Electroplating device for silver-plated copper wire with uniform plating layer

By designing an electroplating device for silver-plated copper wire including an adjustment mechanism and a driving mechanism, the problem of uneven coating caused by the inability to adjust the tension of copper wire in the prior art is solved, and the uniformity of the coating and production quality are improved.

CN222758359UActive Publication Date: 2025-04-15FUJIAN YINTONG SUPERCONDUCTING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421560396.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-03
Publication Date
2025-04-15
Estimated Expiration
2034-07-03

AI Technical Summary

Technical Problem

The existing electroplating device cannot adjust the tension of the copper wire in the electroplating cell, resulting in the copper wire being too loose or too tight, causing the problem of uneven coating.

Method used

An electroplating device for silver-plated copper wire with uniform coating is designed, including an adjustment mechanism and a driving mechanism. The adjustment mechanism can adjust the tightness of the copper wire through the coordination of the connecting plate, roller and vertical plate; the driving mechanism uses a motor and a rotating rod to drive the movement of the connecting plate and roller to achieve adjustment of the tension of the copper wire.

Benefits of technology

By adjusting the tightness of the copper wire, the uneven coating problem caused by excessive loose copper wire is avoided, and the production quality of silver-plated copper wire is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of electroplating devices, and discloses an electroplating device for a silver-plated copper wire with a uniform plating layer, which comprises an electroplating box, the left side and the right side of the top of the electroplating box are fixedly sleeved with fixed shafts, and the outer surfaces of the fixed shafts are movably sleeved with first rollers; the adjusting mechanism is arranged in the electroplating box and located between the two fixing shafts; and the driving mechanism is arranged on the front surface of the electroplating box. By arranging the connecting plate, the second roller, the motor and the rotating rod, when an operator needs to adjust the tightness degree of a copper wire, the rotating shaft can drive the rotating rod to rotate by starting the motor, and then the hinge rod can drive the fixing plate to ascend or descend; and a vertical plate can drive a connecting plate to move, so that the height of a second roller can be adjusted, the tightness degree of copper wires can be adjusted, and the phenomenon that the copper wires are too loose and make contact with one another, and consequently a coating is not uniform can be avoided.
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Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, and more specifically to an electroplating device for silver-plated copper wires with uniform plating layers. Background Art

[0002] Silver-plated copper wire is called silver-plated copper wire or silver-plated wire. Silver-plated copper wire is made by silver plating or drawing on high-quality oxygen-free copper. It has excellent electrical conductivity, thermal conductivity, corrosion resistance and high-temperature oxidation resistance.

[0003] During the production process of silver-plated copper wire, an electroplating device is required to silver-plate the copper wire. In actual use, the existing electroplating device generally electroplates multiple parallel copper wires at the same time in order to pursue production efficiency. However, this type of electroplating device cannot adjust the tension of the copper wire inside the electroplating pool, which causes the copper wire to be too loose, causing multiple copper wires to contact together, resulting in uneven electroplating on the contact surface of the copper wire. If the copper wire is too tight, the thin copper wire will be pulled apart or the internal structure will be broken, affecting the production quality of the silver-plated copper wire. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides an electroplating device for silver-plated copper wire with uniform coating, which has the advantage of adjusting the tightness of the copper wire.

[0005] To achieve the above object, the utility model provides the following technical solution: an electroplating device for silver-plated copper wire with uniform coating, comprising:

[0006] An electroplating box, wherein the left and right sides of the top of the electroplating box are both fixedly sleeved with fixed shafts, and the outer surface of the fixed shaft is movably sleeved with a first roller;

[0007] An adjusting mechanism, the adjusting mechanism is arranged inside the electroplating box and located between the two fixed shafts;

[0008] A driving mechanism, wherein the driving mechanism is arranged on the front side of the electroplating box;

[0009] Among them, the adjusting mechanism includes a connecting plate, and there are two connecting plates. The two connecting plates are movably installed on the front and rear sides of the inside of the electroplating box respectively, and a fixing rod is fixedly sleeved between the left end portion and the right end portion of the two connecting plates respectively, and the outer surface of the fixing rod is movably sleeved with a second roller, and the middle part of each connecting plate is fixedly connected to the vertical plate, the top of the front vertical plate is fixedly connected to a fixing plate that cooperates with the driving mechanism, and the top of the rear vertical plate is fixedly connected to a fixing block, the interior of the fixing block is movably sleeved with a vertical rod, and the bottom end of the vertical rod is fixedly connected to a mounting plate, and the outer surface of the mounting plate is fixedly connected to the top of the back side of the electroplating box.

[0010] As a preferred technical solution of the utility model, the driving mechanism includes:

[0011] A motor, wherein the motor is fixedly mounted on the front of the electroplating box, and the output shaft of the motor is fixedly connected to a rotating shaft;

[0012] A rotating rod, wherein the inner wall of one end of the rotating rod is fixedly sleeved with the outer surface of the rotating shaft, the other end of the rotating rod is hinged with a hinged rod, and the top end of the hinged rod is hinged with the bottom of the fixed plate.

[0013] As a preferred technical solution of the utility model, a support plate is fixedly connected to the top of the left side of the electroplating box, and brackets are fixedly installed on both the front and rear sides of the upper surface of the support plate.

[0014] As a preferred technical solution of the utility model, a transverse plate is fixedly connected between the brackets, and a first cleaning sponge is fixedly installed on the top of the transverse plate.

[0015] As a preferred technical solution of the utility model, round rods are fixedly installed inside the two brackets, and a movable plate is movably sleeved between the two round rods.

[0016] As a preferred technical solution of the utility model, a second cleaning sponge is fixedly installed on the bottom of the movable plate, and a handle is fixedly installed on the top of the movable plate.

[0017] As a preferred technical solution of the utility model, a spring is movably sleeved on the outer surface of the round rod, the bottom end of the spring is fixedly connected to the top of the movable plate, and the top end of the spring is fixedly connected to the top of the inner surface of the bracket.

[0018] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0019] 1. The utility model is provided with a connecting plate, a second roller, a motor and a rotating rod. When the operator needs to adjust the tightness of the copper wire, the motor can be started to make the rotating shaft drive the rotating rod to rotate, so that the hinged rod can drive the fixed plate to rise or fall, so that the connecting plate can be driven to move through the vertical plate, and the height of the second roller can be adjusted, so that the tightness of the copper wire can be adjusted, so as to avoid the phenomenon of uneven coating caused by the copper wire being too loose and in contact with each other.

[0020] 2. The utility model provides a first cleaning sponge, a second cleaning sponge, a handle and a spring. The operator pulls the handle upwards to make the handle drive the movable plate and the second cleaning sponge to rise, and then passes the copper wire through the first cleaning sponge and the second cleaning sponge. At this time, the spring will push the movable plate downward under the action of elastic recovery, so that the second cleaning sponge and the first cleaning sponge can clamp the copper wire, so that the outer surface of the copper wire can be cleaned during the movement of the copper wire, avoiding impurities on the outer surface of the copper wire causing uneven electroplating of the copper wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the cross-sectional structure of the front side of the utility model;

[0023] Figure 3 It is a cross-sectional structural schematic diagram of the side of the utility model;

[0024] Figure 4 It is a cross-sectional structural schematic diagram of a round rod of the utility model;

[0025] Figure 5 for Figure 3 Schematic diagram of the local enlarged structure at point A in the middle.

[0026] In the figure: 1. electroplating box; 2. fixed shaft; 3. first roller; 4. connecting plate; 5. fixed rod; 6. second roller; 7. vertical plate; 8. fixed plate; 9. fixed block; 10. vertical rod; 11. mounting plate; 12. motor; 13. rotating shaft; 14. rotating rod; 15. hinged rod; 16. supporting plate; 17. bracket; 18. horizontal plate; 19. first cleaning sponge; 20. round rod; 21. movable plate; 22. second cleaning sponge; 23. handle; 24. spring. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] like Figures 1 to 5 As shown, the utility model provides a plating device for silver-plated copper wire with uniform plating layer, comprising:

[0029] An electroplating box 1, wherein a fixed shaft 2 is fixedly sleeved on both left and right sides of the top of the electroplating box 1, and a first roller 3 is movably sleeved on the outer surface of the fixed shaft 2;

[0030] An adjusting mechanism, which is arranged inside the electroplating box 1 and between the two fixed shafts 2;

[0031] A driving mechanism, wherein the driving mechanism is arranged on the front side of the electroplating box 1;

[0032] Among them, the adjusting mechanism includes a connecting plate 4, and the number of the connecting plates 4 is two. The two connecting plates 4 are movably installed on the front and rear sides of the inside of the electroplating box 1, and a fixing rod 5 is fixedly sleeved between the left end and the right end of the two connecting plates 4. The outer surface of the fixing rod 5 is movably sleeved with a second roller 6. The middle part of each connecting plate 4 is fixedly connected to a vertical plate 7, and the top of the front vertical plate 7 is fixedly connected to a fixing plate 8 that cooperates with the driving mechanism, and the top of the rear vertical plate 7 is fixedly connected to a fixing block 9. The interior of the fixing block 9 is movably sleeved with a vertical rod 10, and the bottom end of the vertical rod 10 is fixedly connected to a mounting plate 11, and the outer surface of the mounting plate 11 is fixedly connected to the top of the back of the electroplating box 1.

[0033] The outer surfaces of the first roller 3 and the second roller 6 are both provided with a plurality of grooves, so that a plurality of copper wires can be electroplated at the same time. By arranging the vertical rod 10, the vertical rod 10 can limit the fixed block 9. When the second roller 6 rises or falls, the tightness of the copper wire can be adjusted to avoid the situation in which the copper wire is too loose and the plurality of copper wires come into contact with each other, resulting in uneven electroplating on the contact surface.

[0034] Wherein, the driving mechanism comprises:

[0035] A motor 12, wherein the motor 12 is fixedly mounted on the front side of the electroplating box 1, and an output shaft of the motor 12 is fixedly connected to a rotating shaft 13;

[0036] The inner wall of one end of the rotating rod 14 is fixedly sleeved with the outer surface of the rotating shaft 13 , and the other end of the rotating rod 14 is hinged with a hinged rod 15 , and the top end of the hinged rod 15 is hinged with the bottom of the fixed plate 8 .

[0037] When the motor 12 is started, the rotating shaft 13 drives the rotating rod 14 to rotate, so that the hinge rod 15 can push the fixing plate 8 to move upward.

[0038] A support plate 16 is fixedly connected to the top of the left side of the electroplating box 1 , and brackets 17 are fixedly installed on both the front and rear sides of the upper surface of the support plate 16 .

[0039] By providing the support plate 16 , the support plate 16 can support the bracket 17 .

[0040] A transverse plate 18 is fixedly connected between the brackets 17 , and a first cleaning sponge 19 is fixedly installed on the top of the transverse plate 18 .

[0041] By providing the first cleaning sponge 19, the first cleaning sponge 19 can play a role in cleaning the copper wire.

[0042] Round rods 20 are fixedly installed inside the two brackets 17 , and a movable plate 21 is movably sleeved between the two round rods 20 .

[0043] The inner surface of the movable plate 21 is smooth, so that it can move more smoothly on the outer surface of the round rod 20 .

[0044] A second cleaning sponge 22 is fixedly mounted on the bottom of the movable plate 21 , and a handle 23 is fixedly mounted on the top of the movable plate 21 .

[0045] The operator can pull the handle 23 upwards to drive the movable plate 21 and the second cleaning sponge 22 to move upwards.

[0046] A spring 24 is movably sleeved on the outer surface of the round rod 20 , the bottom end of the spring 24 is fixedly connected to the top of the movable plate 21 , and the top end of the spring 24 is fixedly connected to the top of the inner surface of the bracket 17 .

[0047] When the spring 24 is compressed, it can push the movable plate 21 to return to its original position under the action of elastic recovery.

[0048] The working principle and use process of this utility model:

[0049] First, the operator pulls the handle 23 upwards, so that the handle 23 drives the movable plate 21 and the second cleaning sponge 22 to move upwards, and then passes the copper wire through the second cleaning sponge 22 and the first cleaning sponge 19. At this time, the operator releases the handle 23, so that the spring 24 pushes the movable plate 21 downward under the action of elastic recovery, and then the second cleaning sponge 22 and the first cleaning sponge 19 can clamp the copper wire, so that impurities and dust on the outer surface of the copper wire can be cleaned during the movement of the copper wire, thereby preventing these dust and impurities from affecting the electroplating effect of the copper wire.

[0050] When the copper wire passes through the first cleaning sponge 19 and the second cleaning sponge 22, and then passes through the top of the first roller 3 and the bottom of the second roller 6 in turn, and then the electroplating box 1 is started, the copper wire can be electroplated. When the operator needs to adjust the tightness of the copper wire, the motor 12 can be started to make the rotating shaft 13 drive the rotating rod 14 to rotate, so that the hinge rod 15 can pull the fixed plate 8 to move downward, and then the vertical plate 7 drives the connecting plate 4 to move downward, so that the second roller 6 can move downward, and the loose copper wire can be tightened, thereby avoiding the copper wire being too loose and causing the side-by-side copper wires to contact each other and causing uneven plating on the contact surface, thereby improving the production quality of silver-plated copper wire.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for silver-plated copper wire with uniform coating, characterized in that: Included are: An electroplating box (1), wherein a fixed shaft (2) is fixedly sleeved on both left and right sides of the top of the electroplating box (1), and a first roller (3) is movably sleeved on the outer surface of the fixed shaft (2); An adjustment mechanism, the adjustment mechanism being arranged inside the electroplating box (1) and located between the two fixed shafts (2); A driving mechanism, wherein the driving mechanism is arranged on the front side of the electroplating box (1); The adjusting mechanism comprises a connecting plate (4), wherein there are two connecting plates (4), and the two connecting plates (4) are movably mounted on the front and rear sides of the electroplating box (1), respectively; a fixing rod (5) is fixedly sleeved between the left end and the right end of the two connecting plates (4), and a second roller (6) is movably sleeved on the outer surface of the fixing rod (5); the middle part of each connecting plate (4) is fixedly connected to a vertical plate (7), the top of the front vertical plate (7) is fixedly connected to a fixing plate (8) cooperating with the driving mechanism, and the top of the rear vertical plate (7) is fixedly connected to a fixing block (9), the interior of the fixing block (9) is movably sleeved with a vertical rod (10), and the bottom end of the vertical rod (10) is fixedly connected to a mounting plate (11), and the outer surface of the mounting plate (11) is fixedly connected to the top of the back of the electroplating box (1).

2. The electroplating device for silver-plated copper wire with uniform coating according to claim 1, characterized in that: The driving mechanism comprises: A motor (12), wherein the motor (12) is fixedly mounted on the front side of the electroplating box (1), and an output shaft of the motor (12) is fixedly connected to a rotating shaft (13); A rotating rod (14), wherein the inner wall of one end of the rotating rod (14) is fixedly sleeved with the outer surface of the rotating shaft (13), and the other end of the rotating rod (14) is hingedly connected with a hinged rod (15), and the top end of the hinged rod (15) is hingedly connected to the bottom of the fixed plate (8).

3. The electroplating device for silver-plated copper wire with uniform plating layer according to claim 1, characterized in that: A support plate (16) is fixedly connected to the top of the left side of the electroplating box (1), and brackets (17) are fixedly installed on both the front and rear sides of the upper surface of the support plate (16).

4. The electroplating device for silver-plated copper wire with uniform coating according to claim 3, characterized in that: A transverse plate (18) is fixedly connected between the brackets (17), and a first cleaning sponge (19) is fixedly mounted on the top of the transverse plate (18).

5. The electroplating device for silver-plated copper wire with uniform coating according to claim 3, characterized in that: Round rods (20) are fixedly installed inside the two brackets (17), and a movable plate (21) is movably sleeved between the two round rods (20).

6. The electroplating device for silver-plated copper wire with uniform coating according to claim 5, characterized in that: A second cleaning sponge (22) is fixedly mounted on the bottom of the movable plate (21), and a handle (23) is fixedly mounted on the top of the movable plate (21).

7. The electroplating device for silver-plated copper wire with uniform coating according to claim 5, characterized in that: A spring (24) is movably sleeved on the outer surface of the round rod (20), the bottom end of the spring (24) is fixedly connected to the top of the movable plate (21), and the top end of the spring (24) is fixedly connected to the top of the inner surface of the bracket (17).