Base, packaging box, chip packaging structure and superconducting quantum computer

Abstract

The utility model discloses a base, a packaging box, a chip packaging structure and a superconducting quantum computer, and belongs to the field of quantum computer manufacturing. The base comprises a body and a plurality of supporting bodies. Wherein the body is provided with a containing groove defined by a bottom wall and a side wall, and the bottom wall is provided with a plurality of blind holes. The supporting body is provided with a first column section, a second column section and a third column section which are sequentially connected in the axial direction. Along the axial projection of the supporting body, the projection patterns of the first column section and the third column section are both located in the projection pattern of the second column section, and the first column section is detachably connected with the body through the blind hole. According to the base, the internal structure of the packaging box can be adjusted by combining and using different numbers of supporting bodies or supporting bodies in different arrangement modes, so that the packaging box can be suitable for various chips or multiple test requirements.

Description

Technical Field

[0001] The present application belongs to the field of quantum computing technology, especially the field of quantum computer manufacturing. In particular, the present application relates to a base, a packaging box, a chip packaging structure and a superconducting quantum computer. Background Art

[0002] Superconducting quantum computers are physical devices that perform quantum computing based on the laws of quantum mechanics. As an important component of superconducting quantum computers, superconducting quantum chips are relatively fragile components and are easily affected by various electromagnetic noises, mechanical disturbances, etc., which in turn affects the signal transmission in superconducting quantum chips and the performance of performing quantum computing. Therefore, based on practical considerations, superconducting quantum chips are packaged.

[0003] However, the applicant has found that different packaging boxes have different effects on the performance and normal use of the superconducting quantum chip after packaging. Utility Model Content

[0004] The example of the present application provides a base, a packaging box, a chip packaging structure and a superconducting quantum computer. The solution can be used to implement verification tests on the internal structures of various packaging boxes, so as to more quickly and conveniently select a packaging box structure that better matches the superconducting quantum chip to be packaged.

[0005] The solution of this application example is implemented through the following contents.

[0006] In a first aspect, an example of the present application discloses a base of a packaging box for packaging a superconducting quantum chip. The base includes:

[0007] A body having a receiving groove, wherein the receiving groove is defined by a bottom wall and a side wall, and the bottom wall is provided with a plurality of blind holes; and

[0008] A plurality of support bodies, each support body having a first column segment, a second column segment and a third column segment connected in sequence along the axial direction;

[0009] Along the axial projection of the support body, the projection patterns of the first column segment and the third column segment are both located within the projection pattern of the second column segment, and the first column segment is detachably connected to the body through a blind hole.

[0010] According to some examples of the present application, the first column segment and the third column segment of all the supporting bodies are shaped as cylinders, and the second column segment of all the supporting bodies are shaped as cuboids;

[0011] Alternatively, all the first column segments and the third column segments are respectively in the shape of cylinders, the second column segments of part of the support body are in the shape of cuboids, and the remaining second column segments are in an L-shaped bending structure.

[0012] According to some examples of the present application, the base further includes a plug-in body, the plug-in body includes a strip plate, and the strip plate is provided with a plurality of plug-in parts detachably connected to the blind hole;

[0013] and / or, the plurality of blind holes are arranged in an array;

[0014] And / or, the length of the first column segment is less than the length of the third column segment.

[0015] In a second aspect, an example of the present application discloses a packaging box comprising the aforementioned base.

[0016] According to some examples of the present application, the packaging box further includes a top cover detachably connected to the base, and the top cover and the receiving groove of the base together form a packaging cavity for receiving the superconducting quantum chip.

[0017] According to some examples of the present application, the packaging box further includes a signal component;

[0018] The signal component includes: a signal board, a signal connector and a pressing plate, wherein one end of the signal connector is connected to the signal board, and the other end passes through the pressing plate along the thickness direction;

[0019] The signal plate contacts the base, and the pressure plate contacts the top cover.

[0020] According to some examples of the present application, the signal board is provided with a first avoidance hole exposing the receiving groove;

[0021] And / or, the pressing plate is provided with a second avoidance hole exposing the accommodating groove;

[0022] And / or, along the axial direction of the blind hole, the contour of the top cover is within the annular area defined by the signal connector.

[0023] According to some examples of the present application, the signal plate is provided with a first avoidance hole exposing the accommodating groove, the pressing plate is provided with a second avoidance hole exposing the accommodating groove, and the second avoidance hole is radially expanded along the axial direction of the blind hole.

[0024] According to some examples of the present application, the top cover has a conical boss matching the second avoidance hole.

[0025] In a third aspect, an example of the present application discloses a chip packaging structure.

[0026] The chip packaging structure includes:

[0027] Superconducting quantum chip; and packaging box;

[0028] The superconducting quantum chip is accommodated in the receiving groove of the base;

[0029] The superconducting quantum chip has a via hole, and the third column section of the support body passes through the via hole and supports the superconducting quantum chip.

[0030] In a fourth aspect, an example of the present application discloses a superconducting quantum computer, comprising the above-mentioned chip packaging structure.

[0031] The body in the base of the present application example has a receiving groove capable of receiving a superconducting quantum chip, and also has a plurality of support bodies capable of being connected to a blind hole arranged in the receiving groove. Since the support body is detachably connected to the body through the blind hole, it is possible to freely combine support bodies of different numbers and configuration positions, thereby changing the internal structure of the base.

[0032] Accordingly, the internal space structure of the packaging box manufactured by the base also changes accordingly, and the cavity mode of the internal space changes accordingly. In this way, when the superconducting quantum chip is packaged therein, the cavity mode frequency can be changed to different values, so that the mutual influence between the internal structure of the packaging box with different structural forms and the superconducting quantum chip can be examined, and the packaging box that is more compatible with the chip can be screened out more quickly.

[0033] Therefore, by using the base disclosed in the examples of this application and the manufactured products formed based thereon, the performance of the superconducting quantum chip after packaging can be less affected, and it is also helpful to manufacture high-quality superconducting quantum computers in a shorter period of time. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] For a clearer explanation, the following briefly introduces the drawings required for the description.

[0035] Figure 1 This is a schematic diagram of the structure of the base used as an example in this application;

[0036] Figure 2 Public Figure 1 A schematic diagram of the structure of the body in the base;

[0037] Figure 3 Public Figure 1 A schematic diagram of the structure of the support body in the base;

[0038] Figure 4 A schematic structural diagram of another support body in an example of the present application is disclosed;

[0039] Figure 5 A schematic structural diagram of the plug-in body in the example of the present application is disclosed;

[0040] Figure 6 This is a schematic diagram of the structure of the packaging box used as an example in this application;

[0041] Figure 7 A schematic structural diagram of a signal component in a packaging box according to an example of the present application is disclosed;

[0042] Figure 8A schematic diagram of an exploded structure of a signal component in a packaging box of an example of the present application is disclosed;

[0043] Fig. 9 Public Figure 7 A schematic structural diagram of the top cover in the signal assembly shown in another perspective;

[0044] Fig.10 A schematic diagram of a chip packaging structure according to an example of the present application is disclosed;

[0045] Fig.11 for Fig.10 The cross-sectional structural diagram of the chip packaging structure shown.

[0046] Explanation of the reference numerals: 100-base; 101-main body; 102-support body; 102a-support body; 102b-support body; 1011-accommodating groove; 1012-blind hole; 1023-first column section; 1022-second column section; 1022b-second column section; 1021-third column section; 103-plug-in body; 1031-plug-in part; 200-packaging box; 201-top cover; 300-signal component; 301-signal board; 302-pressing plate; 303-signal connector; 304-second avoidance hole; 305-slope; 211-conical boss; 400-chip packaging structure; 401-superconducting quantum chip. DETAILED DESCRIPTION

[0047] After being manufactured, the superconducting quantum chip needs to be packaged in order to protect it (in terms of physical and electromagnetic environment). However, in practice, the applicant has found that the cavity mode in the packaging structure may also cause potential adverse effects on the chip. Therefore, it is chosen to control the cavity film in order to widen the gap between the cavity mode frequency and the frequency of the superconducting quantum bit, thereby reducing the impact of the cavity mode on the superconducting quantum bit. For example, by increasing the cavity mode frequency, the detuning amount between the cavity mode and the bit is increased.

[0048] Specifically, for a superconducting quantum chip, its performance in executing quantum computing is directly related to the degree to which the superconducting quantum bits in the chip are interfered with by electromagnetic noise from the external environment.

[0049] Therefore, in order to minimize the interference of environmental noise on superconducting quantum bits, the superconducting quantum chip is placed in a packaging box, and the packaging box is placed in an extremely low temperature dilution refrigerator environment.

[0050] For superconducting quantum chips, the packaging box is mostly made of metal materials such as aluminum. The internal space of the packaging box can be a microwave resonant cavity, so it has a corresponding resonant cavity frequency, which may have a substantial negative impact on the superconducting quantum bits in the superconducting quantum chip.

[0051] That is, when the resonant frequency of the internal cavity structure of the packaging box (which will form a resonant cavity mode related to microwave signal transmission) resonates with the frequency of the superconducting quantum bit, or when the detuning between the two is small, it will have a greater impact on the superconducting quantum bit.

[0052] For example, when the aforementioned problem occurs, the energy of the superconducting quantum bit may be dissipated through the signal path formed by resonance with the encapsulation box, thereby causing the coherence time of the quantum bit to decrease.

[0053] In addition, when the internal cavity structure of the encapsulation box is coupled with the control lines of the superconducting quantum bits, etc., serious crosstalk may also occur between the control lines of different superconducting quantum bits through the cavity mode of the encapsulation box.

[0054] Through practice, the applicant found that the larger the volume of the internal cavity structure of the encapsulation box, the smaller the eigenmode frequency of the cavity mode will be. In addition, if the frequency of the lowest-order mode of the cavity mode of the internal cavity corresponding to the encapsulation box is lower than the frequency of the superconducting qubit, it may cause the higher-order mode corresponding to the encapsulation box to enter the frequency range of the superconducting qubit. Based on this, in actual engineering, the applicant chooses to optimize the encapsulation box so that the lowest-order mode frequency of the cavity mode inside it is greater than the frequency of the superconducting qubit of the superconducting qubit (that is, the detuning amount between the cavity mode and the frequency of the bit is large), so that the cavity mode will not have an adverse effect on the superconducting qubit.

[0055] The internal cavity of the package box is described by a waveguide rectangular cavity model. The package box will form a specific cavity mode, and the frequency calculation formula of different submodes is:

[0056]

[0057] Where n, m, p are integers representing different cavity modes, such as TE mode or TM mode. For example, the mode can be TE110 mode or other modes. lx, ly, lz represent the size of the cavity inside the package box in the rectangular coordinate system. ∈ and μ represent the dielectric constant and magnetic permeability of the medium in the package box, respectively. Therefore, the larger the size of the package box, the smaller the frequencies of different modes of the package box.

[0058] On the other hand, when the internal space cavity of the package box is used as a resonant cavity, it is equivalent to an LC parallel circuit as an eigencircuit model. The top cover and base structure of the package box are equivalent to the two plates of the first capacitor C, and the side plate of the package box is equivalent to the first inductor L. Therefore, the resonant frequency of the eigencircuit model satisfies

[0059] The lowest submode frequency of the spatial resonance corresponding to the packaging box corresponds to a resonance frequency, and the lowest submode frequency of the spatial resonance corresponding to the packaging box is equal to the resonance frequency.

[0060] The aforementioned intrinsic circuit model can be changed by the base support, for example, the specific expression of LC therein can be changed, thereby changing the f frequency.

[0061] Considering that different structural forms within the packaging box may form different cavity modes, and different chips may have different bit layouts and corresponding circuit configurations in the chips, it may be necessary to set up multiple sets of cavity frequency adjustment structural schemes for different chips, resulting in low utilization of the packaging box and a long scheme verification cycle.

[0062] Based on this situation, the applicant proposed a packaging solution optimized by structural improvement. In the example, the applicant outlined a base, and built a packaging box based on it, and further disclosed a chip packaging structure and a superconducting quantum computer implemented by using the packaging box.

[0063] For example, see Figure 1 The base 100 includes a body 101 and a plurality of support bodies 102. The support bodies 102 can be detachably matched with the body 101, so as to form different structures. Different cavity modes can be formed when used to construct the packaging box 200, and thus can be used to verify different solutions.

[0064] See also Figure 2 , wherein the shape of the body 101 is a rectangular planar plate structure in a top view. The body 101 also has a receiving groove 1011 formed by a depression from a surface. The receiving groove 1011 is defined by a bottom wall and a side wall, and a plurality of blind holes 1012 are provided on the bottom wall of the receiving groove 1011. The number of the blind holes 1012 can be flexibly selected according to different designs without special limitation.

[0065] Based on the shape of the placed chip, the shape of the receiving groove 1011 is designed to be a rectangle in a top view, and can also be designed to be other shapes. The depth of the receiving groove 1011 can be designed to be at least greater than the thickness of the chip, but this is not restrictive.

[0066] In order to adapt to more combinations of the support body 102, the blind hole 1012 can be designed in multiple configurations. Figure 2 In the embodiment, all the blind holes 1012 are arranged in an array, with multiple columns arranged vertically and horizontally.

[0067] As the name implies, the support body 102 is a structure for providing support; it can be made of metal material, such as aluminum material.

[0068] See also Figure 3, discloses a support body 102a. The support body 102a comprises a first column segment 1023, a second column segment 1022 and a third column segment 1021 which are sequentially connected along the axial direction.

[0069] The first column segment 1023, the second column segment 1022 and the third column segment 1021 can be designed into different shapes according to actual needs. For example, the three can be designed into a prism, a cylinder, or other forms of structures.

[0070] In particular, considering the usage (supporting the chip), the support body 102a is designed so that along the axial projection of the support body 102a, the projection patterns of the first column segment 1023 and the third column segment 1021 are both located within the projection pattern of the second column segment 1022.

[0071] In terms of usage, the first column segment 1023 of the support body 102 is detachably connected to the main body 101 through the blind hole 1012, the second column segment 1022 is used to support the chip, and the third column segment 1021 is used to pass the chip (therefore, the chip is provided with a through hole for the third column segment 1021 to pass through).

[0072] For the specific structure, please refer to Figure 3 , the first column segment 1023 and the third column segment 1021 of the support body 102 are respectively in the shape of a cylinder, and the second column segment 1022 of the support body 102 is in the shape of a cuboid. In terms of size, the structure of the support body 102 can also be designed to meet corresponding requirements. For example, in some examples, the length of the first column segment 1023 in the support body 102 is smaller than the length of the third column segment 1021. The third column segment 1021 is longer, so it can pass through the chip and extend to a position farther from the chip surface. For example, as mentioned later, in the packaging box 200, the end of the third column segment 1021 can contact the top cover 201 of the packaging box 200.

[0073] Or, for some other examples, see Figure 4 The example of the present application discloses a support body 102b, wherein the first column segment 1023 and the third column segment 1021 are respectively in the shape of cylinders, and the second column segment 1022b is in an L-shaped bending structure.

[0074] In various examples, the base 100 Figure 3 and Figure 4 The two supports 102 can be freely combined, that is, configured at the same time Figure 3 and Figure 4 The support body 102 is shown.

[0075] Furthermore, another supporting structure may be configured in the base 100, but as Figure 2 , Figure 3The difference between the support body 102 of the three-section structure of the example, the support structure can be described as a plug-in body 103. Figure 5 The base 100 may further include a plug-in body 103, the plug-in body 103 includes a strip plate, and the strip plate is provided with a plurality of plug-in parts 1031 that are detachably connected to the blind hole 1012. Figure 5 In the embodiment, the plug-in body 103 is a rectangular parallelepiped structure and has ten plug-in portions 1031 .

[0076] The plug-in body 103 may be similar to the structure of the support body 102, but does not have the structure of the third column section 1021. It is used to form a support for the chip, but does not need to pass through the chip.

[0077] Based on the above base 100, the example of the present application further discloses a packaging box 200, which includes the base 100. In different examples, the packaging box 200 can be configured with various structures according to different specific needs. For example, the packaging box 200 can be provided with a structure for fixing the base 100 to other devices, such as a fixing hole, such as a screw hole.

[0078] In order to better reduce the impact of electromagnetic signals and noise physically, refer to Figure 6 The packaging box 200 may further include a top cover 201 that is detachably connected to the base 100 . Furthermore, the top cover 201 and the receiving groove 1011 of the base 100 together form a packaging cavity for receiving the superconducting quantum chip 401 .

[0079] The top cover 201 can be connected to the base 100 by means of bolt connection, for example. Therefore, it can be understood that the top cover 201 and the base 100 are respectively provided with screw holes; or the base 100 is provided with screw holes and the top cover 201 is provided with through holes; or the top cover 201 is provided with screw holes and the base 100 is provided with through holes. In addition to bolt connection, it can also be connected by means of bolt connection, or bonding, etc.

[0080] In addition, as an adaptive design, based on the signal transmission considerations of the chip, through holes may be configured on the top cover 201 to serve as a structure for signal transmission lines and components to pass through.

[0081] Furthermore, based on the requirements of communication, control and other operations of the chip packaged in the packaging box 200, in some examples, the packaging box 200 may also include a signal component 300, see Figure 7 and Figure 8 .

[0082] The signal assembly 300 includes: a signal board 301, a signal connector 303, and a pressure plate 302. In the signal assembly 300, one end of the signal connector 303 is connected to the signal board 301, and the other end passes through the pressure plate 302 in the thickness direction. In addition, the signal board 301 contacts the base 100, and the pressure plate 302 contacts the top cover 201. That is, the signal board 301 is restricted and fixed to the base 100 by the pressure plate 302, thereby preventing it from being displaced.

[0083] Because the signal board 301 is connected to the chip through a signal line, if the signal board 301 is displaced, it may cause the risk of disconnection of the connection with the chip. In addition, in order to facilitate the fixing of the top cover 201 and the base 100, such as bolt connection, the pressure plate 302 and the signal board 301 can be configured with holes. Figure 7 ,and Figure 8 Only the holes arranged in the pressure plate 302 are shown.

[0084] Since the configuration position of the signal connector 303 is related to the positions of various circuits and components in the chip, and may also affect the configuration of other structures in the packaging box 200, such as the top cover 201, in some examples, in order to reduce interference and reduce the difficulty of assembling the packaging box 200, the configuration position of the signal connector 303 can be selectively designed.

[0085] For example, along the axial direction of the blind hole 1012, the profile of the top cover 201 is within the annular region defined by the signal connector 303. That is, in some examples, the signal connector 303 can be configured to the edge of the packaging box 200. Therefore, it can be understood that since the signal connector 303 is connected to the signal board 301 and also passes through the pressure plate 302, the connection position of the signal board 301 can be adjusted, and similarly, the position of the hole of the pressure plate 302 for the signal connector 303 to pass through can also be adjusted.

[0086] Depending on the number of connection lines required by the chip, an equal number of signal connectors 303 may be configured accordingly. Figure 7 In the embodiment, the signal connector 303 is an annular structure surrounding the edge of the packaging box 200. In other examples, multiple circles of the signal connector 303 may be provided, and it is not necessary to be designed as an annular structure.

[0087] In particular, if Figure 7 and Figure 8 As shown, the signal board 301 is provided with a first avoidance hole exposing the receiving groove 1011, and the pressing board 302 is provided with a second avoidance hole 304 exposing the receiving groove 1011. The configuration of the two avoidance holes can facilitate the installation of the chip.

[0088] Considering that the superconducting quantum chip 401 has many signal ports, there may be denser connection lines (such as bonding wires) between the chip and the signal board 301. When these bonding wires come into contact with each other or the spacing between adjacent wires is too small, serious signal crosstalk and other problems may occur. Then, in order to alleviate such problems, the connection position of the signal board 301 and the signal line of the chip can be adjusted.

[0089] As in the example of the present application, the second avoidance hole 304 provided on the pressure plate 302 is radially expanded along the axial direction of the blind hole 1012. Therefore, the inner wall of the second avoidance hole 304 has a slope 305. For the convenience of description, the structure responsible for signal transmission on the chip can be described as a (signal) port, and the structure responsible for signal transmission on the signal board 301 can be described as a pad. Corresponding to the pressure plate 302 having the second avoidance hole 304 in the form of the aforementioned slope 305, in some examples, the top cover 201 can have a conical boss 211 matching the second avoidance hole 304, such as Fig. 9 shown.

[0090] Therefore, ports in the inner circle and ports in the outer circle can be set on the chip according to different positions of the inner circle and the outer circle of the plane. Correspondingly, corresponding pads are set at different heights of the aforementioned slope 305 of the signal board 301. Therefore, ports in different circles on the chip can be connected to corresponding pads. In this way, the bonding wires between the ports and the pads can be designed in layers. That is, from different positions on the chip surface, they are set in layers to different height positions of the slope 305 of the signal board 301.

[0091] In this way, the spacing between bonding wires can be larger, so physical contact is less likely to occur, and signal crosstalk between different bonding wires is also less likely to occur.

[0092] Based on the above packaging box 200 structure, a chip packaging structure 400 is also disclosed in the example, see Fig.10 ,and Fig.11 The chip packaging structure 400 includes a superconducting quantum chip 401 and a packaging box 200. The superconducting quantum chip 401 is accommodated in a receiving groove 1011 of a base 100 in the packaging box 200. In particular, the superconducting quantum chip 401 has a via hole. Based on this, the third column segment 1021 of the support body 102 in the base 100 passes through the via hole and supports the superconducting quantum chip 401 through the second column segment 1022 (such as Fig.11 As shown), the first column section 1023 of the support body 102 is inserted into the blind hole 1012 provided on the bottom wall of the accommodating groove 1011 in the base 100.

[0093] In addition, the upper and lower ends of the support body 102 are respectively in contact with the base 100 and the top cover 201. The support body 102 constructed of metal material can connect the top cover 201 and the base 100 made of metal material, and can expand the ground plane of the superconducting quantum chip 401.

[0094] At the same time, the support body 102 provided inside the packaging box 200 can reduce the volume of the internal cavity of the packaging box 200. By constructing it into a circuit model, and through analysis, it can be known that such a solution can change the values ​​of the equivalent capacitance and equivalent inductance of the circuit model, thereby also achieving a change (increase) in frequency, and thus also increasing the detuning amount between the cavity mode frequency and the frequency of the superconducting quantum chip 401, thereby avoiding the adverse effects of the cavity mode on the chip.

[0095] Furthermore, based on the above chip packaging structure, the example of the present application also discloses a superconducting quantum computer including the chip packaging structure. The superconducting quantum computer may also be configured with various appropriate forms of measurement and control systems, and may have a measurement and control integrated machine, etc. Furthermore, the superconducting quantum computer also includes a dilution refrigerator, etc.

[0096] The embodiments described above with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as limiting the present application.

[0097] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the foregoing describes one or more embodiments with reference to the accompanying drawings. Wherein, similar reference numerals throughout the text are used to refer to similar components. In the above description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and each embodiment can be combined with each other and referenced to each other without contradiction.

[0098] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0099] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0100] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above are only preferred embodiments of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A base, used for packaging a superconducting quantum chip, characterized in that: The base comprises: A body having a receiving groove, wherein the receiving groove is defined by a bottom wall and a side wall, and the bottom wall is provided with a plurality of blind holes; and A plurality of support bodies, each support body having a first column segment, a second column segment and a third column segment sequentially connected along the axial direction; Along the axial projection of the support body, the projection patterns of the first column segment and the third column segment are both located within the projection pattern of the second column segment, and the first column segment is detachably connected to the body through the blind hole.

2. The base according to claim 1, characterized in that: The first column segment and the third column segment of all the supports are respectively in the shape of a cylinder, and the second column segment of all the supports are in the shape of a cuboid; Alternatively, all of the first column segments and the third column segments are respectively in the shape of cylinders, the second column segments of part of the support body are in the shape of cuboids, and the remaining second column segments are in an L-shaped bending structure.

3. The base according to claim 1 or 2, characterized in that: The base further comprises a plug-in body, the plug-in body comprises a strip plate, the strip plate is provided with a plurality of plug-in parts detachably connected to the blind hole; And / or, the plurality of blind holes are arranged in an array; And / or, the length of the first column segment is smaller than the length of the third column segment.

4. A packaging box, characterized in that: Comprising a base according to any one of claims 1 to 3.

5. The packaging box according to claim 4, characterized in that: The packaging box further comprises a top cover which is detachably connected to the base, and the top cover and the receiving groove of the base together form a packaging cavity for receiving the superconducting quantum chip.

6. The packaging box according to claim 5, characterized in that: The packaging box also includes a signal component; The signal assembly comprises: a signal board, a signal connector and a pressing plate, wherein one end of the signal connector is connected to the signal board, and the other end thereof passes through the pressing plate in a thickness direction; The signal plate contacts the base, and the pressing plate contacts the top cover.

7. The packaging box according to claim 6, characterized in that: The signal board is provided with a first avoidance hole exposing the receiving groove; And / or, the pressing plate is provided with a second avoidance hole exposing the accommodating groove; And / or, along the axial direction of the blind hole, the contour of the top cover is within the annular area defined by the signal connector.

8. The packaging box according to claim 6, characterized in that: The signal plate is provided with a first avoidance hole exposing the accommodating groove, and the pressing plate is provided with a second avoidance hole exposing the accommodating groove, and the second avoidance hole is radially expanded along the axial direction of the blind hole.

9. The packaging box according to claim 8, characterized in that: The top cover has a conical boss matching the second avoidance hole.

10. A chip packaging structure, characterized in that: include: Superconducting quantum chips; as well as The packaging box according to any one of claims 4 to 9, wherein the superconducting quantum chip is accommodated in a receiving groove of a base in the packaging box; The superconducting quantum chip has a via hole, and the third column section of the support body passes through the via hole and supports the superconducting quantum chip.

11. A superconducting quantum computer, characterized in that: Includes the chip packaging structure as claimed in claim 10.

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