Silicon wafer transfer device and silicon wafer production line

Abstract

The utility model relates to the technical field of silicon wafer processing, and discloses a silicon wafer transfer device and a silicon wafer production line, which comprise a frame, a box body and a degumming frame. The frame is provided with a walking mechanism, the box body is connected to the frame, and the top of the box body is open and suitable for containing liquid for soaking silicon wafers. And the degumming frame is detachably connected in the box body. After slicing is completed, the silicon wafer transfer device serves as a cutting and discharging trolley to complete cutting and discharging operation. Water is injected into the box body, then the frame is pushed to a designated position, and the silicon wafer transfer device serves as a degumming feeding trolley to complete degumming feeding operation. And after the silicon wafers on the degumming frame are degummed by the degumming machine, the silicon wafer transfer device is used as a degumming discharging trolley to complete degumming discharging operation. The silicon wafer transfer device can replace a cutting discharging trolley and a degumming feeding and discharging trolley to complete cutting discharging operation and degumming feeding and discharging operation, and the cost is reduced. And the procedure of transferring the silicon wafers between the cutting and discharging trolley and the degumming and feeding and discharging trolley is omitted, so that the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer transfer device and a silicon wafer production line. Background Art

[0002] Silicon wafer cutting is a key technology in semiconductor manufacturing and the photovoltaic industry, which involves cutting silicon materials into silicon wafers of the required size and shape. During cutting, in order to fix the silicon material, the silicon material is often glued to the working area of ​​the cutter with glue. After the silicon material is cut into silicon wafers by the cutter, the glue remaining on the silicon wafer needs to be debonded using a debonding machine. When the cut silicon wafers are transported to the debonding machine, the slices are placed on the slice unloading trolley. After the slice unloading trolley is used to transport the silicon wafers to the debonding loading and unloading trolley, the silicon wafers are taken out from the slice unloading trolley and placed on the debonding loading and unloading trolley. The robot grabs the silicon wafer and transports it to the debonding machine for debonding. After the debonding is completed, the robot grabs the debonded silicon wafer and transports it to the debonding loading and unloading trolley.

[0003] In this process, a slicing unloading trolley and a degumming loading and unloading trolley are used for silicon wafer cutting and degumming respectively. The silicon wafer needs to be transferred between the slicing unloading trolley and the degumming loading and unloading trolley, which leads to low work efficiency. Utility Model Content

[0004] In view of this, the utility model provides a silicon wafer transfer device and a silicon wafer production line to solve the problem of low work efficiency caused by the need to transfer silicon wafers between a slicing unloading trolley and a degumming loading and unloading trolley when silicon wafer cutting and degumming are performed respectively.

[0005] On the one hand, the utility model provides a silicon wafer transfer device, comprising:

[0006] A vehicle frame, provided with a traveling mechanism;

[0007] A box body connected to the frame, the top of the box body is open and suitable for containing liquid for soaking silicon wafers;

[0008] The debonding rack is detachably connected to the box body, and the debonding rack is suitable for placing the silicon wafer.

[0009] Beneficial effect: After the slicing is completed, the cut silicon wafers are placed on the degumming rack, and the silicon wafer transfer device is used as a cutting and unloading trolley to complete the cutting and unloading operation. Water is injected into the box so that the water in the box overflows the degumming rack and the silicon wafer. Then, after the frame is pushed to the specified position, the degumming rack and the silicon wafers on the degumming rack are transferred to the degumming machine. At this time, the silicon wafer transfer device is used as a degumming loading trolley to complete the degumming and loading operation. After the degumming machine degummes the silicon wafers on the degumming rack, it grabs the degumming rack and returns it to the box, reloads the degumming rack into the box, and finally removes the degummed silicon wafers from the degumming rack. At this time, the silicon wafer transfer device is used as a degumming unloading trolley to complete the degumming and unloading operation. In the whole process, the silicon wafer transfer device can replace the cutting and unloading trolley and the degumming loading and unloading trolley to complete the cutting and unloading operation and the degumming loading and unloading operation, thereby reducing costs. In addition, the process of transferring silicon wafers between the cutting and unloading trolley and the degumming loading and unloading trolley is eliminated, thereby improving work efficiency.

[0010] Moreover, because the silicon wafers are immersed in water during transportation between cutting and debonding, the glue and silicon powder on the silicon wafers are effectively prevented from drying up, and the silicon wafers are also prevented from being exposed to the air for a long time and causing the silicon wafers to become dirty. In addition, because the silicon wafers can be immersed in water for a long time to prevent drying up and dirtiness, the waiting time for the debonding process is extended, ensuring a smoother production process.

[0011] In an optional embodiment, a first positioning structure is provided in the box body, and the first positioning structure is suitable for positioning the degumming rack in the box body, and the degumming rack is detachably connected to the first positioning structure.

[0012] Beneficial effect: it is not only convenient to locate, grasp and place the degumming rack, but also reinforces the degumming rack to prevent the degumming rack from tipping over.

[0013] In an optional embodiment, the first positioning structure includes:

[0014] At least two first positioning posts are provided and fixedly connected in the box body, and first positioning grooves are provided on the side walls of the first positioning posts. The two opposite corner side walls of the degumming rack respectively abut against the groove walls of the first positioning grooves on the two first positioning posts.

[0015] Beneficial effect: The first positioning grooves on the two first positioning columns in the box body respectively position two relatively arranged corners of the degumming frame, making the degumming frame more stable.

[0016] In an optional embodiment, the box is detachably connected to the frame.

[0017] Beneficial effects: When the box is damaged, the box can be directly removed from the frame, and then a new box can be installed on the frame without replacing the frame, which reduces the cost of use. When the box needs to be cleaned, the box can be removed from the frame and can be turned at any angle during cleaning, which is easier than cleaning the box on the frame.

[0018] In an optional embodiment, a second positioning structure is provided on the frame, and the second positioning structure is suitable for positioning the box on the frame, and the box is detachably connected to the second positioning structure.

[0019] Beneficial effect: It is not only easy to install and disassemble the box, but also reinforces the box to prevent the box from falling on the frame.

[0020] In an optional embodiment, the second positioning structure includes:

[0021] At least two second positioning columns are provided and fixedly connected to the frame. Second positioning grooves are provided on the side walls of the second positioning columns. The two opposite corner side walls of the box body respectively abut against the groove walls of the second positioning grooves on the two second positioning columns.

[0022] Beneficial effect: The second positioning grooves on the two second positioning columns on the frame respectively position two oppositely arranged corners of the box body, making the box body more stable.

[0023] In an optional embodiment, a hook is connected to the degumming rack, and the hook is suitable for being grasped by a robot.

[0024] Beneficial effect: It is more convenient for the manipulator to locate and grab the degumming rack.

[0025] In an optional embodiment, the box body is provided with a liquid outlet suitable for the liquid to flow out.

[0026] Beneficial effect: After the liquid outlet is closed, water is poured into the box from the opening at the top of the box. When the water needs to be changed or drained, the liquid outlet is opened. At this time, the inside of the box is connected to the outside through the liquid outlet, and the water in the box can be discharged from the liquid outlet, making drainage more convenient and quick.

[0027] In an optional embodiment, a buffer pad is provided on the debonding rack, and the buffer pad is suitable for contacting the side of the silicon wafer.

[0028] Beneficial effect: After the silicon wafer is placed on the debonding rack, the side of the silicon wafer abuts against the buffer pad, and the buffer pad plays a buffering role during movement, preventing the side of the silicon wafer from directly contacting the debonding rack and being damaged.

[0029] On the other hand, the utility model provides a silicon wafer production line, including a silicon wafer cutting device and a silicon wafer degumming device, a silicon wafer transfer device is arranged between the silicon wafer cutting device and the silicon wafer degumming device, and the silicon wafer transfer device is set to any of the silicon wafer transfer devices described above.

[0030] Beneficial effects: The beneficial effects produced by the silicon wafer production line are consistent with the technical effects produced by the silicon wafer transfer device, so they will not be repeated. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a schematic structural diagram of a silicon wafer transfer device according to an embodiment of the utility model;

[0033] Figure 2 A top view of a box body according to an embodiment of the utility model;

[0034] Figure 3 This is a structural schematic diagram of a degumming rack according to an embodiment of the utility model;

[0035] Figure 4 This is a front view of a silicon wafer transfer device according to an embodiment of the utility model;

[0036] Figure 5 A side view of a silicon wafer transfer device according to an embodiment of the utility model;

[0037] Figure 6 It is a structural schematic diagram of a frame of an embodiment of the utility model.

[0038] Description of reference numerals:

[0039] 1. Frame; 2. Box; 3. Degumming frame; 4. First positioning column; 5. First positioning groove; 6. Second positioning column; 7. Second positioning groove; 8. Hook; 9. Liquid outlet; 10. Universal roller; 11. Fixed roller; 12. Liquid inlet. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0041] Combine the following Figures 1 to 6 , describing an embodiment of the utility model.

[0042] According to an embodiment of the present utility model, on the one hand, a silicon wafer transport device is provided, such as Figure 1 As shown, it includes a frame 1, a box 2 and a degumming frame 3. A walking structure is arranged on the frame 1 to form a transfer trolley, wherein the walking structure can be rollers respectively arranged at the four corners of the bottom of the frame 1. The box 2 is connected to the frame 1, so that pushing the frame 1 can drive the box 2 to move. An opening is arranged on the top of the box 2, and liquid can be added into the box 2 through the opening. The degumming frame 3 is a commonly used support frame for degumming. After the silicon wafer is placed on the degumming frame 3, the manipulator grabs the degumming frame 3 to the degumming machine, and the degumming machine can degumming the silicon wafer on the degumming frame 3. After the degumming is completed, the manipulator grabs the degumming frame 3 and leaves the degumming machine. The degumming frame 3 can be any common degumming frame 3, such as a clamping degumming frame 3, and the degumming frame 3 is detachably connected to the box 2.

[0043] Push the carriage 1 to the cutting and unloading position, load the degumming rack 3 into the box 2, and after the slicing is completed, place the cut silicon wafer on the degumming rack 3. At this time, the silicon wafer transfer device serves as a cutting and unloading trolley to complete the cutting and unloading operation. Inject water into the box 2 so that the water in the box 2 overflows the degumming rack 3 and the silicon wafer. Then push the carriage 1 so that the carriage 1 moves to the degumming and unloading position. After the carriage 1 reaches the specified position, the manipulator reaches into the box 2 and grabs the degumming rack 3 in the box 2, and transfers the degumming rack 3 and the silicon wafer on the degumming rack 3 to the degumming machine. At this time, the silicon wafer transfer device serves as a degumming loading trolley to complete the degumming and loading operation. After the degumming machine degummes the silicon wafer on the degumming rack 3, the manipulator grabs the degumming rack 3 and returns to the box 2, reloads the degumming rack 3 into the box 2, and finally removes the degummed silicon wafer from the degumming rack 3. At this time, the silicon wafer transfer device serves as a degumming unloading trolley to complete the degumming and unloading operation. After the unloading is completed, the frame 1 is pushed to the cutting and unloading position to wait for the next cutting and unloading operation.

[0044] In the whole process, the silicon wafer transfer device can replace the cutting and unloading trolley and the degumming loading and unloading trolley to complete the cutting and unloading operations and the degumming loading and unloading operations, reducing costs. It also eliminates the process of transferring silicon wafers between the cutting and unloading trolley and the degumming loading and unloading trolley, improving work efficiency.

[0045] Moreover, because the silicon wafers are immersed in water during transportation between cutting and debonding, the glue and silicon powder on the silicon wafers are effectively prevented from drying up, and the silicon wafers are also prevented from being exposed to the air for a long time and causing the silicon wafers to become dirty. Since the silicon wafers can be immersed in water for a long time to prevent drying up and dirtiness, the waiting time for the debonding process is extended, ensuring a smoother production process.

[0046] The load-bearing capacity of the box body 2 should be greater than or equal to 0.5 tons.

[0047] In one embodiment, if Figure 2 and Figure 3 As shown, a first positioning structure is provided in the box body 2, and the degumming rack 3 is detachably connected to the first positioning structure. In this way, when the degumming rack 3 is connected to the first positioning structure, the degumming rack 3 is positioned at a designated position in the box body 2, and when the degumming rack 3 needs to be removed, the degumming rack 3 can be quickly positioned at the designated position. This not only facilitates the positioning, grasping and placement of the robot, but also reinforces the degumming rack 3 to prevent the degumming rack 3 from tipping over.

[0048] As a preferred embodiment, the first positioning structure includes a first positioning column 4. The bottom of the first positioning column 4 is fixedly connected to the bottom of the box body 2. The first positioning column 4 is perpendicular to the bottom surface of the box body 2. At least two first positioning columns 4 are provided, and a right-angled first positioning groove 5 is provided on the side wall of each first positioning column 4. The first positioning groove 5 passes through the top of the first positioning column 4 along the length direction of the first positioning column 4.

[0049] If two first positioning posts 4 are provided, the first positioning grooves 5 on the two first positioning posts 4 are respectively provided on the sides close to each other on the two first positioning posts 4. After the degumming is completed, the manipulator grabs the degumming rack 3 and moves it above the first positioning posts 4, aligns one corner of the degumming rack 3 with the first positioning groove 5 on one first positioning post 4, and aligns the other diagonal corner of the degumming rack 3 with the first positioning groove 5 on the other first positioning post 4. After both are aligned, the manipulator places the degumming rack 3 downward. The two opposite corners on the degumming rack 3 respectively enter the first positioning grooves 5 on the two first positioning posts 4 and slide down along them until the bottom of the degumming rack 3 is against the bottom surface of the box body 2, and the manipulator releases the degumming rack 3 to complete the placement of the degumming rack 3. At this time, the side walls of the two opposite corners of the degumming rack 3 are fitted with the groove walls of the first positioning groove 5, and the bottom surface of the box body 2 is matched to make the degumming rack 3 unable to rotate and tilt, and can only move upward along the first positioning groove 5. Thereby reinforcing the degumming rack 3 and preventing the degumming rack 3 from tipping over. Before degumming, the robot is positioned and moved to the location of the degumming rack 3, and the degumming rack 3 is grasped and moved upward along the first positioning groove 5 to leave the first positioning structure and the box body 2, so that positioning is easier.

[0050] In this way, the first positioning grooves 5 on the two first positioning columns 4 respectively position two oppositely disposed corners of the degumming frame 3 , making the degumming frame 3 more stable.

[0051] If four first positioning posts 4 are provided, the first positioning grooves 5 on the four first positioning posts 4 correspond to the four corners of the degumming rack 3. When the side walls of two opposite corners of the degumming rack 3 are respectively fitted with the groove walls of the first positioning grooves 5 of the two first positioning posts 4, the side walls of the other two opposite corners of the degumming rack 3 are respectively fitted with the groove walls of the first positioning grooves 5 of the other two first positioning posts 4, so as to further reinforce the degumming rack 3 and prevent the degumming rack 3 from tipping over.

[0052] In one embodiment, if Figure 4-Figure 6 As shown, the box body 2 is detachably connected to the frame 1. When the box body 2 is damaged, the box body 2 can be directly removed from the frame 1, and then a new box body 2 can be installed on the frame 1, without replacing the frame 1, thereby reducing the use cost. When the box body 2 needs to be cleaned, the box body 2 can be removed from the frame 1 and can be flipped at any angle during cleaning, which is easier than cleaning the box body 2 on the frame 1.

[0053] As a preferred embodiment, a second positioning structure is provided on the vehicle frame 1, and the box body 2 is detachably connected to the second positioning structure. In this way, when the box body 2 is connected to the second positioning structure, the debonding frame 3 is positioned at the position to be installed on the vehicle frame 1, and the box body 2 can be quickly and accurately installed in place when installing the box body 2, and the box body 2 is reinforced to prevent the box body 2 from falling on the vehicle frame 1. When the box body 2 needs to be removed, the box body 2 can be removed from the second positioning structure.

[0054] As a further preferred embodiment, the second positioning structure includes: a second positioning column 6. The bottom of the second positioning column 6 is fixedly connected to the top of the frame 1, so that the first positioning column 4 is perpendicular to the top of the frame 1. At least two second positioning columns 6 are provided, and a right-angled second positioning groove 7 is provided on the side wall of each second positioning column 6, and the second positioning groove 7 passes through the top of the second positioning column 6 along the length direction of the second positioning column 6.

[0055] If two second positioning posts 6 are provided, the second positioning grooves 7 on the two second positioning posts 6 are respectively provided on the sides of the two second positioning posts 6 close to each other. When loading the box 2, lift the box 2 above the second positioning posts 6, align one corner of the box 2 with the second positioning groove 7 on one second positioning post 6, and align the other corner of the box 2 with the second positioning groove 7 on the other second positioning post 6. After both are aligned, place the box 2 downward. The two opposite corners of the box 2 enter the second positioning grooves 7 on the two second positioning posts 6 respectively and slide down until the bottom of the box 2 is against the top of the frame 1, completing the installation of the box 2. At this time, the side walls of the two opposite corners of the box 2 fit with the groove walls of the second positioning groove 7, and cooperate with the top of the frame 1 so that the box 2 cannot rotate or tilt, and can only move upward along the second positioning groove 7. This reinforces the box 2 and prevents the box 2 from falling off the frame 1. When the box body 2 needs to be removed, the box body 2 is moved upward to overcome gravity, and the box body 2 can move upward along the second positioning groove 7 and leave the second positioning structure, so that the box body 2 can be removed.

[0056] If four second positioning posts 6 are provided, the second positioning grooves 7 on the four second positioning posts 6 correspond to the four corners of the box body 2. When the side walls of two opposite corners of the box body 2 are respectively fitted with the groove walls of the second positioning grooves 7 of the two second positioning posts 6, the side walls of the other two opposite corners of the box body 2 are respectively fitted with the groove walls of the second positioning grooves 7 of the other two second positioning posts 6, so as to further reinforce the box body 2 and prevent the box body 2 from falling off the frame 1.

[0057] In one embodiment, if Figure 3 As shown, hooks 8 are connected to both sides of the degumming rack 3. When the manipulator grabs the degumming rack 3 for transportation, the manipulator grabs the degumming rack 3 by grabbing the hooks 8 on the degumming rack 3, which is convenient for the manipulator to position and grab.

[0058] In one embodiment, if Figure 2 As shown, a liquid outlet 9 is provided at the bottom of the box body 2, and the liquid outlet 9 connects the outside and the inside of the box body 2. Figure 4 and Figure 5As shown, a valve is detachably provided at the liquid outlet 9. When in use, the valve is closed to seal the liquid outlet 9, and water is poured into the box body 2 from the opening at the top of the box body 2. When the water needs to be changed or drained, the valve is opened to open the liquid outlet 9, and the inside of the box body 2 is connected to the outside through the liquid outlet 9, and the water in the box body 2 can be discharged from the liquid outlet 9. With this arrangement, drainage is more convenient and quick.

[0059] like Figure 1 As shown, a liquid inlet 12 can also be provided on the box body 2, and a quick-connect connector can be provided at the liquid inlet 12, so that a water pipe can be connected to the liquid inlet 12 to inject water into the box body 2. During the water injection process, the user does not need to hold the water pipe, which makes the operation more convenient and improves work efficiency.

[0060] In one embodiment, a buffer pad is provided on the debonding rack 3. After the silicon wafer is placed on the debonding rack 3, the side of the silicon wafer abuts against the buffer pad. The buffer pad plays a buffering role during movement to prevent the side of the silicon wafer from directly contacting the debonding rack 3 and being damaged. The buffer pad can be a cotton pad.

[0061] In one embodiment, the walking mechanism includes a universal roller 10, which connects the outward wheel to the bottom of the frame 1 and supports it on the ground, so that the frame 1 can not only move, but also turn according to needs. It also includes a fixed roller 11, wherein two fixed rollers 11 are provided and arranged at the front side of the bottom of the frame 1, and two universal rollers 10 are provided and arranged at the rear side of the bottom of the frame 1. In this way, the two fixed rollers 11 keep rolling forward and backward, while the two outward wheels are used for turning guidance. This makes it easier to control the frame 1 when it moves.

[0062] According to an embodiment of the utility model, on the other hand, a silicon wafer production line is provided. The silicon wafer production line includes a silicon wafer cutting device and a silicon wafer degumming device, and a silicon wafer transfer device is arranged between the silicon wafer cutting device and the silicon wafer degumming device, and the cut silicon wafer is transferred to the degumming machine through the silicon wafer transfer device for degumming. The silicon wafer transfer device is set to any of the above silicon wafer transfer devices.

[0063] In this way, the technical effect of the silicon wafer production line is consistent with the technical effect of the silicon wafer transfer device, so it will not be repeated.

[0064] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the present application.

Claims

1. A silicon wafer transport device, characterized in that: include: A vehicle frame (1) is provided with a running mechanism; A box body (2) is connected to the frame (1), the top of the box body (2) is open and is suitable for containing liquid for soaking silicon wafers; A debonding rack (3) is detachably connected to the box body (2), and the debonding rack (3) is suitable for placing the silicon wafer.

2. The silicon wafer transport device according to claim 1, characterized in that: A first positioning structure is arranged in the box body (2), and the first positioning structure is suitable for positioning the degumming rack (3) in the box body (2), and the degumming rack (3) is detachably connected to the first positioning structure.

3. The silicon wafer transport device according to claim 2, characterized in that: The first positioning structure comprises: At least two first positioning columns (4) are provided and fixedly connected in the box body (2); a first positioning groove (5) is provided on the side wall of the first positioning column (4); and two opposite corner side walls of the degumming rack (3) respectively abut against the groove walls of the first positioning groove (5) on the two first positioning columns (4).

4. The silicon wafer transport device according to claim 1, characterized in that: The box body (2) is detachably connected to the vehicle frame (1).

5. The silicon wafer transport device according to claim 4, characterized in that: The frame (1) is provided with a second positioning structure, the second positioning structure being suitable for positioning the box body (2) on the frame (1), and the box body (2) is detachably connected to the second positioning structure.

6. The silicon wafer transport device according to claim 5, characterized in that: The second positioning structure comprises: At least two second positioning columns (6) are provided and fixedly connected to the vehicle frame (1); a second positioning groove (7) is provided on the side wall of the second positioning column (6); and two opposite corner side walls of the box body (2) respectively abut against the groove walls of the second positioning groove (7) on the two second positioning columns (6).

7. The silicon wafer transport device according to claim 1, characterized in that: The degumming rack (3) is connected with a hook (8), and the hook (8) is suitable for being grasped by a robot.

8. The silicon wafer transport device according to claim 1, characterized in that: The box body (2) is provided with a liquid outlet (9) suitable for the liquid to flow out.

9. The silicon wafer transport device according to claim 1, characterized in that: The debonding frame (3) is provided with a buffer pad, and the buffer pad is suitable for contacting the side of the silicon wafer.

10. A silicon wafer production line, characterized in that: It comprises a silicon wafer cutting device and a silicon wafer degumming device, wherein a silicon wafer transfer device is arranged between the silicon wafer cutting device and the silicon wafer degumming device, and the silicon wafer transfer device is configured as the silicon wafer transfer device according to any one of claims 1-9.

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