Semiconductor plastic product mold with automatic ejection function

Abstract

The utility model discloses a semiconductor plastic product mould with an automatic material ejection function, which comprises a working table, a first U-shaped plate is fixedly arranged at the top of the working table, an upper mould is arranged at the top of the first U-shaped plate through a first pushing mechanism, a lower mould is fixedly arranged at the top of the working table, and the upper mould and the lower mould are fixedly arranged on the working table. And a mold groove is formed in the top of the lower mold, a second U-shaped plate is fixedly installed at the bottom of the workbench, and a connecting rod is installed on the inner wall of the second U-shaped plate through a second pushing mechanism. A second electric push rod drives a second push plate to ascend, the second push plate drives a connecting rod to ascend, and the connecting rod drives an ejector plate to ascend, so that the ejector plate ejects a semiconductor plastic part on the inner wall of a mold groove, and after ejection, a motor drives a lead screw to rotate, and the lead screw drives a moving block to move; and the moving block drives the material pushing plate to move, so that the semiconductor plastic parts can be pushed through the material pushing plate and fall off through the inclined plate.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to a mold for semiconductor plastic products with an automatic ejection function. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. When producing and processing semiconductor plastic parts, molds are usually required to produce and process semiconductor plastic parts.

[0003] In the process of using the mold, molding is usually performed through the mold groove, but after molding, the molded semiconductor plastic parts need to be manually taken out because when molding semiconductor plastic parts, multiple groups of semiconductor plastic parts are usually molded at the same time. This requires taking out the semiconductor plastic parts multiple times when taking out multiple groups of semiconductor plastic parts, which is cumbersome to use and inconvenient to automatically take out the semiconductor plastic parts. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a mold for semiconductor plastic products with an automatic ejection function, which solves the problems in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A mold for semiconductor plastic products with an automatic ejection function comprises a workbench, a first U-shaped plate is fixedly installed on the top of the workbench, an upper mold is installed on the top of the first U-shaped plate through a first pushing mechanism, a lower mold is fixedly installed on the top of the workbench, a mold groove is provided on the top of the lower mold, a second U-shaped plate is fixedly installed on the bottom of the workbench, a connecting rod is installed on the inner wall of the second U-shaped plate through a second pushing mechanism, an ejection plate is fixedly installed on one end of the connecting rod, a pusher plate is installed on one side of the workbench through a moving mechanism, and a limiting mechanism is provided on the top of the workbench.

[0007] Preferably, the first pushing mechanism includes a first electric push rod fixedly mounted on the top of the first U-shaped plate, a first push plate fixedly mounted on the output end of the first electric push rod, and a bottom of the first push plate and a top of the upper mold are fixedly mounted.

[0008] Preferably, the second pushing mechanism includes a second electric push rod fixedly mounted on the inner wall of the second U-shaped plate, a second push plate fixedly mounted on the output end of the second electric push rod, and a top of the second push plate and one end of the connecting rod are fixedly mounted.

[0009] Preferably, the moving mechanism includes a motor fixedly mounted on one side of the workbench, a screw is fixedly mounted on the output end of the motor, a moving block is threadedly sleeved on the surface of the screw, and the top of the moving block and the bottom of the push plate are fixedly mounted.

[0010] Preferably, the limiting mechanism comprises a limiting groove opened on the top of the workbench, a limiting block is slidably mounted on the inner wall of the limiting groove, and the top of the limiting block and the bottom of the moving block are fixedly mounted.

[0011] Preferably, an inclined plate is fixedly mounted on the top of the workbench, and one side of the inclined plate and one side of the lower mold are fixedly mounted.

[0012] Preferably, support columns are fixedly installed on the bottom of the workbench, and the number of the support columns is four groups and they are arranged in an array.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the semiconductor plastic product mold with automatic ejection function drives the upper mold to descend by the first electric push rod, so that the upper mold and the lower mold cooperate to form the semiconductor plastic part; after forming, the upper mold is driven to rise by the first electric push rod, so that the upper mold leaves the lower mold, and the second push plate is driven to rise by the second electric push rod, and the second push plate drives the connecting rod to rise, and the connecting rod drives the ejection plate to rise, so that the ejection plate ejects the semiconductor plastic part on the inner wall of the mold groove; after ejection, the motor drives the screw rod to rotate, the screw rod drives the moving block to move, and the moving block drives the push plate to move, so that the semiconductor plastic part can be pushed by the push plate, and the semiconductor plastic part can be automatically unloaded by the inclined plate falling, thereby achieving the purpose of automatically taking out the semiconductor plastic part, with a simple structure and easy use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the positive equalization diagram of the utility model;

[0015] Figure 2 It is a structural schematic diagram of a partial side sectional view of the utility model;

[0016] Figure 3 It is a structural schematic diagram of a partial top view of the utility model;

[0017] Figure 4 It is a structural schematic diagram of a partial diagram of the utility model;

[0018] Figure 5 It is a structural schematic diagram of the enlarged view of point A of the utility model.

[0019] In the figure: 1. workbench; 2. first U-shaped plate; 3. first electric push rod; 4. first push plate; 5. upper mold; 6. lower mold; 7. mold groove; 8. second U-shaped plate; 9. second electric push rod; 10. second push plate; 11. connecting rod; 12. ejector plate; 13. motor; 14. screw; 15. moving block; 16. ejector plate; 17. limit groove; 18. limit block; 19. inclined plate; 20. support column. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Example: Refer to Figure 1-5 The utility model provides a technical solution, a semiconductor plastic product mold with automatic ejection function, including a workbench 1, a support column 20 is fixedly installed at the bottom of the workbench 1, the number of the support columns 20 is four groups and arranged in an array, a first U-shaped plate 2 is fixedly installed on the top of the workbench 1, an upper mold 5 is installed on the top of the first U-shaped plate 2 through a first pushing mechanism, the first pushing mechanism includes a first electric push rod 3 fixedly installed on the top of the first U-shaped plate 2, a first push plate 4 is fixedly installed on the output end of the first electric push rod 3, the bottom of the first push plate 4 and the top of the upper mold 5 are fixedly installed, which is convenient for driving the upper mold 5 to move up and down, and the top of the workbench 1 A lower mold 6 is fixedly installed on the bottom, and a mold groove 7 is opened on the top of the lower mold 6. A second U-shaped plate 8 is fixedly installed on the bottom of the workbench 1. A connecting rod 11 is installed on the inner wall of the second U-shaped plate 8 through a second pushing mechanism. The second pushing mechanism includes a second electric push rod 9 fixedly installed on the inner wall of the second U-shaped plate 8. A second push plate 10 is fixedly installed on the output end of the second electric push rod 9. The top of the second push plate 10 and one end of the connecting rod 11 are fixedly installed to facilitate driving the connecting rod 11 to rise and fall. An inclined plate 19 is fixedly installed on the top of the workbench 1, and one side of the inclined plate 19 and one side of the lower mold 6 are fixedly installed. A top plate 12 is fixedly installed on one end of the connecting rod 11.

[0022] Specifically, a push plate 16 is installed on one side of the workbench 1 through a moving mechanism. The moving mechanism includes a motor 13 fixedly installed on one side of the workbench 1. A screw rod 14 is fixedly installed on the output end of the motor 13. A moving block 15 is threadedly sleeved on the surface of the screw rod 14. The top of the moving block 15 and the bottom of the push plate 16 are fixedly installed to facilitate the movement of the push plate 16. A limiting mechanism is arranged on the top of the workbench 1. The limiting mechanism includes a limiting groove 17 opened on the top of the workbench 1. A limiting block 18 is slidably installed on the inner wall of the limiting groove 17. The top of the limiting block 18 and the bottom of the moving block 15 are fixedly installed to limit the moving block 15, so that the movement of the moving block 15 is more stable. The upper mold 5 is driven to descend by the first electric push rod 3, so that the upper mold 5 and the lower mold 6 are matched. The semiconductor plastic part can be molded. After the molding is completed, the upper mold 5 is driven to rise by the first electric push rod 3, so that the upper mold 5 leaves the lower mold 6, and the second push plate 10 is driven to rise by the second electric push rod 9. The second push plate 10 drives the connecting rod 11 to rise, and the connecting rod 11 drives the ejecting plate 12 to rise, so that the ejecting plate 12 ejects the semiconductor plastic part on the inner wall of the mold groove 7. After ejection, the motor 13 drives the screw rod 14 to rotate, the screw rod 14 drives the moving block 15 to move, and the moving block 15 drives the ejecting plate 16 to move, and the semiconductor plastic part can be pushed by the ejecting plate 16, and the semiconductor plastic part falls through the inclined plate 19, so that the semiconductor plastic part can be automatically unloaded, thereby achieving the purpose of automatically taking out the semiconductor plastic part. The structure is simple and easy to use.

[0023] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0024] When in use: when using the semiconductor plastic product mold with automatic ejection function, the first push plate 4 is driven to descend by the first electric push rod 3, and the first push plate 4 drives the upper mold 5 to descend, so that the upper mold 5 and the lower mold 6 cooperate to form the semiconductor plastic part. After the molding is completed, the upper mold 5 is driven to rise by the first electric push rod 3, so that the upper mold 5 leaves the lower mold 6, and the second push plate 10 is driven to rise by the second electric push rod 9, and the second push plate 10 drives the connecting rod 11 to rise, and the connecting rod 11 drives the ejection plate 12 to rise, so that the ejection plate 12 ejects the semiconductor plastic part on the inner wall of the mold groove 7. After ejection, the motor 13 drives the screw rod 14 to rotate, and the screw rod 14 drives the moving block 15 to move, and the moving block 15 drives the ejection plate 16 to move, and the semiconductor plastic part can be pushed by the ejection plate 16, and the semiconductor plastic part can be automatically unloaded by the inclined plate 19, so as to achieve the purpose of automatically taking out the semiconductor plastic part. The structure is simple and easy to use.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mold for semiconductor plastic products with automatic ejection function, comprising a workbench (1), characterized in that: A first U-shaped plate (2) is fixedly mounted on the top of the workbench (1), an upper mold (5) is mounted on the top of the first U-shaped plate (2) via a first pushing mechanism, a lower mold (6) is fixedly mounted on the top of the workbench (1), a mold groove (7) is provided on the top of the lower mold (6), a second U-shaped plate (8) is fixedly mounted on the bottom of the workbench (1), a connecting rod (11) is mounted on the inner wall of the second U-shaped plate (8) via a second pushing mechanism, a top plate (12) is fixedly mounted on one end of the connecting rod (11), a push plate (16) is mounted on one side of the workbench (1) via a moving mechanism, and a limiting mechanism is provided on the top of the workbench (1).

2. A semiconductor plastic product mold with automatic ejection function according to claim 1, characterized in that: The first pushing mechanism comprises a first electric push rod (3) fixedly mounted on the top of the first U-shaped plate (2); a first push plate (4) is fixedly mounted on the output end of the first electric push rod (3); and the bottom of the first push plate (4) and the top of the upper mold (5) are fixedly mounted.

3. A semiconductor plastic product mold with automatic ejection function according to claim 1, characterized in that: The second pushing mechanism comprises a second electric push rod (9) fixedly mounted on the inner wall of the second U-shaped plate (8), a second push plate (10) fixedly mounted on the output end of the second electric push rod (9), and a top of the second push plate (10) and one end of a connecting rod (11) are fixedly mounted.

4. A semiconductor plastic product mold with automatic ejection function according to claim 1, characterized in that: The moving mechanism comprises a motor (13) fixedly mounted on one side of the workbench (1); a screw rod (14) is fixedly mounted on the output end of the motor (13); a moving block (15) is threadedly sleeved on the surface of the screw rod (14); and the top of the moving block (15) and the bottom of the push plate (16) are fixedly mounted.

5. A semiconductor plastic product mold with automatic ejection function according to claim 4, characterized in that: The limiting mechanism comprises a limiting groove (17) provided on the top of the workbench (1), a limiting block (18) being slidably mounted on the inner wall of the limiting groove (17), and the top of the limiting block (18) and the bottom of the moving block (15) being fixedly mounted.

6. The semiconductor plastic product mold with automatic ejection function according to claim 1, characterized in that: An inclined plate (19) is fixedly mounted on the top of the workbench (1), and one side of the inclined plate (19) and one side of the lower mold (6) are fixedly mounted.

7. The semiconductor plastic product mold with automatic ejection function according to claim 1, characterized in that: Support columns (20) are fixedly mounted on the bottom of the workbench (1), and the number of the support columns (20) is four groups and they are arranged in an array.

Images