Solid-state chip laminated capacitor with upper interlayer and lower interlayer of ceramic aluminum substrate

Abstract

The solid-state chip laminated capacitor comprises an inner core body and metal outer layers, conductive silver layers are arranged between the inner core body and the metal outer layers at the two ends, the inner core body comprises a core, an upper substrate and a lower substrate, the core is arranged in a clamping space formed by the upper substrate and the lower substrate in a sealed mode through the upper substrate and the lower substrate, and the upper substrate and the lower substrate are arranged in the clamping space. A gap, in the clamping space, of the core is filled with insulating resin, an upper anode leading-out terminal and an upper cathode leading-out terminal are correspondingly arranged on the left side and the right side of the upper substrate in a sealed mode, and a lower anode leading-out terminal and a lower cathode leading-out terminal are correspondingly arranged on the left side and the right side of the lower substrate in a sealed mode. According to the utility model, the upper interlayer and the lower interlayer of the core are formed by the ceramic aluminum substrate, after the core is carried, the core is completely cured and sealed by the insulating resin, and the electrode lead of the core is led out without penetrating through the resin and is completely sealed in the packaging insulating resin, so that a steam inlet channel formed by the packaging insulating resin and the lead due to different material shrinkage ratios is avoided; and the moisture resistance of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip stacked capacitors, in particular to a solid-state chip stacked capacitor with upper and lower sandwich layers of a ceramic aluminum substrate. Background Art

[0002] The traditional method of making laminated capacitors is to coat the aluminum foil with a polymer film, and then bond the positive electrode to the copper tinned lead frame by welding and the negative electrode by conductive silver paste. Then, the multi-layer aluminum foil is wrapped with insulating resin by plastic sealing, leaving only the leads to pass through the insulating resin to connect the positive and negative electrodes of the aluminum foil to the outside world, and then bend the leads outside the insulating resin to the bottom of the package to serve as the product's solder pads. The cured insulating resin originally has holes and is risky for waterproofing. The lead frame and the insulating resin are made of different materials and have different expansion coefficients, which results in a water vapor channel between the leads and the insulating resin when used in an extremely low temperature environment. The product performance will change in an extremely low temperature environment or after being placed for a long time. Utility Model Content

[0003] In order to solve the technical problems mentioned in the background technology, the utility model provides a solid-state chip stacked capacitor with upper and lower layers of a ceramic aluminum substrate.

[0004] The utility model adopts the following technical scheme: a solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrates, comprising an inner core and metal outer layers arranged on both sides of the inner core; a conductive silver layer is arranged between the inner core and the metal outer layers at both ends; the inner core comprises a core and an upper substrate and a lower substrate; the anode end of the core is clamped by welding and holding a conductive metal gasket; the core is formed by stacking a plurality of single pieces between an upper substrate and a lower substrate; the upper substrate and the lower substrate seal the core in a clamping space formed by the two, and the gap of the core in the clamping space is filled with insulating resin; the upper substrate and the lower substrate are both ceramic aluminum substrates; upper anode lead terminals and upper cathode lead terminals are correspondingly sealed on the left and right sides of the upper substrate; lower anode lead terminals and lower cathode lead terminals are correspondingly sealed on the left and right sides of the lower substrate.

[0005] Furthermore, outer surfaces of the upper substrate and the lower substrate are coated with an insulating ink layer.

[0006] Furthermore, the upper anode lead terminal, the lower anode lead terminal, the upper cathode lead terminal and the lower cathode lead terminal all include an external conductive metal sheet A and an internal conductive metal sheet B; the external conductive metal sheet A and the internal conductive metal sheet B are respectively arranged on the inner and outer sides of the upper substrate and the lower substrate; an electrical connection is formed between the external conductive metal sheet A and the internal conductive metal sheet B; the internal conductive metal sheet B of the upper anode lead terminal and the lower anode lead terminal are respectively bonded to the positive end of the core through a conductive metal gasket and an anode conductive paste, and the internal conductive metal sheet B of the upper cathode lead terminal and the lower cathode lead terminal are bonded to the negative end of the core through a conductive paste.

[0007] Furthermore, the thickness of the internal conductive metal sheet B of the upper anode lead-out terminal and the lower anode lead-out terminal is greater than that of the internal conductive metal sheet B of the upper cathode lead-out terminal and the lower cathode lead-out terminal.

[0008] Furthermore, an outer surface of the metal outer layer is provided with an electroplated nickel layer and an electroplated tin layer in sequence.

[0009] Furthermore, an anode conductive paste is provided between the internal conductive metal sheet B of the upper anode lead terminal and the lower anode lead terminal and the positive end of the core; a cathode conductive paste is provided between the internal conductive metal sheet B of the upper cathode lead terminal and the lower cathode lead terminal and the negative end of the core.

[0010] Compared with the prior art, the utility model has the following advantages: the solid-state chip stacked capacitor with upper and lower layers of a ceramic aluminum substrate designed by the utility model has a core formed of an upper and lower layer of a ceramic aluminum substrate, and the ceramic aluminum substrate has good insulation, low high-frequency loss, thermal stability, high thermal conductivity, low thermal expansion coefficient, air tightness and packaging glue adhesion. After the core is mounted and then completely cured and sealed with an insulating resin, the electrode lead of the core does not need to pass through the resin and is completely sealed in the packaging insulating resin, thereby avoiding the formation of a water inlet channel formed by the packaging insulating resin and the lead due to different material shrinkage ratios, improving the moisture-proof performance of the product, and greatly improving the reliability of the aluminum capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The utility model is a schematic cross-sectional structure diagram of a solid-state chip stacked capacitor with upper and lower layers of a ceramic aluminum substrate.

[0012] in:

[0013] 1-metal outer layer, 2-core, 3-upper substrate, 4-lower substrate, 5-insulating resin, 6-upper anode lead terminal, 7-lower anode lead terminal, 8-upper cathode lead terminal, 9-lower cathode lead terminal, 10-conductive silver layer, 11-anode conductive paste, 12-cathode conductive paste, 13-insulating ink layer, 14-conductive metal gasket. DETAILED DESCRIPTION

[0014] In order to facilitate those skilled in the art to understand the technical solution of the utility model, further description is now made with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model.

[0015] In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, it is apparent that one or more embodiments may be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present invention.

[0016] like Figure 1 The figure shows a cross-sectional structural diagram of a solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrates of the utility model, which includes an inner core and a metal outer layer 1 arranged on both sides of the inner core, and the outer surface of the metal outer layer 1 is provided with an electroplated nickel layer and an electroplated tin layer in sequence. A conductive silver layer 10 is arranged between the inner core and the metal outer layers 1 at both ends, and the inner core includes a core 2 and an upper substrate 3 and a lower substrate 4; the anode end of the core 2 is welded to clamp a conductive metal gasket 14; the core 2 is formed by stacking a number of single pieces between the upper substrate 3 and the lower substrate 4; the upper substrate 3 and the lower substrate 4 seal the core 2 in the clamping space formed by the two, and the gap of the core 2 in the clamping space is filled with an insulating resin 5. In the specific implementation, the insulating packaging glue is injected and baked to solidify to achieve a sealed coating around the capacitor to play a waterproof and moisture-proof role.

[0017] The upper substrate 3 and the lower substrate 4 are both ceramic aluminum substrates, and the outer surfaces of the upper substrate 3 and the lower substrate 4 are coated with an insulating ink layer 13. In this embodiment, the insulating ink is coated on the other areas outside the anode lead terminal and the cathode lead terminal by printing and coating, which can enhance the airtightness of the ceramic aluminum substrate, beautify the appearance, and facilitate specification and polarity marking.

[0018] This embodiment uses a ceramic aluminum substrate with good insulation, low high-frequency loss, thermal stability, high thermal conductivity, low thermal expansion coefficient, airtightness and packaging glue adhesion as a sandwich plate to improve the reliability and high-frequency application performance of the aluminum solid-state laminated electrolytic capacitor.

[0019] In this embodiment, upper anode lead terminals 6 and upper cathode lead terminals 8 are correspondingly sealed on the left and right sides of the upper substrate 3, and lower anode lead terminals 7 and lower cathode lead terminals 9 are correspondingly sealed on the left and right sides of the lower substrate 4. The upper anode lead terminals 6, the lower anode lead terminals 7, the upper cathode lead terminals 8 and the lower cathode lead terminals 9 all include an external conductive metal sheet A and an internal conductive metal sheet B. And the thickness of the internal conductive metal sheet B of the upper anode lead terminals 6 and the lower anode lead terminals 7 is greater than the internal conductive metal sheet B of the upper cathode lead terminals 8 and the lower cathode lead terminals 9. The external conductive metal sheet A and the internal conductive metal sheet B are respectively arranged on the inner and outer sides of the upper substrate 3 and the lower substrate 4, and an electrical connection is formed between the external conductive metal sheet A and the internal conductive metal sheet B. The internal conductive metal sheets B of the upper anode lead terminals 6 and the lower anode lead terminals 7 are respectively welded to the positive terminal of the core 2, and the internal conductive metal sheets B of the upper cathode lead terminals 8 and the lower cathode lead terminals 9 are bonded to the negative terminal of the core 2 through conductive paste. In this embodiment, the internal conductive metal sheet B and the external conductive metal sheet A are electrically connected by means of a hole-through metal sinking method. In order to increase the contact area between the internal conductive metal sheet B and the external conductive metal sheet A in the upper cathode lead terminal 8 and the lower cathode lead terminal 9, reduce the impedance of the internal and external conductive metal sheets and the equivalent series resistance, increase the heat dissipation speed, and reduce the equivalent series inductance, more small holes can be provided between the two.

[0020] An anode conductive paste 11 is arranged between the internal conductive metal sheet B of the upper anode lead-out terminal 6 and the lower anode lead-out terminal 7 and the positive terminal of the core 2, and a cathode conductive paste 12 is arranged between the internal conductive metal sheet B of the upper cathode lead-out terminal 8 and the lower cathode lead-out terminal 9 and the negative terminal of the core 2. The electrodes are turned on by welding with the conductive paste or by applying and curing the paste to reduce the parallel impedance at the cathode of the core.

[0021] In summary, the solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrates designed by the utility model has a core formed of upper and lower layers with a ceramic aluminum substrate, and the ceramic aluminum substrate has good insulation, low high-frequency loss, thermal stability, high thermal conductivity, low thermal expansion coefficient, airtightness and packaging glue adhesion. After the core is mounted and then completely cured and sealed with insulating resin, the electrode lead of the core does not need to pass through the resin and is completely sealed in the packaging insulating resin, avoiding the formation of water inlet channels due to different material shrinkage ratios of the packaging insulating resin and the leads, thereby improving the moisture-proof performance of the product and greatly improving the reliability of the aluminum capacitor.

[0022] The above embodiments are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the protection scope determined by the claims of the present invention.

Claims

1. A solid-state chip stacked capacitor with upper and lower layers of a ceramic aluminum substrate, characterized in that: The invention comprises an inner core and metal outer layers (1) arranged on both sides of the inner core; a conductive silver layer (10) is arranged between the inner core and the metal outer layers (1) at both ends; the inner core comprises a core (2) and an upper substrate (3) and a lower substrate (4); the anode end of the core (2) is clamped by welding with a conductive metal gasket (14); the core (2) is formed by stacking a plurality of single pieces between an upper substrate (3) and a lower substrate (4); the upper substrate (3) and the lower substrate (4) seal the core (2) in a clamping space formed by the two, and the gap of the core (2) in the clamping space is filled with insulating resin (5); the upper substrate (3) and the lower substrate (4) are both ceramic aluminum substrates; an upper anode lead terminal (6) and an upper cathode lead terminal (8) are correspondingly sealed on the left and right sides of the upper substrate (3); a lower anode lead terminal (7) and a lower cathode lead terminal (9) are correspondingly sealed on the left and right sides of the lower substrate (4).

2. The solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrate according to claim 1 is characterized in that: The outer surfaces of the upper substrate (3) and the lower substrate (4) are both coated with an insulating ink layer (13).

3. The solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrate according to claim 2, characterized in that: The upper anode lead terminal (6), the lower anode lead terminal (7), the upper cathode lead terminal (8) and the lower cathode lead terminal (9) all comprise an external conductive metal sheet A and an internal conductive metal sheet B; the external conductive metal sheet A and the internal conductive metal sheet B are respectively arranged on the inner and outer sides of the upper substrate (3) and the lower substrate (4); an electrical connection is formed between the external conductive metal sheet A and the internal conductive metal sheet B; the internal conductive metal sheet B of the upper anode lead terminal (6) and the lower anode lead terminal (7) are respectively bonded and conducted to the positive terminal of the core (2) via a conductive metal gasket (14) and an anode conductive paste (11); and the internal conductive metal sheet B of the upper cathode lead terminal (8) and the lower cathode lead terminal (9) are bonded to the negative terminal of the core (2) via a conductive paste.

4. The solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrate according to claim 3, characterized in that: The thickness of the conductive metal sheet B connected to the upper anode lead terminal (6) and the lower anode lead terminal (7) is greater than that of the conductive metal sheet B connected to the upper cathode lead terminal (8) and the lower cathode lead terminal (9).

5. The solid-state chip stacked capacitor with upper and lower layers of ceramic aluminum substrate according to claim 4, characterized in that: The outer surface of the metal outer layer (1) is provided with an electroplated nickel layer and an electroplated tin layer in sequence.

6. The solid-state chip multilayer capacitor with upper and lower layers of ceramic aluminum substrate according to claim 5, characterized in that: An anode conductive paste (11) is provided between the conductive metal sheet B connected internally to the upper anode lead-out terminal (6) and the lower anode lead-out terminal (7) and the positive terminal of the core (2); and a cathode conductive paste (12) is provided between the conductive metal sheet B connected internally to the upper cathode lead-out terminal (8) and the lower cathode lead-out terminal (9) and the negative terminal of the core (2).

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