output end of the driving member 33, and a clamping arm 32 is symmetrically threadedly connected to the outer periphery of the bidirectional screw rod 331, and a slide plate 35 is provided at one end of the clamping arm 32, and a slide groove 311 is correspondingly opened on the mounting plate 31, and the slide plate 35 is slidably installed in the slide groove 311, and the bidirectional screw rod 331 is rotated by starting the driving member 33, so that the two clamping arms 32 move toward the middle to clamp the wafer, and during the movement, the slide plate 35 moves in the slide groove 311 to improve the stability of the movement of the clamping arm 32, thereby improving the stability of the clamping arm 32 when clamping;

[0029] Furthermore, a gasket 323 is provided at the bottom of the upper clamping plate 322 and the top of the clamping groove 321, and the gasket 323 plays a protective role when clamping the wafer;

[0030] Furthermore, a buffer pad 324 is provided inside the clamping groove 321 , and the buffer pad 324 effectively prevents the clamping arm 32 from clamping the side of the wafer with great force and causing damage.

[0031] like Figure 1 and Figure 5 Shown

[0032] An active cavity 11 is provided in the corresponding base 1 on the extended line below the clamping mechanism 3, and a lifting mechanism 4 is installed in the active cavity 11. The lifting mechanism 4 includes a telescopic member 41, which can be a cylinder. The telescopic member 41 is installed in the active cavity 11, and a support plate 42 is provided at the output end of the telescopic member 41. The diameter of the support plate 42 is smaller than the diameter of the wafer. When the wafer needs to be clamped, the wafer is placed at the center of the active cavity 11, and then the telescopic member 41 is started to make the support plate 42 lift the wafer until it moves to the vicinity of the clamping mechanism 3, so as to facilitate the clamping mechanism 3 to clamp the wafer;

[0033] Furthermore, a telescopic part 25 is symmetrically installed on the base 1. The telescopic part 25 is a cylinder. An arc plate 6 is provided at the output end of the telescopic part 25. The arc plate 6 matches the lifting mechanism 4. By starting the telescopic part 25, the two arc plates 6 are brought closer to move the wafer to the center position of the active cavity 11. In this way, when the support plate 42 lifts the wafer, the wafer is located at the center position of the clamping mechanism 3, which makes it more convenient for the clamping mechanism 3 to clamp the wafer.

[0034] The above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it.

Claims

1. A wafer flipping device, characterized in that: include: Base (1); A rotating mechanism (2), wherein the rotating mechanism (2) is mounted on the base (1); A clamping mechanism (3), wherein the clamping mechanism (3) is mounted on the rotating mechanism (2), and the clamping mechanism (3) comprises two symmetrical clamping arms (32), wherein a clamping groove (321) is provided in the clamping arm (32), a second driving member (34) is mounted on the clamping arm (32), a screw rod (341) is provided at the output end of the second driving member (34), a connecting plate (3221) is threadedly connected to the outer periphery of the screw rod (341), a through hole (325) is provided on the clamping arm (32), the connecting plate (3221) extends into the clamping groove (321), an upper clamping plate (322) is fixed on the connecting plate (3221), and the upper clamping plate (322) is located in the clamping groove (321).

2. The wafer flipping device according to claim 1, characterized in that: The clamping mechanism (3) further comprises a mounting plate (31), wherein the mounting plate (31) is mounted on the rotating mechanism (2), a driving member (33) is mounted on the mounting plate (31), a bidirectional screw rod (331) is provided at the output end of the driving member (33), a clamping arm (32) is symmetrically threadedly connected to the outer periphery of the bidirectional screw rod (331), a slide plate (35) is provided at one end of the clamping arm (32), a sliding groove (311) is correspondingly provided on the mounting plate (31), and the slide plate (35) is slidably mounted in the sliding groove (311).

3. The wafer flipping device according to claim 2, characterized in that: Gaskets (323) are provided at the bottom of the upper clamping plate (322) and the top of the clamping groove (321).

4. The wafer flipping device according to claim 3, characterized in that: A buffer pad (324) is provided inside the clamping groove (321).

5. The wafer flipping device according to claim 1, characterized in that: An active cavity (11) is provided in the corresponding base (1) on the extended line below the clamping mechanism (3), a lifting mechanism (4) is installed in the active cavity (11), the lifting mechanism (4) comprises a telescopic member (41), the telescopic member (41) is installed in the active cavity (11), and a support plate (42) is provided at the output end of the telescopic member (41).

6. The wafer flipping device according to claim 5, characterized in that: A second telescopic member (5) is symmetrically mounted on the base (1), and an arc plate (6) is provided at the output end of the second telescopic member (5), and the arc plate (6) matches the lifting mechanism (4).

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