Image sensor packaging structure

Abstract

The utility model discloses an image sensor packaging structure, and relates to the technical field of semiconductor chip packaging, and the sensor packaging structure comprises a substrate and a sensing chip disposed on the substrate. The sensor packaging structure further comprises a plurality of leads electrically connected with the substrate and the sensing chip, and a transparent cover plate covering the sensing chip, the transparent cover plate is integrally formed by a light-transmitting area and a supporting part, the transparent cover plate is fixed on the sensing chip through a filling adhesive layer, and the transparent cover plate is fixed on the sensing chip through the filling adhesive layer. The risk that the sensing area is possibly polluted by the adhesive due to the fact that the adhesive is adopted to form the supporting dam can be avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip packaging technology, and in particular to an image sensor packaging structure. Background Art

[0002] The sensor chip packaging structure consists of a sensor chip mounted on a substrate and packaging materials. The sensor chip is covered with a light-transmitting sheet that allows external light to pass through to achieve sensing purposes.

[0003] In the current production process, a support dam is formed by adhesive, and a transparent sheet is placed before the adhesive is cured; this process may bring the risk of the adhesive contaminating the sensing area of ​​the sensing chip. Utility Model Content

[0004] In view of this, the image sensor packaging structure provided in the first aspect of the present application can prevent the adhesive forming the support dam from contaminating the sensing area of ​​the sensing chip, and specifically adopts the following technical solutions:

[0005] Image sensor packaging structure, including:

[0006] a substrate, the substrate having a first bottom surface and a second bottom surface opposite to the first bottom surface;

[0007] A sensing chip, wherein the sensing chip has a first surface and a second surface opposite to the first surface, the sensing chip is disposed on the first bottom surface, and the first surface of the sensing chip has a sensing area;

[0008] A transparent cover plate, the transparent cover plate comprising a light-transmitting area, the light-transmitting area being located above the sensing area;

[0009] A plurality of leads electrically connecting the substrate and the sensing chip;

[0010] The transparent cover plate further includes a support portion; the light-transmitting area and the support portion are integrally formed; the support portion and the light-transmitting area form a cavity, and the sensing area is located in the cavity; the support portion is placed above the outer area of ​​the sensing area of ​​the sensing chip;

[0011] A filling glue layer, covering the lead, the outer side surface of the transparent cover plate, the first surface of the sensing chip outside the transparent cover plate, the outer side surface of the sensing chip, and the first bottom surface outside the sensing chip;

[0012] The transparent cover plate is fixed on the sensing chip through the filling glue layer.

[0013] In some embodiments, the transparent cover is further provided with an enclosing light-shielding structure, which is used to eliminate glare, and the enclosing light-shielding structure is arranged on the lower surface of the light-transmitting area.

[0014] In some embodiments, the surrounding light-shielding structure is disposed on the upper surface of the light-transmitting area.

[0015] In some embodiments, the transparent cover plate further includes a top groove, which is arranged around the upper surface of the light-transmitting area and is retracted from the outer side of the supporting portion, and the inner edge of the top groove does not exceed the projection area of ​​the sensing area.

[0016] In some embodiments, the lower end of the support portion of the transparent cover is inwardly contracted to form a bottom groove.

[0017] In some embodiments, the substrate also includes a side panel integrally connected to the outer top surface portion of the substrate, and a filling glue layer is also filled in a filling cavity formed between the inner side surface of the side panel and the first bottom surface of the substrate, the outer side surface of the sensing chip, and the outer side surface of the transparent cover plate. The filling glue layer covers the lead, the inner side surface of the side panel, the outer side surface of the sensing chip, and the outer side surface of the transparent cover plate, and the top surface of the filling glue layer does not exceed the top surface of the light-transmitting area.

[0018] In some embodiments, the supporting portion of the transparent cover is continuous or discontinuous.

[0019] Beneficial effects of this application:

[0020] 1) Compared with the prior art that forms a support dam by adhesive, a transparent sheet is placed before the adhesive is cured;

[0021] 2) The present application adopts a transparent cover plate in which the support portion and the light-transmitting area are integrally formed, and the transparent cover plate is fixed on the sensing chip by a packaging adhesive on the outer layer of the transparent cover plate, thereby avoiding the risk of the adhesive contaminating the sensing area caused by forming a support dam with an adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a cross-sectional view of an image sensor packaging structure in which a top groove is arranged on the upper surface surrounding the light-transmitting area as described in Embodiment 1 of the present application;

[0023] Figure 2 is a cross-sectional view of the image sensor packaging structure in which a bottom groove is set inwardly at the bottom of the support portion as described in Embodiment 1 of the present application;

[0024] Figure 3 It is a cross-sectional view of an image sensor packaging structure in which the transparent cover plate described in Embodiment 2 of the present application is provided with both a top groove and a bottom groove.

[0025] In the figure: 10-substrate, 11-first bottom surface, 12-second bottom surface, 13-side plate, 131-inner side surface of side plate, 20-sensing chip, 21-sensing area, 22-connecting area, 23-outer side surface of sensing chip, 30-lead, 31-substrate metal pad, 32-chip metal pad, 40-transparent cover, 41-light-transmitting area, 42-supporting part, 43-top groove, 44-bottom groove, 411-upper surface, 412-lower surface, 45-projection area, 46-outer side surface of transparent cover, 50-light-shielding structure, 60-filling glue layer. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described in the present application are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0027] Example 1

[0028] like Figure 1 As shown, the image sensor packaging structure described in the present application includes:

[0029] A substrate 10, the substrate having a first bottom surface 11 and a second bottom surface 12 opposite to the first bottom surface;

[0030] A sensing chip 20, wherein the sensing chip has a first surface and a second surface opposite to the first surface, the second surface of the sensing chip is disposed on the first bottom surface 11, and the first surface of the sensing chip has a sensing area 21;

[0031] A transparent cover plate 40, wherein the transparent cover plate includes a light-transmitting area 41, and the light-transmitting area 41 is located above the sensing area 21;

[0032] A plurality of leads 30 electrically connecting the substrate metal pad 31 and the chip metal pad 32 of the sensing chip;

[0033] The transparent cover plate 40 further includes a support portion 42; the light-transmitting area and the support portion are integrally formed; the support portion and the light-transmitting area form a cavity, and the sensing area 21 is located in the cavity; the support portion is placed above the outer area of ​​the sensing area of ​​the sensing chip;

[0034] A filling glue layer 60, covering the lead 30, the outer side surface 46 of the transparent cover, the first surface of the sensing chip outside the transparent cover, the outer side surface 23 of the sensing chip, and the upper part of the first bottom surface 11 outside the sensing chip;

[0035] The transparent cover plate 40 is fixed on the sensing chip 20 through the filling adhesive layer 60 .

[0036] The upper surface 411 , the lower surface 412 , and the support portion 42 of the transparent cover plate 40 are integrally formed.

[0037] The supporting portion 42 of the transparent cover plate may be continuous or discontinuous.

[0038] When the support portion 42 is continuous, it can surround the sensing area 21 to form protection and prevent the filling glue layer from contaminating the sensing area;

[0039] When the support portion 42 is discontinuous, the air pressure in the cavity formed by the lower surface 412 of the light-transmitting area, the inner surface of the support portion 42 and the first surface of the sensing chip can be released to avoid expansion due to high temperature in subsequent processes.

[0040] The transparent cover plate 40 can be made of other transparent and light-transmitting materials such as transparent glass and transparent plastic.

[0041] An enclosing shading portion 50 is also provided at the junction of the lower surface 412 of the light-transmitting area and the inner edge of the supporting portion. The inner edge of the enclosing shading portion 50 does not interfere with the sensing area of ​​the sensing chip. Specifically, the inner edge of the enclosing shading portion 50 does not exceed the projection area 45 of the sensing area. The shading structure 50 is used to prevent external light from being reflected through the supporting portion to the sensing area to eliminate glare. Moreover, since the shading structure is located in the cavity formed by the transparent cover plate and the sensing chip, the external environment can be prevented from affecting the shading structure and causing it to fall off or wear, thereby improving its durability and stability.

[0042] The surrounding light shielding portion 50 can be formed by photoresist, silk screen printing or the like.

[0043] A plurality of chip metal pads 32 corresponding to the substrate metal pads are also provided on the connection area 22 located outside the support portion 42, and leads 30, such as gold wires, are connected between the corresponding plurality of substrate metal pads 31 and the chip metal pads 32 to achieve electrical connection between the substrate 10 and the sensing chip 20. The connection area 22 is an area of ​​the first surface of the sensing chip 20 outside the sensing area 21.

[0044] See also Figure 1The substrate 10 also includes a side plate 13 integrally connected to the outer top surface of the substrate 10, and a filling chamber is formed between the inner side surface 131 of the side plate and the first bottom surface 11 of the substrate, the outer side surface 23 of the sensing chip, and the outer side surface 46 of the transparent cover plate, and the filling chamber is filled with a filling glue layer 60.

[0045] The transparent cover plate 40 is of surrounding type. No adhesive layer may be provided between the bottom of the transparent cover plate and the sensing chip. The transparent cover plate 40 is fixed to the connection area of ​​the sensing chip by a filling adhesive layer 60 .

[0046] See also Figure 1 The transparent cover plate 40 also includes a top groove 43 which is arranged around the upper surface 411 of the light-transmitting area and is retracted from the outer side of the support portion 42; the top groove 43 can be retracted to be aligned with the inner edge of the surrounding light-shielding portion 50; when the filling glue layer 60 is filled, the filling glue layer 60 will fill the top groove 43, and when the filling glue layer 60 is not light-transmitting, the top groove 43 can play a corresponding light-shielding effect with the surrounding light-shielding portion 50.

[0047] See also Figure 2 The lower end of the support portion 42 of the transparent cover plate 40 is retracted to form a bottom groove 44. When the filling glue layer 60 is filled, the filling glue layer 60 will fill the bottom groove, and to a certain extent, increase the firmness of the connection between the transparent cover plate 40 and the sensing chip.

[0048] Example 2

[0049] See also Figure 3 The transparent cover plate may be provided with both a top groove 43 and a bottom groove 44. When the top groove 43 is provided and the top groove 43 is filled with a light-proof filling glue layer 60, the surrounding light-shielding portion 50 may not be provided.

[0050] Example 3

[0051] The surrounding light shielding layer 50 may also be formed on the upper surface 411 of the transparent cover plate, and the surrounding light shielding layer 50 does not interfere with the sensing area of ​​the sensing chip.

Claims

1. Image sensor packaging structure, a substrate, the substrate having a first bottom surface and a second bottom surface opposite to the first bottom surface; A sensing chip, the sensing chip having a first surface and a second surface opposite to the first surface, the sensing chip being disposed on the first bottom surface, and the first surface of the sensing chip having a sensing area; A transparent cover plate, the transparent cover plate comprising a light-transmitting area, the light-transmitting area being located above the sensing area; A plurality of leads electrically connecting the substrate and the sensing chip; Features: The transparent cover plate further includes a support portion; the light-transmitting area and the support portion are integrally formed; the support portion and the light-transmitting area form a cavity, and the sensing area is located in the cavity; the support portion is placed above the outer area of ​​the sensing area of ​​the sensing chip; A filling glue layer, covering the lead, the outer side surface of the transparent cover plate, the first surface of the sensing chip outside the transparent cover plate, the outer side surface of the sensing chip, and above the first bottom surface outside the sensing chip; The transparent cover plate is fixed on the sensing chip through the filling glue layer.

2. The image sensor packaging structure according to claim 1, characterized in that: The transparent cover is also provided with an enclosing light-shielding structure, which is used to eliminate glare and is arranged on the lower surface of the light-transmitting area.

3. The image sensor packaging structure according to claim 2, characterized in that: The surrounding light-shielding structure is arranged on the upper surface of the light-transmitting area.

4. The image sensor packaging structure according to claim 1, wherein: The transparent cover plate further includes a top groove, which is arranged around the upper surface of the light-transmitting area and is retracted from the outer side of the supporting portion. The inner side edge of the top groove does not exceed the projection area of ​​the sensing area.

5. The image sensor packaging structure according to claim 1, wherein: The lower end of the supporting portion of the transparent cover is inwardly contracted to form a bottom groove.

6. The image sensor packaging structure according to claim 1, characterized in that: The substrate also includes a side plate integrally connected to the outer top surface of the substrate, and a filling glue layer is also filled in a filling cavity formed between the inner side surface of the side plate and the first bottom surface of the substrate, the outer side surface of the sensing chip, and the outer side surface of the transparent cover plate. The filling glue layer covers the lead, the inner side surface of the side plate, the outer side surface of the sensing chip, and the outer side surface of the transparent cover plate, and the top surface of the filling glue layer does not exceed the top surface of the light-transmitting area.

7. The image sensor packaging structure according to claim 1, characterized in that: The supporting portion of the transparent cover plate is continuous or discontinuous.

Images