Wafer clamping device

Abstract

The present application discloses a wafer clamping device, comprising: a base, a lifting mechanism and a clamping mechanism; the lifting mechanism is installed on the base; the clamping mechanism is connected to the power end of the lifting mechanism, and the clamping mechanism comprises: a bottom plate, a driving assembly, a rotating member, a plurality of guide assemblies, a plurality of clamping assemblies and a plurality of connecting members, the bottom plate comprises a first plate body and a second plate body arranged in parallel, the driving assembly is installed on the first plate body; the rotating member is connected to the power end of the driving assembly; a plurality of the guide assemblies are respectively installed on the second plate body, and are circumferentially distributed with the center point of the rotating member as the center of the circle; a plurality of the clamping assemblies are respectively slidably connected to each of the guide assemblies; the connecting member connects the clamping assembly and the rotating member. The present application can realize the precise grasping and handling of wafers, and has a compact structural design and low manufacturing cost.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors, and in particular to a wafer clamping device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] During the chip preparation process, it is often necessary to clamp the wafer. However, most of the clamping mechanisms on the market currently use pneumatic or electric three-jaw mechanisms, or motor + lead screw + guide rails to drive the movement of the clamping jaws. There is a contradictory relationship between their stroke and volume. When the stroke is sufficient to grasp multiple products of different sizes, the size is often large, resulting in excessive space occupation. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a wafer clamping device that can realize the grasping and carrying actions of the wafer, has a compact structural design, and has low manufacturing cost.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In one aspect, a wafer clamping device is provided, comprising: a base;

[0007] A lifting mechanism is installed on the base;

[0008] A clamping mechanism is connected to the power end of the lifting mechanism, and the clamping mechanism includes: a base plate, a driving assembly, a rotating member, a plurality of guide assemblies, a plurality of clamping assemblies and a plurality of connecting members, the base plate includes a first plate body and a second plate body arranged in parallel, the driving assembly is installed on the first plate body; the rotating member is connected to the power end of the driving assembly; a plurality of the guide assemblies are respectively installed on the second plate body, and are circumferentially distributed with the center point of the rotating member as the center of the circle; a plurality of the clamping assemblies are respectively slidably connected to each of the guide assemblies; the connecting member connects the clamping assembly and the rotating member, and the clamping assembly is configured as follows: the driving assembly drives the rotating member to rotate, and synchronously drives each of the clamping assemblies to move relative to the center of the circle or away from the center of the circle through each of the connecting members.

[0009] Furthermore, the clamping assembly includes a mounting member and a clamping member, the mounting member is slidably mounted on the guide assembly, the connecting member is connected to the top end of the mounting member, the clamping member is mounted on the bottom end of the mounting member, and the clamping member can abut against the wafer in the direction relative to the center of the circle to clamp the wafer.

[0010] Furthermore, the clamping assembly also includes a fixed shaft, a bearing and a locking piece, one end of the fixed shaft is fixedly connected to the mounting piece, and the other end is mounted on the connecting piece through the bearing, and the locking piece locks the connecting piece and the fixed shaft.

[0011] Furthermore, the guide assembly includes a first guide rail fixed on the second plate body, and a first slider slidably disposed on the first guide rail, and the mounting member is fixedly connected to the first slider.

[0012] Furthermore, it also includes a first sensor component, which is electrically connected to the driving component and is used to detect the rotation angle of the rotating member.

[0013] Furthermore, it also includes a transmission shaft, one end of which is connected to the power end of the driving assembly, and the other end of which is connected to the rotating member.

[0014] Furthermore, the first sensing component includes a first shading member and a first photoelectric sensor, the first photoelectric sensor is installed on the base, and the first shading member is installed on the transmission shaft.

[0015] Furthermore, a second guide rail is provided on the base, a second slider is slidably provided on the second guide rail, the second slider is fixedly connected to the bottom plate, and the bottom plate is connected to the power end of the lifting mechanism.

[0016] Furthermore, it also includes a transmission assembly, which connects the lifting mechanism and the base plate.

[0017] Furthermore, the transmission assembly includes a first synchronous pulley, a tensioning pulley, a second synchronous pulley, a screw and a connecting block, the first synchronous pulley is connected to the power end of the lifting mechanism, the first synchronous pulley and the second synchronous pulley are arranged at an interval and are connected through a synchronous belt transmission, the tensioning pulley is arranged on the synchronous belt, the second synchronous pulley is connected to the screw key, and the connecting block connects the screw and the base plate.

[0018] Furthermore, it also includes a second sensor component, which is electrically connected to the lifting mechanism and is used to detect the lifting position of the base plate.

[0019] Furthermore, the second sensing component includes a second shading member and a second photoelectric sensor, the second shading member is mounted on the bottom plate, and the second photoelectric sensor is mounted on the base.

[0020] Furthermore, two of the lifting mechanisms and two of the clamping mechanisms are provided, the two lifting mechanisms are respectively provided at two horizontal ends of the base, and the two clamping mechanisms are spaced apart on the base and are respectively connected to the two lifting mechanisms.

[0021] The beneficial effects of the present application are as follows: the rotating part is driven to rotate by the driving component, and during the rotation of the rotating part, the connecting part can drive the clamping component to move relative to the center of the circle, and the set guide component can ensure that the clamping component moves in the preset trajectory direction, so that multiple clamping components can be close to each other to clamp the wafer. After clamping the wafer, the clamping mechanism is driven to move upward or downward to the wafer placement position by the lifting mechanism. When the clamped wafer moves to the specified position, the driving component drives in the reverse direction to move the clamping component away from the center of the circle, so that multiple clamping components can move outward synchronously, and then release the wafer and place it to the specified position. The entire wafer clamping device uses a compact transmission drive structure design, which makes the overall device more compact in structural design, occupies less assembly space, and reduces manufacturing costs. In addition, multiple clamping components are driven to move in a centering manner by multiple connecting parts simultaneously, so that the wafer can be synchronously centered during the grasping and handling process, with good synchronization and high center positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present application is further described in detail below based on the drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of the clamping mechanism described in the embodiment of the present application;

[0024] Figure 2 A rear view of the wafer clamping device according to an embodiment of the present application;

[0025] Figure 3 This is a front view of the wafer clamping device described in an embodiment of the present application.

[0026] In the figure:

[0027] 110, wafer; 1, base; 2, lifting mechanism; 3, clamping mechanism; 301, bottom plate; 3011, first plate body; 3012, second plate body; 3013, support plate; 302, driving assembly; 303, rotating member; 304, guide assembly; 3041, first guide rail; 3042, first slider; 305, clamping assembly; 3051, mounting member; 3052, clamping member; 3053, fixed shaft; 3054, bearing ; 3055, locking piece; 306, connecting piece; 307, first photoelectric sensor; 308, first shading piece; 309, first bevel gear; 310, second bevel gear; 311, bearing seat; 312, transmission shaft; 4, first synchronous pulley; 5, tensioning pulley; 6, second synchronous pulley; 7, nut; 8, screw rod; 9, connecting block; 10, second photoelectric sensor; 11, second shading piece; 12, second guide rail; 13, second slider. DETAILED DESCRIPTION

[0028] In order to make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0029] In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] like Figure 1-Figure 3As shown, this embodiment provides a wafer clamping device, which includes: a base 1, a lifting mechanism 2 and a clamping mechanism 3; the lifting mechanism 2 is installed on the base 1; the clamping mechanism 3 is connected to the power end of the lifting mechanism 2, and the clamping mechanism 3 includes: a bottom plate 301, a driving component 302, a rotating member 303, a plurality of guide components 304, a plurality of clamping components 305 and a plurality of connecting members 306, the bottom plate 301 includes a first plate body 3011 and a second plate body 3012 arranged in parallel, the driving component 302 is installed on the first plate body 3011; the rotating member 303 is connected to the driving component 302, and the rotating member 303 is connected to the driving component 302. The driving component 302 is connected to the power end; the plurality of guide components 304 are respectively installed on the second plate body 3012, and are circumferentially distributed with the center point of the rotating member 303 as the center of the circle; the plurality of clamping components 305 are respectively slidably connected to each of the guide components 304; the connecting member 306 connects the clamping component 305 and the rotating member 303, and the clamping component 305 is configured as follows: the driving component 302 drives the rotating member 303 to rotate, and synchronously drives each of the clamping components 305 to move relative to the center direction of the circle or away from the center direction of the circle through each of the connecting members 306.

[0032] Based on the above scheme, the lifting mechanism 2 first drives the base 1 to rise and fall through its power end according to work requirements, so that the clamping mechanism 3 reaches a predetermined operating height to adapt to different work scenarios or wafer 110 sizes. When the wafer 110 needs to be clamped, the driving component 302 starts to work. This driving component 302 may be a motor or other power source, which connects and drives the rotating member 303 to start rotating through its power end. The rotation of the rotating member 303 is transmitted to each clamping component 305 through the connecting member 306. These connecting members 306 may be connecting rods, chains or other forms of transmission mechanisms to ensure that the power of the rotating member 303 can be evenly and synchronously transmitted to each clamping component 305. As the part 303 rotates, each clamping assembly 305 begins to move relative to the center of the circle or away from the center of the circle under the guidance of the guide assembly 304. This movement is synchronous and controlled, ensuring that the wafer 110 is subjected to uniform and stable clamping force at multiple points. When the clamping assemblies 305 move to the predetermined position, they firmly clamp the wafer 110 in the middle to achieve stable fixation of the wafer 110. At this time, the wafer 110 is clamped uniformly and stably to prevent movement or damage during subsequent process. In addition, since the clamping assemblies 305 slide on the base plate 301 through the guide assembly 304, the device can adapt to wafers 110 of different sizes, thereby improving its versatility and adaptability. The entire wafer 110 clamping device uses a compact transmission drive structure design, which makes the overall device more compact in structure design, occupies a smaller assembly space, and reduces manufacturing costs; multiple connecting members 306 synchronously drive multiple clamping assemblies 305 to move in the center, so that the wafer 110 can be synchronously centered during the grasping and handling process, with good synchronization and high center positioning accuracy. In addition, a space is formed between the first plate 3011 and the second plate 3012 arranged in parallel, and the rotating member 303, the connecting member 306, the guide assembly 304 and the clamping assembly 305 can be installed in the space. The upper and lower first plate 3011 and the second plate 3012 can play a role in protecting and limiting, and can ensure accurate and reliable installation.

[0033] Furthermore, the clamping assembly 305 includes a mounting member 3051 and a clamping member 3052, wherein the mounting member 3051 is slidably mounted on the guide assembly 304, the connecting member 306 is connected to the top of the mounting member 3051, and the clamping member 3052 is mounted on the bottom of the mounting member 3051, and the clamping member 3052 can abut against the wafer 110 relative to the direction of the center of the circle to clamp the wafer 110. The mounting member 3051 is designed to be slidably mounted on the guide assembly 304. The guide assembly 304 ensures the stability and accuracy of the mounting member 3051 during movement, so that it can move along a predetermined trajectory. The connecting member 306 is connected to the top of the mounting member 3051 and is connected to the rotating member 303. When the rotating member 303 starts to rotate under the drive of the driving assembly 302, the connecting member 306 transmits the power to the mounting member 3051, driving the mounting member 3051 to move along the guide assembly 304. The clamping member 3052 is installed at the bottom of the mounting member 3051. When the mounting member 3051 moves driven by the connecting member 306, the clamping member 3052 The fastener 3052 will also move accordingly. The design of the clamping member 3052 enables it to contact the surface of the wafer 110 and apply pressure. When multiple clamping members 3052 work at the same time, they can apply uniform pressure to the wafer 110 from different directions to achieve stable clamping of the wafer 110. As the clamping member 3052 moves, its direction relative to the center of the circle can abut against the surface of the wafer 110. When the clamping member 3052 applies sufficient pressure, the wafer 110 is firmly clamped between the multiple clamping members 3052, ensuring the stability and safety of the wafer 110 in subsequent process steps. Since multiple clamping components 305 can simultaneously apply pressure to the wafer 110 through the cooperation of the guide component 304 and the connecting member 306, it is ensured that the wafer 110 is subjected to uniform force, and the risk of deformation or damage caused by uneven force is reduced; the combined design of the clamping member 3052 and the mounting member 3051 makes the clamping action more precise and controllable, and can adapt to wafers 110 of different sizes and shapes, thereby improving the accuracy and reliability of clamping. In addition, the various parts of the clamping component 305 are relatively independent and easy to disassemble and replace, making the maintenance and care of the device relatively simple and convenient.

[0034] Furthermore, the clamping assembly 305 also includes a fixed shaft 3053, a bearing 3054 and a locking member 3055, one end of the fixed shaft 3053 is fixedly connected to the mounting member 3051, and the other end is mounted on the connecting member 306 through the bearing 3054, and the locking member 3055 locks the connecting member 306 and the fixed shaft 3053. One end of the fixed shaft 3053 is fixedly connected to the mounting member 3051 to ensure that during the clamping process, the connecting member 306 can stably drive the mounting member 3051 to move along the direction of the guide assembly 304. The other end of the fixed shaft 3053 is mounted on the connecting member 306 through the bearing 3054. The design of the bearing 3054 allows the fixed shaft 3053 to rotate or slide inside the connecting member 306, while reducing friction and wear to ensure the smoothness and stability of the movement; the locking member 3055 is used to lock the connecting member 306 and the fixed shaft 3053 to ensure that during the clamping process, the relative position between the fixed shaft 3053 and the connecting member 306 remains stable to prevent loosening or displacement caused by vibration or external force. In this solution, by introducing components such as the fixed shaft 3053, the bearing 3054 and the locking member 3055, the clamping assembly 305 in the wafer 110 clamping device has been further improved in terms of stability and reliability, providing more reliable technical support for chip manufacturing and other fields.

[0035] It is worth mentioning that when the locking piece 3055 is not set, the angle between the fixed shaft 3053 and the connecting piece 306 is adjustable. The purpose of adjusting the angle between the fixed shaft 3053 and the connecting piece 306 is to debug a clamping device that can clamp wafers 110 of different sizes. In addition to clamping wafers 110 of different sizes by controlling the movement of the clamping piece 3052, the size of the clampable wafer 110 can also be adjusted by adjusting the angle between the fixed shaft 3053 and the connecting piece 306. In simple terms, the angle between the fixed shaft 3053 and the connecting piece 306 determines the movable range of the clamping piece 3052, which determines the size of the wafer 110 that can be clamped. After the angle between the fixed shaft 3053 and the connecting piece 306 is adjusted, the fixing and locking are completed by the locking piece 3055.

[0036] In some embodiments, the guide assembly 304 includes a first guide rail 3041 fixed on the second plate 3012, and a first slider 3042 slidably disposed on the first guide rail 3041, and the mounting member 3051 is fixedly connected to the first slider 3042. The first guide rail 3041 is firmly fixed on the second plate 3012 to form a stable guide base, and the first slider 3042 is designed to slide along the first guide rail 3041. The mounting member 3051 and the first slider 3042 are connected by a fixed connection, which means that when the first slider 3042 moves along the first guide rail 3041, the mounting member 3051 will also move synchronously therewith, and when the driving assembly 302 drives the rotating member 303 to rotate, the first slider 3042 is driven to slide on the first guide rail 3041 through the connecting member 306. Due to the precise guiding effect of the first guide rail 3041, the first slider 3042 can move stably and accurately according to the predetermined track. Since the mounting member 3051 is fixedly connected to the first slider 3042, the movement of the first slider 3042 will directly drive the mounting member 3051 and the clamping member 3052 connected thereto to move together, thereby realizing the clamping or loosening operation of the wafer 110. The fixed installation and precise design of the first guide rail 3041 enable the first slider 3042 to remain stable and not easily deviate from the track during the movement, thereby improving the stability of the clamping assembly 305; the coordinated use of the first guide rail 3041 and the first slider 3042 ensures the accuracy and precision of the clamping assembly 305 during the movement, avoiding clamping failure or error caused by deviation from the track. At the same time, the first slider 3042 is optimized to slide smoothly on the first guide rail 3041, reducing friction and resistance, and improving the working efficiency of the clamping assembly 305.

[0037] In addition, it also includes a transmission shaft 312, a bearing seat 311, a first bevel gear 309 and a second bevel gear 310. The bearing seat 311 is installed on the first plate body 3011, the transmission shaft 312 is installed in the bearing seat 311, the first bevel gear 309 is connected to the driving component 302, the first bevel gear 309 and the second bevel gear 310 are engaged through gears, when the driving component 302 drives the first bevel gear 309 to rotate, the second bevel gear 310 is rotated around the bearing seat 311 through the gear transmission of the first bevel gear 309, the transmission shaft 312 and the second bevel gear 310 are connected through a key, the rotating member 303 is fixed to the transmission shaft 312, that is, the rotating member 303 is driven to rotate, thereby driving multiple corresponding clamping members 3052 to align at the same time through multiple connecting members 306, and completing the grasping action of the wafer 110.

[0038] In the above solution, the rotating member 303 is specifically a rotating disk, the connecting member 306 is a connecting rod, the driving assembly 302 is a servo motor, the locking member 3055 is a locking retaining ring, and the clamping member 3052 is a clamping claw.

[0039] Preferably, a first sensor component is further included, and the first sensor component is electrically connected to the driving component 302, and is used to detect the rotation angle of the rotating member 303. The first sensor component and the driving component 302 are electrically connected to transmit signals. When the driving component 302 starts to work and drives the rotating member 303 to rotate, the first sensor component can receive relevant information about the angle change of the rotating member 303 in real time. Specifically, the first sensor component uses a built-in sensor (such as an angle sensor) to accurately detect the rotation angle of the rotating member 303. The sensor can monitor the change of the angle of the rotating member 303 in real time and convert these changes into electrical signals for output; the first sensor component processes the detected rotation angle information and feeds back the processed data to the driving component 302 through an electrical connection. The driving component 302 can adjust the working parameters in real time according to the received angle information, thereby realizing precise control of the clamping process of the wafer 110. By real-time monitoring of the rotation angle of the rotating part 303, the first sensor component can ensure the accuracy of the wafer 110 during the clamping process and reduce clamping failure or errors caused by angle deviation. At the same time, by real-time monitoring of the rotation angle of the rotating part 303 by the first sensor component, abnormal conditions or faults can be discovered in time, providing data support for fault warning and diagnosis, and helping to take timely measures for repair or adjustment.

[0040] Specifically, the first sensing assembly includes a first light shielding member 308 and a first photoelectric sensor 307, wherein the first photoelectric sensor 307 is mounted on the base 1, and the first light shielding member 308 is mounted on the transmission shaft 312. The first light shielding member 308 is fixed on the transmission shaft 312, and as the second bevel gear 310 rotates, the control of the travel range of the clamping jaws is achieved through the induction of the first photoelectric sensor 307, and the grasping action is precisely controllable in cooperation with the servo motor. In addition, by adjusting the specific installation position of the first photoelectric sensor 307, the rotation angle of the rotating disk can be controlled, and the range of the clamping jaws to be centered and retracted can be controlled.

[0041] In the above scheme, four clamping assemblies 305, connecting members 306 and guide assemblies 304 are respectively provided, that is, four clamping assemblies 305 synchronously center and shrink and clamp the wafer 110. Here, only one servo motor is used to achieve precise and controllable grasping and centering of the wafer 110, and it is compatible with the clamping of wafers 110 of different specifications within a certain range of sizes.

[0042] In order to achieve precise guidance for the lifting of the bottom plate 301, a second guide rail 12 is provided on the base 1, and a second slider 13 is slidably provided on the second guide rail 12. The second slider 13 is fixedly connected to the bottom plate 301, and the bottom plate 301 is connected to the power end of the lifting mechanism 2. When the lifting mechanism 2 starts to work, its power end will drive the bottom plate 301 to perform lifting and lowering movements. Since the bottom plate 301 is directly connected to the power end of the lifting mechanism 2, the bottom plate 301 can be accurately lifted and lowered according to the instructions of the lifting mechanism 2. During the lifting and lowering process of the bottom plate 301, the second slider 13 will slide along the second guide rail 12. Since the second guide rail 12 has a precise guiding function, the second slider 13 can stably move along a predetermined track, thereby ensuring the stability and accuracy of the bottom plate 301 during the lifting process; since the second slider 13 is fixedly connected to the bottom plate 301, the movement of the second slider 13 will directly drive the movement of the bottom plate 301. This connection method ensures that the bottom plate 301 will not deviate from the track during the lifting process, and achieves precise guidance. By using the second guide rail 12 and the second slider 13 in coordination, the base plate 301 can obtain stable support and guidance during the lifting process, thereby reducing errors or failures caused by shaking or deviation from the trajectory.

[0043] like Figure 2 As shown, it also includes a transmission component, which connects the lifting mechanism 2 and the base plate 301. The transmission component includes a first synchronous pulley 4, a tensioning wheel 5, a second synchronous pulley 6, a screw rod 8 and a connecting block 9. The first synchronous pulley 4 is connected to the power end of the lifting mechanism 2. The first synchronous pulley 4 and the second synchronous pulley 6 are arranged at intervals and are connected through a synchronous belt transmission. The tensioning wheel 5 is arranged on the synchronous belt. The second synchronous pulley 6 is key-connected with the screw rod 8. The connecting block 9 connects the screw rod 8 and the base plate 301. In this scheme, the lifting mechanism 2 drives the first synchronous pulley 4 to rotate, and drives the second synchronous pulley 6 to rotate through the synchronous belt transmission. The tension of the synchronous belt can be adjusted by the tensioning wheel 5. The second synchronous pulley 6 is connected to the screw rod 8 by a key, so it can drive the screw rod 8 to rotate. A nut 7 is also provided between the connecting block 9 and the screw rod 8, that is, the nut 7 and the screw rod 8 are matched for transmission, and the rotation of the screw rod 8 can be converted into the up and down movement of the nut 7, and the nut 7 is fixedly connected to the connecting block 9, that is, the screw rod 8 drives the nut 7 and the connecting block 9 to move up and down along the axial direction of the screw rod 8, and at the same time drives the bottom plate 301 to move up and down along the direction of the second guide rail 12, completing the up and down movement of the clamp after the wafer 110 is clamped, and a complete wafer 110 grasping process is realized.

[0044] In addition, the bottom plate 301 further includes a support plate 3013 protruding from the first plate body 3011 . The support plate 3013 is fixedly connected to the connection block 9 , and the support plate 3013 and the first plate body 3011 are vertically connected.

[0045] Furthermore, a second sensor assembly is also included, and the second sensor assembly is electrically connected to the lifting mechanism 2, and is used to detect the lifting position of the bottom plate 301. Specifically, the second sensor assembly includes a second shading member 11 and a second photoelectric sensor 10, and the second shading member 11 is installed on the bottom plate 301, and the second photoelectric sensor 10 is installed on the base 1. The operating principle of the second sensor assembly is similar to that of the first sensor assembly, and will not be repeated here. In addition, the adjustment of the up and down movement stroke of the grab can be achieved by adjusting the installation position of the second shading member 11 and the second photoelectric sensor 10.

[0046] Preferably, two lifting mechanisms 2 and two clamping mechanisms 3 are provided, and the two lifting mechanisms 2 are respectively provided at the two horizontal ends of the base 1, and the two clamping mechanisms 3 are provided on the base 1 at intervals and are respectively connected to the two lifting mechanisms 2. Through program control, one of the clamping jaws can be used for loading and the other for unloading, and the loading and unloading action can be realized in a cycle with the moving module, saving time and improving the beat; and the double-jaw symmetrical design has a compact structure, saves space, and makes the grabbing action more efficient, and the material sheet is clamped and transported efficiently, which is conducive to the optimization of the processing procedure.

[0047] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of this application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0048] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0049] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0050] The technical principles of the present application are described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation methods of the present application without creative work, and these methods will fall within the scope of protection of the present application.

Claims

1. A wafer clamping device, characterized in that: include: Base (1); A lifting mechanism (2) is installed on the base (1); A clamping mechanism (3) is connected to the power end of the lifting mechanism (2), and the clamping mechanism (3) comprises: a base plate (301), a driving assembly (302), a rotating member (303), a plurality of guide assemblies (304), a plurality of clamping assemblies (305) and a plurality of connecting members (306), wherein the base plate (301) comprises a first plate body (3011) and a second plate body (3012) arranged in parallel, and the driving assembly (302) is mounted on the first plate body (3011); the rotating member (303) is connected to the power end of the driving assembly (302); the plurality of guide assemblies (304) are connected to ... 04) are respectively installed on the second plate body (3012), and are distributed circumferentially with the center point of the rotating member (303) as the center of the circle; multiple clamping assemblies (305) are respectively slidably connected to each guide assembly (304); the connecting member (306) connects the clamping assembly (305) and the rotating member (303), and the clamping assembly (305) is configured as follows: the driving assembly (302) drives the rotating member (303) to rotate, and synchronously drives each clamping assembly (305) to move relative to the center of the circle or away from the center of the circle through each connecting member (306).

2. The wafer clamping device according to claim 1, characterized in that: The clamping assembly (305) comprises a mounting member (3051) and a clamping member (3052), wherein the mounting member (3051) is slidably mounted on the guide assembly (304), the connecting member (306) is connected to the top end of the mounting member (3051), and the clamping member (3052) is mounted on the bottom end of the mounting member (3051), and the clamping member (3052) can abut against the wafer (110) in a direction relative to the center of the circle to thereby clamp the wafer (110).

3. The wafer clamping device according to claim 2, characterized in that: The clamping assembly (305) further comprises a fixed shaft (3053), a bearing (3054) and a locking member (3055); one end of the fixed shaft (3053) is fixedly connected to the mounting member (3051), and the other end is mounted on the connecting member (306) via the bearing (3054); and the locking member (3055) locks the connecting member (306) and the fixed shaft (3053).

4. The wafer clamping device according to claim 2, characterized in that: The guide assembly (304) comprises a first guide rail (3041) fixed on the second plate (3012), and a first slider (3042) slidably arranged on the first guide rail (3041), and the mounting member (3051) is fixedly connected to the first slider (3042).

5. The wafer clamping device according to any one of claims 1 to 4, characterized in that: It also includes a first sensor component, which is electrically connected to the driving component (302) and is used to detect the rotation angle of the rotating member (303).

6. The wafer clamping device according to claim 5, characterized in that: It also comprises a transmission shaft (312), one end of the transmission shaft (312) is connected to the power end of the driving component (302), and the other end is connected to the rotating member (303); the first sensing component comprises a first shading member (308) and a first photoelectric sensor (307), the first photoelectric sensor (307) is mounted on the base (1), and the first shading member (308) is mounted on the transmission shaft (312).

7. The wafer clamping device according to any one of claims 1 to 4, characterized in that: The base (1) is provided with a second guide rail (12), a second slider (13) is slidably provided on the second guide rail (12), the second slider (13) is fixedly connected to the bottom plate (301), and the bottom plate (301) is connected to the power end of the lifting mechanism (2).

8. The wafer clamping device according to any one of claims 1 to 4, characterized in that: It also includes a transmission assembly, wherein the transmission assembly connects the lifting mechanism (2) and the bottom plate (301). The transmission assembly comprises a first synchronous pulley (4), a tensioning wheel (5), a second synchronous pulley (6), a screw rod (8) and a connecting block (9); the first synchronous pulley (4) is connected to the power end of the lifting mechanism (2); the first synchronous pulley (4) and the second synchronous pulley (6) are arranged at intervals and connected through a synchronous belt transmission; the tensioning wheel (5) is arranged on the synchronous belt; the second synchronous pulley (6) is key-connected to the screw rod (8); and the connecting block (9) connects the screw rod (8) and the base plate (301).

9. The wafer clamping device according to any one of claims 1 to 4, characterized in that: It also includes a second sensor component, which is electrically connected to the lifting mechanism (2) and is used to detect the lifting position of the base plate (301); The second sensing component comprises a second shading member (11) and a second photoelectric sensor (10); the second shading member (11) is mounted on the bottom plate (301); and the second photoelectric sensor (10) is mounted on the base (1).

10. The wafer clamping device according to any one of claims 1 to 4, characterized in that: The lifting mechanism (2) and the clamping mechanism (3) are both provided with two, the two lifting mechanisms (2) are respectively provided at the two horizontal ends of the base (1), and the two clamping mechanisms (3) are provided on the base (1) at intervals and are respectively connected to the two lifting mechanisms (2).

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