Light-emitting device

Abstract

The utility model provides a light-emitting device. The light-emitting device includes a printed circuit board, a conductive connecting member (solder), and a light-emitting diode. The printed circuit board includes a printed circuit board soldering pad, an ink layer, and a conductive circuit layer. The ink layer is arranged on the conductive circuit layer. The conductive connecting member (solder) is arranged on the printed circuit board soldering pad of the printed circuit board. The light-emitting diode is arranged on the ink layer and the conductive connecting member (solder). The light-emitting diode includes a light-emitting diode soldering pad. The conductive connecting member (solder) connects the light-emitting diode soldering pad and the printed circuit board soldering pad. The ink layer covers part of the printed circuit board soldering pad.

Description

Technical Field

[0001] The utility model relates to a light emitting device, and in particular to a light emitting device comprising a light emitting diode (LED) arranged on a printed circuit board. Background Art

[0002] Light-emitting diodes are widely used in light-emitting devices. Generally, such light-emitting devices may include a printed circuit board. In addition, one or more light-emitting diodes may be arranged on the printed circuit board and electrically connected to the printed circuit board through a conductive connector (solder) such as solder. For example, solder may be provided on the printed circuit board pad first, and then the light-emitting diode pad may be aligned with the solder, and the light-emitting diode may be placed on the printed circuit board in this way, and then the solder may be heated and cured to fix the light-emitting diode. However, in such a process, the solder is still in a flowable state when the light-emitting diode is placed on the printed circuit board, resulting in the inability to provide sufficient support for the light-emitting diode, so that the solder may be deformed by the weight of the light-emitting diode thereon during the curing process, and the expected thickness and light-emitting diode tilt cannot be achieved. This situation may affect the performance of the product. Utility Model Content

[0003] The utility model aims to avoid the situation that a conductive connecting member (solder) such as solder is affected by the weight of a light emitting diode thereon during the curing process and fails to reach an expected thickness.

[0004] The utility model provides a light-emitting device. The light-emitting device includes a printed circuit board, a conductive connecting member (solder), and a light-emitting diode. The printed circuit board includes a printed circuit board soldering pad, an ink layer, and a conductive circuit layer. The ink layer is arranged on the conductive circuit layer. The conductive connecting member (solder) is arranged on the printed circuit board soldering pad of the printed circuit board. The light-emitting diode is arranged on the ink layer and the conductive connecting member (solder). The light-emitting diode includes a light-emitting diode soldering pad. The conductive connecting member (solder) connects the light-emitting diode soldering pad and the printed circuit board soldering pad. The ink layer covers part of the printed circuit board soldering pad.

[0005] Therein, the light emitting diode can contact the ink layer and the conductive connection (solder).

[0006] The ink layer may have a first portion and a second portion. The thickness of the second portion is greater than the thickness of the first portion. The light emitting diode may be arranged on the second portion of the ink layer and the conductive connecting member (solder).

[0007] The second part covers a portion of the soldering pad of the printed circuit board.

[0008] Among them, the ink layer may include a first ink layer and a second ink layer. The second ink layer is disposed on the first ink layer. The first ink layer alone constitutes the first part of the ink layer. The first ink layer and the second ink layer together constitute the second part of the ink layer.

[0009] Among them, the second part may be in a square shape with a missing side.

[0010] Among them, the second part may be in a shape like the Chinese character "工".

[0011] Among them, the ink layer may cover the edge of the printed circuit board pad.

[0012] Among them, the ink layer may cover the corner of the printed circuit board pad.

[0013] Among them, the thickness of the conductive connection member (solder) may be 40 microns or more.

[0014] The utility model provides additional support for the light-emitting diode in the manufacturing process through the ink layer, sharing the pressure of the conductive connection member (solder) such as solder, and preventing it from deforming due to the weight of the light-emitting diode and failing to reach the expected thickness.

[0015] In order to have a better understanding of the above and other aspects of the utility model, specific embodiments are given below and described in detail in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1A-Figure 1D is a schematic diagram of a specific example of the light-emitting device of the utility model;

[0017] Figure 2A-2E is a schematic diagram of another specific example of the light-emitting device of the utility model.

[0018] Among them, reference numerals:

[0019] 10: Printed circuit board

[0020] 11: Printed circuit board pad

[0021] 12: Conductive circuit layer

[0022] 20: Light-emitting diode

[0023] 21: Light-emitting diode pad

[0024] 30: Conductive connection member (solder)

[0025] 40, 40': Ink layer

[0026] 40A, 40A': First part

[0027] 40B, 40B': Second part

[0028] 41, 41': first ink layer

[0029] 42,42': second ink layer

[0030] A: Arrow

[0031] t1: thickness

[0032] t2: thickness DETAILED DESCRIPTION

[0033] The technical content of the embodiment of the utility model will be described more clearly and completely below. In the utility model, similar symbols are used to represent corresponding components. In the utility model, if it involves "first", "second" and other descriptions, it is only used for the purpose of convenient distinction in description, and cannot be understood as indicating or implying its relative importance or manufacturing assembly order, nor can it be understood as implying the number of technical features described. The appearance and structure of the components in the accompanying drawings are only used for examples to facilitate understanding, and cannot be understood as limitations on the utility model unless otherwise specified. In addition, the size ratio of the components in the accompanying drawings may not be drawn in proportion to the actual product. In order to avoid blurring the focus, the embodiments and drawings may not provide all the details. It can be understood that the described embodiments are only embodiments of a part of the utility model, and do not represent all possible embodiments. The components, structures, features, etc. in one embodiment may be applied to another embodiment or combined with another embodiment as long as they do not affect the efficacy, and will not be repeated here.

[0034] The utility model provides a light-emitting device. The light-emitting device includes a printed circuit board, a conductive connecting member (solder), and a light-emitting diode. The printed circuit board includes a printed circuit board soldering pad, an ink layer, and a conductive circuit layer. The ink layer is arranged on the conductive circuit layer. The conductive connecting member (solder) is arranged on the printed circuit board soldering pad of the printed circuit board. The light-emitting diode is arranged on the ink layer and the conductive connecting member (solder). The light-emitting diode includes a light-emitting diode soldering pad. The conductive connecting member (solder) connects the light-emitting diode soldering pad and the printed circuit board soldering pad. The ink layer covers part of the printed circuit board soldering pad.

[0035] Please see Figure 1A-Figure 1D , which shows a specific example of the light-emitting device of the utility model, wherein, Figure 1A is a top view of the entire light emitting device, Figure 1B The printed circuit board pad and ink layer (not shown) Figure 1A A top view of a light emitting diode and conductive connections (solder). Figure 1C It is along Figure 1A and Figure 1B The cross-section of the 1-1' line, Figure 1D It is along Figure 1A and Figure 1BSection view along the 2-2' line.

[0036] The light emitting device includes a printed circuit board 10. The printed circuit board 10 may include a printed circuit board pad 11, a conductor circuit layer 12, and an ink layer 40. The printed circuit board pad 11 is, for example, located at a position corresponding to the position of the light emitting diode 20. In this case, for example, two printed circuit board pads 11 may be provided corresponding to one light emitting diode 20.

[0037] The light emitting diode 20 of the light emitting device is arranged on the printed circuit board 10. More specifically, the light emitting diode 20 is arranged on the printed circuit board 10 through the conductive connection member (solder) 30. At the same time, the light emitting diode 20 of the present invention is also supported by the ink layer 40. In other words, the light emitting diode 20 of the present invention is arranged on the ink layer 40 and the conductive connection member (solder) 30, and then arranged on the printed circuit board 10. The light emitting diode 20 can contact the ink layer 40 and the conductive connection member (solder) 30 at the same time. The light emitting diode 20 includes a light emitting diode pad 21. One light emitting diode 20 includes two light emitting diode pads 21, for example.

[0038] The conductive connector (solder) 30 is disposed on the printed circuit board pad 11 of the printed circuit board 10. The conductive connector (solder) 30 connects the light-emitting diode pad 21 and the printed circuit board pad 11. The conductive connector (solder) 30 is, for example, a connector formed after solidification of solder or the like, but is not limited thereto. In the case of using solder to form the conductive connector 30, since the solder still retains flow properties before solidification, the formed conductive connector (solder) 30 may have a portion with an irregular contour. The thickness of the conductive connector (solder) 30 can be determined according to customer needs. For example, the thickness of the conductive connector (solder) 30 can be more than 40 microns, but is not limited thereto.

[0039] Let's go back to the printed circuit board 10. The ink layer 40 is disposed on the conductor circuit layer 12. The ink layer 40 covers the conductor circuit layer 12 and part of the printed circuit board pad 11. More specifically, the ink layer may have a first portion 40A and a second portion 40B. The first portion 40A has a thickness t1. The second portion 40B has a thickness t2. The thickness t2 of the second portion 40B is greater than the thickness t1 of the first portion 40A. . The light emitting diode 20 may be disposed on the second portion 40B of the ink layer 40 and the conductive connector (solder) 30. Accordingly, the second portion 40B of the ink layer 40 also covers part of the printed circuit board pad 11, as indicated by arrow A. According to some embodiments, an ink layer 40 having different thicknesses at different positions may be formed by secondary coating of ink. In this case, the ink layer 40 may include a first ink layer 41 and a second ink layer 42. The second ink layer 42 is disposed on the first ink layer 41. The first ink layer 41 alone constitutes the first portion 40A of the ink layer 40. The first ink layer 41 and the second ink layer 42 together constitute the second portion 40B of the ink layer 40. In this example, the second portion 40B (especially when viewed from above) may be in the shape of a square. And, as indicated by arrow A, the ink layer 40 (the second portion 40B) covers the edge of the printed circuit board pad 11.

[0040] Please see Figure 2A-2E , which shows another specific example of the light-emitting device of the utility model, wherein, Figure 2A is a top view of the entire light emitting device, Figure 2B The printed circuit board pad and ink layer (not shown) Figure 2A A top view of a light emitting diode and conductive connections (solder). Figure 2C It is along Figure 2A and Figure 2B The cross-section of the 1-1' line, Figure 2D It is along Figure 2A and Figure 2B The cross-section of the 2-2' line, Figure 2E It is along Figure 2A and Figure 2B Section view along the 3-3' line.

[0041] This example is similar to Figure 1A-Figure 1DThe difference from the example is that the first ink layer 41' and the second ink layer 42' of the ink layer 40' are formed in different shapes. Therefore, the second part 40B' of the ink layer 40' is in an I-shape. And, as indicated by arrow A, the ink layer 40' (the second part 40B') covers the corner of the printed circuit board pad 11. Other details of the first part 40A' and the second part 40B' of the ink layer 40' are similar to the first part 40A and the second part 40B of the ink layer 40. Similarly, the conductive connection (solder) 30 (between the light emitting diode 20 and the printed circuit board 10) can be supported by the second ink layer 42'. Figure 2D ) can be maintained at a desired thickness. In addition, other Figure 1A-Figure 1D The same details as the examples will not be repeated.

[0042] The utility model has proposed a number of examples so far, illustrating that the ink layer provides additional support for the light-emitting diode in the manufacturing process, shares the pressure of the conductive connecting member (solder) such as solder, and prevents it from deforming due to the weight of the light-emitting diode and failing to reach the expected thickness, thereby forming a new light-emitting device structure. For example, Figure 1A-Figure 1D The example may be applicable to situations where the overall component size is small and it is not easy to provide additional ink between the pad gaps. Figure 2A-2E The example may be applicable to situations where the overall component size is larger and more support is desired under the light-emitting diode.

[0043] Of course, the present invention may have many other implementation schemes. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims of the present invention.

Claims

1. A light emitting device, characterized in that: include: A printed circuit board, the printed circuit board comprising a printed circuit board pad, an ink layer, and a conductive circuit layer, wherein the ink layer is disposed on the conductive circuit layer; a conductive connector disposed on the printed circuit board pad of the printed circuit board; and A light emitting diode, disposed on the ink layer and the conductive connecting member, the light emitting diode comprising a light emitting diode pad; Wherein, the conductive connecting member connects the light emitting diode pad and the printed circuit board pad; Wherein, the ink layer covers a portion of the printed circuit board pad.

2. The light emitting device according to claim 1, characterized in that: The light emitting diode contacts the ink layer and the conductive connection.

3. The light emitting device according to claim 1, characterized in that: The ink layer has a first portion and a second portion, the thickness of the second portion is greater than the thickness of the first portion, wherein the light emitting diode is arranged on the second portion of the ink layer and the conductive connecting member.

4. The light emitting device according to claim 3, characterized in that: The second portion covers a portion of the printed circuit board pad.

5. The light emitting device according to claim 3, characterized in that: The ink layer includes a first ink layer and a second ink layer, wherein the second ink layer is disposed on the first ink layer, the first ink layer alone constitutes the first part of the ink layer, and the first ink layer and the second ink layer together constitute the second part of the ink layer.

6. The light emitting device according to claim 3, characterized in that: The second part is in a mouth shape.

7. The light emitting device according to claim 3, characterized in that: The second portion is in an I-shape.

8. The light emitting device according to claim 1, characterized in that: The ink layer covers the edge of the printed circuit board pad.

9. The light emitting device according to claim 1, characterized in that: The ink layer covers the corners of the printed circuit board pads.

10. The light emitting device according to claim 1, characterized in that: The thickness of the conductive connecting member is greater than 40 microns.

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