Sintering mold with end face flush with end plate

Abstract

The utility model relates to a sintering die with an end face flush with an end plate. The sintering die comprises a die base; the shell is arranged on the mold base; the sealing glass is arranged in the shell; the lead is arranged in the sealing glass and the mold base, the upper end face of the lead is flush with the upper end plate of the shell, and a wire is further arranged on the upper end face of the lead; and the mold upper cover is used for being matched with the mold base. Compared with the prior art, the sintering die is used for positioning the position of the lead in the shell through the inverted circular truncated cone conical groove designed on the upper end face of the lead and the wire, so that on one hand, the upper end face of the lead can be ensured to be flush with the upper end plate of the shell; on the other hand, the accurate concentricity of the lead can be kept, and the defect of poor resistance is overcome. Besides, after sintering is completed, the upper end face of the lead is kept flush with the upper end plate of the shell only by removing the inverted circular truncated cone conical groove through simple dull polish, the size, the shape and the sealing performance of a product cannot be affected, and the acting efficiency and the qualified rate are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing, in particular to a sintering mold with an end face flush with an end plate. Background Art

[0002] At present, in order to improve efficiency while ensuring accuracy, integrated circuit shells are generally assembled and sintered using sintering molds, which requires the end plate of the shell to be flush with the end face of the lead. However, due to the small distance between the lead and the edge of the glass hole where the lead is loaded, direct sintering cannot guarantee concentricity, and insulation resistance is prone to poor. If the part of the lead close to the end face is lengthened for positioning sintering, the lead needs to be further ground later, which is prone to dimensional deviation, shell deformation, poor sealing of the glass and other problems.

[0003] Therefore, there is an urgent need for a device that can both ensure that the end plate of the housing is flush with the end surface of the lead and that the concentricity of the lead is ensured. Summary of the invention

[0004] The utility model aims to overcome the defects of the prior art and provide a sintering mold with an end face flush with an end plate.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] One of the technical solutions of the utility model is to provide a sintering mold with an end surface flush with an end plate, comprising:

[0007] Mould base;

[0008] A shell placed on the mold base;

[0009] A sealing glass disposed within the housing;

[0010] A lead wire is placed in the sealing glass and the mold base, the upper end surface of the lead wire is flush with the upper end plate of the shell, and a conductor is also provided on the upper end surface of the lead wire;

[0011] A mold upper cover is used to match the mold base.

[0012] In some specific embodiments, the mold base is provided with a lead hole groove penetrating therethrough and used for accommodating the lead wire and a shell hole groove for accommodating the shell.

[0013] In some specific embodiments, the housing is provided with a glass hole groove which penetrates the lead hole groove and is used to place a sealing glass.

[0014] In some specific embodiments, a glass cavity penetrating the lead wire hole groove and used for placing the lead wire is provided in the sealing glass.

[0015] In some specific embodiments, the mold upper cover is provided with a wire hole groove for placing the wire.

[0016] In some specific embodiments, the diameter of the wire hole groove is greater than the diameter of the wire, and the depth of the wire hole groove is greater than the length of the wire.

[0017] In some specific embodiments, the lead includes a lead body and a lead head, and the upper end surface of the lead head is provided with an inverted truncated cone groove for clamping the wire.

[0018] In some specific embodiments, the depth of the inverted frustum cone groove is 0.07-0.1 cm.

[0019] In some specific embodiments, the diameter of the wire is smaller than the diameter of the lead head.

[0020] In some specific implementations, the concentricity between the wire and the lead head is 0.01-0.03 cm.

[0021] Compared with the prior art, the sintering mold of the utility model uses the inverted frustum cone groove and the wire designed on the upper end surface of the lead to locate the position of the lead in the shell, which can ensure that the upper end surface of the lead is flush with the upper end plate of the shell on the one hand; on the other hand, it can also maintain the precise concentricity of the lead to overcome the defect of poor resistance. In addition, after sintering, the inverted frustum cone groove is removed by simple grinding to keep the upper end surface of the lead flush with the upper end plate of the shell, which will not affect the size, shape and sealing of the product, greatly improving the efficiency and qualified rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic cross-sectional view of the structure of the utility model.

[0023] Figure 2 It is a schematic top view of the structure of the mold base in the utility model.

[0024] Figure 3 It is a schematic top view of the structure of the mold upper cover in the utility model.

[0025] Figure 4 It is a structural schematic diagram of the lead wire in the utility model.

[0026] The following are marked in the figure:

[0027] 1 is the mold base, 101 is the lead hole slot, 102 is the shell hole slot,

[0028] 2 is the mold cover, 201 is the wire hole slot,

[0029] 3 is the shell, 301 is the glass hole groove,

[0030] 4 is the sealing glass, 401 is the glass cavity,

[0031] 5 is a lead, 501 is a lead body, 502 is a lead head, 503 is an inverted frustum cone groove, and 504 is a conductor. DETAILED DESCRIPTION

[0032] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and a specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0035] In the following embodiments, unless otherwise specified, functional components or structures are conventional components or conventional structures used in the art to achieve corresponding functions.

[0036] Embodiment 1:

[0037] like Figure 1-4 As shown, a sintering mold with an end face flush with an end plate comprises: a mold base 1; a shell 3 placed on the mold base 1; a sealing glass 4 placed in the shell 3; a lead 5 placed in the sealing glass 4 and the mold base 1, wherein the upper end face of the lead 5 is flush with the upper end plate of the shell 3, and a wire 504 is also provided on the upper end face of the lead 5; and a mold cover 2 for matching with the mold base 1.

[0038] In this technical solution, the lead 5 is positioned in the housing 3 by the wire 504 on the upper end surface of the lead 5, which ensures that the upper end surface of the lead 5 is flush with the upper end plate of the housing 3, and also ensures the concentricity of the lead 5 and the housing 3, thereby overcoming the problem of poor resistance. In addition, after sintering, the wire 504 can be simply removed, thereby avoiding problems such as size, deformation, and poor sealing caused by excessive grinding.

[0039] In order to define the positions of the housing 3 and the lead 5 in batches and accurately, the mold base 1 is provided with a lead hole 101 that penetrates and is used to place the lead 5 and a housing hole 102 that is used to place the housing 3. In order to further define the positions of the sealing glass 4 and the lead 5, the housing 3 is provided with a glass hole 301 that penetrates the lead hole 101 and is used to place the sealing glass 4. In order to further define the position of the lead 5, the sealing glass 4 is provided with a glass cavity 401 that penetrates the lead hole 101 and is used to place the lead 5. In order to further define the position of the lead 5, the mold upper cover 2 is provided with a wire hole 201 for placing the wire 504. The diameter of the wire hole 201 is greater than the diameter of the wire 504, and the depth of the wire hole 201 is greater than the length of the wire 504, so as to completely cover the wire 504. Exemplarily, the diameter of the wire 504 is 0.4 cm, and the diameter of the wire hole 201 is 0.45 cm. In this embodiment, a structure of a lead 5 is also exemplarily provided, wherein the lead 5 comprises a lead body 501 and a lead head 502, and the upper end surface of the lead head 502 is provided with an inverted frustum cone groove 503 for clamping the wire 504. The wire 504 and the lead head 502 are connected through the inverted frustum cone groove 503, and when sintering is completed, the wire 504 can be pulled out from the inverted frustum cone groove 503, and then the inverted frustum cone groove 503 is removed, which satisfies that the upper end surface of the lead 5 is flush with the upper end plate of the housing 3. In order to facilitate the removal of the inverted frustum cone groove 503, the depth of the inverted frustum cone groove 503 is 0.07-0.1 cm, and the area where the inverted frustum cone groove 503 contacts the upper end surface of the lead 5 is at least smaller than the diameter of the wire 504. For example, the diameter of the contact portion of the inverted frustum cone groove 503 with the upper end surface of the lead 5 is 0.2 cm. The inverted frustum cone groove 503 can be eliminated by only gently grinding it with a special sand bar for a few times, and it will not affect the sealing between the lead 5 and the housing 3. In order to save materials, the diameter of the wire 504 is smaller than the diameter of the lead head 502, so as to achieve the effect of positioning the lead 5. In order to ensure the concentricity of the lead 5, the concentricity of the wire 504 and the lead head 502 is 0.01-0.03 cm. For example, the concentricity of the wire 504 and the lead head 502 is 0.02 cm.

[0040] When the sintering mold provided by the technical solution is used, the shell 3, the lead 5, and the sealing glass 4 are first installed on the mold base 1, and then the mold upper cover 2 is covered for sintering. In this way, after sintering, on the one hand, the upper end surface of the lead big head 502 is flush with the upper end plate of the shell 3, and on the other hand, the concentricity of the lead big head 502 and the glass inner cavity 401 is guaranteed. After sintering, the wire 504 can be separated from the inverted frustum cone groove 503 by gently shaking it, and the inverted frustum cone groove 503 can be eliminated by gently grinding it a few times with a special sand bar, so that the size, shape, and sealing of the sintered product will not be affected.

[0041] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. A sintering mold with an end face flush with an end plate, characterized in that: include: Mold base (1); A housing (3) placed on the mold base (1); A sealing glass (4) disposed in the housing (3); A lead wire (5) is placed in the sealing glass (4) and the mold base (1), the upper end surface of the lead wire (5) is flush with the upper end plate of the shell (3), and a wire (504) is also provided on the upper end surface of the lead wire (5); A mold upper cover (2) is used to match the mold base (1).

2. The sintering mold with the end surface flush with the end plate according to claim 1, characterized in that: The mold base (1) is provided with a lead hole groove (101) that penetrates through and is used to place the lead wire (5) and a shell hole groove (102) that is used to place the shell (3).

3. The sintering mold with the end surface flush with the end plate according to claim 2, characterized in that: The housing (3) is provided with a glass hole groove (301) which penetrates the lead hole groove (101) and is used to place the sealing glass (4).

4. The sintering mold with the end surface flush with the end plate according to claim 2, characterized in that: The sealing glass (4) is provided with a glass inner cavity (401) which penetrates the lead wire hole groove (101) and is used to place the lead wire (5).

5. The sintering mold with the end surface flush with the end plate according to claim 1, characterized in that: The mold upper cover (2) is provided with a wire hole groove (201) for placing the wire (504).

6. The sintering mold with the end surface flush with the end plate according to claim 5, characterized in that: The diameter of the wire hole groove (201) is greater than the diameter of the wire (504), and the depth of the wire hole groove (201) is greater than the length of the wire (504).

7. The sintering mold with the end surface flush with the end plate according to claim 1, characterized in that: The lead wire (5) comprises a lead wire body (501) and a lead wire head (502), and the upper end surface of the lead wire head (502) is provided with an inverted truncated cone groove (503) for clamping the conductive wire (504).

8. The sintering mold with the end surface flush with the end plate according to claim 7, characterized in that: The depth of the inverted frustum cone groove (503) is 0.07-0.1 cm.

9. The sintering mold with the end surface flush with the end plate according to claim 7, characterized in that: The diameter of the wire (504) is smaller than the diameter of the lead head (502).

10. The sintering mold with the end surface flush with the end plate according to claim 7, characterized in that: The concentricity between the conductive wire (504) and the lead wire head (502) is 0.01-0.03 cm.

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