Intelligent cabin host with natural convection type heat dissipation function

Abstract

The utility model provides an intelligent cabin host with natural convection type heat dissipation, which comprises a bottom shell, a first heat dissipation piece, a second heat dissipation piece and a main board, and a power amplifier and a main chip of the main board are respectively arranged at a first position and a second position at the bottom of the main board; a first position of the bottom shell is provided with a first concave platform, a second position is provided with a first window, and a third position is provided with a second concave platform; the first concave table is provided with a limiting table, the second concave table is provided with a second window, the top of the bottom shell is provided with a connecting part to bear the mainboard so that a power amplifier of the mainboard can be arranged at the second window, and the main chip faces the first window; the heat conduction part of the first heat dissipation piece is connected with the second concave table so as to be attached to the power amplifier at the second window, and the heat dissipation part is connected with the limiting table and covers the first concave table in a suspended mode so as to separate an air channel between the heat dissipation part and the first concave table; the heat dissipation part of the second heat dissipation piece covers the first window of the bottom shell in a sealing mode, and the heat conduction part is attached to the mainboard main chip. Therefore, in a narrow space, the heat dissipation requirement of the hardware is met in a natural convection mode.

Description

Technical Field

[0001] The utility model relates to a vehicle-mounted terminal heat dissipation technology, in particular to an intelligent cockpit host with natural convection heat dissipation. Background Art

[0002] As the driving force of the automotive industry, automobile intelligence, networking, electrification and sharing are gradually becoming the future development trend. Intelligence and high integration are the main development direction of smart cockpits. For this reason, the existing technology has proposed various smart cockpit host systems to effectively enhance the connection and communication between various intelligent control components and improve the control performance of the cockpit.

[0003] With the development of diverse human-computer interaction today, the in-vehicle intelligent terminal can detect user needs and driving environment through voice recognition, sight recognition, gesture recognition and other recognition methods to meet the special needs of users in specific situations, which can effectively improve the user's driving comfort. After analyzing user needs through intelligent terminals, the feedback made will become more and more diverse. Through voice, vision and other multi-faceted feedback, users can enjoy a full sensory immersive experience.

[0004] However, with the increasing demand for intelligence, the field is also constantly upgrading the hardware of the smart cockpit host. The accompanying problem is that with the improvement of hardware configuration, the heat dissipation requirements of the hardware are also greatly increased. In the narrow host space, how to reasonably design the heat dissipation structure to meet the hardware heat dissipation requirements is a problem that technical personnel in this field have always been trying to solve. Utility Model Content

[0005] To this end, the main purpose of the utility model is to provide a smart cockpit host with natural convection heat dissipation, so as to meet the hardware heat dissipation requirements in a small host space by natural convection.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a natural convection heat dissipation intelligent cockpit host is provided, which includes: a bottom shell, a first heat sink, a second heat sink, and a mainboard, wherein the power amplifier of the mainboard is arranged at a first position at the bottom of the mainboard, and is perpendicular to the mainboard, and the main chip of the mainboard is flatly attached to the second position at the bottom of the mainboard, and the bottom and side surfaces of the bottom shell are provided with heat dissipation holes and interface windows corresponding to the mainboard plug-in interface; the first position of the bottom shell is provided with a first concave platform, the second position is provided with a first window, and the third position is provided with a second concave platform, wherein the first concave platform is provided with a There is a raised limit platform, and a second window is arranged on the second concave platform; a connecting part is arranged on the top of the bottom shell to support the mainboard and define a heat dissipation cavity connected with the heat dissipation hole between the bottom shell, and place the power amplifier at the second window and the main chip toward the first window; the heat conduction part of the first heat sink is connected to the second concave platform to fit with the power amplifier at the second window, and the heat dissipation part is connected to the limit platform, and is suspended on the first concave platform to separate an air duct connected with the heat dissipation cavity between the heat dissipation part and the first concave platform; the heat dissipation part of the second heat sink is sealed at the first window of the bottom shell, and the heat conduction part fits with the main chip of the main board.

[0007] Preferably, the first heat sink is in an L-like shape, and a strip-shaped heat dissipation window is arranged on its heat dissipation portion. The heat dissipation window is arranged so that it does not directly penetrate the heat dissipation holes on the first concave platform. A first convex heat-conducting platform is provided on the heat-conducting portion of the first heat sink at a position corresponding to the position where the power amplifier is attached.

[0008] Preferably, the thickness of the heat dissipation part and the heat conduction part of the first heat dissipation element and the recessed depths of the first recess and the second recess correspond to each other, so that after the heat dissipation part and the heat conduction part of the first heat dissipation element are connected at the first recess and the second recess, they are basically flush with the bottom and side surfaces of the bottom shell.

[0009] Preferably, the second heat sink is in a C-like shape, a plurality of heat dissipation holes connected to the heat dissipation cavity are arranged on its heat dissipation portion, and a second heat conduction platform in a convex shape is provided at a position on its heat conduction portion corresponding to the position affixed to the main chip.

[0010] Preferably, the natural convection heat dissipation smart cockpit host also includes: a fixed bracket, cantilevers are provided on both sides of the fixed bracket, a support seat is provided between the cantilever walls, and a baffle extends from the back of the support seat, wherein the fixed bracket is connected to the mainboard via the cantilever to support the bottom and back of the power amplifier via the support seat and the baffle.

[0011] Preferably, the smart cockpit host with natural convection heat dissipation also includes: a partition bracket and a ground contact spring. The partition bracket is arranged on one side of the interface window of the bottom shell to define an isolation groove to accommodate the plug-in interface of the mainboard, and the ground contact spring is arranged on the partition bracket, and its spring end is in contact with at least part of the plug-in interface.

[0012] Preferably, the smart cockpit host with natural convection heat dissipation also includes: an external antenna and a protective cover, wherein an antenna platform extends from one side of the main board, and an antenna window is provided on the side of the bottom shell corresponding to the antenna platform to allow the antenna platform to extend outside the bottom shell, the external antenna is connected to the main board and attached to the antenna platform, and the protective cover is sleeved on the antenna platform to cover the external antenna.

[0013] Preferably, the natural convection heat dissipation smart cockpit host also includes: an upper cover, wherein the upper cover is provided with countersunk holes for connection with the connecting part on the top of the bottom shell, the cover is connected to the main board, and a heat dissipation cavity is separated between the upper cover and the main board, and the upper cover is provided with heat dissipation holes connected to the heat dissipation cavity.

[0014] Preferably, the side portions at the edge of the mainboard have a drop so that the heat dissipation compartments are connected to the heat dissipation cavities.

[0015] Preferably, positioning heads extend outwardly from the front and rear side shells of the bottom shell.

[0016] The natural convection heat dissipation smart cockpit host provided by the utility model cleverly arranges the positions of the main chip and the power amplifier on the mainboard, and correspondingly designs the first and second heat dissipating parts to fit therewith, while establishing an air duct and a heat dissipation cavity between the bottom shell, thereby conducting the working heat of these devices to the bottom of the bottom shell, so that part of the heat is dissipated to the outside, and the other part causes natural convection of air upward, so as to enter the heat dissipation cavity of the bottom shell through the air duct and the heat dissipation holes at the bottom of the bottom shell, and flow out from the heat dissipation holes on the side of the bottom shell, thereby forming a natural convection cycle of air, taking away the working heat of the devices on the mainboard, so as to form a good heat dissipation effect in a limited and narrow space, so as to meet the hardware heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 to Figure 2 This is a schematic diagram of the overall structure of the intelligent cockpit host with natural convection heat dissipation of the utility model;

[0019] Figures 3 to 5 This is a schematic diagram of the overall assembly structure of the intelligent cockpit host with natural convection heat dissipation of the utility model from multiple perspectives;

[0020] Figure 6 It is a structural schematic diagram of the first heat sink in the intelligent cockpit host with natural convection heat dissipation of the utility model;

[0021] Figure 7It is a structural schematic diagram of the second heat sink in the intelligent cockpit host with natural convection heat dissipation of the utility model;

[0022] Figure 8 It is a schematic diagram of the bottom shell structure of the intelligent cockpit host with natural convection heat dissipation of the utility model;

[0023] Fig. 9 It is a schematic diagram of the mainboard structure of the intelligent cockpit host with natural convection heat dissipation of the utility model;

[0024] Fig.10 This is a schematic diagram of the structure of the mainboard covered on the bottom shell in the natural convection heat dissipation intelligent cockpit host of the utility model, wherein the mainboard surface is in a perspective form;

[0025] Fig.11 It is a schematic diagram of the half-section structure of the intelligent cockpit host with natural convection heat dissipation of the utility model.

[0026] Description of Reference Numerals

[0027] Bottom shell 1, first heat sink 2, second heat sink 3, mainboard 4, heat dissipation cavity 5, air duct 6, fixing bracket 7, partition bracket 8, ground contact spring 9, upper cover 10, heat dissipation hole 11, interface window 12, first concave platform 13, first window 14, second concave platform 15, connecting part 16, positioning head 17, heat dissipation window 21, first heat conduction platform 22, second heat conduction platform 31, power amplifier 41, main chip 42, plug-in interface 43, external antenna 44, protective cover 45, antenna platform 46, cantilever 71, support seat 72, baffle 73, countersunk hole 101, heat dissipation cavity 102, limit platform 131, second window 151. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0032] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "layout", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances and in combination with the prior art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict. And one or more of the components in the diagram may be necessary or non-essential, and the relative position relationship between the components in the above diagram can be adjusted according to actual needs.

[0034] In order to achieve efficient hardware heat dissipation in a small host space by natural air convection, Figures 1 to 11 As shown, this example provides a natural convection heat dissipation intelligent cockpit host, which includes: a bottom shell 1, a first heat sink 2, a second heat sink 3, a mainboard 4, wherein Figure 5As shown, in this example, the power amplifier 41 of the mainboard 4 is arranged at a first position at the bottom of the mainboard 4, and is perpendicular to the mainboard 4. The main chip 42 of the mainboard 4 is flatly attached to a second position at the bottom of the mainboard 4. Figures 4 to 5 As shown, the bottom surface and side surfaces of the bottom shell 1 are provided with heat dissipation holes 11 and interface windows 12 corresponding to the plug-in interfaces 43 of the mainboard 4 .

[0035] Among them Figure 5 As shown, the bottom shell 1 is provided with a first recess 13 at the first position, a first window 14 at the second position, and a second recess 15 at the third position, wherein the first recess 13 is provided with a raised limiting platform 131 , and the second recess 15 is provided with a second window 151 .

[0036] Among them Figure 4 As shown, a connecting portion 16 is provided on the top of the bottom shell 1 to support the mainboard 4 and define a heat dissipation cavity 5 connected with the heat dissipation hole 11 between the bottom shell 1 , and to place the power amplifier 41 at the second window 151 and the main chip 42 toward the first window 14 .

[0037] Among them Figure 1 , Figure 2 , Fig.10 , Fig.11 As shown, the heat conducting part of the first heat sink 2 is connected to the second concave platform 15, so as to be in contact with the power amplifier 41 of the motherboard 4 at the second window 151, and the heat dissipation part of the first heat sink 2 is connected to the limiting platform 131, and is suspended on the first concave platform 13, so as to separate the air duct 6 connected to the heat dissipation cavity 5 between the heat dissipation part of the first heat sink 2 and the first concave platform 13. The heat dissipation part of the second heat sink 3 is sealed at the first window 14 of the bottom case 1, and the heat conducting part is in contact with the main chip 42 of the motherboard 4.

[0038] Specifically, since the power of the power amplifier 41 on the mainboard 4 can reach about 20W under extreme working conditions, the two devices can form a power of up to 40W, and therefore the power amplifier 41 is one of the main sources of working heat for the mainboard 4. For this reason, in this example, the power amplifier 41 is specially set at the first position at the bottom of the mainboard 4, that is, close to the front edge of the mainboard 4, perpendicular to the surface of the mainboard 4, and as close to the edge of the bottom shell 1 as possible, so that its heat can be dissipated to the outside of the bottom shell 1 as quickly as possible, and will not be excessively accumulated in the heat dissipation cavity 5 of the bottom shell 1.

[0039] At the same time, in order to improve the heat dissipation effect as much as possible without relying on active heat dissipation devices, this example intends to construct a heat dissipation solution of natural air convection circulation to prevent heat accumulation in the heat dissipation cavity 5. For this purpose, Figure 6 , Fig.11As shown, in this example, the first heat sink 2 is designed to be L-shaped, so as to guide part of the heat of the power amplifier 41 to the first recessed platform 13 at the bottom of the bottom shell 1. At this time, the heat discharged by the heat dissipation part of the first heat sink 2 will form an upward airflow at the air duct 6, enter the heat dissipation cavity 5 along the air duct 6, and dissipate outward from the heat dissipation holes 11 in all directions of the bottom shell 1, thereby forming a natural convection circulation of air to enhance the heat dissipation effect.

[0040] Furthermore, in order to increase the air convection rate and improve the heat dissipation effect, in an optional example, a strip heat dissipation window 21 is arranged on the heat dissipation part of the first heat dissipation element 2. The heat dissipation window 21 is arranged so that it does not directly penetrate the heat dissipation hole 11 on the first recessed platform 13. On the one hand, this can meet the EMC shielding requirements, and at the same time, it can also prevent solid materials larger than the size of the strip heat dissipation window 21 from directly entering the bottom shell 1.

[0041] At the same time, in order to achieve better thermal contact with the power amplifier 41, in an optional example, a first raised thermal platform 22 is provided on the thermal conductive portion of the first heat sink 2 at a position corresponding to the position where the power amplifier 41 is fitted. By applying thermal conductive gel on the first thermal platform 22 to fit it with the power amplifier 41, small gaps at the fitting position can be better filled, thereby improving the fitting tolerance during assembly and ensuring the reliability of thermal conduction.

[0042] On the other hand, since the power consumption of the main chip 42 and its supporting power processing module on the motherboard 4 is about 2W, and the main chip 42 is generally not designed to be too close to the edge of the motherboard 4, in this example, Figure 7 , Fig.11 As shown, the second heat sink 3 is preferably designed to be C-shaped, with a plurality of heat dissipation holes 11 connected to the heat dissipation cavity 5 arranged on its heat dissipation portion, and a convex second heat conduction platform 31 is provided on its heat conduction portion at a position corresponding to the main chip 42, thereby filling the first window 14 of the bottom shell 1 through the C-shaped second heat sink 3. On the one hand, the heat of the main chip 42 can be directed to itself to dissipate from the side and bottom of the bottom shell 1, which not only increases the heat dissipation area, but also provides electromagnetic shielding protection for the devices in this area. On the other hand, the heat introduced into the heat dissipation portion at the bottom of the second heat sink 3 can also form the above-mentioned airflow into the heat dissipation cavity 5, and dissipate outward from the heat dissipation holes 11 in all directions of the bottom shell 1, thereby forming a natural convection circulation of air to enhance the heat dissipation effect.

[0043] It can be seen that through the design of the first heat sink 2 and the second heat sink 3, two sets of natural air convection circulation can be formed in the heat dissipation cavity 5, thereby greatly improving the overall heat dissipation effect of the host.

[0044] Furthermore, since the power amplifier 41 is fixed to the mainboard 4 by pins, in order to stabilize the position of the power amplifier 41 on the mainboard 4 and avoid being squeezed and misaligned by the first heat sink 2 when it is attached, Figure 3 , Figure 4 , Fig. 9 , Fig.10 As shown, the natural convection heat dissipation smart cockpit host also includes: a fixed bracket 7, cantilevers 71 are provided on both sides of the fixed bracket 7, a support seat 72 is provided between the cantilever walls, and a baffle 73 extends from the back of the support seat 72, wherein the fixed bracket 7 is connected to the main board 4 via the cantilever 71 to support the bottom and back of the power amplifier 41 via the support seat 72 and the baffle 73, thereby providing a stable support for the power amplifier 41 and improving the structural reliability.

[0045] Furthermore, in order to isolate the signal crosstalk between the plug-ins on the mainboard 4 and the interference between the circuit boards, as Figure 3 , Fig.10 As shown, the natural convection heat dissipation intelligent cockpit host further includes: a partition bracket 8 and a ground contact spring 9. The partition bracket 8 is arranged on one side of the interface window 12 of the bottom shell 1 to define an isolation groove to accommodate the plug-in interface 43 of the mainboard 4. The ground contact spring 9 is arranged on the partition bracket 8, and its contact spring end contacts at least part of the plug-in interface 43. In this way, the ground contact spring 9 is connected to the metal ground of the plug-in interface 43 to quickly release the impact of static electricity.

[0046] Furthermore, in order to physically increase the penetration of the host signal, such as Figure 3 As shown, the natural convection heat dissipation intelligent cockpit host also includes: an external antenna 44 and a protective cover 45, wherein an antenna platform 46 is extended from one side of the mainboard 4, and an antenna window is provided on the side of the bottom shell 1 corresponding to the antenna platform 46, so that the antenna platform 46 can extend outside the bottom shell 1, and the external antenna 44 is connected to the mainboard 4 and attached to the antenna platform 46, and the protective cover 45 is sleeved on the antenna platform 46 to cover the external antenna 44. Thus, since the protective cover isolates the external antenna 44 from the metal parts and the external space, the interference of the metal parts on it can be controlled.

[0047] Furthermore, in order to improve the overall structural impact resistance of the host and ensure the heat dissipation effect, such as Figure 1 , Figure 3 , Fig.11As shown, the natural convection heat dissipation intelligent cockpit host also includes: an upper cover 10, wherein the upper cover 10 is provided with a countersunk hole 101 for connection with the connection portion 16 at the top of the bottom shell 1, and the cover is connected to the mainboard 4, and a heat dissipation cavity 102 is separated between the upper cover 10 and the mainboard 4, and the upper cover 10 is provided with a heat dissipation hole 11 connected to the heat dissipation cavity 102, so that the heat on the top of the mainboard 4 is dissipated through the heat dissipation hole 11 of the upper cover 10. In addition, in an optional embodiment, in order to ensure the heat dissipation effect, as Fig. 9 , Fig.10 As shown, the side portion of the edge of the mainboard 4 has a step so that the heat dissipation compartment 102 is connected with the heat dissipation cavity 5, which accelerates the dissipation of heat inside the host and prevents internal heat accumulation, thereby improving the heat dissipation effect.

[0048] Further, in an optional embodiment, if Figure 1 to Figure 2 As shown, the thickness of the heat dissipation part and the heat conduction part of the first heat dissipation element 2 and the recessed depths of the first recess 13 and the second recess 15 correspond to each other, so that after the heat dissipation part and the heat conduction part of the first heat dissipation element 2 are connected at the first recess 13 and the second recess 15, they are basically flush with the bottom surface and the side surface of the bottom shell 1.

[0049] Furthermore, in an optional embodiment, in order to facilitate post-installation positioning, positioning heads 17 are extended outwardly from the front and rear side shells of the bottom shell 1.

[0050] In summary, the natural convection heat dissipation smart cockpit host provided by the utility model cleverly arranges the positions of the main chip 42 and the power amplifier 41 on the motherboard 4, and correspondingly designs the first and second heat sinks 3 to fit therewith, while establishing an air duct 6 and a heat dissipation cavity 5 between the bottom shell 1, thereby conducting the working heat of these devices to the bottom of the bottom shell 1, so that part of the heat is dissipated to the outside, and the other part causes natural convection of air upward, so as to enter the heat dissipation cavity 5 of the bottom shell 1 through the air duct 6 and the heat dissipation holes 11 at the bottom of the bottom shell 1, and flow out from the heat dissipation holes 11 on the side of the bottom shell 1, thereby forming a natural convection cycle of air, taking away the working heat of the devices on the motherboard 4, thereby forming a good heat dissipation effect in a limited and narrow space to meet the hardware heat dissipation requirements.

[0051] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can understand and use the utility model well. The utility model is only limited by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

[0052] In addition, various implementations of the embodiments of the present utility model can also be arbitrarily combined, as long as they do not violate the concept of the embodiments of the present utility model, they should also be regarded as the contents disclosed in the embodiments of the present utility model.

Claims

1. A natural convection heat dissipation intelligent cockpit host, characterized in that include: A bottom shell, a first heat sink, a second heat sink, and a mainboard, wherein the power amplifier of the mainboard is arranged at a first position at the bottom of the mainboard and is perpendicular to the mainboard, the main chip of the mainboard is flatly attached to the second position at the bottom of the mainboard, and the bottom and side surfaces of the bottom shell are provided with heat dissipation holes and interface windows corresponding to the mainboard plug-in interface; a first concave platform is provided at the first position of the bottom shell, a first window is provided at the second position, and a second concave platform is provided at the third position, wherein a raised limit platform is provided on the first concave platform, and a second window is provided on the second concave platform; a connecting portion is provided at the top of the bottom shell to support the mainboard and the bottom shell to define a heat dissipation cavity connected to the heat dissipation hole, and the power amplifier is placed at the second window and the main chip faces the first window; the heat conduction portion of the first heat sink is connected to the second concave platform to fit with the power amplifier at the second window, the heat dissipation portion is connected to the limit platform, and the cover is suspended on the first concave platform to separate an air duct connected to the heat dissipation cavity between the heat dissipation portion and the first concave platform; the heat dissipation portion of the second heat sink is sealed at the first window of the bottom shell, and the heat conduction portion fits with the main chip of the mainboard.

2. The natural convection heat dissipation intelligent cockpit host according to claim 1 is characterized in that: The first heat sink is in an L-like shape, and a strip heat dissipation window is arranged on its heat dissipation part. The heat dissipation window is arranged in a position so that it does not directly penetrate the heat dissipation holes on the first concave platform. A first convex heat conduction platform is provided on the heat conduction part of the first heat sink at a position corresponding to the position where the power amplifier is attached.

3. The natural convection heat dissipation intelligent cockpit host according to claim 1 is characterized in that: The thickness of the heat dissipation part and the heat conduction part of the first heat dissipation element and the recessed depths of the first concave platform and the second concave platform correspond to each other, so that the heat dissipation part and the heat conduction part of the first heat dissipation element are basically flush with the bottom surface and the side surface of the bottom shell after being connected at the first concave platform and the second concave platform.

4. The natural convection heat dissipation intelligent cockpit host according to claim 1 is characterized in that: The second heat sink is in a C-like shape, and a plurality of heat dissipation holes connected to the heat dissipation cavity are arranged on its heat dissipation part, and a second heat conduction platform in a convex shape is provided at a position on its heat conduction part corresponding to the main chip.

5. The natural convection heat dissipation intelligent cockpit host according to claim 1, characterized in that: Also includes: A fixed bracket is provided with cantilevers on both sides of the fixed bracket, a support base is provided between the cantilevers, and a baffle is extended from the back of the support base, wherein the fixed bracket is connected to the mainboard through the cantilever to support the bottom and back of the power amplifier through the support base and the baffle.

6. The natural convection heat dissipation intelligent cockpit host according to claim 1, characterized in that: Also includes: A partition bracket and a ground contact spring. The partition bracket is arranged on one side of the interface window of the bottom shell to define an isolation groove to accommodate the plug-in interface of the mainboard. The ground contact spring is arranged on the partition bracket, and its spring end contacts at least part of the plug-in interface.

7. The natural convection heat dissipation intelligent cockpit host according to claim 1, characterized in that: Also includes: An external antenna and a protective cover, wherein an antenna platform extends from one side of the mainboard, and an antenna window is provided on the side of the bottom shell corresponding to the antenna platform so that the antenna platform can extend outside the bottom shell. The external antenna is connected to the mainboard and attached to the antenna platform, and the protective cover is sleeved on the antenna platform to cover the external antenna.

8. The natural convection heat dissipation intelligent cockpit host according to claim 1, characterized in that: Positioning heads are extended outwardly from the shell bodies at the front and rear sides of the bottom shell.

9. The natural convection heat dissipation intelligent cockpit host according to any one of claims 1 to 8, characterized in that: Also includes: The upper cover is provided with countersunk holes for connection with the connecting part on the top of the bottom shell, and the cover is connected to the mainboard, so that a heat dissipation cavity is separated between the upper cover and the mainboard, and the upper cover is provided with heat dissipation holes connected with the heat dissipation cavity.

10. The natural convection heat dissipation intelligent cockpit host according to claim 8, characterized in that: The side portions of the edge of the mainboard have a drop so that the heat dissipation compartments are connected to each other.

Images