Adjustable Clip packaging structure and system thereof

Abstract

The utility model discloses an adjustable Clip packaging structure and a system thereof, and belongs to the field of semiconductor device packaging and manufacturing. The Clip packaging structure comprises a Clip structure used for connecting a chip and a lead frame, the end face of the Clip structure is provided with a separation group, the separation group is used for being connected with the lead frame, the Clip structure is provided with a via hole group penetrating through the side wall of the Clip structure, and the separation group and the via hole group are arranged in the direction from the chip to the lead frame. The separation group can limit the distance between the Clip structure and the lead frame, and the via hole group can discharge solder bubbles, so that the void ratio is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device packaging manufacturing, and in particular to an adjustable Clip packaging structure and a system thereof. Background Art

[0002] Clip Bond is a packaging process that uses a solid copper bridge welded to the solder to connect the chip and the pin. The lead frame has the functions of carrying the chip, connecting the internal chip with the external circuit board electrical signal, and installing and fixing electronic devices. Clip copper sheet welding, as a commonly used method of connecting the chip and the frame, replaces the standard wire bonding method between the chip and the pin to a certain extent, and can obtain a unique packaging resistance value, higher current, and better thermal conductivity.

[0003] For power devices with high power density, better connection can be achieved by using conductive clips (such as copper clips). However, the length of the conductive clips limits the scope of use and causes unnecessary impedance from the conductive clips. At the same time, during the welding process, the solder at the contact point between the clip and the frame may release gas due to heating. If these gases cannot be effectively discharged, voids will be formed at the contact position, introducing the risk of increased voids. Utility Model Content

[0004] In order to help reduce the void ratio, the present application provides an adjustable Clip packaging structure and a system thereof.

[0005] The present application provides an adjustable Clip packaging structure that adopts the following technical solution:

[0006] An adjustable Clip packaging structure includes a Clip structure for connecting a chip and a lead frame, wherein the end surface of the Clip structure is provided with a partition group, wherein the partition group is used to connect with the lead frame, and the Clip structure is provided with a via group penetrating its side wall, wherein the partition group and the via group are arranged in a direction from the chip toward the lead frame.

[0007] By adopting the above technical solution, "voids" refer to the internal cavities formed during the solidification process of the solder during the electronic device packaging process. These cavities may affect the electrical performance and mechanical strength of the device and reduce the reliability of the device. In this application, the separation group can limit the spacing between the Clip structure and the lead frame, and the via group can discharge solder bubbles, thereby reducing the void ratio.

[0008] Optionally, the installation position of the Clip structure can be adjusted to adjust the contact position between the separation group and the lead frame.

[0009] By adopting the above technical solution, this design allows the contact position between the separation group and the lead frame to be flexibly adjusted according to actual needs. By adjusting the installation position of the Clip structure, the current path can be actively optimized and unnecessary impedance loss can be reduced, thereby improving the overall performance of the packaging structure.

[0010] Optionally, the separation groups and the via groups are arranged in a staggered manner along a direction from the chip toward the lead frame.

[0011] By adopting the above technical solution, this staggered arrangement helps to distribute the connection force more evenly and improve the stability of the overall structure.

[0012] Optionally, the separation group includes a plurality of bumps, and the plurality of bumps are arranged at intervals along a direction perpendicular to the chip toward the lead frame.

[0013] By adopting the above technical solution, this setting method helps to increase the number of connection points and improve the reliability of the connection.

[0014] Optionally, the separation group includes strip-shaped bosses, and the strip-shaped bosses extend in a direction perpendicular to the chip and toward the lead frame.

[0015] By adopting the above technical solution, the design of the strip-shaped boss helps to provide a larger contact area and further reduce the contact resistance.

[0016] Optionally, the via hole group includes a plurality of spot holes, and the plurality of spot holes are arranged at intervals along a direction perpendicular to the chip toward the lead frame.

[0017] By adopting the above technical solution, the design of the point holes helps to reduce the weight of the structure while maintaining a good connection effect.

[0018] Optionally, the via hole group includes elongated holes, and the elongated holes extend in a direction perpendicular to the chip and toward the lead frame.

[0019] By adopting the above technical solution, the design of the long holes helps to provide a larger adjustment space and meet more diverse connection needs.

[0020] Optionally, the via group is made by stamping.

[0021] By adopting the above technical solution, the stamping process is efficient and accurate, and can ensure that the size and shape of the via group meet the design requirements.

[0022] Optionally, the Clip structure can be used for MOSFET and IGBT products.

[0023] An adjustable Clip packaging system comprises the above-mentioned adjustable Clip packaging structure, wherein the adjustable Clip packaging system is composed of a plurality of the above-mentioned Clip structures arranged in an arranged manner.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The separation group in the present invention can limit the distance between the Clip structure and the lead frame, and the via group can discharge solder bubbles, thereby reducing the void ratio.

[0026] 2. This design allows the contact position between the separation group and the lead frame to be flexibly adjusted according to actual needs. By adjusting the installation position of the Clip structure, the current path can be actively optimized and unnecessary impedance loss can be reduced, thereby improving the overall performance of the packaging structure.

[0027] 3. By alternately setting the spacer group and the via group, a dynamic balance can be achieved between the connection force and the heat dissipation performance at any given point. The spacer group provides a stable connection point, while the via group forms an effective "ventilation channel" between these connection points to facilitate the rapid dissipation of heat. This structure not only improves the reliability of the package, but also significantly extends its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the adjustable CLIP packaging structure according to Example 1 of the present application.

[0029] Figure 2 This is another state schematic diagram of the adjustable CLIP packaging structure according to Embodiment 1 of the present application.

[0030] Figure 3 It is a front schematic diagram of the Clip structure in Example 1 of the present application.

[0031] Figure 4 yes Figure 3 Sectional view along line AA.

[0032] Figure 5 yes Figure 3 Sectional view along line BB.

[0033] Figure 6 It is a front schematic diagram of the Clip structure in Example 2 of the present application.

[0034] Figure 7 yes Figure 6 Cross-sectional view along line CC.

[0035] Figure 8 yes Figure 6 Cross-sectional view along line DD.

[0036] Description of reference numerals:

[0037] 10. Chip; 11. Lead frame; 20. Clip structure; 30. Separation group; 31. Bump; 32. Strip boss; 40. Via group; 41. Dot hole; 42. Long hole. DETAILED DESCRIPTION

[0038] The following is combined with Figure 1-8 This application is described in further detail.

[0039] Example 1

[0040] The adjustable CLIP packaging structure provided in the embodiments of the present application is as follows: Figure 1 As shown, the Clip structure 20 is used to connect the chip 10 and the lead frame 11. The Clip structure 20 is connected to the chip 10 through solder. The end surface of the Clip structure 20 is designed with a separation group 30, which is specifically used for connection with the lead frame 11. At the same time, the Clip structure 20 is also characterized by a via group 40 that penetrates its side wall. These separation groups 30 and via groups 40 are arranged in an orderly manner along the direction from the chip 10 to the lead frame 11.

[0041] Reference Figure 1 and Figure 2 Specifically, the design of the Clip structure 20 takes into account the flexibility of installation, and its installation position can be adjusted. By adjusting the position of the Clip structure 20, the contact position between the separation group 30 and the lead frame 11 can be further adjusted to achieve the best connection effect. This design can actively optimize the current path and reduce unnecessary impedance loss, thereby improving the overall performance of the packaging structure.

[0042] Reference Figure 2 and Figure 3 In this embodiment, the arrangement of the spacer group 30 and the via group 40 is also carefully designed. The spacer group 30 and the via group 40 are arranged in a staggered manner along the direction from the chip 10 to the lead frame 11. This staggered arrangement can more evenly distribute the connection force, thereby improving the overall stability of the packaging structure.

[0043] Reference Figure 3 and Figure 4 , wherein the adjustable CLIP package structure provided in the embodiment of the present application has a further improvement in the design of the spacer group 30. The spacer group 30 includes a plurality of bumps 31, which are arranged at intervals along a direction perpendicular to the chip 10 toward the lead frame 11. Such a design increases the number of connection points, thereby further improving the reliability of the connection.

[0044] Reference Figure 3and Figure 5 In terms of the via group 40, the via group 40 may include a plurality of spot holes 41, which are arranged at intervals along a direction perpendicular to the chip 10 toward the lead frame 11. The design of the spot holes 41 can reduce the weight of the structure while maintaining the connection effect, thereby achieving a more lightweight design.

[0045] The bumps 31 and the holes 41 are arranged in a staggered manner along the direction from the chip 10 to the lead frame 11. By alternately arranging the spacer groups 30 and the via groups 40, a dynamic balance can be achieved between the connection force and the heat dissipation performance at any given point. The spacer groups 30 provide a stable connection point, while the via groups 40 form an effective "ventilation channel" between these connection points to facilitate the rapid dissipation of heat.

[0046] In this embodiment, the cross-sectional shapes of the protrusions 31 and the hole 41 are both square. In other embodiments, the cross-sectional shapes of the protrusions 31 and the hole 41 may also be circular or irregular.

[0047] Optionally, the Clip structure 20 is mainly used for products such as MOSFET and IGBT.

[0048] The embodiment of the present application further provides a preparation process of the via group 40 and a material selection of the Clip structure 20. The via group 40 can be made by a stamping process, and the efficiency and precision of the stamping process can ensure that the size and shape of the via group 40 strictly meet the design requirements, thereby improving the quality and performance of the product.

[0049] In terms of material selection, the Clip structure 20 can use copper or silver as the main structural material. Both copper and silver have good electrical and thermal conductivity, which can ensure that the Clip structure 20 maintains stable performance during operation, while effectively dissipating heat and extending the service life of the product.

[0050] Example 2

[0051] The difference between this embodiment and the first embodiment is that the structures of the partition group 30 and the via group 40 are different. Figure 6 and Figure 7 In this embodiment, the separation group 30 includes a strip-shaped boss 32, which extends in a direction perpendicular to the chip 10 toward the lead frame 11. The strip-shaped boss 32 can be provided as one, or can be provided as multiple strip-shaped bosses 32 arranged at intervals. The design of the strip-shaped boss 32 can provide a larger contact area, help reduce contact resistance, and thus improve the overall conductive performance.

[0052] At this time, the via group 40 can be arranged in the form of a dot hole 41. Figure 6 and Figure 8The via group 40 may also include a long hole 42, which extends in a direction perpendicular to the chip 10 toward the lead frame 11 to provide a larger adjustment space to meet more diverse connection requirements.

[0053] Example 3

[0054] The embodiment of the present application also provides an adjustable CLIP packaging system, which includes the adjustable CLIP packaging structure as described in Embodiments 1 and 2, and the adjustable Clip packaging system is composed of a plurality of Clip structures 20. By arranging and combining these carefully designed Clip structures 20 according to certain rules, a more powerful, flexible and diverse packaging system can be constructed to meet the needs of different application scenarios.

[0055] In summary, the embodiment of the present application achieves optimization and innovation of the Clip structure 20 through the unique design of the separation group 30 and the via group 40, as well as the flexible adjustment mechanism. This not only significantly improves the stability and reliability of the connection, but also effectively reduces the risk of unnecessary impedance and increased voids, bringing new technological breakthroughs to the field of semiconductor device packaging manufacturing.

[0056] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An adjustable Clip packaging structure, characterized in that: The invention comprises a Clip structure (20) for connecting a chip (10) and a lead frame (11); a separation group (30) is provided on the end surface of the Clip structure (20); the separation group (30) is used to connect to the lead frame (11); the Clip structure (20) is provided with a via group (40) penetrating its side wall; the separation group (30) and the via group (40) are arranged in a direction from the chip (10) toward the lead frame (11).

2. The adjustable Clip packaging structure according to claim 1, characterized in that: The installation position of the Clip structure (20) can be adjusted to adjust the contact position between the separation group (30) and the lead frame (11).

3. The adjustable Clip packaging structure according to claim 1, characterized in that: The separation groups (30) and the via groups (40) are arranged in a staggered manner along a direction from the chip (10) toward the lead frame (11).

4. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The separation group (30) comprises a plurality of bumps (31), and the plurality of bumps (31) are arranged at intervals along a direction perpendicular to the chip (10) and towards the lead frame (11).

5. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The separation group (30) comprises a strip-shaped boss (32), wherein the strip-shaped boss (32) extends in a direction perpendicular to the chip (10) and towards the lead frame (11).

6. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The via hole group (40) comprises a plurality of spot holes (41), and the plurality of spot holes (41) are arranged at intervals along a direction perpendicular to the chip (10) and towards the lead frame (11).

7. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The via hole group (40) comprises elongated holes (42), and the elongated holes (42) extend in a direction perpendicular to the chip (10) and towards the lead frame (11).

8. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The via group (40) is made by stamping.

9. The adjustable Clip packaging structure according to any one of claims 1 to 3, characterized in that: The Clip structure (20) can be used for MOSFET and IGBT products.

10. An adjustable Clip packaging system, characterized in that: It comprises the adjustable Clip packaging structure according to any one of claims 1 to 9, wherein the adjustable Clip packaging system is composed of a plurality of the Clip structures (20) arranged in an arranged manner.

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