Safety protection device that can relieve chip packaging stress

Abstract

The utility model relates to the technical field of protective devices, and discloses a safety protective device that can relieve chip packaging stress, including: a shell, a cover plate fixedly installed on the top of the shell, a buffer enclosure fixedly installed on the bottom end of the shell, and a chip assembly movably installed on the top of the buffer enclosure. The utility model sets a fixed rod, a rotating plate, a connecting rod, a short rod and a first spring. When the chip generates downward stress, it will squeeze the carrier plate, so that the carrier plate moves downward with the connecting block and the connecting rod, so that the connecting rod generates a thrust on the top of the rotating plate, drives the rotating plate to rotate, and causes the bottom of the rotating plate to generate a pulling force on the short rod, pulling the short rod with the movable block, the long rod and the round block to move up along the inner surface of the cylinder and stretch the first spring. Under the recovery action of the first spring, the movable block will be forced to reset, thereby achieving the purpose of relieving chip packaging stress.

Description

Technical Field

[0001] The utility model relates to the technical field of protective devices, and more specifically, to a safety protective device capable of relieving chip packaging stress. Background Art

[0002] Chip refers to the general term for semiconductor component products. In electronics, it is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of semiconductor wafers. It is widely used in computers, mobile phones and other digital appliances, and has become an indispensable part of the social structure.

[0003] During the manufacturing process of chips, the chips need to be packaged before the next step of production can be carried out. The packaged chips are affected by their own materials and performance and are very fragile. When stress is generated, the chips will be affected by the stress and damaged or even broken, causing damage to the chip. At this time, the chip needs to be replaced, which increases the production cost, causes a waste of resources, and affects the normal use of digital appliances. Therefore, improvements are needed. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a safety protection device capable of relieving chip packaging stress, which has the advantage of relieving chip packaging stress.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a safety protection device capable of relieving chip packaging stress, comprising:

[0006] A housing, wherein a cover plate is fixedly mounted on the top of the housing, a buffer panel is fixedly mounted on the bottom of the housing, and a chip assembly is movably mounted on the top of the buffer panel;

[0007] A protection mechanism, wherein the protection mechanism is arranged inside the buffer enclosure;

[0008] A buffer mechanism, the buffer mechanism being arranged at the bottom end of the housing;

[0009] Wherein, the protective mechanism includes a fixing rod, and the number of the fixing rods is two, and the two fixing rods are respectively fixedly sleeved on the left and right sides of the bottom end of the buffer enclosure, and the outer surfaces of the two fixing rods are respectively movably sleeved with a rotating plate, and the inner surface of the top end of the rotating plate is movably sleeved with a connecting rod, and the outer surface of the connecting rod is fixedly sleeved with a connecting block, and the outer surface of the connecting block is movably sleeved with the inner surface of the top end of the rotating plate, and a carrying plate is fixedly installed on the top end of the connecting block, and the outer surface of the carrying plate is movably sleeved with the inner surface of the buffer enclosure, and the top end of the carrying plate is movably connected to the bottom end of the chip assembly, and a circular hole is opened at the top end of the carrying plate, and the rotating plate plays a protective role.

[0010] As a preferred technical solution of the utility model, the buffer mechanism includes:

[0011] A short rod, the short rod is movably sleeved on the inner surface of the bottom end of the rotating plate, the outer surface of the short rod is fixedly sleeved with a movable block, and the outer surface of the movable block is movably sleeved on the inner surface of the bottom end of the rotating plate;

[0012] A long rod, the long rod is fixedly mounted on the bottom end of the movable block, a round block is fixedly mounted on the bottom end of the long rod, a cylinder is movably sleeved on the outer surface of the round block, the outer surface of the cylinder is fixedly sleeved with the inner surface of the bottom end of the shell, and the inner surface of the top end of the cylinder is movably sleeved with the outer surface of the long rod;

[0013] The first spring is fixedly mounted on the bottom end of the movable block, and the other end of the first spring is fixedly connected to the top end of the cylinder.

[0014] As a preferred technical solution of the utility model, a first fixed plate and a second fixed plate are respectively fixedly installed on the upper and lower sides of the front end of the buffer enclosure, and long plates are movably sleeved on the left and right sides inside the first and second fixed plates, and the number of the long plates is two and they are symmetrical with respect to the center of the buffer enclosure.

[0015] As a preferred technical solution of the utility model, the two long boards are respectively movably sleeved with vertical rods, the top ends of the outer surfaces of the vertical rods are fixedly sleeved with circular plates, the bottom ends of the vertical rods are fixedly mounted with pressure blocks, the bottom ends of the pressure blocks are movably connected to the top ends of the chip components, the top ends of the pressure blocks are fixedly mounted with a second spring, and the other end of the second spring is fixedly mounted on the bottom ends of the long boards.

[0016] As a preferred technical solution of the utility model, a card slot is opened at the front end of the first fixed plate, a card block is movably sleeved at the bottom end of the card slot, and the bottom of the outer surface of the card block is movably sleeved with the inner surface of the top end of the long board.

[0017] As a preferred technical solution of the utility model, a horizontal plate is fixedly installed at the bottom of the right end of the card block, and the outer surface of the horizontal plate and the inner surface of the long board are movably connected. A vertical block is fixedly installed at the right end of the horizontal plate, and the top of the vertical block penetrates the long board and extends to the outside of the long board. A connecting spring is fixedly installed in the middle of the bottom end of the horizontal plate, and the other end of the connecting spring is fixedly installed at the bottom end inside the long board. The vertical block will move the card block downward.

[0018] As a preferred technical solution of the utility model, the upper and lower ends of the shell are respectively provided with first through holes, and the upper and lower ends of the buffer enclosure are respectively provided with second through holes.

[0019] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0020] 1. The utility model sets a fixed rod, a rotating plate, a connecting rod, a short rod and a first spring. When the chip generates downward stress, it will squeeze the carrier plate, so that the carrier plate moves downward with the connecting block and the connecting rod, so that the connecting rod generates a thrust on the top of the rotating plate, drives the rotating plate to rotate and causes the bottom of the rotating plate to generate a pulling force on the short rod, pulling the short rod with the movable block, the long rod and the round block to move up along the inner surface of the cylinder and stretch the first spring. Under the restoring action of the first spring, the movable block will be forced to reset, thereby achieving the purpose of alleviating the chip packaging stress.

[0021] 2. The utility model sets a long plate, a pressure block, a second spring, a card block and a vertical block. When the vertical block is pressed, the horizontal plate will move downward with the card block and compress the connecting spring, so that the card block releases the lock on the long plate. Then, the long plate is pushed to move the long plate with the pressure block until the pressure block is separated from the chip assembly. The existence of the second spring ensures that the pressure block presses the chip assembly tightly, thereby realizing the rapid disassembly and fixation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the utility model;

[0023] Figure 2 It is a cross-sectional structural schematic diagram of the side of the utility model;

[0024] Figure 3 It is a cross-sectional structural schematic diagram of the front side of the utility model;

[0025] Figure 4 It is a schematic diagram of the cross-sectional structure of the long board of the utility model;

[0026] Figure 5 It is a schematic diagram of the cross-sectional structure of the top of the utility model;

[0027] Figure 6 for Figure 3 A schematic diagram of the local enlarged structure at point A in the middle;

[0028] Figure 7 for Figure 4 Schematic diagram of the local enlarged structure at point B in the middle.

[0029] In the figure: 1. shell; 2. cover plate; 3. buffer enclosure; 4. protection mechanism; 401. fixed rod; 402. rotating plate; 403. connecting rod; 404. connecting block; 405. bearing plate; 406. round hole; 5. buffer mechanism; 501. short rod; 502. movable block; 503. long rod; 504. round block; 505. cylinder; 506. first spring; 6. first fixed plate; 7. second fixed plate; 8. long plate; 9. vertical rod; 10. round plate; 11. pressure block; 12. second spring; 13. slot; 14. block; 15. horizontal plate; 16. vertical block; 17. connecting spring; 18. chip assembly; 19. first through hole; 20. second through hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figures 1 to 7 As shown, the utility model provides a safety protection device that can relieve chip packaging stress, including:

[0032] A housing 1, a cover plate 2 is fixedly mounted on the top of the housing 1, a buffer panel 3 is fixedly mounted on the bottom of the housing 1, and a chip assembly 18 is movably mounted on the top of the buffer panel 3;

[0033] A protection mechanism 4, which is arranged inside the buffer enclosure 3;

[0034] A buffer mechanism 5, the buffer mechanism 5 is arranged at the bottom end of the housing 1;

[0035] Among them, the protective mechanism 4 includes a fixed rod 401, the number of the fixed rods 401 is two, the two fixed rods 401 are respectively fixedly sleeved on the left and right sides of the bottom end of the buffer enclosure 3, the outer surfaces of the two fixed rods 401 are respectively movably sleeved with a rotating plate 402, the inner surface of the top of the rotating plate 402 is movably sleeved with a connecting rod 403, the outer surface of the connecting rod 403 is fixedly sleeved with a connecting block 404, the outer surface of the connecting block 404 and the inner surface of the top of the rotating plate 402 are movably sleeved, and the top of the connecting block 404 is fixedly installed with a supporting plate 405, the outer surface of the supporting plate 405 and the inner surface of the buffer enclosure 3 are movably sleeved, the top of the supporting plate 405 and the bottom of the chip assembly 18 are movably connected, and a round hole 406 is opened at the top of the supporting plate 405, and the rotating plate 402 plays a protective role.

[0036] When the packaged chip generates a downward stress, a downward force will be generated on the carrier plate 405, so that the connecting block 404 fixedly connected to the carrier plate 405 moves downward with the connecting rod 403. Since the connecting rod 403 is movably sleeved on the inner surface of the top of the rotating plate 402, as the connecting rod 403 moves, the outer surface of the connecting rod 403 will generate a thrust on the inner surface of the top of the rotating plate 402, pushing the rotating plate 402 to rotate with the fixed rod 401 as the axis. The existence of the circular hole 406 has the effect of dissipating heat for the chip. Under the action of the rotating plate 402, the chip packaging stress will be absorbed, thereby protecting the chip.

[0037] Wherein, the buffer mechanism 5 includes:

[0038] A short rod 501, the short rod 501 is movably sleeved on the inner surface of the bottom end of the rotating plate 402, the outer surface of the short rod 501 is fixedly sleeved with a movable block 502, and the outer surface of the movable block 502 is movably sleeved with the inner surface of the bottom end of the rotating plate 402;

[0039] A long rod 503, the long rod 503 is fixedly mounted on the bottom end of the movable block 502, a round block 504 is fixedly mounted on the bottom end of the long rod 503, a cylinder 505 is movably sleeved on the outer surface of the round block 504, the outer surface of the cylinder 505 is fixedly sleeved on the inner surface of the bottom end of the housing 1, and the inner surface of the top end of the cylinder 505 is movably sleeved on the outer surface of the long rod 503;

[0040] The first spring 506 is fixedly mounted on the bottom end of the movable block 502 , and the other end of the first spring 506 is fixedly connected to the top end of the cylinder 505 .

[0041] When the rotating plate 402 rotates, the inner surface of the bottom end of the rotating plate 402 will generate a pulling force on the short rod 501, pulling the short rod 501 and the movable block 502, the long rod 503 and the round block 504 to move upward along the inner surface of the cylinder 505 and stretch the first spring 506. Under the restoring action of the first spring 506, the movable block 502 will be forced to return to its original position, thereby releasing the stress absorbed by the rotating plate 402 and relieving the stress.

[0042] Among them, the first fixed plate 6 and the second fixed plate 7 are fixedly installed on the upper and lower sides of the front end of the buffer enclosure 3, and the long plates 8 are movably sleeved on the left and right sides inside the first fixed plate 6 and the second fixed plate 7. There are two long plates 8 and they are symmetrical with each other about the center of the buffer enclosure 3.

[0043] Due to the existence of the first fixing plate 6 and the second fixing plate 7 , the movement of the long plate 8 will be restricted.

[0044] Among them, the two long plates 8 are respectively movably sleeved with vertical rods 9, the top of the outer surface of the vertical rods 9 is fixedly sleeved with a circular plate 10, the bottom end of the vertical rods 9 is fixedly installed with a pressure block 11, the bottom end of the pressure block 11 is movably connected to the top of the chip assembly 18, the top of the pressure block 11 is fixedly installed with a second spring 12, and the other end of the second spring 12 is fixedly installed at the bottom end of the long plate 8.

[0045] Since the second spring 12 is in a compressed state, the pressing block 11 will always maintain contact with the chip assembly 18, thereby pressing and fixing the chip assembly 18.

[0046] A slot 13 is formed at the front end of the first fixing plate 6 , a block 14 is movably sleeved at the bottom end of the slot 13 , and the bottom of the outer surface of the block 14 is movably sleeved with the inner surface of the top end of the long plate 8 .

[0047] Due to the presence of the locking slot 13 and the locking block 14 , the position of the long board 8 will be locked.

[0048] Among them, a horizontal plate 15 is fixedly installed at the bottom of the right end of the card block 14, and the outer surface of the horizontal plate 15 is movably connected to the inner surface of the long board 8. A vertical block 16 is fixedly installed at the right end of the horizontal plate 15. The top of the vertical block 16 penetrates the long board 8 and extends to the outside of the long board 8. A connecting spring 17 is fixedly installed in the middle of the bottom end of the horizontal plate 15, and the other end of the connecting spring 17 is fixedly installed at the bottom end inside the long board 8. The vertical block 16 will move the card block 14 downward.

[0049] When the vertical block 16 is pressed, the vertical block 16 will move downward along the inner surface of the long board 8 with the horizontal board 15 and compress the connecting spring 17. At this time, the card block 14 fixedly connected to the horizontal board 15 will also move together, thereby separating from the card slot 13, thereby releasing the lock of the card block 14 on the long board 8.

[0050] The upper and lower ends of the outer shell 1 are respectively provided with first through holes 19 , and the upper and lower ends of the buffer enclosure 3 are respectively provided with second through holes 20 .

[0051] The existence of the first through hole 19 and the second through hole 20 will facilitate the air circulation inside the housing 1 and the buffer enclosure 3, thereby enhancing the heat dissipation effect.

[0052] The working principle and use process of this utility model:

[0053] First, when the chip generates a downward stress, the carrier plate 405 will move downward, so that the connecting block 404 will move downward with the connecting rod 403. At this time, the outer surface of the connecting rod 403 will generate a thrust on the inner surface of the top of the rotating plate 402, pushing the rotating plate 402 to rotate around the fixed rod 401 as the axis, thereby absorbing the stress. At this time, the inner surface of the bottom end of the rotating plate 402 will generate a pulling force on the outer surface of the short rod 501, pulling the short rod 501 with the movable block 502, the long rod 503 and the round block 504 to move upward along the inner surface of the cylinder 505 and stretch the first spring 506. Under the restoring action of the first spring 506, the movable block 502 will be restored to its original position, thereby releasing the stress, thereby alleviating the chip packaging stress and protecting the chip.

[0054] When the chip needs to be removed, the operator presses the vertical block 16, so that the vertical block 16 moves downward along the inner surface of the long board 8 with the cross plate 15 and the card block 14 and compresses the connecting spring 17 until the card block 14 and the card slot 13 are separated. At this time, the card block 14 will release the lock on the long board 8, and then push the long board 8. Since the left and right inner walls of the top of the buffer enclosure 3 and the left and right ends of the pressure block 11 are all arc surfaces, the pressure block 11 will be pushed to the left and right sides of the top of the buffer enclosure 3, and under the recovery action of the connecting spring 17, the card block 14 will be re-embedded in the card slot 13, thereby locking the long board 8 again. At this time, the pressure block 11 will release the pressure on the chip assembly 18, and then the chip assembly 18 can be taken out. At the same time, since the second spring 12 is always in a compressed state, the second spring 12 can ensure that the pressure block 11 is always tightly fitted with the chip assembly 18 when it contacts the chip assembly 18, thereby pressing the chip assembly 18. The cooperation of various mechanisms realizes the rapid disassembly and installation of the chip, thereby improving its convenience.

[0055] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A safety protection device capable of relieving chip packaging stress, characterized in that: Included are: A housing (1), a cover plate (2) being fixedly mounted on the top of the housing (1), a buffer panel (3) being fixedly mounted on the bottom of the housing (1), and a chip assembly (18) being movably mounted on the top of the buffer panel (3); A protection mechanism (4), wherein the protection mechanism (4) is arranged inside the buffer enclosure (3); A buffer mechanism (5), wherein the buffer mechanism (5) is arranged at the bottom end inside the housing (1); The protection mechanism (4) comprises a fixing rod (401), the number of the fixing rods (401) is two, the two fixing rods (401) are respectively fixedly sleeved on the left and right sides of the bottom end of the buffer enclosure (3), the outer surfaces of the two fixing rods (401) are respectively movably sleeved with a rotating plate (402), the inner surface of the top end of the rotating plate (402) is movably sleeved with a connecting rod (403), and the outer surface of the connecting rod (403) is fixedly sleeved with a connecting block (404) The outer surface of the connecting block (404) is movably connected to the inner surface of the top of the rotating plate (402); a supporting plate (405) is fixedly installed on the top of the connecting block (404); the outer surface of the supporting plate (405) is movably connected to the inner surface of the buffer enclosure (3); the top of the supporting plate (405) is movably connected to the bottom of the chip assembly (18); a circular hole (406) is opened at the top of the supporting plate (405); and the rotating plate (402) plays a protective role.

2. The safety protection device capable of relieving chip packaging stress according to claim 1, characterized in that: The buffer mechanism (5) comprises: A short rod (501), the short rod (501) is movably sleeved on the inner surface of the bottom end of the rotating plate (402), the outer surface of the short rod (501) is fixedly sleeved with a movable block (502), and the outer surface of the movable block (502) is movably sleeved with the inner surface of the bottom end of the rotating plate (402); A long rod (503), the long rod (503) is fixedly mounted on the bottom end of the movable block (502), a round block (504) is fixedly mounted on the bottom end of the long rod (503), a cylinder (505) is movably sleeved on the outer surface of the round block (504), the outer surface of the cylinder (505) is fixedly sleeved on the inner surface of the bottom end of the housing (1), and the inner surface of the top end of the cylinder (505) is movably sleeved on the outer surface of the long rod (503); A first spring (506), wherein the first spring (506) is fixedly mounted on the bottom end of the movable block (502), and the other end of the first spring (506) is fixedly connected to the top end of the cylinder (505).

3. The safety protection device capable of relieving chip packaging stress according to claim 1, characterized in that: A first fixing plate (6) and a second fixing plate (7) are fixedly mounted on the upper and lower sides of the front end of the buffer enclosure (3), respectively; long plates (8) are movably sleeved on the left and right sides inside the first fixing plate (6) and the second fixing plate (7), respectively; the number of the long plates (8) is two and they are symmetrical with respect to the center of the buffer enclosure (3).

4. The safety protection device capable of relieving chip packaging stress according to claim 3, characterized in that: The insides of the two long plates (8) are movably sleeved with vertical rods (9), the top ends of the outer surfaces of the vertical rods (9) are fixedly sleeved with a circular plate (10), the bottom ends of the vertical rods (9) are fixedly mounted with a pressure block (11), the bottom ends of the pressure blocks (11) are movably connected to the top ends of the chip components (18), the top ends of the pressure blocks (11) are fixedly mounted with a second spring (12), and the other end of the second spring (12) is fixedly mounted on the bottom ends of the long plates (8).

5. The safety protection device capable of relieving chip packaging stress according to claim 3, characterized in that: A slot (13) is provided at the front end of the first fixing plate (6), a block (14) is movably sleeved at the bottom end of the slot (13), and the bottom of the outer surface of the block (14) is movably sleeved with the inner surface of the top end of the long plate (8).

6. The safety protection device capable of relieving chip packaging stress according to claim 5, characterized in that: A horizontal plate (15) is fixedly mounted on the bottom of the right end of the clamping block (14), and the outer surface of the horizontal plate (15) is movably sleeved with the inner surface of the long plate (8). A vertical block (16) is fixedly mounted on the right end of the horizontal plate (15), and the top end of the vertical block (16) penetrates the long plate (8) and extends to the outside of the long plate (8). A connecting spring (17) is fixedly mounted in the middle of the bottom end of the horizontal plate (15), and the other end of the connecting spring (17) is fixedly mounted on the bottom end of the long plate (8). The vertical block (16) will move the clamping block (14) downward.

7. The safety protection device capable of relieving chip packaging stress according to claim 1, characterized in that: The upper and lower ends of the outer shell (1) are respectively provided with first through holes (19), and the upper and lower ends of the buffer enclosure (3) are respectively provided with second through holes (20).

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