Sputtering film strain type temperature and pressure integrated sensor

Abstract

The utility model provides a sputtering film strain type temperature and pressure integrated sensor, which relates to the technical field of sensors and comprises a shell, an electrical interface seat is arranged at the top of the shell, and a pressure interface seat is arranged at the bottom of the shell. According to the utility model, the upper layer circuit board and the lower layer circuit board in the housing form a layered structure through the arrangement of the circuit board support, the upper layer circuit board is mainly responsible for temperature and pressure signal conditioning, and the lower layer circuit board is mainly responsible for being connected with the sputtering film core body. The sputtering film strain type temperature and pressure integrated sensor is produced through integrated laser welding, the upper circuit board and the lower circuit board are fixed through metal contact pins, the anti-seismic performance and the waterproof performance of the sensor are improved, and meanwhile the sensor is packaged through heat-conducting glue of the NTC thermistor, so that the temperature and pressure of the sensor are greatly improved. The strength and the thermal sensitivity of the sensor can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a sputtering thin film strain type temperature and pressure integrated sensor. Background Art

[0002] The temperature and pressure sensor is a device that can measure temperature and pressure at the same time. It combines the functions of temperature sensor and pressure sensor to provide important monitoring data for a variety of applications.

[0003] In the prior art, conventional voltage-stabilizing sensor devices are usually installed in a split manner, which may result in assembly difficulties and unreasonable internal structure design. To address the above problems, it is necessary to improve and optimize the internal structure of the sensor. Utility Model Content

[0004] The utility model aims to solve the problems of difficult assembly and unreasonable internal structure design in the prior art, and proposes a sputtering thin film strain type temperature and pressure integrated sensor.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: it includes a shell, an electrical interface seat is arranged on the top of the shell, a pressure interface seat is arranged on the bottom of the shell, an NTC protection tube is arranged on the bottom of the pressure interface seat, a circuit board bracket is fixedly connected to the inner surface of the shell, an upper circuit board is fixedly connected to the top of the circuit board bracket, a lower circuit board is fixedly connected to the bottom of the circuit board bracket, a sputtering film core is connected to the inside of the shell through an aluminum silicon wire, a metal base is fixedly connected to the bottom of the shell, the metal base is fixedly connected to the sputtering film core, an air hole is opened on the outer surface of the shell, the sputtering film core matches the position of the air hole, a wire is arranged inside the shell, an NTC thermistor is arranged inside the NTC protection tube, and the NTC thermistor is connected to the upper circuit board and the lower circuit board through the wire.

[0006] Preferably, a plurality of metal pins are arranged inside the circuit board bracket, and the metal pins are used to connect the upper circuit board and the lower circuit board.

[0007] Preferably, the lower circuit board is electrically connected to the sputtered thin film core.

[0008] Preferably, a plurality of thin film resistors are arranged on the surface of the sputtered thin film core, and the thin film resistors are connected to the upper circuit board through aluminum silicon wires.

[0009] Preferably, the lower circuit board is fixedly connected to the pressure interface seat via a circuit board bracket.

[0010] Preferably, the NTC thermistor is fixed inside the NTC protection tube by means of thermally conductive adhesive.

[0011] Compared with the prior art, the advantages and positive effects of the utility model are:

[0012] 1. In the utility model, the upper circuit board and the lower circuit board inside the shell form a layered structure through the arrangement of the circuit board bracket. The upper circuit board is mainly responsible for temperature and pressure signal conditioning, and the lower circuit board is mainly responsible for connecting with the sputtered film core. Through the use of metal pins, the upper circuit board and the lower circuit board can transmit signals. The sputtered film strain type temperature and pressure integrated sensor is produced by integrated laser welding, and the upper circuit board and the lower circuit board are fixed by metal pins, which improves the shock resistance and waterproof performance of the sensor. At the same time, the strength and thermal sensitivity of the sensor can be improved by encapsulating the NTC thermistor with thermal conductive glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram of a sputtered thin film strain type temperature and pressure integrated sensor is proposed for the utility model;

[0014] Figure 2 A front view of a sputtered thin film strain type temperature and pressure integrated sensor is proposed for the utility model;

[0015] Figure 3 A cross-sectional view of a sputtered thin film strain type temperature and pressure integrated sensor is proposed for the utility model;

[0016] Figure 4 The utility model provides a sectional view from another perspective of a sputtered thin film strain type temperature and pressure integrated sensor.

[0017] Legend: 1. Electrical interface socket; 2. Housing; 3. Pressure interface socket; 4. NTC protection tube; 5. Upper circuit board; 6. Metal pins; 7. Lower circuit board; 8. Sputtered film core; 9. Circuit board bracket; 10. Wire; 11. NTC thermistor. DETAILED DESCRIPTION

[0018] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0019] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0020] Embodiment 1, as Figure 1-Figure 4As shown, the utility model provides a sputtered thin film strain type temperature and pressure integrated sensor, including a shell 2, an electrical interface seat 1 is arranged on the top of the shell 2, a pressure interface seat 3 is arranged on the bottom of the shell 2, an NTC protection tube 4 is arranged on the bottom of the pressure interface seat 3, a circuit board bracket 9 is fixedly connected to the inner surface of the shell 2, an upper circuit board 5 is fixedly connected to the top of the circuit board bracket 9, a lower circuit board 7 is fixedly connected to the bottom of the circuit board bracket 9, a sputtered thin film core 8 is connected to the inside of the shell 2 through an aluminum silicon wire, a metal base is fixedly connected to the bottom of the shell 2, the metal base is fixedly connected to the sputtered thin film core 8, an air hole is opened on the outer surface of the shell 2, and the sputtered thin film core 8 matches the position of the air hole A wire 10 is arranged inside the housing 2, an NTC thermistor 11 is arranged inside the NTC protection tube 4, the NTC thermistor 11 is connected to the upper circuit board 5 and the lower circuit board 7 through the wire 10, a plurality of metal pins 6 are arranged inside the circuit board bracket 9, the metal pins 6 are used to connect the upper circuit board 5 and the lower circuit board 7, the lower circuit board 7 is electrically connected to the sputtered film core 8, a plurality of thin film resistors are arranged on the surface of the sputtered film core 8, the thin film resistors are connected to the upper circuit board 5 through aluminum silicon wires, the lower circuit board 7 is fixedly connected to the pressure interface seat 3 through the circuit board bracket 9, and the NTC thermistor 11 is fixed inside the NTC protection tube 4 through thermal conductive glue.

[0021] The effect achieved by the entire embodiment 1 is that the sensor forms an external structure through the coordinated use of the housing 2, the electrical interface seat 1, the pressure interface seat 3 and the NTC protection tube 4. The upper circuit board 5 and the lower circuit board 7 inside the housing 2 form a layered structure through the arrangement of the circuit board bracket 9. The upper circuit board 5 is mainly responsible for temperature and pressure signal conditioning, and the lower circuit board 7 is mainly responsible for connecting with the sputtered film core 8. Through the use of the metal pin 6, the upper circuit board 5 and the lower circuit board 7 can transmit signals. When the sensor is in use, when the measured medium applies pressure through the pressure interface seat 3, the thin film resistor on the sputtered film core 8 will As a result, deformation occurs, which in turn changes its resistance value. This change in resistance value is transmitted to the upper circuit board 5 through the aluminum silicon wire, and is output as a pressure signal after signal processing. At the same time, the NTC thermistor 11 senses the ambient temperature and transmits the temperature signal to the circuit board for processing through the wire 10, ultimately achieving integrated temperature and pressure measurement. The sputtered thin film strain type temperature and pressure integrated sensor is produced using integrated laser welding, and the upper circuit board 5 and the lower circuit board 7 are fixed with metal pins 6, which improves the sensor's shock resistance and waterproof performance. At the same time, the thermal conductive adhesive packaging of the NTC thermistor 11 can improve the sensor's strength and thermal sensitivity.

[0022] Working principle: The upper circuit board 5 and the lower circuit board 7 form a layered structure through the setting of the circuit board bracket 9. The upper circuit board 5 is mainly responsible for temperature and pressure signal conditioning, and the lower circuit board 7 is mainly responsible for connecting with the sputtered film core 8. Through the use of metal pins 6, the upper circuit board 5 and the lower circuit board 7 can transmit signals. When the sensor is in use, when the measured medium applies pressure through the pressure interface seat 3, the thin film resistor on the sputtered film core 8 will deform accordingly, thereby changing its resistance value. This change in resistance value is transmitted to the upper circuit board 5 through the aluminum silicon wire, and the output is a pressure signal after signal processing. At the same time, the NTC thermistor 11 senses the ambient temperature and transmits the temperature signal to the circuit board for processing through the wire 10, ultimately realizing integrated temperature and pressure measurement.

[0023] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A sputtered thin film strain type temperature and pressure integrated sensor, comprising a housing (2), characterized in that: An electrical interface seat (1) is arranged at the top of the shell (2), a pressure interface seat (3) is arranged at the bottom of the shell (2), an NTC protection tube (4) is arranged at the bottom of the pressure interface seat (3), a circuit board bracket (9) is fixedly connected to the inner surface of the shell (2), an upper circuit board (5) is fixedly connected to the top of the circuit board bracket (9), and a lower circuit board (7) is fixedly connected to the bottom of the circuit board bracket (9), a sputtering film core (8) is connected to the inside of the shell (2) via an aluminum silicon wire, a metal base is fixedly connected to the bottom of the shell (2), and the metal base is fixedly connected to the sputtering film core (8), an air hole is opened on the outer surface of the shell (2), and the sputtering film core (8) matches the position of the air hole, a wire (10) is arranged inside the shell (2), and an NTC thermistor (11) is arranged inside the NTC protection tube (4), and the NTC thermistor (11) is connected to the upper circuit board (5) and the lower circuit board (7) via the wire (10).

2. The sputtered thin film strain type temperature and pressure integrated sensor according to claim 1, characterized in that: A plurality of metal pins (6) are arranged inside the circuit board bracket (9), and the metal pins (6) are used to connect the upper circuit board (5) and the lower circuit board (7).

3. The sputtered thin film strain type temperature and pressure integrated sensor according to claim 1, characterized in that: The lower circuit board (7) is electrically connected to the sputtered thin film core (8).

4. The sputtered thin film strain type temperature and pressure integrated sensor according to claim 1, characterized in that: A plurality of thin film resistors are arranged on the surface of the sputtered thin film core (8), and the thin film resistors are connected to the upper circuit board (5) via aluminum silicon wires.

5. The sputtered thin film strain type temperature and pressure integrated sensor according to claim 1, characterized in that: The lower circuit board (7) is fixedly connected to the pressure interface seat (3) via a circuit board bracket (9).

6. The sputtered thin film strain type temperature and pressure integrated sensor according to claim 1, characterized in that: The NTC thermistor (11) is fixed inside the NTC protection tube (4) by means of a thermally conductive adhesive.

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