A radiator
By designing a radiator with adjustable connection components, the problem of poor compatibility of existing radiators is solved, achieving a more stable and efficient heat dissipation effect.
Patent Information
- Application Number
- CN202421052335.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-05-14
AI Technical Summary
The existing external radiator has poor compatibility and cannot fit with the heating zone of power electronic equipment, affecting the heat dissipation effect.
A radiator is designed, including a housing, a heat dissipation module and a connecting assembly. The heat dissipation module is connected to the housing through a connecting frame, and is equipped with a heat conductor and a heat dissipation rack. A heat dissipation fan is installed in the heat dissipation rack. The connecting assembly can be moved relative to the heat dissipation module so that the heat conductor sheet flush or protrudes with the end of the connecting assembly, thereby adapting to different forms of electronic devices.
By improving the compatibility of the radiator, it enhances its contact stability and applicability with electronic devices, thereby improving the heat dissipation effect and reducing the temperature of the electronic devices.
Smart Images

Figure CN222750743U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a radiator. Background Art
[0002] With the rapid development of power electronic equipment towards miniaturization, integration and high efficiency, the performance and heat dissipation of devices are increasing, which brings about problems such as uneven heat flux distribution, extremely high local heat flux, heat accumulation in local areas and excessively high local temperatures. Power electronic equipment that continuously runs at high temperatures will cause frequency reduction, affect equipment performance and pose certain safety risks.
[0003] Therefore, additional radiators are often set at required locations to help power electronic equipment reduce temperature and provide additional heat dissipation effects. However, existing external radiators have poor compatibility and cannot fit well with the heating area of the power electronic equipment, affecting the applicability of the radiator. Utility Model Content
[0004] The technical problem to be solved by the embodiments of the present utility model is to provide a radiator that can improve the compatibility of the radiator and thus improve the applicability of the radiator when in use.
[0005] The utility model discloses a radiator, comprising: a shell, and a heat dissipation module and a connecting component connected to the shell, the heat dissipation module comprising a connecting frame connected to the shell, a heat conductive sheet and a heat dissipation frame connected to the connecting frame, and a heat dissipation fan arranged in the heat dissipation frame, wherein the heat dissipation frame is connected to the heat conductive sheet, and the connecting component can be moved relative to the heat dissipation module so that the heat conductive sheet protrudes from the connecting component, or the heat conductive sheet is flush with the end of the connecting component.
[0006] Optionally, the connecting frame includes a first connecting part, a second connecting part and a third connecting part connected in sequence, the first connecting part is connected to the shell, the heat conducting plate is located at the third connecting part, the connecting component is located at the outer ring of the second connecting part, and the connecting component can move along the axial direction of the second connecting part.
[0007] Optionally, the connecting assembly includes an adjusting frame, and a magnetic attraction member, an adhesive member or a clamping member arranged on the adjusting frame, and the connecting assembly is threadedly connected to the second connecting portion through the adjusting frame.
[0008] Optionally, when the magnetic attraction component is provided on the adjustment frame, the adjustment frame includes an annular frame body, an annular groove is provided on the annular frame body, and the magnetic attraction component is located in the annular groove; the outer ring of the second connecting part is provided with a thread, the inner ring of the annular frame body is provided with a clamping protrusion clamped with the thread, the annular frame body is also provided with an annular rib, and the shell is provided with an avoidance groove corresponding to the annular rib.
[0009] Optionally, a cover plate is further provided on the annular frame, and the cover plate is provided on the annular groove to shield the magnetic attraction component.
[0010] Optionally, the connecting assembly includes an adjusting frame, which includes an annular frame body, on which a magnetic attraction part, an adhesive part or a clamping part is provided, the annular frame body is also provided with an annular rib, and a buckle is provided on the annular rib, the shell is provided with a first card slot and a second card slot corresponding to the buckle, and the shell is also provided with a connecting column for connecting the first connecting part, the buckle can be clamped in the first card slot, and an elastic part is provided on the connecting column, one end of the elastic part is elastically abutted against the annular rib, so that when the buckle is released from the first card slot, the buckle can slide in the second card slot.
[0011] Optionally, the radiator also includes a wireless charging module, which includes an iron core arranged in the third connecting part, and a coil stacked and wound on the outer circle of the iron core, the iron core and the coil are respectively attached to the thermal conductive sheet, so that the heat sink is connected to the thermal conductive sheet through the wireless charging module, and the coil is electrically connected to the circuit board of the radiator.
[0012] Optionally, the heat sink includes a thermally conductive base and a plurality of heat sinks arranged on the thermally conductive base, and the thermally conductive base and the heat sinks form an accommodating space for accommodating the cooling fan; the radiator also includes a thermally conductive block, and the thermally conductive base is connected to the iron core through the thermally conductive block.
[0013] Optionally, the outer ring of the shell is provided with a plurality of strip holes, and the strip holes correspond to the heat sinks; the end surface of the shell is also provided with a plurality of through holes, and the through holes correspond to the heat dissipation fans.
[0014] Optionally, a magnetic part or an adhesive body is further provided on the end surface of the shell, and the magnetic part or the adhesive body is located on the outer circle of the end surface.
[0015] Compared with the prior art, the beneficial effect of the radiator provided by the embodiment of the utility model is that: through the shell, and the heat dissipation module and the connecting assembly connected to the shell, when in use, the heat dissipation module contacts the electronic device, and is connected to the electronic device through the connecting assembly to ensure the stability of the heat dissipation process. The heat dissipation module is connected to the shell through a connecting frame, and the connecting frame is also connected to a heat conductive sheet and a heat dissipation frame, and a heat dissipation fan is arranged in the heat dissipation frame. The heat conductive sheet can directly contact the electronic device and transfer heat to the heat dissipation frame. When the heat dissipation fan in the heat dissipation frame is running, the heat dissipation frame is quickly cooled to accelerate heat transfer and improve the heat dissipation effect. In addition, when connected to the electronic device through the connecting assembly, the heat dissipation module can move relative to the connecting assembly so that the heat conductive sheet protrudes from the connecting assembly, or the heat conductive sheet is flush with the end of the connecting assembly, so as to adapt to different forms of electronic devices. The above form can improve the compatibility of the radiator, and then improve the applicability of the radiator when in use. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:
[0017] Figure 1 This is one of the structural schematic diagrams of the radiator provided by the embodiment of the utility model;
[0018] Figure 2 This is the second structural schematic diagram of the radiator provided by the embodiment of the utility model;
[0019] Figure 3 It is an exploded schematic diagram of a radiator provided by an embodiment of the utility model;
[0020] Figure 4 is a cross-sectional view of a radiator provided by an embodiment of the utility model;
[0021] Figure 5 It is a structural schematic diagram of the adjustment frame provided by the embodiment of the utility model;
[0022] Figure 6 It is a structural schematic diagram of another radiator provided by an embodiment of the utility model;
[0023] Figure 7 It is a schematic diagram of the structure of the adjustment frame and the housing provided by the embodiment of the utility model;
[0024] Figure 8 It is a cross-sectional view of another radiator provided by an embodiment of the utility model.
[0025] The reference numerals in the figures are:
[0026] 100, radiator; 110, shell; 112, first card slot; 114, second card slot; 116, connecting column; 118, strip hole; 120, heat dissipation module; 122, connecting frame; 1222, first connecting part; 1224, second connecting part; 1226, third connecting part; 124, heat conductive sheet; 126, heat dissipation frame; 1262, thermal conductive base; 1264, heat sink; 128, cooling fan; 130, connecting assembly; 132, adjusting frame; 1322, annular frame; 1324, annular groove; 1326, card protrusion; 1328, annular rib; 1329, buckle; 134, magnetic member; 136, cover plate; 140, elastic member; 150, wireless charging module; 152, iron core; 154, coil; 160, heat conductive block; 170, magnetic member. DETAILED DESCRIPTION
[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.
[0028] like Figures 1 to 4 As shown, an embodiment of the utility model provides a heat sink 100, comprising: a shell 110, and a heat dissipation module 120 and a connecting assembly 130 connected to the shell 110, the heat dissipation module 120 comprises a connecting frame 122 connected to the shell 110, a heat conductive sheet 124 and a heat dissipation frame 126 connected to the connecting frame 122, and a heat dissipation fan 128 arranged in the heat dissipation frame 126, wherein the heat dissipation frame 126 is connected to the heat conductive sheet 124, and the connecting assembly 130 can move relative to the heat dissipation module 120 so that the heat conductive sheet 124 protrudes from the connecting assembly 130, or the heat conductive sheet 124 is flush with the end of the connecting assembly 130.
[0029] Specifically, the embodiment of the present application is explained by taking the heat dissipation of an electronic device as an example. The heat dissipation surface on the electronic device may have a sunken plane or a flat plane and other structural forms. For the above forms, the radiator 100 provided in the embodiment of the present application can adjust the relative position between the heat dissipation module 120 and the connecting component 130 when in use. When in use, the heat dissipation module 120 can be moved relative to the shell 110, and the connecting component 130 can be fixed relative to the shell 110 to adjust the relative position of the two. The heat dissipation module 120 can also be fixed relative to the shell 110, and the connecting component 130 can be moved relative to the shell 110 to adjust the relative position of the two.
[0030] In addition, the heat dissipation module 120 plays a stable supporting role through the connecting frame 122 connected to the housing 110, which is conducive to ensuring the stability of the heat conductive sheet 124 and the heat sink 126 set on the connecting frame 122. Among them, the heat conductive sheet 124 is used to connect with the heat dissipation surface of the electronic device to transfer the heat generated by the electronic device to the heat sink 126 through the heat conductive sheet 124, and through the cooperation of the heat dissipation fan 128 and the heat sink 126, the heat dissipation ability of the heat sink 126 is improved, thereby reducing the temperature of the electronic device. In actual applications, the heat conductive sheet 124 can be protruded from the connecting component 130 to adapt to the recessed plane. The heat conductive sheet 124 can also be flush with the end of the connecting component 130 to adapt to the flat plane. The connecting component 130 ensures a stable connection between the radiator 100 and the electronic device.
[0031] The heat sink 100 provided in the embodiment of the present application is in contact with the electronic device through the housing 110, and the heat dissipation module 120 and the connection assembly 130 connected to the housing 110. When in use, the heat dissipation module 120 contacts the electronic device, and is connected to the electronic device through the connection assembly 130 to ensure the stability of the heat dissipation process. The heat dissipation module 120 is connected to the housing 110 through the connecting frame 122, and the connecting frame 122 is also connected with a heat conductive sheet 124 and a heat dissipation frame 126. A heat dissipation fan 128 is arranged in the heat dissipation frame 126. The heat conductive sheet 124 can directly contact the electronic device and transfer heat to the heat dissipation frame 126. When the heat dissipation fan 128 in the heat dissipation frame 126 is running, the heat dissipation frame 126 is quickly cooled to accelerate heat transfer and improve the heat dissipation effect. In addition, when connected to an electronic device through the connecting component 130, the heat dissipation module 120 can move relative to the connecting component 130 so that the heat conductive sheet 124 protrudes from the connecting component 130, or the heat conductive sheet 124 is flush with the end of the connecting component 130, so as to adapt to different forms of electronic devices. By adopting the above form, the compatibility of the radiator 100 can be improved, thereby improving the applicability of the radiator 100 when in use.
[0032] like Figure 2 and Figure 3 As shown, the connecting frame 122 includes a first connecting part 1222, a second connecting part 1224 and a third connecting part 1226 which are connected in sequence, the first connecting part 1222 is connected to the shell 110, the heat conductive plate 124 is located at the third connecting part 1226, the connecting component 130 is located at the outer ring of the second connecting part 1224, and the connecting component 130 can move along the axial direction of the second connecting part 1224.
[0033] Specifically, the connecting frame 122 is an annular structure as a whole, and the first connecting part 1222 is connected to the shell 110 and can be fastened by screws when connected. The second connecting part 1224 cooperates with the connecting component 130 to enable the connecting component 130 to move axially relative to the second connecting part 1224, so that the heat conducting plate 124 located at the third connecting part 1226 protrudes from the connecting component 130, or the heat conducting plate 124 is flush with the end of the connecting component 130.
[0034] like Figure 2 and Figure 3 As shown, the connection assembly 130 includes an adjustment frame 132 , and a magnetic attraction member 134 , an adhesive member or a clamping member disposed on the adjustment frame 132 . The connection assembly 130 is threadedly connected to the second connection portion 1224 through the adjustment frame 132 .
[0035] Specifically, when the adjustment frame 132 is provided with a magnetic member 134, it can be connected to the electronic device by magnetic attraction; when the adjustment frame 132 is provided with an adhesive member, it can be connected to the electronic device by bonding; when the adjustment frame 132 is provided with a clamping member, it can be connected to the electronic device by clamping. The position of the connection component 130 itself can be adjusted by threading the adjustment frame 132 with the second connection part 1224, so as to flexibly adjust the relative position between the connection component 130 and the heat dissipation module 120.
[0036] like Figure 3 , Figure 4 and Figure 5 As shown, when a magnetic attraction member 134 is provided on the adjustment frame 132, the adjustment frame 132 includes an annular frame body 1322, an annular groove 1324 is provided on the annular frame body 1322, and the magnetic attraction member 134 is located in the annular groove 1324; the outer ring of the second connecting portion 1224 is provided with a thread, the inner ring of the annular frame body 1322 is provided with a clamping protrusion 1326 clamped with the thread, and an annular rib 1328 is also provided on the annular frame body 1322, and an avoidance groove corresponding to the annular rib 1328 is provided on the shell 110.
[0037] Specifically, the magnetic suction member 134 is set in an annular shape so as to be placed in the annular groove 1324. When applied to an electronic device that can be directly magnetically adsorbed, the relative position between the heat dissipation module 120 and the connecting assembly 130 is adjusted first, and then the magnetic suction member 134 is directly used for adsorption. When the second connecting portion 1224 is connected to the adjustment frame 132, by setting a thread on the outer ring of the second connecting portion 1224, and the inner ring of the annular frame 1322 is provided with a clamping protrusion 1326 that is clamped with the thread, the thread engagement relationship can be achieved between the clamping protrusion 1326 and the second connecting portion 1224. In addition, an annular rib 1328 is also provided on the annular frame 1322. When the annular frame 1322 moves in a direction away from the housing 110, the annular rib 1328 can be used to shield the area between the housing 110 and the annular frame 1322 to prevent foreign matter from entering the housing 110. When the annular frame 1322 moves toward the direction where the housing 110 is located, the annular frame 1322 can smoothly move toward the position where the housing 110 is located through the avoidance grooves provided on the housing 110 and corresponding to the annular retaining edges 1328 .
[0038] like Figure 3 As shown, in an optional embodiment of the present application, a cover plate 136 is further provided on the annular frame 1322 , and the cover plate 136 is covered on the annular groove 1324 to shield the magnetic attraction member 134 .
[0039] By adopting the above method, the magnetic member 134 can be shielded and protected by the cover plate 136 to prevent the magnetic member 134 from being directly exposed to the outside, which is conducive to improving the reliability of the connection between them. Among them, a sinking groove can be set on the annular frame 1322, and the cover plate 136 is set in the sinking groove to prevent the cover plate 136 from protruding from the annular frame 1322. In addition, the cover plate 136 and the annular frame 1322 can be connected by bonding.
[0040] In another optional embodiment of the present application, Figures 6 to 8 As shown, the connecting assembly 130 includes an adjusting frame 132, and the adjusting frame 132 includes an annular frame body 1322. A magnetic attraction member 134, an adhesive member or a clamping member is provided on the annular frame body 1322. An annular rib 1328 is also provided on the annular rib 1328. A buckle 1329 is provided on the annular rib 1328. A first card slot 112 and a second card slot 114 corresponding to the buckle 1329 are provided on the shell 110. A connecting column 116 for connecting the first connecting part 1222 is also provided in the shell 110. The buckle 1329 can be clamped in the first card slot 112. An elastic member 140 is provided on the connecting column 116. One end of the elastic member 140 is elastically abutted against the annular rib 1328, so that when the buckle 1329 is released from the first card slot 112, the buckle 1329 can slide in the second card slot 114.
[0041] Specifically, when a magnetic attraction member 134 is provided on the annular frame 1322, it can be connected to the electronic device by magnetic attraction; when an adhesive member is provided on the annular frame 1322, it can be connected to the electronic device by bonding; when a clamping member is provided on the annular frame 1322, it can be connected to the electronic device by clamping. When the annular frame 1322 moves away from the shell 110, the annular rib 1328 provided on the annular frame 1322 can shield the area between the shell 110 and the annular frame 1322 through the annular rib 1328 to prevent foreign matter from entering the shell 110. For example, it can prevent fingers from being inserted into the shell 110 during use, and when the annular frame 1322 moves toward the direction of the shell 110, the fingers are accidentally squeezed and injured. In addition, through the cooperation between the buckle 1329 and the first slot 112 or the second slot 114, when the buckle 1329 is clamped with the first slot 112, it can limit the connection component 130, and at this time, the heat conductive sheet 124 protrudes from the connection component 130. When it is necessary to release the limit of the buckle 1329 by the first slot 112, the buckle 1329 can be manually pressed, and the buckle 1329 is deformed by force to release the limit with the first slot 112. At this time, the annular retaining edge 1328 is moved away from the housing 110 by the elastic force of the elastic member 140, and after the buckle 1329 is no longer subjected to the pressing force, it restores its own deformation and is clamped in the second slot 114, thereby achieving a sliding connection with the second slot 114. In this way, after the connection component 130 is connected to the electronic device, the positional relationship between the connection component 130 and the heat conductive sheet 124 can be changed, so as to better adapt to the electronic device.
[0042] like Figure 4 combine Figure 8 As shown, the radiator 100 also includes a wireless charging module 150, which includes an iron core 152 arranged in the third connecting portion 1226, and a coil 154 stacked and wound around the outer circle of the iron core 152, the iron core 152 and the coil 154 are respectively attached to the thermal conductive sheet 124, so that the heat sink 126 is connected to the thermal conductive sheet 124 through the wireless charging module 150, and the coil 154 is electrically connected to the circuit board of the radiator 100.
[0043] Specifically, the wireless charging module 150 can charge the electronic device with wireless charging function on the one hand, and can also play a role of heat conduction, so that the heat generated by the electronic device is transferred to the heat sink 126 through the heat conducting sheet 124 and the iron core 152 in sequence. In addition, the circuit board is also provided with a switch and a plug port to power on the radiator 100 and control the start and stop of the cooling fan 128 through the switch.
[0044] like Figure 4 and Figure 8As shown, the heat sink 126 includes a thermally conductive base 1262 and a plurality of heat sinks 1264 disposed on the thermally conductive base 1262 , and the thermally conductive base 1262 and the heat sinks 1264 form an accommodating space for accommodating the cooling fan 128 ; the radiator 100 also includes a thermally conductive block 160 , and the thermally conductive base 1262 is connected to the iron core 152 via the thermally conductive block 160 .
[0045] In actual applications, due to the distance between the heat conducting sheet 124 and the heat conducting base 1262, in order to ensure normal heat conduction, it is sometimes necessary to use the heat conducting block 160 to achieve heat transfer, and apply thermal grease on the contact surface to improve the heat conduction efficiency. When the heat is transferred to the heat conducting base 1262, it can be dispersed to the heat sink 1264 to improve the heat dissipation capacity. At the same time, the air flow at the heat sink 1264 is strengthened by the heat dissipation fan 128 to improve the heat dissipation efficiency.
[0046] like Figure 7 As shown, the outer ring of the shell 110 is provided with a plurality of strip holes 118 , which correspond to the heat sink 1264 ; the end surface of the shell 110 is also provided with a plurality of through holes, which correspond to the heat dissipation fan 128 .
[0047] Specifically, by providing the strip-shaped holes 118 on the outer ring of the housing 110, the heat sink 1264 is exposed, thereby enhancing the air flow with the outside world and improving the heat dissipation efficiency. In addition, by providing the through holes on the end surface of the housing 110, the convection between the outside world and the heat dissipation fan 128 is facilitated, and the heat dissipation fan 128 is protected to prevent foreign matter from affecting the normal operation of the heat dissipation fan 128. The through holes may be circular holes, fan-shaped holes, or diamond-shaped holes, etc., and are not specifically limited by the embodiments of the present application.
[0048] In an optional embodiment of the present application, a magnetic member 170 or an adhesive is further provided on the end surface of the shell 110, and the magnetic member 170 or the adhesive is located on the outer circle of the end surface.
[0049] By adopting the above method, when the electronic device is relatively small, such as a mobile phone, it can be connected to the back cover of the mobile phone through the connecting component 130 so that the heat dissipation module 120 can dissipate heat for the mobile phone. At the same time, the mobile phone can be fixed on the bracket through the radiator 100. When fixed, it can be connected through the magnetic part 170 or the adhesive on the end face, thereby improving the applicability during use.
[0050] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.
Claims
1. A radiator, characterized in that: It includes: a shell, and a heat dissipation module and a connecting component connected to the shell, the heat dissipation module includes a connecting frame connected to the shell, a heat conductive sheet and a heat dissipation frame connected to the connecting frame, and a heat dissipation fan arranged in the heat dissipation frame, wherein the heat dissipation frame is connected to the heat conductive sheet, and the connecting component can move relative to the heat dissipation module so that the heat conductive sheet protrudes from the connecting component, or the heat conductive sheet is flush with the end of the connecting component.
2. The heat sink according to claim 1, characterized in that: The connecting frame includes a first connecting part, a second connecting part and a third connecting part which are connected in sequence, the first connecting part is connected to the shell, the heat conducting plate is located at the third connecting part, the connecting component is located at the outer ring of the second connecting part, and the connecting component can move along the axial direction of the second connecting part.
3. The heat sink according to claim 2, characterized in that: The connecting component includes an adjusting frame, and a magnetic attraction member, an adhesive member or a clamping member arranged on the adjusting frame, and the connecting component is threadedly connected to the second connecting part through the adjusting frame.
4. The heat sink according to claim 3, characterized in that: When the magnetic attraction component is arranged on the adjustment frame, the adjustment frame includes an annular frame body, an annular groove is arranged on the annular frame body, and the magnetic attraction component is located in the annular groove; the outer ring of the second connecting part is provided with a thread, the inner ring of the annular frame body is provided with a clamping protrusion clamped with the thread, the annular frame body is also provided with an annular rib, and the shell is provided with an avoidance groove corresponding to the annular rib.
5. The heat sink according to claim 4, characterized in that: The annular frame is also provided with a cover plate, and the cover plate is arranged on the annular groove to cover the magnetic attraction component.
6. The heat sink according to claim 2, characterized in that: The connecting assembly includes an adjusting frame, which includes an annular frame body, on which a magnetic attraction part, an adhesive part or a clamping part is provided, and an annular frame body is also provided with an annular rib, on which a buckle is provided, and the shell is provided with a first card slot and a second card slot corresponding to the buckle, and the shell is also provided with a connecting column for connecting the first connecting part, the buckle can be clamped in the first card slot, and an elastic part is provided on the connecting column, and one end of the elastic part is elastically abutted against the annular rib, so that when the buckle is released from the first card slot, the buckle can slide in the second card slot.
7. The radiator according to any one of claims 2 to 6, characterized in that: The radiator also includes a wireless charging module, which includes an iron core arranged in the third connecting portion, and a coil stacked and wound around the outer circle of the iron core, the iron core and the coil are respectively attached to the thermal conductive sheet, so that the heat sink is connected to the thermal conductive sheet through the wireless charging module, and the coil is electrically connected to the circuit board of the radiator.
8. The heat sink according to claim 7, characterized in that: The heat dissipation frame includes a heat conductive base and a plurality of heat dissipation fins arranged on the heat conductive base, wherein the heat conductive base and the heat dissipation fins form an accommodation space for accommodating the heat dissipation fan; The heat sink also includes a heat-conducting block, and the heat-conducting base is connected to the iron core through the heat-conducting block.
9. The heat sink according to claim 8, characterized in that: The outer ring of the shell is provided with a plurality of strip holes, and the strip holes correspond to the heat sinks; the end surface of the shell is also provided with a plurality of through holes, and the through holes correspond to the heat dissipation fans.
10. The radiator according to any one of claims 2 to 6, characterized in that: A magnetic part or an adhesive is also arranged on the end surface of the shell, and the magnetic part or the adhesive is located on the outer circle of the end surface.