Wafer moving device and wafer detection system

Abstract

The utility model provides a wafer moving device and a wafer detection system, the wafer moving device comprises a first moving member, a wafer positioning disc and a second moving member, the first moving member comprises a first adsorption member, the first adsorption member moves between a first position and a second position along a first direction, and the first position is in butt joint with a wafer storage member; the wafer positioning disc is arranged corresponding to the second position; the second moving part comprises a second adsorption part and a third adsorption part, the second adsorption part and the third adsorption part move between a third position and a fourth position in the second direction, the third position is in butt joint with the wafer positioning disc, and the fourth position is in butt joint with the wafer detection device; the second adsorption part and the third adsorption part move synchronously, when the second adsorption part is located at the third position, the third adsorption part is located at the fourth position, and when the third adsorption part is located at the third position, the second adsorption part is located at the fourth position; the first direction intersects the second direction. According to the invention, the first moving part and the second moving part move along different directions, so that automatic transportation of wafers is realized.

Description

Technical Field

[0001] The present application relates to the field of semiconductor materials, and in particular to a wafer moving device and a wafer detection system. Background Art

[0002] In the semiconductor industry, wafers are generally placed in wafer storage devices. During testing, the wafer needs to be taken out of the wafer storage device and placed on the wafer inspection system for testing. After the test is completed, the wafer needs to be taken out and placed back into the wafer storage device, and the operation is repeated in this way. Manually moving wafers is a common operation method at present, but manual operation is not precise enough and accidents that damage the wafer may occur. In addition, another common method is to use a wafer handling robot, but it is costly and inefficient, and is not suitable for large-scale deployment. Utility Model Content

[0003] The present application mainly provides a wafer moving device and a wafer detection system, which can realize automatic transportation of wafers while controlling costs.

[0004] To solve the above technical problems, a technical solution adopted in the present application is: to provide a wafer moving device, including a first moving part, a wafer positioning plate, and a second moving part, the first moving part including a first adsorption part, the first adsorption part moves between a first position and a second position along a first direction, the first position is used to dock with a wafer storage part; the wafer positioning plate is arranged corresponding to the second position; the second moving part includes a second adsorption part and a third adsorption part, the second adsorption part and the third adsorption part move between a third position and a fourth position along a second direction, the third position is docked with the wafer positioning plate, and the fourth position is used to dock with a wafer detection device; wherein, the second adsorption part moves synchronously with the third adsorption part, when the second adsorption part is located at the third position, the third adsorption part is located at the fourth position, and when the third adsorption part is located at the third position, the second adsorption part is located at the fourth position; the first direction intersects with the second direction.

[0005] In a specific embodiment, the second moving member further includes a synchronous belt, the synchronous belt includes an upper belt and a lower belt, the second adsorption member is fixed to the upper belt, the third adsorption member is fixed to the lower belt, and the synchronous belt is arranged along the second direction.

[0006] In a specific embodiment, the second movable member also includes a longitudinal movable shaft, the longitudinal movable shaft is connected to the synchronous belt, and the second adsorption member and the third adsorption member move synchronously along a third direction through the longitudinal movable shaft, and the third direction is perpendicular to the plane where the first direction and the second direction are located.

[0007] In a specific embodiment, the wafer positioning plate includes a suction cup, a first mounting position, and a second mounting position. The suction cup is arranged corresponding to the first mounting position and the second mounting position. When the wafer is limited to the first mounting position and / or the second mounting position, the suction cup adsorbs the wafer.

[0008] In a specific embodiment, the wafer positioning plate includes a positioning ring, the suction cup is arranged in the positioning ring, and the suction cup is parallel to the positioning ring, the positioning ring includes a first positioning structure and a second positioning structure, the first positioning structure is arranged around the outer periphery of the positioning ring to form the first mounting position, and the second positioning structure is arranged around the inner periphery of the positioning ring to form the second mounting position; wherein, in a direction parallel to the suction cup, the diameter of the first mounting position is 8 inches, and the diameter of the second mounting position is 6 inches.

[0009] In a specific embodiment, the positioning ring is provided with a first notch, and when the first adsorption component moves to the second position, the first adsorption component docks with the wafer adsorbed by the suction cup through the first notch; and / or, when the second adsorption component and the third adsorption component move to the third position, the second adsorption component and the third adsorption component dock with the wafer adsorbed by the suction cup through the first notch.

[0010] In a specific embodiment, the first positioning structure includes a plurality of first limiting protrusions, and the second positioning structure includes a plurality of second limiting protrusions, the positions of the first limiting protrusions and the second limiting protrusions correspond one to one, and the two are evenly arranged relative to the positioning ring; when the first adsorbent moves to the second position, the first adsorbent docks with the wafer adsorbed by the suction cup through two adjacent first limiting protrusions or two adjacent second limiting protrusions; and / or, when the second adsorbent and the third adsorbent move to the third position, the second adsorbent and the third adsorbent dock with the wafer adsorbed by the suction cup through two adjacent first limiting protrusions or two adjacent second limiting protrusions.

[0011] In a specific embodiment, at least one of the first adsorption component, the second adsorption component, and the third adsorption component is provided with a second notch, the contour shape of the second notch matches the outer contour shape of the suction cup, and at least one of the first adsorption component, the second adsorption component, and the third adsorption component is also provided with a plurality of adsorption holes around the second notch.

[0012] In a specific embodiment, the wafer moving device further includes a wafer detection component, and the wafer detection component includes a light source and an optical coupler. The optical coupler is arranged on one side of the first position, and the light source is arranged on the other side of the first position. When a wafer is arranged at the first position, the light path emitted from the light source to the optical coupler is blocked by the wafer.

[0013] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a wafer inspection system, including a wafer moving device, a wafer storage device, and a wafer inspection system as described in any of the above items, wherein the wafer moving device is respectively connected to the wafer storage device and the wafer inspection device, and the wafer moving device obtains wafers from the wafer storage device and transports them to the wafer inspection device for inspection, and transports the wafers inspected by the wafer inspection device back to the wafer storage device.

[0014] The beneficial effect of the present application is: different from the prior art, the implementation method of the present application utilizes the first adsorption component to move between the first position and the second position along the first direction, and the second adsorption component and the third adsorption component to move between the third position and the fourth position along the second direction, so as to dock with the wafer storage component at the first position and dock with the wafer detection device at the fourth position, thereby realizing the transportation of the wafer in the first direction and the second direction, and realizing automatic transportation of the wafer without the need for a high-cost robot; at the same time, the second adsorption component and the third adsorption component alternately transport the wafer, which can improve the working efficiency of the wafer moving device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the description of the implementation modes will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the assembly structure of the wafer moving device provided by the present application;

[0017] Figure 2 It is a schematic diagram of the assembly structure of the wafer moving device provided by the present application and the wafer storage element docking;

[0018] Figure 3 It is a schematic diagram of the structure of the wafer positioning plate provided by the present application;

[0019] Figure 4 is a structural schematic diagram of a second moving member provided by the present application;

[0020] Figure 5 is a structural schematic diagram of a first moving member provided by the present application;

[0021] Figure 6 is another structural schematic diagram of the first moving member provided by the present application;

[0022] Figure 7 is another structural schematic diagram of the wafer positioning plate provided by the present application;

[0023] Figure 8 is a schematic diagram of the structure of the wafer storage device provided by the present application;

[0024] Fig. 9 is another structural schematic diagram of the wafer storage device provided by the present application;

[0025] Fig.10 This is another structural schematic diagram of the wafer storage device provided by the present application.

[0026] 1. Wafer moving device; 11. First moving member; 111. First suction member; 112. Lifting cylinder; 113. First direction guide rail; 12. Wafer positioning plate; 121. Suction cup; 122. First mounting position; 123. Second mounting position; 124. Positioning ring; 125. First limiting protrusion; 126. Second limiting protrusion; 127. First notch; 128. Positioning plate transverse cylinder; 129. Positioning plate lifting cylinder; 13. Second moving member; 131. Second suction member; 132 , third adsorption part; 133, synchronous belt; 133a, upper belt; 133b, lower belt; 134, longitudinal moving axis; 14, second notch; 15, adsorption hole; 16, wafer detection part; 161, light source; 162, optical coupler; 2, wafer storage part; 21, plug lifting shaft; 22, wafer plug; 23, plug positioning part; 24, wafer sensor; 3, wafer; first direction F; second direction G; third direction H; first position A; second position B; third position C; fourth position D. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings and implementation methods. It is particularly noted that the following implementation methods are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following implementation methods are only some implementation methods of the present application rather than all implementation methods. All other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The terms "first", "second" and "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, and the manner is such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications in the implementation mode of this application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. The manner, such as a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0029] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In the semiconductor industry, wafers are generally placed in wafer storage devices. Therefore, when testing wafers and circuits on wafers, it is necessary to take the wafers out of the wafer storage device and place them on the wafer inspection system for inspection. After the inspection is completed, the wafers must be taken out and placed back in the wafer storage device, and the operation is repeated in this way. Manually moving wafers is a common operation method at present, but manual operation is not precise enough and accidents that damage wafers may occur. In addition, another common method is to use wafer handling robots, but the cost is high and the efficiency is insufficient, which is not suitable for large-scale deployment.

[0031] In order to improve or solve the above technical problems, the inventors of the present application have proposed at least the following embodiments after long-term research.

[0032] See also Figure 1 , 2 Figure 1 It is a schematic diagram of the assembly structure of the wafer moving device provided in this application. Figure 2The present application provides a schematic diagram of the assembly structure of the wafer moving device and the wafer storage device for docking. The present application provides a wafer moving device (1), comprising a first moving member (11), a wafer positioning plate (12) and a second moving member (13). The first moving member (11) comprises a first adsorbing member (111), the first adsorbing member (111) moves between a first position A and a second position B along a first direction F, and the first position A is used to dock with the wafer storage device (2). The wafer positioning plate (12) is arranged corresponding to the second position B. The second moving member (13) comprises a second adsorbing member (131) and a third adsorbing member (132), the second adsorbing member (131) and the third adsorbing member (132) move between a third position C and a fourth position D along a second direction G, the third position C docks with the wafer positioning plate (12), and the fourth position D is used to dock with the wafer detection device.

[0033] The second adsorption member (131) and the third adsorption member (132) move synchronously, when the second adsorption member (131) is located at the third position C, the third adsorption member (132) is located at the fourth position D, and when the third adsorption member (132) is located at the third position C, the second adsorption member (131) is located at the fourth position D. The first direction F intersects with the second direction G.

[0034] The wafer moving device (1) provided in this embodiment uses the first suction member (111) to move between the first position A and the second position B along the first direction F, and the second suction member (131) and the third suction member (132) to move between the third position C and the fourth position D along the second direction G, so as to dock the wafer storage member (2) at the first position A and dock the wafer detection device at the fourth position D, thereby realizing the transportation of the wafer (3) in the non-parallel first direction F and second direction G, without the need for a high-cost robot, and realizing the automatic transportation of the wafer (3) in an economical and practical manner. At the same time, the second suction member (131) and the third suction member (132) alternately dock with the wafer positioning plate (12), which can improve the working efficiency of the wafer moving device (1).

[0035] In one embodiment, the second moving member (13) further comprises a synchronous belt (133). The synchronous belt (133) may comprise an upper belt (133a) and a lower belt (133b), the second adsorption member (131) is fixed to the upper belt (133a), the third adsorption member (132) is fixed to the lower belt (133b), and the synchronous belt (133) is arranged along the second direction G. Thus, the second adsorption member (131) and the third adsorption member (132) are connected by the synchronous belt (133) to achieve synchronous movement of the two.

[0036] Furthermore, the second adsorption component (131) and the third adsorption component (132) can be arranged at different ends of the synchronous belt (133) along the second direction G. When the second adsorption component (131) is located at the third position C, the third adsorption component (132) is located at the fourth position D. When the third adsorption component (132) is located at the third position C, the second adsorption component (131) is located at the fourth position D. This prevents the two components from conflicting when moving, thereby improving the stability of the wafer moving device (1).

[0037] Further reading Figure 4 , Figure 4 1 is a schematic diagram of the structure of the second movable member provided by the present application. In one embodiment, the second movable member (13) further includes a longitudinal movable shaft (134). The longitudinal movable shaft (134) is connected to the synchronous belt (133), and the second adsorption member (131) and the third adsorption member (132) move synchronously along the third direction H through the longitudinal movable shaft (134), and the third direction H is perpendicular to the plane where the first direction F and the second direction G are located.

[0038] In order to prevent the second adsorption member (131) and the third adsorption member (132) from colliding when they move, a certain height difference is provided between the upper belt (133a) and the lower belt (133b), respectively. This height difference may cause the second adsorption member (131) and the third adsorption member (132) to be less stable when docked with the wafer positioning plate (12) and the wafer detection device. Therefore, the second moving member (13) can also use the longitudinal moving axis (134) to control the overall longitudinal movement of the second adsorption member (131) and the third adsorption member (132), thereby eliminating the influence of the height difference and improving the stability of the wafer moving device (1).

[0039] Optionally, see Figure 6 , Figure 6 This is another structural schematic diagram of the first movable member provided by the present application. The first movable member (11) also includes a lifting cylinder (112) and a first direction guide rail (113). The lifting cylinder (112) connects the first adsorption member (111) and the first direction guide rail (113), and the lifting cylinder (112) and the first adsorption member (111) can move synchronously along the first direction guide rail (113). Under the action of the lifting cylinder (112), the first adsorption member (111) can move up and down along the third direction H relative to the first direction guide rail (113) to adjust the first adsorption member (111) to facilitate its carrying of the wafer (3) and / or docking with the wafer positioning plate (12) and the wafer storage member (2).

[0040] Further reading Figure 3 , Figure 7 , Figure 3 It is a structural schematic diagram of the wafer positioning plate provided in this application. Figure 7This is another structural schematic diagram of a wafer positioning plate provided by the present application. In one embodiment, the wafer positioning plate (12) includes a suction cup (121), a first mounting position (122), and a second mounting position (123). The suction cup (121) is arranged corresponding to the first mounting position (122) and the second mounting position (123). When the wafer (3) is limited in the first mounting position (122) and / or the second mounting position (123), the suction cup (121) absorbs the wafer (3).

[0041] The wafer positioning plate (12) can be specifically provided with two different mounting positions, namely a first mounting position (122) and a second mounting position (123), so as to be adaptable to different wafers (3), and the wafer (3) can be fixed by adsorbing using a suction cup (121), thereby improving the versatility and stability of the wafer moving device (1).

[0042] Optionally, the wafer positioning plate (12) may also include a positioning plate transverse movement cylinder (128) and a positioning plate lifting cylinder (129). The positioning plate transverse movement cylinder (128) can control the positioning ring (124), suction cup (121) and other structures to move synchronously along a direction parallel to the plane where the first direction F and the second direction G are located. The positioning plate lifting cylinder (129) can control the positioning ring (124), suction cup (121) and other structures to move up and down synchronously along a direction parallel to the third direction H, so that the positioning ring (124), suction cup (121) and other structures can flexibly adjust their position and height according to needs, so as to facilitate their docking with the first movable member (11) and the second movable member (13).

[0043] In one embodiment, the wafer positioning plate (12) includes a positioning ring (124), a suction cup (121) is disposed in the positioning ring (124), and the suction cup (121) is parallel to the positioning ring (124). The positioning ring (124) includes a first positioning structure and a second positioning structure, the first positioning structure is disposed around the outer periphery of the positioning ring (124) to form a first mounting position (122), and the second positioning structure is disposed around the inner periphery of the positioning ring (124) to form a second mounting position (123).

[0044] Specifically, the present embodiment utilizes a positioning ring (124) and a first positioning structure and a second positioning structure formed on the outer periphery and inner periphery of the positioning ring (124) to form different first mounting positions (122) and second mounting positions (123), thereby being able to adapt to different positioning requirements of wafers (3). A suction cup (121) for adsorbing and fixing the wafer (3) can be arranged in the positioning ring (124) in parallel with the positioning ring (124), so that no matter whether the wafer (3) is placed in the first mounting position (122) or the wafer (3) is placed in the second mounting position (123), it can be adsorbed by the suction cup (121), thereby improving the versatility and stability of the wafer moving device (1).

[0045] In the direction parallel to the suction cup (121), the diameter of the first mounting position (122) can be 8 inches, and the diameter of the second mounting position (123) can be 6 inches, so that two common sizes of wafers (3) of 8 inches and 6 inches can be adapted.

[0046] In one embodiment, the positioning ring (124) is provided with a first notch (127). When the first suction member (111) moves to the second position B, the first suction member (111) docks with the wafer (3) suctioned by the suction cup (121) through the first notch (127).

[0047] Optionally, when the second adsorption member (131) and the third adsorption member (132) move to the third position C, the second adsorption member (131) and the third adsorption member (132) dock with the wafer (3) adsorbed by the suction cup (121) through the first notch (127).

[0048] In the structure provided in this embodiment, the positioning ring (124) can specifically be provided with a first notch (127), and any one of the first adsorption component (111), the second adsorption component (131), and the third adsorption component (132) can enter the positioning ring (124) through the first notch (127) to dock with the wafer (3) adsorbed by the suction cup (121), thereby reducing the influence of the positioning ring (124) on the operation of the first adsorption component (111), the second adsorption component (131), and the third adsorption component (132), and improving the versatility and stability of the wafer moving device (1).

[0049] In one embodiment, the first positioning structure includes a plurality of first limiting protrusions (125), and the second positioning structure includes a plurality of second limiting protrusions (126). The positions of the first limiting protrusions (125) and the second limiting protrusions (126) correspond one to one, and the two are evenly arranged relative to the positioning ring (124).

[0050] When the first suction member (111) moves to the second position B, the first suction member (111) docks with the wafer (3) suctioned by the suction cup (121) through two adjacent first limiting protrusions (125) or two adjacent second limiting protrusions (126); and / or,

[0051] When the second suction member (131) and the third suction member (132) move to the third position C, the second suction member (131) and the third suction member (132) dock with the wafer (3) adsorbed by the suction cup (121) through two adjacent first limiting protrusions (125) or two adjacent second limiting protrusions (126). Any one of the first suction member (111), the second suction member (131) and the third suction member (132) can enter between the positioning ring (124) and the wafer (3) through two adjacent first limiting protrusions (125) or two adjacent second limiting protrusions (126), thereby adsorbing the surface of the wafer (3) facing the positioning ring (124) and docking with the wafer (3), reducing the influence of the positioning ring (124) on the operation of the first suction member (111), the second suction member (131) and the third suction member (132), and improving the versatility and stability of the wafer moving device (1).

[0052] Further reading Figure 5 , 6 , Figure 5 It is a structural schematic diagram of the first moving part provided by the present application. In one embodiment, at least one of the first adsorption part (111), the second adsorption part (131), and the third adsorption part (132) is provided with a second notch (14), and the contour shape of the second notch (14) matches the outer contour shape of the suction cup (121). At least one of the first adsorption part (111), the second adsorption part (131), and the third adsorption part (132) is also provided with a plurality of adsorption holes (15) around the second notch (14).

[0053] This embodiment uses the first adsorption member (111) as an exemplary figure, and the second adsorption member (131) and the third adsorption member (132) can also adopt the same or similar structure as the first adsorption member (111) shown in the figure. It should be noted that the first adsorption member (111), the second adsorption member (131), and the third adsorption member (132) are applied to different positions of the wafer moving device (1), and the structures other than the second notch (14) and the adsorption hole (15) can be adaptively adjusted to meet different usage requirements.

[0054] Through the structure provided in this embodiment, the first adsorption component (111), the second adsorption component (131), and the third adsorption component (132) can be docked with the suction cup (121) through the second notch (14), and the adsorption holes (15) on the side of the second notch (14) can be used to adsorb the surface of the wafer (3), thereby improving the stability of the wafer moving device (1).

[0055] In one embodiment, the wafer moving device (1) also includes a wafer detection component (16). The wafer detection component (16) includes a light source (161) and an optical coupler (162). The optical coupler (162) is arranged on one side of the first position A, and the light source (161) is arranged on the other side of the first position A. When a wafer (3) is arranged at the first position A, the light path emitted from the light source (161) and directed to the optical coupler (162) is blocked by the wafer (3). Thus, the wafer detection component (16) can be used to detect whether there is a wafer (3) at the first position A, and then when there is no wafer (3) at the first position A, the first adsorption component (111) is not controlled to adsorb the wafer (3), thereby reducing unnecessary operations and improving the working efficiency of the wafer moving device (1).

[0056] See also Figure 3 and Figure 7 The wafer detection component (16) provided in this embodiment can be fixed to the side of the wafer positioning plate (12) facing the wafer storage component (2), so as to achieve relative fixation of the two.

[0057] The present application also provides a wafer inspection system, comprising a wafer storage unit (2), a wafer inspection device, and a wafer moving device (1) as described in any one of the above embodiments. The wafer moving device (1) is respectively connected to the wafer storage unit (2) and the wafer inspection device, and the wafer moving device (1) obtains a wafer (3) from the wafer storage unit (2) and transports it to the wafer inspection device for inspection, and transports the wafer (3) inspected by the wafer inspection device back to the wafer storage unit (2).

[0058] The wafer moving device (1) provided in this embodiment uses the first suction member (111) to move between the first position A and the second position B along the first direction F, and the second suction member (131) and the third suction member (132) to move between the third position C and the fourth position D along the second direction G, so as to dock with the wafer storage member (2) at the first position A and dock with the wafer detection device at the fourth position D, thereby realizing the transportation of the wafer (3) in the non-parallel first direction F and second direction G, and realizing the automatic transportation of the wafer (3) without the need for a high-cost robot. At the same time, the second suction member (131) and the third suction member (132) alternately dock with the wafer positioning plate (12), which can improve the working efficiency of the wafer moving device (1), thereby improving the efficiency of the wafer detection system in detecting the surface of the wafer (3) and / or the wafer circuit.

[0059] See also Figure 8 , 9 , 10, Figure 8 It is a schematic diagram of the structure of the wafer storage device provided in this application. Fig. 9 This is another structural schematic diagram of the wafer storage device provided in this application. Fig.10It is another structural schematic diagram of the wafer storage device provided by the present application. The wafer storage device (2) provided by the present application may include a plug lifting shaft (21), a wafer plug (22), a plug positioning member (23) and a wafer sensor (24). The plug lifting shaft (21) can control the wafer plug (22), the plug positioning member (23) and the wafer sensor (24) to move up and down synchronously along a direction parallel to a third direction H, so that the wafer plug (22) can be moved to a suitable height, and the wafer (3) therein can be detected by the wafer detection member (16). The wafer plug (22) can be relatively fixed to the plug positioning member (23) in a detachable manner, and the wafer plug (22) can be provided with a plurality of layers of storage positions parallel to the third direction H, and the storage positions are used to store the wafer (3). The plug positioning member (23) is used to limit the wafer plug (22). When the wafer plug (22) is assembled in the plug positioning member (23), the two can synchronously move in parallel to the third direction H under the action of the plug lifting shaft (21). The wafer sensor (24) can be arranged on the lower side of the wafer plug (22) to detect the part of the wafer (3) protruding out of the wafer plug (22), so as to determine whether there is a wafer (3) stored in the wafer plug (22), thereby reducing the probability of the wafer detection system working without load. When it is necessary to detect the wafer (3), the user can load the entire wafer plug (22) into the plug positioning member (23), and can automatically detect the wafer (3) in the wafer plug (22) through the coordinated work between the various structures in the wafer detection system.

[0060] By way of example, the wafer detection system and wafer moving device (1) provided in the embodiment of the present application can realize the movement of the wafer (3) in the following process: the user manually places the wafer plug (22) into the plug positioning member (23) and fixes it, and then the plug lifting shaft (21) works to lift the wafer plug (22) to a suitable height. When the wafer detection member (16) senses that the wafer (3) appears in the first position A, the plug lifting shaft (21) stops working. At this time, the lifting cylinder (112) raises the first suction member (111), and the first suction member (111) moves to the first position A along the first direction F, thereby taking the wafer (3) from the wafer plug (22). Afterwards, the first suction member (111) absorbs the wafer (3) along the first direction F and moves it to the wafer positioning plate (12). The lifting cylinder (112) descends, causing the wafer (3) to fall onto the wafer positioning plate (12).

[0061] The positioning ring (124) uses the first limiting protrusion (125) and the second limiting protrusion (126) to position the wafer (3). The positioning plate transverse movement cylinder (128) is transversely moved to a position, and the longitudinal moving shaft (134) synchronously lifts the second adsorption component (131) and the third adsorption component (132), and one of them is used to adsorb the wafer (3) on the wafer positioning plate (12). After one of them adsorbs the wafer (3) on the wafer positioning plate (12), and because the other moves in the opposite direction, after one of them adsorbs the wafer (3) on the wafer positioning plate (12), the other can place the wafer (3) removed from the wafer detection device and completed the inspection on the wafer positioning plate (12), and then can use the first adsorption component (111) to adsorb and move it back to the wafer plug (22) for storage.

[0062] The second suction member (131) and the third suction member (132) move toward each other along the second direction G and exchange positions under the action of the synchronous belt (133). The longitudinal moving shaft (134) descends, so that the wafers (3) adsorbed by the second suction member (131) and the third suction member (132) fall onto the wafer positioning plate (12) and the wafer detection device, respectively. The positioning plate transverse movement cylinder (128) controls the wafer positioning plate (12) to return to its original position, the lifting cylinder (112) rises, and the first suction member (111) adsorbs the wafer (3) on the wafer positioning plate (12). Afterwards, the first suction member (111) moves the wafer (3) back to the wafer plug (22) along the first direction F.

[0063] The above description is only part of the implementation methods of the present application, and does not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer moving device (1), characterized in that: include: A first moving member (11) comprises a first adsorption member (111), wherein the first adsorption member (111) moves along a first direction between a first position and a second position, wherein the first position is used for docking with the wafer storage member (2); A wafer positioning plate (12), arranged corresponding to the second position; A second moving member (13) comprises a second adsorption member (131) and a third adsorption member (132), wherein the second adsorption member (131) and the third adsorption member (132) move along a second direction between a third position and a fourth position, wherein the third position is docked with the wafer positioning plate (12), and the fourth position is used for docking with a wafer detection device; The second adsorbent (131) and the third adsorbent (132) move synchronously; when the second adsorbent (131) is located at the third position, the third adsorbent (132) is located at the fourth position; when the third adsorbent (132) is located at the third position, the second adsorbent (131) is located at the fourth position; the first direction intersects with the second direction.

2. The wafer moving device (1) according to claim 1, characterized in that: The second moving member (13) further comprises a synchronous belt (133), wherein the synchronous belt (133) comprises an upper belt (133a) and a lower belt (133b), the second adsorption member (131) is fixed to the upper belt (133a), the third adsorption member (132) is fixed to the lower belt (133b), and the synchronous belt (133) is arranged along the second direction.

3. The wafer moving device (1) according to claim 2, characterized in that: The second moving member (13) further comprises a longitudinal moving shaft (134), wherein the longitudinal moving shaft (134) is connected to the synchronous belt (133), and the second adsorption member (131) and the third adsorption member (132) are synchronously moved along a third direction via the longitudinal moving shaft (134), wherein the third direction is perpendicular to the plane where the first direction and the second direction are located.

4. The wafer moving device (1) according to claim 1, characterized in that: The wafer positioning plate (12) comprises a suction cup (121), a first mounting position (122), and a second mounting position (123); the suction cup (121) is arranged corresponding to the first mounting position (122) and the second mounting position (123); when the wafer (3) is limited in the first mounting position (122) and / or the second mounting position (123), the suction cup (121) absorbs the wafer (3).

5. The wafer moving device (1) according to claim 4, characterized in that: The wafer positioning plate (12) comprises a positioning ring (124), the suction cup (121) is arranged in the positioning ring (124), and the suction cup (121) is parallel to the positioning ring (124), the positioning ring (124) comprises a first positioning structure and a second positioning structure, the first positioning structure is arranged around the outer periphery of the positioning ring (124) to form the first mounting position (122), and the second positioning structure is arranged around the inner periphery of the positioning ring (124) to form the second mounting position (123); Wherein, in a direction parallel to the suction cup (121), the diameter of the first mounting position (122) is 8 inches, and the diameter of the second mounting position (123) is 6 inches.

6. The wafer moving device (1) according to claim 5, characterized in that: The positioning ring (124) is provided with a first notch (127). When the first suction member (111) moves to the second position, the first suction member (111) docks with the wafer (3) suctioned by the suction cup (121) through the first notch (127); and / or, When the second adsorption member (131) and the third adsorption member (132) move to the third position, the second adsorption member (131) and the third adsorption member (132) dock with the wafer (3) adsorbed by the suction cup (121) through the first notch (127).

7. The wafer moving device (1) according to claim 5, characterized in that: The first positioning structure comprises a plurality of first limiting protrusions (125), and the second positioning structure comprises a plurality of second limiting protrusions (126), the first limiting protrusions (125) and the second limiting protrusions (126) have a one-to-one correspondence in position, and the two are evenly arranged relative to the positioning ring (124); When the first suction member (111) moves to the second position, the first suction member (111) docks with the wafer (3) suctioned by the suction cup (121) through two adjacent first limiting protrusions (125) or two adjacent second limiting protrusions (126); and / or, When the second adsorbing member (131) and the third adsorbing member (132) move to the third position, the second adsorbing member (131) and the third adsorbing member (132) dock with the wafer (3) adsorbed by the suction cup (121) through two adjacent first limiting protrusions (125) or two adjacent second limiting protrusions (126).

8. The wafer moving device (1) according to claim 5, characterized in that: At least one of the first adsorption component (111), the second adsorption component (131), and the third adsorption component (132) is provided with a second notch (14), the contour shape of the second notch (14) matches the outer contour shape of the suction cup (121), and at least one of the first adsorption component (111), the second adsorption component (131), and the third adsorption component (132) is also provided with a plurality of adsorption holes (15) around the second notch (14).

9. The wafer moving device (1) according to claim 1, characterized in that: The wafer moving device (1) further comprises a wafer detection component (16), wherein the wafer detection component (16) comprises a light source (161) and an optical coupler (162), wherein the optical coupler (162) is arranged on one side of the first position, and the light source (161) is arranged on the other side of the first position. When a wafer (3) is arranged at the first position, a light path emitted from the light source (161) and directed to the optical coupler (162) is blocked by the wafer (3).

10. A wafer inspection system, characterized in that: include: Wafer storage device (2); Wafer inspection device; The wafer moving device (1) as described in any one of claims 1 to 9, wherein the wafer moving device (1) is respectively connected to the wafer storage device (2) and the wafer detection device, and the wafer moving device (1) obtains the wafer (3) from the wafer storage device (2) and transports it to the wafer detection device for detection, and transports the wafer (3) detected by the wafer detection device back to the wafer storage device (2).

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