Silicon wafer edge polishing and grinding device
By designing a silicon wafer edge polishing and grinding device including a chassis, adjustment structure and polishing structure, the problems of poor stability, difficulty in adaptability adjustment and poor versatility in the polishing process of silicon wafers are solved, and high-quality silicon wafer edge polishing and grinding are achieved and widely applicable effects are achieved.
Patent Information
- Application Number
- CN202420602601.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-03-27
AI Technical Summary
The existing silicon wafer edge polishing and grinding devices have problems such as poor stability during the grinding process, inability to adjust adaptability according to different silicon wafers, and poor versatility.
A silicon wafer edge polishing and grinding device including a chassis, a tuning structure and a polishing structure is designed. The device can adaptively adjust the drive shaft and rotary plate driven by the motor according to the edge size of different silicon wafers, and the up and down movement and rotation of the grinding disc is realized through the cooperation of the hydraulic cylinder and the push rod, improving the stability and versatility of the grinding.
This device can significantly improve the polishing and grinding quality of the edges of the silicon wafer, enhance the mechanical strength of the silicon wafer, reduce particle contamination, and is suitable for silicon wafers of different sizes, improving the versatility and scope of application of the grinding device.
Smart Images
Figure CN222755080U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon slice production, in particular to a silicon slice edge polishing and grinding device. Background Art
[0002] At present, most integrated circuits use silicon wafers, which have high requirements for the flatness of the silicon wafer surface. Various semiconductor devices can be made by photolithography, ion implantation and other means. During the silicon wafer processing, the edge surface of the silicon wafer after cutting has edges, burrs, broken edges, and even cracks or other defects, and the edge surface is relatively rough. In order to increase the mechanical strength of the silicon wafer edge surface and reduce particle contamination, the silicon wafer edge surface needs to be ground. However, the existing silicon wafer edge polishing and grinding device has the problems of poor stability of the silicon wafer during the grinding process, inability to adapt to different silicon wafers, and poor versatility.
[0003] Based on this, we propose a silicon wafer edge polishing and grinding device. Utility Model Content
[0004] The utility model aims to overcome the problems of poor stability of silicon wafers during the grinding process, inability to perform adaptability adjustment according to different silicon wafers, and poor versatility in silicon wafer edge polishing and grinding devices, and to provide a silicon wafer edge polishing and grinding device with reasonable structural design, good stability during the grinding process, ability to perform adaptability adjustment according to different silicon wafers, and good versatility.
[0005] The technical solution adopted by the utility model to solve the technical problem is:
[0006] A silicon wafer edge polishing and grinding device comprises a base frame, an adjustment structure and a polishing structure. The base frame is arranged on a bracket, a driving structure and a column are arranged on the base frame, and a top plate is arranged on the column. The adjustment structure is arranged on the top plate, and the polishing structure is movably connected to the adjustment structure.
[0007] Preferably, the driving structure includes a motor 1 and a carrying plate. The motor 1 is arranged on a base frame. A transmission shaft is arranged on the motor 1. The carrying plate is arranged on the transmission shaft. The silicon wafer that needs edge grinding is placed on the carrying plate. The motor 1 drives the transmission shaft and the carrying plate on the transmission shaft to rotate, so that the carrying plate drives the silicon wafer to rotate, so that the edge of the rotating silicon wafer contacts the grinding disk, which is convenient for the grinding disk to polish and grind the edge of the silicon wafer, thereby improving the edge polishing and grinding quality of the silicon wafer.
[0008] Preferably, the polishing structure includes motor 2, an adjustment plate, a movable plate, motor 3, and a grinding disc. Motor 2 is arranged on the top plate, a transmission stud is arranged on motor 2, and motor 2 is arranged as a servo motor. Connecting screw rings are arranged at both ends of the adjustment plate, the transmission studs are vertically passed through the connecting screw rings, and a fixing groove is arranged on the adjustment plate. The movable plate is movably arranged in the fixing groove, and the movable plate is movably connected to the adjustment structure. Motor 3 is arranged on the movable plate, a driving shaft is arranged on motor 3, and the grinding disc is installed on the driving shaft. Motor 2 drives the transmission stud to rotate, and the transmission stud pushes the connecting screw ring to rise or fall, driving the adjustment plate to rise or fall, and then driving the movable plate, motor 3, and grinding disc to rise or fall. Motor 3 drives the grinding disc to rotate, so that the grinding disc contacts the edge of the silicon wafer during the rotation, and the edge of the silicon wafer is ground and polished to improve the grinding and polishing quality of the silicon wafer.
[0009] Preferably, limiting grooves are provided on the adjustment plates on both sides of the fixed groove, limiting rods are provided on the opposite sides of the movable plate, and the limiting rods are inserted into the limiting grooves. The movable plate moves back and forth in the fixed groove under the action of the adjustment structure, driving the motor 3 and the grinding disc to move back and forth, so that the grinding disc can polish and grind the edges of silicon wafers of different sizes, thereby improving the versatility of the polishing and grinding device and expanding the scope of application of the polishing and grinding device.
[0010] Preferably, the grinding disc is provided with a mounting ring, which is mounted on the driving shaft, and the grinding disc is configured as a replaceable structure on the driving shaft through the mounting ring, and the mounting ring on the grinding disc is mounted on the driving shaft through threads, thereby improving the installation efficiency of the grinding disc on the driving shaft and the stability of the grinding disc on the driving shaft. On the other hand, according to different polishing and grinding requirements of the edge of the silicon wafer, the corresponding grinding disc is selected to improve the versatility of the polishing and grinding device and expand the scope of application of the polishing and grinding device.
[0011] Preferably, the adjustment structure includes a hydraulic cylinder, a push plate, and a push rod. The hydraulic cylinder is arranged on the top plate, and a piston rod is arranged on the hydraulic cylinder. The push plate is connected with the piston rod, and connecting grooves 2 are arranged on opposite sides of the push plate. Connecting rods are arranged at both ends of the push rod. One end of the push rod is extended into the connecting groove 2, the connecting rod is connected with the push plate, and the connecting rod at the other end is connected with the movable plate, and connecting groove 1 is arranged on the movable plate. The hydraulic cylinder and the piston rod push the push plate to rise or fall, and the push plate drives one end of the push rod to rise or fall through the connecting rod, so that the other end of the push rod pushes the movable plate to move back and forth in the fixed groove, driving motor 3 and the grinding disc to move back and forth, so that the grinding disc can polish and grind the edges of silicon wafers of different sizes, thereby improving the versatility of the polishing and grinding device and expanding the application scope of the polishing and grinding device.
[0012] Preferably, a pressing structure is provided on the back of the adjusting plate, and the pressing structure includes a fixed cylinder, a rotating plate, and a pressing plate. The top of the fixed cylinder is connected to the adjusting plate, and a slot is provided on the inner wall of the fixed cylinder. A rotating column is provided on the rotating plate, and the top of the rotating column is extended into the fixed cylinder. A blocking block is provided on the rotating column, and the blocking block is inserted into the slot. The rotating plate is set to a structure that can rotate on the fixed cylinder through the rotating column. The pressing plate is movably arranged on the rotating plate, and a silicon wafer that needs edge polishing and grinding is placed on the carrying plate. The pressing structure presses the silicon wafer downward, and the carrying plate drives the silicon wafer to rotate, so that the silicon wafer drives the rotating plate to rotate, and the blocking block on the rotating column of the rotating plate rotates in the slot, so that the silicon wafer that needs polishing and grinding and the silicon wafer in the polishing and grinding process can rotate smoothly, which is convenient for the grinding disk to smoothly polish and grind the silicon wafer, thereby enhancing the polishing and grinding quality of the silicon wafer.
[0013] Preferably, a fixing hole is provided on the rotating plate, and a fixing column is provided on the pressing plate. The fixing column is vertically passed through the fixing hole, and a baffle is provided on the top of the fixing column. The adjusting plate moves vertically under the action of motor 2, driving the pressing structure to move vertically, and the pressing plate at the bottom end of the fixed column presses the silicon wafer placed on the supporting plate, thereby enhancing the stability of the silicon wafer during edge polishing and grinding, and enhancing the grinding quality of the silicon wafer.
[0014] Preferably, a spring is sleeved on the fixed column between the rotating plate and the pressing plate, and the spring can make the pressing plate elastic during the pressing process of the silicon wafer, thereby avoiding damage to the silicon wafer caused by the pressing plate hard pressing, thereby improving the integrity of the silicon wafer.
[0015] Beneficial effects:
[0016] 1. The transmission stud is driven to rotate by the second motor, and the transmission stud pushes the connecting screw ring to rise or fall, driving the adjustment plate to rise or fall, and then driving the moving plate, the third motor, and the grinding disc to rise or fall. The third motor drives the grinding disc to rotate, so that the grinding disc contacts the edge of the silicon wafer during the rotation process, and the edge of the silicon wafer is ground and polished to improve the grinding and polishing quality of the silicon wafer;
[0017] 2. The top of the rotating column is extended into the fixed cylinder. A card block is arranged on the rotating column. The card block is inserted into the card slot. The rotating plate is arranged on the rotating column to be rotatable on the fixed cylinder. The pressing plate is movably arranged on the rotating plate. The silicon wafer that needs edge polishing and grinding is placed on the carrying plate. The pressing structure presses the silicon wafer downward. The carrying plate drives the silicon wafer to rotate, so that the silicon wafer drives the rotating plate to rotate. The card block on the rotating column of the rotating plate rotates in the card slot, so that the silicon wafer that needs polishing and grinding and the silicon wafer in the polishing and grinding process can rotate smoothly, which is convenient for the grinding disc to perform smooth polishing and grinding on the silicon wafer, thereby enhancing the polishing and grinding quality of the silicon wafer;
[0018] 3. The hydraulic cylinder and piston rod push the push plate up or down, and the push plate drives one end of the push rod to rise or fall through the connecting rod, so that the other end of the push rod pushes the movable plate to move back and forth in the fixed groove, driving the motor 3. The grinding disc moves back and forth, so that the grinding disc can polish and grind the edges of silicon wafers of different sizes, which improves the versatility of the polishing and grinding device and expands the scope of application of the polishing and grinding device. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of the utility model.
[0020] Figure 2 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the transmission stud and the adjustment plate.
[0021] Figure 3 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the adjusting plate and the moving plate.
[0022] Figure 4 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the push plate and the push rod.
[0023] Figure 5 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the rotating plate and the fixed column.
[0024] Figure 6 It is another schematic diagram of the implementation structure of the utility model.
[0025] In the figure: 1. chassis, 2. motor 1, 3. bearing plate, 4. bracket, 5. column, 6. top plate, 7. motor 2, 8. adjustment plate, 9. moving plate, 10. motor 3, 11. grinding disc, 12. transmission stud, 13. connecting screw ring, 14. fixing groove, 15. limiting groove, 16. limiting rod, 17. connecting groove 1, 18. driving shaft, 19. mounting ring, 20. hydraulic cylinder, 21. push plate, 22. push rod, 23. piston rod, 24. connecting groove 2, 25. connecting rod, 26. fixing cylinder, 27. rotating plate, 28. pressure plate, 29. slot, 30. rotating column, 31. fixing hole, 32. block, 33. fixing column, 34. baffle, 35. spring, 36. transmission shaft, 37. anti-skid pad. DETAILED DESCRIPTION
[0026] The present invention will be described in more detail below with reference to the accompanying drawings.
[0027] Embodiment 1:
[0028] As attached Figure 1-5As shown, a silicon wafer edge polishing and grinding device includes a base frame 1, an adjustment structure, and a polishing structure. The base frame 1 is arranged on a bracket 4, a driving structure and a column 5 are arranged on the base frame 1, and a top plate 6 is arranged on the column 5. The adjustment structure is arranged on the top plate 6, and the polishing structure is movably connected to the adjustment structure.
[0029] The driving structure includes a motor 2 and a supporting plate 3 . The motor 2 is arranged on the base frame 1 . A transmission shaft 36 is arranged on the motor 2 . The supporting plate 3 is arranged on the transmission shaft 36 .
[0030] Among them, the polishing structure includes motor 2 7, an adjusting plate 8, a movable plate 9, motor 3 10, and a grinding disc 11. Motor 2 7 is arranged on the top plate 6, a transmission stud 12 is arranged on motor 2 7, and motor 2 7 is set as a servo motor, connecting screw rings 13 are arranged at both ends of the adjusting plate 8, the transmission stud 12 is vertically passed through the connecting screw ring 13, and a fixing groove 14 is arranged on the adjusting plate 8, the movable plate 9 is movably arranged in the fixing groove 14, and the movable plate 9 is movably connected to the adjustment structure, motor 3 10 is arranged on the movable plate 9, a driving shaft 18 is arranged on motor 3 10, the grinding disc 11 is installed on the driving shaft 18, limiting grooves 15 are arranged on the adjusting plate 8 on both sides of the fixing groove 14, limiting rods 16 are arranged on opposite sides of the movable plate 9, and the limiting rods 16 are inserted into the limiting grooves 15, a mounting ring 19 is arranged on the grinding disc 11, the mounting ring 19 is installed on the driving shaft 18, and the grinding disc 11 is set as a structure that can be replaced on the driving shaft 18 through the mounting ring 19.
[0031] Among them, the adjustment structure includes a hydraulic cylinder 20, a push plate 21, and a push rod 22. The hydraulic cylinder 20 is arranged on the top plate 6, and a piston rod 23 is arranged on the hydraulic cylinder 20. The push plate 21 is connected to the piston rod 23. Connecting grooves 24 are arranged on the opposite sides of the push plate 21. Connecting rods 25 are arranged at both ends of the push rod 22. One end of the push rod 22 is extended into the connecting groove 24, and the connecting rod 25 is connected to the push plate 21. The other end of the connecting rod 25 is connected to the movable plate 9, and a connecting groove 17 is arranged on the movable plate 9.
[0032] Among them, a pressing structure is arranged on the back of the adjusting plate 8, and the pressing structure includes a fixed cylinder 26, a rotating plate 27, and a pressing plate 2. The top end of the fixed cylinder 26 is connected to the adjusting plate 8, and a slot 29 is arranged on the inner wall of the fixed cylinder 26. A rotating column 30 is arranged on the rotating plate 27, and the top end of the rotating column 30 is extended into the fixed cylinder 26. A block 32 is arranged on the rotating column 30, and the block 32 is inserted into the slot 29. The rotating plate 27 is arranged as a structure that can rotate on the fixed cylinder 26 through the rotating column 30. The pressing plate 2 is movably arranged on the rotating plate 27, and a fixing hole 31 is arranged on the rotating plate 27. A fixing column 33 is arranged on the pressing plate 2, and the fixing column 33 is vertically passed through the fixing hole 31, and a baffle 34 is arranged on the top end of the fixing column 33. A spring 35 is sleeved on the fixed column 33 between the rotating plate 27 and the pressing plate 2.
[0033] Embodiment 2:
[0034] This embodiment is further described on the basis of the first embodiment. Figure 6 As shown: an anti-skid pad 37 is arranged on the carrier plate 3, and the silicon wafer that needs edge polishing is placed on the carrier plate 3. The anti-skid pad 37 can improve the stability of the silicon wafer on the carrier plate 3, avoid shaking of the silicon wafer during the edge polishing process, and improve the edge grinding quality of the silicon wafer.
[0035] Working principle: Place the silicon wafer that needs edge polishing on the carrier plate 3, select the corresponding grinding disc 11 according to the different requirements for polishing the edge of the silicon wafer, install the mounting ring 19 on the grinding disc 11 on the driving shaft 18, and the motor 2 7 drives the transmission stud 12 to rotate, and the transmission stud 12 pushes the connecting screw ring 13 to rise or fall, driving the adjustment plate 8 to rise or fall, and then drives the moving plate 9, the motor 3 10, the grinding disc 11, and the pressing structure to rise or fall, and the pressing structure presses the silicon wafer downward, and the carrier plate 3 drives the silicon wafer to rotate, so that the silicon wafer drives the rotating plate 27 to rotate, and the block 32 on the rotating column 30 of the rotating plate 27 rotates in the card slot 29, so that the silicon wafer that needs to be polished and the silicon wafer in the polishing process can rotate smoothly, and according to the motor 1 2 drives the transmission shaft 36 and the bearing on the transmission shaft 36 The carrier plate 3 rotates, so that the carrier plate 3 drives the silicon wafer to rotate, the hydraulic cylinder 20 and the piston rod 23 push the push plate 21 to rise or fall, and the push plate 21 drives one end of the push rod 22 to rise or fall through the connecting rod 25, so that the other end of the push rod 22 pushes the movable plate 9 to move back and forth in the fixed groove 14, driving the motor three 10 and the grinding disk 11 to move back and forth, the motor three 10 drives the grinding disk 11 to rotate, so that the grinding disk 11 contacts the edge of the silicon wafer during the rotation process, and the edge of the silicon wafer is ground and polished. After the edge of the silicon wafer is polished and ground, the adjustment plate 8 drives the motor three 10 and the grinding disk 11 to rise under the action of the motor two 7, so that the grinding disk 11 is separated from the edge of the silicon wafer, and the motor one 2 is turned off to stop the rotation of the carrier plate 3, and the silicon wafer with the polished edge is removed from the carrier plate 3 to complete the polishing and grinding of the edge of the silicon wafer.
[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
[0037] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0038] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.
Claims
1. A silicon wafer edge polishing and grinding device, comprising a base frame, an adjustment structure, and a polishing structure, characterized in that: The base frame is arranged on the bracket, and a driving structure and a column are arranged on the base frame, and a top plate is arranged on the column. The adjustment structure is arranged on the top plate, and the polishing structure is movably connected with the adjustment structure. The polishing structure includes motor 2, an adjustment plate, a movable plate, motor 3, and a grinding disc. The motor 2 is arranged on the top plate, and a transmission stud is arranged on the motor 2, and the motor 2 is arranged as a servo motor. Connecting screw rings are arranged at both ends of the adjusting plate, and the transmission stud is vertically passed through the connecting screw ring, and a fixing groove is arranged on the adjusting plate. The movable plate is movably arranged in the fixing groove, and the movable plate is movably connected with the adjustment structure. The motor 3 is arranged on the movable plate, and a driving shaft is arranged on the motor 3. The grinding disc is installed on the driving shaft. The adjustment structure includes a hydraulic cylinder, a push plate, and a push rod. The hydraulic cylinder is arranged on the top plate, and a piston rod is arranged on the hydraulic cylinder. The push plate is connected with the piston rod. A second connecting groove is provided on opposite sides of the push plate, and connecting rods are provided at both ends of the push rod. One end of the push rod is extended into the second connecting groove, the connecting rod is connected to the push plate, and the connecting rod at the other end is connected to the moving plate, and a connecting groove is provided on the moving plate.
2. The silicon wafer edge polishing and grinding device according to claim 1, characterized in that: The driving structure comprises a motor 1 and a bearing plate. The motor 1 is arranged on a base frame, a transmission shaft is arranged on the motor 1, and the bearing plate is arranged on the transmission shaft.
3. The silicon wafer edge polishing and grinding device according to claim 1, characterized in that: Limiting grooves are arranged on the adjusting plates at both sides of the fixing groove, and limiting rods are arranged at opposite sides of the movable plate, and the limiting rods are inserted into the limiting grooves.
4. The silicon wafer edge polishing and grinding device according to claim 1, characterized in that: The grinding disc is provided with a mounting ring, which is mounted on the driving shaft, and the grinding disc is arranged as a replaceable structure on the driving shaft through the mounting ring.
5. The silicon wafer edge polishing and grinding device according to claim 1, characterized in that: A pressing structure is provided on the back of the adjusting plate, and the pressing structure includes a fixed cylinder, a rotating plate, and a pressing plate. The top end of the fixed cylinder is connected to the adjusting plate, and a slot is provided on the inner wall of the fixed cylinder. A rotating column is provided on the rotating plate, and the top end of the rotating column is extended into the fixed cylinder. A blocking block is provided on the rotating column, and the blocking block is inserted into the slot. The rotating plate is set as a structure that can rotate on the fixed cylinder through the rotating column, and the pressing plate is movably arranged on the rotating plate.
6. The silicon wafer edge polishing and grinding device according to claim 5, characterized in that: The rotating plate is provided with a fixing hole, the pressing plate is provided with a fixing column, the fixing column is passed vertically through the fixing hole, and a baffle is provided on the top of the fixing column.
7. The silicon wafer edge polishing and grinding device according to claim 5, characterized in that: A spring is sleeved on the fixed column between the rotating plate and the pressing plate.