Laser processing equipment

Abstract

The utility model discloses laser processing equipment which comprises a first laser beam forming device and a second laser beam forming device which are both used for switching and outputting a first laser beam or a second laser beam; wherein the first laser beam can be used for processing edge grooves, and the second laser beam can be used for processing a middle groove between each pair of edge grooves; the distance between the light beam output ends of the first laser beam forming device and the second laser beam forming device in the first direction is adjustable, and the light beam output ends are flush in the second direction. The first direction is perpendicular to the second direction; the bearing platform is used for bearing a wafer to be processed; and a first driving assembly connected with the bearing platform and used for driving the bearing platform to drive the to-be-processed wafer to translate along the first direction and the second direction respectively. The distance between the light beam output ends of the two laser beam forming devices is adjustable, so that the groove machining device can adapt to groove machining on wafers of different specifications, and the flexibility and practicability of groove machining are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, in particular to a laser processing device. Background Art

[0002] In the field of semiconductor processing, after the processing of chips distributed in an array on the surface of the wafer is completed, it is necessary to use laser grooving technology to groove a specific groove structure on the cutting path between two adjacent rows or columns of chips on the wafer; when groove processing each cutting path, it is necessary to first use double thin laser lines to use low heat to process two parallel edge grooves on both sides of the cutting path to form a thermal isolation area, and then use a thick laser line to generate high heat to use laser energy to reduce the area between the two edge grooves to form an intermediate groove.

[0003] The laser processing equipment used to realize laser grooving may require wafers of various models and specifications for grooving. However, currently conventional laser processing equipment is often difficult to adapt to grooving processing of wafers of different models and specifications, and has the problem of insufficient flexibility in practical applications. Utility Model Content

[0004] The purpose of the utility model is to provide a laser processing device, which can realize groove processing on wafers of various specifications and improve the practicability and flexibility of the device.

[0005] In order to solve the above technical problems, the utility model provides a laser processing equipment, comprising:

[0006] The first laser beam forming device and the second laser beam forming device are both used for switching and outputting the first laser beam or the second laser beam; wherein the first laser beam is a beam that can be processed to form a pair of parallel edge grooves on each cutting path of the wafer to be processed, and the second laser beam is a beam that can be processed to form an intermediate groove between each pair of the edge grooves; and the distance between the beam output end of the first laser beam forming device and the beam output end of the second laser beam forming device in the first direction is adjustable and aligned in the second direction; the first direction and the second direction are perpendicular to each other;

[0007] A carrying platform disposed below the beam output ends of the first laser beam forming device and the second laser beam forming device, and used for carrying the wafer to be processed;

[0008] The first driving assembly connected to the carrying platform is used to drive the carrying platform to drive the wafer to be processed to translate along the first direction and the second direction respectively.

[0009] In an optional embodiment of the present application, the second laser beam forming device includes a reflective deflection element, which is used to reflect and deflect the output direction of the laser light output by the second laser beam forming device from the first direction to a vertical direction;

[0010] The reflective deflection element is connected to a second driving component for driving the reflective deflection element and various optical elements on the output light path of the reflective deflection element to move synchronously along the first direction, so that the beam output end of the second laser beam forming device moves along the first direction relative to the beam output end of the first laser beam forming device.

[0011] In an optional embodiment of the present application, the second laser beam forming device includes a horizontal lens barrel extending along the first direction and a vertical lens barrel extending along the vertical direction; the end of the horizontal lens barrel is connected to the top of the vertical lens barrel;

[0012] The reflection and deflection element is arranged at the top of the vertical lens barrel and located at the connection position between the horizontal lens barrel and the vertical lens barrel;

[0013] The horizontal lens barrel is a telescopic lens barrel that can be extended and retracted along the first direction; the vertical lens barrel is a telescopic lens barrel that can be extended and retracted along the vertical direction;

[0014] When the second driving assembly drives the reflective deflection element and the vertical lens barrel to move synchronously along the first direction, the horizontal lens barrel is extended and retracted in the first direction;

[0015] When the vertical lens barrel is extended and retracted in the vertical direction, the position of the optical element on the output light path of the reflection and deflection element in the vertical direction is adjustable along with the extension and retraction of the vertical lens barrel.

[0016] In an optional embodiment of the present application, the second driving assembly includes a horizontal slide rail extending along the first direction, and a horizontal slider disposed on the horizontal slide rail and fixedly connected to the reflective deflection element and the vertical lens barrel.

[0017] In an optional embodiment of the present application, it also includes a vertical slide rail fixedly connected to the horizontal slide block, and a vertical slide block arranged on the vertical slide rail and connected to the bottom end of the vertical lens barrel.

[0018] In an optional embodiment of the present application, the first laser beam forming device and the second laser beam forming device both include:

[0019] A laser light source for outputting a laser beam; a beam selector and a first PBS element sequentially arranged on the output optical path of the laser light source; a beam expander, an aperture, a first reflecting element, a second reflecting element, and a second PBS element sequentially arranged on the first output direction of the first PBS element; and the second PBS element is located on the second output direction of the first PBS element; a third reflecting element arranged on the output optical path of the second PBS element; and a Wollaston prism and a focusing element sequentially arranged on the output optical path of the third reflecting element;

[0020] The beam selector is used to modulate the laser beam into polarized light, and the polarization direction can be switched between a first polarization direction and a second polarization direction;

[0021] When the polarization direction of the laser beam output from the beam selector is the first polarization direction, the laser beam is incident on the first PBS element, and is output from the first output direction of the first PBS element, and sequentially passes through the second PBS element, the third reflecting element, the Wollaston prism and the focusing element to form the first laser beam output;

[0022] When the polarization direction of the laser beam output from the beam selector is the second polarization direction, the laser beam is incident on the first PBS element, and is output from the second output direction of the first PBS element, and sequentially passes through the beam expander, the aperture, the first reflecting element, the second reflecting element, the second PBS element, the third reflecting element, the Wollaston prism and the focusing element to form the second laser beam output;

[0023] Wherein, the third reflecting element is the reflecting deflecting element.

[0024] In an optional embodiment of the present application, the Wollaston prism is connected to a rotating structure for driving the Wollaston prism to rotate with the optical axis of the focusing element as the central axis of rotation.

[0025] In an optional embodiment of the present application, the light-transmitting slit width of the aperture is adjustable.

[0026] In an optional embodiment of the present application, the aperture is a flat plate aperture having a plurality of light-transmitting slits of different widths, and a translation structure connected to the flat plate aperture; the translation structure is used to drive the flat plate aperture to translate.

[0027] In an optional embodiment of the present application, the first driving assembly includes a first machine tool guide rail for driving the carrying platform to move along the first direction, and a second machine tool guide rail for driving the carrying platform to move along the second direction; the carrying platform is arranged on the second machine tool guide rail, and the second machine tool guide rail is arranged on the first machine tool guide rail;

[0028] The first driving assembly also includes a rotating motor connected to the carrying platform, which is used to drive the carrying platform to rotate in a horizontal plane.

[0029] The utility model provides a laser processing equipment, comprising: a first laser beam forming device and a second laser beam forming device, both of which are used to switch and output the first laser beam or the second laser beam; wherein the first laser beam is a beam that can be processed to form a pair of parallel edge grooves on each cutting path of a wafer to be processed, and the second laser beam is a beam that can be processed to form an intermediate groove between each pair of edge grooves; and the spacing between the beam output end of the first laser beam forming device and the beam output end of the second laser beam forming device in the first direction is adjustable, and is flush in the second direction; the first direction and the second direction are perpendicular to each other; a bearing platform arranged below the beam output ends of the first laser beam forming device and the second laser beam forming device, and used to bear the wafer to be processed; and a first driving component connected to the bearing platform, used to drive the bearing platform to drive the wafer to be processed to translate along the first direction and the second direction respectively.

[0030] The laser processing equipment provided in the present application includes two groups of devices, namely a first laser beam forming device and a second laser beam forming device, which can output laser beams respectively. Therefore, when processing grooves on each cutting path on the wafer to be processed, the first laser beam forming device and the second laser beam forming device can be used to simultaneously output the first laser beam, so that the edge grooves on the two cutting paths can be processed synchronously. After the edge grooves on each cutting path are processed, the first laser beam forming device and the second laser beam forming device can be further controlled to simultaneously output the second laser beam, so that the edge grooves on the two cutting paths can be processed synchronously at one time, thereby greatly improving the processing efficiency of the groove processing on the wafer to be processed; on this basis, the spacing between the beam output ends of the first laser beam forming device and the second laser beam forming device in the present application is adjustable, so that it can better adapt to the groove processing on wafers of different specifications, and improve the flexibility and practicality of the laser processing equipment in the actual processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of the structure of the laser processing equipment provided in the embodiment of the present application;

[0033] Figure 2 A schematic diagram of the structure of a cutting path on a wafer provided in an embodiment of the present application;

[0034] Figure 3 A partial structural schematic diagram of a second laser beam forming device provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the optical path structure of a laser beam forming device provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of a spot of a first laser beam provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the laser beam shielding by the aperture provided in an embodiment of the present application;

[0038] Figure 7 A schematic diagram of a spot of a second laser beam provided in an embodiment of the present application;

[0039] In the accompanying drawings: 10 is a main body shell, 101 is a horizontal lens barrel, 102 is a vertical lens barrel, 103 is a horizontal slide rail, 104 is a horizontal slider, 105 is a reflective deflection element, 11 is a carrying platform, 12 is a first machine tool guide rail, 13 is a second machine tool guide rail, 14 is a rotating motor, 200 is a wafer to be processed, 201 is a cutting path, 202 is an edge groove, 203 is an intermediate groove, 301 is a laser light source, 302 is a beam selector, 303 is a first PBS element, 304 is a beam expander, 305 is an aperture, 3051 is a light-transmitting slit, 306 is a first reflecting element, 307 is a second reflecting element, 308 is a second PBS element, 309 is a third reflecting element, 310 is a Wollaston prism, and 311 is a focusing lens. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0041] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiment of the present application. Figure 2 A schematic diagram of the structure of the cutting lanes on a wafer provided in an embodiment of the present application.

[0042] In a specific embodiment of the present application, the laser processing equipment may include:

[0043] The first laser beam forming device and the second laser beam forming device are both used for switching and outputting the first laser beam or the second laser beam; wherein the first laser beam is a beam that can be processed to form a pair of parallel edge grooves 202 on each cutting road 201 of the wafer 200 to be processed, and the second laser beam is a beam that can be processed to form an intermediate groove 203 between each pair of edge grooves 202; and the distance between the beam output end of the first laser beam forming device and the beam output end of the second laser beam forming device in the first direction is adjustable and aligned in the second direction; the first direction and the second direction are perpendicular to each other;

[0044] A carrying platform 11 disposed below the beam output ends of the first laser beam forming device and the second laser beam forming device, and used for carrying the wafer 200 to be processed;

[0045] The first driving assembly connected to the carrying platform 11 is used to drive the carrying platform 11 to drive the wafer 200 to be processed to translate along the first direction and the second direction respectively.

[0046] Reference Figure 1 ,exist Figure 1 In the illustrated embodiment, the laser processing device comprises a main body housing 10, in which the main optical structure of the first laser beam forming device and the second laser beam forming device, as well as the control system of the laser processing device, etc. are built. In addition, the beam output ends of the first laser beam forming device and the second laser beam forming device both extend from the side wall of the main body housing 10, and both output laser beams in a vertical downward direction.

[0047] On this basis, a carrying platform 11 is arranged below the beam output ends of the two laser beam forming devices, namely the first laser beam forming device and the second laser beam forming device. When grooves are processed in the area where the cutting road 201 on the wafer 200 to be processed is located, the wafer 200 to be processed can be placed on the carrying platform 11; and the carrying platform 11 is also connected to a first driving component, which can drive the carrying platform 11 to translate along the first direction, and can also drive the carrying platform 11 to translate along the second direction.

[0048] like Figure 2 As shown, the cutting roads 201 on the wafer 200 to be processed include multiple cutting roads 201 in two directions perpendicular to each other. Therefore, when the wafer 200 to be processed is placed on the supporting platform 11, the cutting roads 201 in one direction of the wafer 200 to be processed can be parallel to the second direction, while the cutting roads 201 in the other direction can be parallel to the first direction. In addition, the spacing between the beam output ends of the first laser beam forming device and the second laser beam forming device in the first direction can be equal to an integer multiple of the distance between two adjacent cutting lanes 201; thereby, by adjusting the position of the carrying platform 11 in the first direction through the first driving component, the beam output ends of the first laser beam forming device and the second laser beam forming device can be directly opposite to the two cutting lanes 201 extending along the second direction on the wafer 200 to be processed. At this time, the first laser beam forming device and the second laser beam forming device are controlled to output laser beams, and the first driving component is controlled to drive the carrying platform 11 to drive the wafer 200 to be processed to move along the second direction. The light spots of the laser light output by the first laser beam forming device and the second laser beam forming device respectively also move along the second direction on the two cutting lanes 201 on the wafer 200 to be processed, thereby completing the synchronous processing of the grooves on the two cutting lanes 201 on the wafer 200 to be processed. It can be understood that in the actual groove processing process, the first laser beam forming device and the second laser beam forming device can both output the first laser beam, so that the first laser beam forming device and the second laser beam forming device can synchronously process the edge grooves 202 on two cutting lanes 201 on the wafer 200 to be processed at one time. After the edge grooves 202 on each cutting lane 201 are processed, the laser light output by the first laser beam forming device and the second laser beam forming device can be switched to the second laser beam, and the first driving component drives the supporting platform 11 to drive the wafer 200 to be processed to move along the second direction, so as to realize the processing of the middle groove 203 between the two edge grooves 202 on each cutting lane 201.

[0049] Based on the above discussion, the laser processing equipment of this embodiment is provided with two groups of laser beam forming devices, namely a first laser beam forming device and a second laser beam forming device. Therefore, when actually processing grooves on each cutting lane 201 of the wafer 200 to be processed, the processing of two pairs of edge grooves 202 can be achieved simultaneously at one time, and the processing of two middle grooves 203 can be achieved simultaneously at one time, thereby greatly improving the efficiency of groove processing by the laser processing equipment.

[0050] As mentioned above, to achieve synchronous processing of grooves on two cutting paths 201, it is necessary to make the distance between the beam output ends of the first laser beam forming device and the second laser beam forming device in the first direction equal to an integer multiple of the distance between two adjacent cutting paths 201; however, in actual applications, the wafers to be processed include wafers of various different models and specifications; for wafers of different models and specifications, the distance between the corresponding two adjacent cutting paths 201 is not the same, which requires that the distance between the beam output ends of the first laser beam forming device and the second laser beam forming device in the first direction is also different accordingly. To this end, in this embodiment, the distance between the beam output ends of the first laser beam forming device and the second laser beam forming device is adjustable, so that the distance between the beam output ends of the first laser beam forming device and the second laser beam forming device can be adjusted to an integer multiple of the distance between two adjacent cutting paths 201 on wafers of various models and specifications according to actual needs, thereby ensuring that the laser processing equipment can flexibly adapt to the processing of grooves on wafers of various models and specifications, thereby improving the practicality and flexibility of the laser processing equipment.

[0051] Based on the above discussion, in order to achieve adjustable distance between the beam output ends of the first laser beam forming device and the second laser beam forming device, in an optional embodiment of the present application, the second laser beam forming device may further include:

[0052] A reflection and deflection element, used for reflecting and deflecting the output direction of the laser light output by the second laser beam forming device from the first direction to a vertical direction;

[0053] The reflective deflection element is connected to a second driving component for driving the reflective deflection element and various optical elements on the output light path of the reflective deflection element to move synchronously along the first direction, so that the beam output end of the second laser beam forming device moves along the first direction relative to the beam output end of the first laser beam forming device.

[0054] As described above, in the present embodiment, most of the optical elements of the first laser beam forming device and the second laser beam forming device are built into the main body shell 10, and the beam output ends of the first laser beam forming device and the second laser beam forming device extend outside the main body shell 10; for the second laser beam forming device, its optical structure built into the main body shell 10 outputs the laser beam to the reflective deflection element in a direction parallel to the first direction, and the reflective surface of the reflective deflection element forms an angle of 45 degrees with the first direction, so that the laser beam incident on the reflective deflection element is deflected and output in a vertically downward direction; therefore, when the second driving component drives the reflective deflection element to move along the first direction, it is obvious that the laser beam output through the reflective deflection element also correspondingly moves in translation in the first direction while maintaining the vertically downward output, so that the laser beam finally output from the beam output end of the second laser beam forming device will also move in translation in the first direction. On this basis, the beam output end of the first laser beam forming device remains fixed, so as the laser beam output by the second laser beam forming device translates in the first direction, the distance between the beam output ends of the first laser beam forming device and the second laser beam forming device can be adjusted.

[0055] In addition, it can be understood that optical elements distributed in sequence along the vertical direction are also arranged on the output light path of the reflective deflection element in the second laser beam forming device. Therefore, in the process of the second driving component driving the reflective deflection element to move along the first direction, each optical element located on the output light path of the reflective deflection element should also move synchronously with the reflective deflection element along the first direction to ensure that the above optical elements are always located on the output light path of the reflective deflection element.

[0056] Reference Figure 3 , Figure 3 A schematic diagram of a portion of the structure of a second laser beam forming device provided in an embodiment of the present application.

[0057] Based on the above discussion, in another optional embodiment of the present application, the second laser beam forming device may further include:

[0058] A horizontal lens barrel 101 extending in a first direction and a vertical lens barrel 102 extending in a vertical direction; an end of the horizontal lens barrel 101 and a top end of the vertical lens barrel 102 are connected;

[0059] The reflection and deflection element 105 is disposed at the top of the vertical lens barrel 102 and located at the connection position between the horizontal lens barrel 101 and the vertical lens barrel 102;

[0060] The horizontal lens barrel 101 is a telescopic lens barrel that can be extended and retracted along a first direction; the vertical lens barrel 102 is a telescopic lens barrel that can be extended and retracted along a vertical direction;

[0061] When the second driving assembly drives the reflective deflection element 105 and the vertical lens barrel 102 to move synchronously along the first direction, the horizontal lens barrel 101 is extended and retracted in the first direction;

[0062] When the vertical lens barrel 102 is extended or retracted in the vertical direction, the position of the optical element on the output light path of the reflective deflection element 105 can be adjusted in the vertical direction along with the extension or retraction of the vertical lens barrel 102 .

[0063] Reference Figure 3 In this embodiment, the optical path structure in which the second laser beam forming device is located outside the main shell body 10 is arranged in the horizontal lens barrel 101 and the vertical lens barrel 102; wherein the horizontal lens barrel 101 is a lens barrel extending along the first direction, and the vertical lens barrel 102 is a lens barrel extending along the vertical direction; on this basis, the horizontal lens barrel 101 and the vertical lens barrel 102 can be lens barrels that can be extended and retracted along the length direction.

[0064] As described above, in order to achieve an adjustable distance in the first direction between the beam output end of the second laser beam forming device and the beam output end of the first laser beam forming device, it is necessary to drive the reflective deflection element 105 to translate along the first direction through the second driving component, and the optical elements located on the output light path of the reflective deflection element 105 should also move synchronously therewith. To this end, in this embodiment, the reflective deflection element 105 and each optical element on its output light path are both packaged and arranged in the vertical lens barrel 102, so that as the second driving component drives the vertical lens barrel 102 to move in the first direction, the reflective deflection element 105 and each optical element on its output light path can also be synchronously moved along the first direction.

[0065] In addition, it is further considered that as the reflective deflection element 105 moves in the first direction, that is, the optical path of the second laser beam forming device is changed to a certain extent, in order to ensure that the laser beam output by the second laser beam forming device can meet the groove processing requirements, it is necessary to adjust the positions of the various optical elements on the output optical path of the reflective deflection element 105 in the vertical direction accordingly. To this end, in this embodiment, the vertical lens barrel 102 that accommodates the various optical elements on the output optical path of the reflective deflection element 105 is further set as a telescopic lens barrel, and the various optical elements on the output optical path of the reflective deflection element 105 should be fixedly connected to the side wall of the vertical lens barrel 102; therefore, as the vertical lens barrel 102 is telescopically changed, the relative distance of the various optical elements in the vertical lens barrel 102 in the vertical direction can also change accordingly, and finally ensure that the optical path structure formed between the reflective deflection element 105 and the various optical elements on its output optical path can make the laser beam output by the second laser beam forming device meet the groove processing requirements.

[0066] Furthermore, the second driving assembly for realizing synchronous movement of the reflective deflection element 105 and the vertical lens barrel 102 along the first direction may include:

[0067] A horizontal slide rail 103 extending along a first direction, and a horizontal slider 104 disposed on the horizontal slide rail 103 and fixedly connected to the reflective deflection element 105 and the vertical lens barrel 102 .

[0068] like Figure 1 As shown, in this embodiment, a horizontal slide rail 103 is provided on one side of the horizontal lens barrel 101 and is parallel to the length direction of the horizontal lens barrel 101, that is, the first direction; and a horizontal slider 104 is provided on the horizontal slide rail 103 and is fixedly connected to the vertical lens barrel 102 and the reflection and deflection element 105. Therefore, as the horizontal slider 104 moves along the first direction on the horizontal slide rail 103, it can drive the reflection and deflection element 105 and the vertical lens barrel 102 to translate synchronously along the first direction, and at the same time drive the horizontal lens barrel 101 to expand and contract.

[0069] In practical applications, the sliding movement of the horizontal slider 104 on the horizontal slide rail 103 can be achieved by driving the movement with a high-precision driving motor.

[0070] On this basis, in order to further realize the extension and retraction of the vertical lens barrel 102, and then realize the position adjustment of each optical element on the output light path of the reflection and deflection element 105, a vertical slide rail can be further connected to the horizontal slider 104, and the vertical slide rail is also provided with a vertical slider fixedly connected to the bottom end of the vertical lens barrel 102. The vertical slider can move in the vertical direction on the vertical slide rail, thereby driving the vertical lens barrel 102 to extend and retract in the vertical direction, thereby realizing the relative position of each optical element in the vertical lens barrel 102 except the reflection and deflection element 105.

[0071] Based on any of the above embodiments, the optical path structures in the first laser beam forming device and the second laser beam forming device can be the same optical path structure; Figure 4 As shown, in another optional embodiment of the present application, the optical path structures of the first laser beam forming device and the second laser beam forming device may include:

[0072] A laser light source 301 for outputting a laser beam; a beam selector 302 and a first PBS element 303 arranged in sequence on the output optical path of the laser light source 301; a beam expander 304, an aperture 305, a first reflecting element 306, a second reflecting element 307, and a second PBS element 308 arranged in sequence in a first output direction of the first PBS element 303; and the second PBS element 308 is located in a second output direction of the first PBS element 303; a third reflecting element 309 arranged on the output optical path of the second PBS element 308; a Wollaston prism 310 and a focusing element 311 arranged in sequence on the output optical path of the third reflecting element 309;

[0073] The beam selector 302 is used to modulate the laser beam into polarized light, and the polarization direction can be switched between a first polarization direction and a second polarization direction;

[0074] When the polarization direction of the laser beam output from the beam selector 302 is the first polarization direction, the laser beam is incident on the first PBS element 303, and is output from the first output direction of the first PBS element 303, and passes through the second PBS element 308, the third reflecting element 309, the Wollaston prism 310 and the focusing element 311 in sequence to form a first laser beam output;

[0075] When the polarization direction of the laser beam output from the beam selector 302 is the second polarization direction, the laser beam is incident on the first PBS element 303, and is output from the second output direction of the first PBS element 303, and sequentially passes through the beam expander 304, the aperture 305, the first reflecting element 306, the second reflecting element 307, the second PBS element 308, the third reflecting element 309, the Wollaston prism 310 and the focusing element 311 to form a second laser beam output;

[0076] The third reflective element 309 is the reflective deflection element 105 .

[0077] Reference Figure 4 The optical path structure is as follows: the laser beam output by the laser light source 301 is incident on the beam selector 302, and the laser beam is adjusted to polarized light in the beam selector 302. By switching the working state of the beam selector 302, the beam selector 302 can adjust the laser beam output by the laser light source 301 to P polarized light or S polarized light. After the laser beam output by the laser light source 301 passes through the beam selector 302, it forms polarized light and is incident on the first PBS element 303; the first PBS element 303 is a polarization prism that transmits polarized light with a first polarization direction (that is, it can be P polarized light) and reflects polarized light with a second polarization direction (that is, it can be S polarized light).

[0078] Therefore, when the laser beam passes through the beam selector 302, polarized light with a first polarization direction is formed. The polarized light is transmitted through the first PBS element 303 and the second PBS element 308 in sequence, and is reflected by the third reflecting element 309 before being incident on the Wollaston prism 310. Based on the characteristics of the Wollaston prism 310, it can be known that the light incident on the Wollaston prism 310 can be split into two light beams. After the two light beams pass through the focusing effect of the focusing element 311, a first laser beam can be output. The first laser beam can form two light spots with a certain distance in the first direction on the wafer 200 to be processed.

[0079] like Figure 5 As shown, Figure 5 Schematic diagram of the light spot formed by the first laser beam on the wafer 200 to be processed; it can be understood that the center distance between the two light spots of the first laser beam in the first direction is adapted to the width of the cutting path 201 on the wafer 200 to be processed, and the width of the cutting path 201 is not corresponding to the wafers 200 to be processed of different specifications and types; for this reason, the Wollaston prism 310 in this embodiment is also connected with a rotating structure, which can drive the Wollaston prism 310 to rotate with the optical axis of the focusing element 311 as the rotation center; as the rotation of the Wollaston prism 310 changes, the center distance between the light spots of the two fine light beams split by the Wollaston prism 310 on the wafer 200 to be processed in the first direction also changes accordingly, thereby meeting the processing requirements of the edge groove 202 on wafers of various specifications and types.

[0080] Furthermore, when the laser beam output by the laser light source 301 passes through the beam selector 302, a polarized light having a second polarization direction is formed. The polarized light is reflected by the first PBS element 303 and then incident on the beam expander 304 to expand the polarized light. The beam expander 304 may be a cylindrical lens, so that the polarized light passing through the beam expander 304 forms a beam with a flat cross section. Figure 6 As shown, Figure 6The light spot in is the light spot formed by the polarized light on the plane where the aperture 305 is located. The polarized light after beam expansion is incident on the aperture 305, and the shielding direction of the polarized light by the light-transmitting slit 3051 in the aperture 305 should be parallel to the central axis of the cylindrical lens; the polarized light after beam expansion can form polarized light with a roughly rectangular cross section after passing through the aperture 305, and the polarized light is further reflected by the first reflecting element 306, the second reflecting element 307, the second PBS element 308, and the third reflecting element 309 in sequence, and then incident on the Wollaston prism 310, and the Wollaston prism 310 can split the polarized light into two light beams, and after the two light beams are focused by the focusing element 311, a second laser beam for processing and forming the middle groove 203 can be formed; the second laser beam can be two light beams arranged along the second direction.

[0081] like Figure 7 As shown, Figure 7 Schematic diagram of the light spot formed by the second laser beam on the wafer 200 to be processed; the width of the light spot in the first direction is determined by the width of the light-transmitting slit 3051 on the aperture 305 in the shielding direction. Similar to the center spacing between the two light spots of the first laser beam, for wafers of different specifications and types, the width of the intermediate groove 203 to be processed is also different, and the corresponding width of the light spot formed by the second laser beam on the wafer 200 to be processed in the first direction also needs to be adjusted to adapt to the changes of wafers of different specifications and types; for this reason, the width of the light-transmitting slit 3051 of the aperture 305 in this embodiment is adjustable.

[0082] Optionally, the aperture 305 in this embodiment may be a flat plate aperture having a plurality of light-transmitting slits 3051 of different widths, and a translation structure connected to the flat plate aperture 305 ; the translation structure is used to drive the flat plate aperture 305 to move translationally.

[0083] The translation structure in this embodiment can be a structural component such as a motor, etc., which is not specifically limited in this embodiment. In practical applications, the translation structure can drive the flat plate aperture to translate, and then switch the light-transmitting slits 3051 of different widths on the output optical path of the beam expander 304, thereby adjusting the spot width of the second laser beam.

[0084] Refer to the above Figure 4 The optical path structure shown in FIG. 1 is combined with the embodiment in which the reflective deflection element 105 in the second laser beam forming device and each optical element on the output optical path can be adjusted in translation in the first direction. It can be understood that the reflective deflection element 105 in the second laser beam forming device in the present application can correspond to Figure 4The third reflecting element 309 in the optical path structure shown, correspondingly, the various optical elements on the output optical path of the reflective deflection element 105 are the above-mentioned Wollaston prism 310 and the focusing element 311; when the vertical lens barrel 102 is telescopically adjusted in the vertical direction, the relative distance between the third reflecting element 309, the Wollaston prism 310 and the focusing element 311 in the vertical direction is adjusted.

[0085] Based on any of the above embodiments, refer to Figure 1 In an optional embodiment of the present application, the first driving component for driving the carrying platform 11 may include:

[0086] A first machine tool guide rail 12 for driving the carrying platform 11 to move along a first direction, and a second machine tool guide rail 13 for driving the carrying platform 11 to move along a second direction; the carrying platform 11 is arranged on the second machine tool guide rail 13, and the second machine tool guide rail 13 is arranged on the first machine tool guide rail 12;

[0087] The first driving assembly further includes a rotating motor 14 connected to the carrying platform 11 and configured to drive the carrying platform 11 to rotate in a horizontal plane.

[0088] As described above, the wafer 200 to be processed includes cutting paths 201 in two directions perpendicular to each other. Therefore, in the actual processing process, after the groove processing corresponding to the cutting path 201 in one direction is completed, the wafer 200 to be processed needs to be adjusted so that the cutting path 201 in another direction is parallel to the second direction, and the groove processing is performed again; to this end, the rotating motor 14 in this embodiment can drive the carrying platform 11 to rotate, so that the carrying platform 11 can drive the wafer 200 to be processed to rotate in a horizontal plane.

[0089] In summary, the laser processing equipment provided by the present application includes two groups of devices, namely a first laser beam forming device and a second laser beam forming device, which can output laser beams respectively. Therefore, when actually processing grooves on each cutting path on the wafer to be processed, the first laser beam forming device and the second laser beam forming device can be used to simultaneously output the first laser beam, so that the edge grooves on the two cutting paths can be synchronously processed. After the edge grooves on each cutting path are processed, the first laser beam forming device and the second laser beam forming device can be further controlled to simultaneously output the second laser beam, so that the edge grooves can be synchronously processed on the two cutting paths at one time, thereby greatly improving the processing efficiency of the groove processing on the wafer to be processed; on this basis, the spacing between the beam output ends of the first laser beam forming device and the second laser beam forming device in the present application is adjustable, so that it can better adapt to the groove processing on wafers of different specifications, and improve the flexibility and practicality of the laser processing equipment in the actual processing process.

[0090] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements are inherent to the elements. In the absence of more restrictions, the elements limited by the sentence "comprising one..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. In addition, the above-mentioned technical solution provided in the embodiment of the present application is consistent with the corresponding technical solution in the prior art in principle, and the part is not described in detail, so as to avoid too much redundancy.

[0091] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A laser processing device, characterized in that: include: The first laser beam forming device and the second laser beam forming device are both used for switching and outputting the first laser beam or the second laser beam; wherein the first laser beam is a beam that can be processed to form a pair of parallel edge grooves on each cutting path of the wafer to be processed, and the second laser beam is a beam that can be processed to form an intermediate groove between each pair of the edge grooves; and the distance between the beam output end of the first laser beam forming device and the beam output end of the second laser beam forming device in the first direction is adjustable and aligned in the second direction; the first direction and the second direction are perpendicular to each other; A carrying platform disposed below the beam output ends of the first laser beam forming device and the second laser beam forming device, and used for carrying the wafer to be processed; The first driving assembly connected to the carrying platform is used to drive the carrying platform to drive the wafer to be processed to translate along the first direction and the second direction respectively.

2. The laser processing equipment according to claim 1, characterized in that: The second laser beam forming device comprises a reflective deflection element, which is used to reflect and deflect the output direction of the laser light output by the second laser beam forming device from the first direction to a vertical direction; The reflective deflection element is connected to a second driving component for driving the reflective deflection element and various optical elements on the output light path of the reflective deflection element to move synchronously along the first direction, so that the beam output end of the second laser beam forming device moves along the first direction relative to the beam output end of the first laser beam forming device.

3. The laser processing equipment according to claim 2, characterized in that: The second laser beam forming device comprises a horizontal lens barrel extending along the first direction and a vertical lens barrel extending along the vertical direction; the end of the horizontal lens barrel is connected to the top of the vertical lens barrel; The reflection and deflection element is arranged at the top of the vertical lens barrel and located at the connection position between the horizontal lens barrel and the vertical lens barrel; The horizontal lens barrel is a telescopic lens barrel that can be extended and retracted along the first direction; the vertical lens barrel is a telescopic lens barrel that can be extended and retracted along the vertical direction; When the second driving assembly drives the reflective deflection element and the vertical lens barrel to move synchronously along the first direction, the horizontal lens barrel is extended and retracted in the first direction; When the vertical lens barrel is extended and retracted in the vertical direction, the position of the optical element on the output light path of the reflection and deflection element in the vertical direction is adjustable along with the extension and retraction of the vertical lens barrel.

4. The laser processing equipment according to claim 3, characterized in that: The second driving assembly includes a horizontal slide rail extending along the first direction, and a horizontal sliding block disposed on the horizontal slide rail and fixedly connected to the reflection and deflection element and the vertical lens barrel.

5. The laser processing equipment according to claim 4, characterized in that: It also includes a vertical slide rail fixedly connected to the horizontal slide block, and a vertical slide block arranged on the vertical slide rail and connected to the bottom end of the vertical lens barrel.

6. The laser processing equipment according to any one of claims 2 to 5, characterized in that: The first laser beam forming device and the second laser beam forming device both include: A laser light source for outputting a laser beam; a beam selector and a first PBS element sequentially arranged on the output optical path of the laser light source; a beam expander, an aperture, a first reflecting element, a second reflecting element, and a second PBS element sequentially arranged on the first output direction of the first PBS element; and the second PBS element is located on the second output direction of the first PBS element; a third reflecting element arranged on the output optical path of the second PBS element; and a Wollaston prism and a focusing element sequentially arranged on the output optical path of the third reflecting element; The beam selector is used to modulate the laser beam into polarized light, and the polarization direction can be switched between a first polarization direction and a second polarization direction; When the polarization direction of the laser beam output from the beam selector is the first polarization direction, the laser beam is incident on the first PBS element, and is output from the first output direction of the first PBS element, and sequentially passes through the second PBS element, the third reflecting element, the Wollaston prism and the focusing element to form the first laser beam output; When the polarization direction of the laser beam output from the beam selector is the second polarization direction, the laser beam is incident on the first PBS element, and is output from the second output direction of the first PBS element, and sequentially passes through the beam expander, the aperture, the first reflecting element, the second reflecting element, the second PBS element, the third reflecting element, the Wollaston prism and the focusing element to form the second laser beam output; Wherein, the third reflecting element is the reflecting deflecting element.

7. The laser processing equipment according to claim 6, characterized in that: The Wollaston prism is connected with a rotating structure for driving the Wollaston prism to rotate with the optical axis of the focusing element as the rotation center axis.

8. The laser processing equipment according to claim 6, characterized in that: The light-transmitting slit width of the aperture is adjustable.

9. The laser processing equipment according to claim 8, characterized in that: The aperture is a flat plate aperture having a plurality of light-transmitting slits of different widths, and a translation structure connected to the flat plate aperture; the translation structure is used to drive the flat plate aperture to translate.

10. The laser processing equipment according to claim 1, characterized in that: The first driving assembly includes a first machine tool guide rail for driving the carrying platform to move along the first direction, and a second machine tool guide rail for driving the carrying platform to move along the second direction; the carrying platform is arranged on the second machine tool guide rail, and the second machine tool guide rail is arranged on the first machine tool guide rail; The first driving assembly also includes a rotating motor connected to the carrying platform, which is used to drive the carrying platform to rotate in a horizontal plane.

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