Wafer automatic centering and notch detection mechanism

Abstract

The utility model discloses a wafer automatic centering and notch detection mechanism, which relates to the technical field of semiconductor wafers, and comprises a fixing assembly, which comprises a cover plate provided with at least three straight slotted holes; the centering assembly comprises a centering disc, a centering pin and a centering driving piece which are arranged below the cover plate in parallel, the centering disc is provided with track groove holes distributed corresponding to the straight groove holes, the bottom of the centering pin is arranged in the track groove holes in a sliding mode, and the top of the centering pin is inserted into the straight groove holes. The centering pin reciprocates along the track slotted hole under the guiding action of the straight slotted hole; the rotating assembly comprises a carrying table, a hollow shaft and a rotating driving piece, the top of the hollow shaft is communicated with the carrying table, and when the centering pin moves to the innermost end of the straight slotted hole, the centering pin is in contact with the periphery of the wafer; and the gap detection assembly is movably arranged on the cover plate, and the gap detection assembly is used for detecting the gap of the wafer. The device can complete centering operation and notch detection operation of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, and more specifically to an automatic wafer centering and notch detection mechanism. Background Art

[0002] At present, wafer thinning is a crucial part of the wafer packaging process. During the wafer thinning process, the center of the wafer needs to be determined in order to control the wafer's TTV (total thickness variation) and reduce the fragmentation rate during the wafer grinding process. Secondly, the consistency of the wafer gap needs to be ensured to facilitate subsequent processes.

[0003] In the prior art, usually one set of equipment can only perform wafer centering operations, but cannot perform wafer notch detection. Or one set of equipment can only perform wafer notch detection, but cannot perform wafer centering operations. If it is necessary to perform wafer centering operations and notch detection operations, two sets of equipment are usually required to cooperate in the operation, resulting in a large space occupied by the equipment and low efficiency. Moreover, most common wafer centering devices use two arc-shaped or two V-shaped centering blocks to center the wafer, which is not well suited for flat wafers. During the centering operation, the wafer centering operation may not be completed, and the wafer may even be damaged.

[0004] In summary, how to complete the wafer centering operation and notch detection operation on a set of equipment and avoid damage to the wafer during the centering process is a problem that needs to be urgently solved by technical personnel in this field. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a wafer automatic centering and notch detection mechanism, which can complete the wafer centering operation and notch detection operation on a set of devices and avoid damage to the wafer during the centering process.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A wafer automatic centering and notch detection mechanism, comprising:

[0008] A fixing assembly, comprising at least two pillars and a cover plate disposed at the upper end of each of the pillars, wherein the cover plate is evenly provided with at least three straight slot holes along the circumference of the center thereof, and each of the straight slot holes is distributed toward the center of the cover plate;

[0009] A centering assembly, comprising a centering disk arranged parallel to the bottom of the cover plate, a centering pin, and a centering drive connected to the centering disk, wherein the centering disk is provided with track slot holes corresponding to the straight slot holes, the bottom of the centering pin is slidably arranged in the track slot holes, the top of the centering pin is inserted into the straight slot holes, and when the centering disk rotates, the centering pin reciprocates along the track slot holes under the guiding action of the straight slot holes;

[0010] A rotating assembly, comprising a carrier for carrying a wafer, a hollow shaft, and a rotating driving member connected to the hollow shaft, wherein the hollow shaft is passed through the center of the centering disk and the cover plate, the top of the hollow shaft is connected to the carrier, the bottom of the hollow shaft is used to selectively connect with a vacuum pump, and when the centering pin moves to the innermost end of the straight slot hole, it contacts the outer periphery of the wafer;

[0011] A notch detection component is movably arranged on the cover plate, and the notch detection component is used to detect the notch of the wafer.

[0012] In one embodiment, the device further comprises a driving motor, wherein the upper portion of the motor shaft of the driving motor is sleeved with a first driving gear, and the lower portion of the motor shaft is sleeved with a second driving gear;

[0013] The centering drive member includes a first driven gear meshing with the first driving gear, and the first driven gear is arranged at the bottom of the centering plate; the rotating drive member includes a second driven gear meshing with the second driving gear, and the second driven gear is sleeved on the lower part of the hollow shaft.

[0014] In one embodiment, the first driving gear and the second driving gear are both provided with teeth on a semicircle, and the teeth of the two gears are arranged relatively to each other; the teeth of the second driving gear and the second driven gear are matched to each other, so that when the second driving gear rotates half a circle, the second driven gear is driven to rotate one circle;

[0015] The teeth of the first driving gear and the first driven gear are matched so that when the first driving gear rotates half a circle, the first driven gear is driven to rotate a preset angle, so that the centering pin reciprocates once in the straight slot hole, wherein the preset angle is 360° / n, and n is the total number of the centering pins.

[0016] In one embodiment, the centering plate has three centering pins evenly distributed along the circumference, the track slot hole includes an arc-shaped slot, and three sections of the arc-shaped slots are connected in sequence to form a triangular structure;

[0017] The centering plate has four centering pins evenly distributed along the circumference, the track slot hole includes an arc-shaped slot, and four sections of the arc-shaped slots are connected in sequence to form a four-corner structure;

[0018] The centering disk is evenly distributed with 6 centering pins along the circumferential direction, the track slot hole comprises an arc-shaped slot, and the six arc-shaped slots are connected in sequence to form a hexagonal structure.

[0019] In one embodiment, the notch detection assembly includes a rotating cylinder, a connecting rod, a driving swing arm arranged parallel to the carrier, and a sensor arranged on the driving swing arm, wherein the connecting rod is used to vertically connect the rotating end of the rotating cylinder and the driving swing arm, and the sensor is used to detect the notch of the wafer.

[0020] In one embodiment, the centering drive member includes a first motor, a first driving gear sleeved on an output shaft of the first motor, and a first driven gear meshed with the first driving gear, wherein the first driven gear is disposed at the bottom of the centering disk;

[0021] The rotary drive member comprises a second motor, a second driving gear sleeved on the output shaft of the second motor, and a second driven gear meshing with the second driving gear, wherein the second driven gear is sleeved on the hollow shaft;

[0022] The first motor and the second motor are respectively located on two sides of the hollow shaft.

[0023] In one embodiment, the track slots are distributed in sequence, and there is a spacing between adjacent track slots, and the distance from the center line of the track slot to the center of the centering disk gradually increases in a clockwise or counterclockwise direction.

[0024] In one embodiment, the cover plate is provided with a detection groove, and the notch detection assembly includes a telescopic cylinder, a sensor for detecting whether there is a wafer on the carrier, and a signal amplifier, the telescopic cylinder is arranged under the cover plate, the sensor and the signal amplifier are both arranged on the telescopic end of the telescopic cylinder, and the sensor and the signal amplifier are connected.

[0025] In one embodiment, a detection device for detecting whether the wafer is placed on the carrier is further included, and the detection device is arranged on the cover plate.

[0026] In one embodiment, an adjusting nut is provided at the lower end of the support column, and a leveling member for leveling the carrier is provided on the cover plate.

[0027] When using the wafer automatic centering and notch detection mechanism provided by the utility model, first, the wafer can be placed on the carrier. Since the top of the hollow shaft is connected to the carrier, the bottom of the hollow shaft is connected to the vacuum pumping device, and the hollow shaft is vacuumed, so that the wafer can be adsorbed on the carrier. Then, the centering drive can be controlled to operate, and the centering drive can drive the centering disk to rotate. When the centering disk rotates, the centering pin can move back and forth along the track slot under the guidance of the straight slot hole. Similarly, the centering pin can move back and forth in the straight slot hole. Because the center of the cover plate, the center of the centering disk, the center of the hollow shaft and the center of the carrier are consistent, and multiple centering pins are evenly distributed with the center of the cover plate as the center of the circle. By controlling the centering pin to move along the straight slot hole, the centering pin moves to the innermost end of the straight slot hole and contacts the outer periphery of the wafer. When multiple centering pins approach the wafer synchronously, the non-centrally distributed wafer can be pushed to the center to complete the centering operation of the wafer (so that the wafer and the carrier are concentrically distributed), which is conducive to ensuring the accuracy of the subsequent notch detection operation. The wafer and the centering pin are in point contact and will not cause damage to the wafer. After the centering operation is completed, the centering drive can be controlled to stop running.

[0028] After that, the notch detection component can be controlled to move to a position in contact with the outer periphery of the wafer, and the rotation drive can be controlled to operate. The rotation drive can drive the hollow shaft and the stage to rotate synchronously. In the process of the stage driving the wafer to rotate, the notch detection component can detect the notch on the entire circumference of the wafer. If a notch is encountered, the controller can be fed back with relevant information about the notch to complete the notch detection operation of the wafer. Finally, the rotation drive is controlled to stop running, and the notch detection component is controlled to reset, so as to facilitate the centering and notch detection operations on the next wafer.

[0029] In summary, the wafer automatic centering and notch detection mechanism provided by the present invention can complete the wafer centering operation and notch detection operation on a set of devices, and avoid damage to the wafer during the centering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0031] Figure 1 A cross-sectional view of a first embodiment of the wafer automatic centering and notch detection mechanism provided by the utility model;

[0032] Figure 2 A top view of a first embodiment of a wafer automatic centering and notch detection mechanism;

[0033] Figure 3 A top view of the first embodiment of the wafer automatic centering and notch detection mechanism with the cover plate hidden;

[0034] Figure 4 is a schematic diagram of the structure of the drive motor;

[0035] Figure 5 It is a structural schematic diagram of a second embodiment of a wafer automatic centering and notch detection mechanism;

[0036] Figure 6 It is a structural schematic diagram of the second embodiment of the wafer automatic centering and notch detection mechanism from another viewing angle;

[0037] Figure 7 It is a schematic diagram of the first structure of the track slot;

[0038] Figure 8 is a schematic diagram of the second structure of the track slot;

[0039] Fig. 9 It is a schematic diagram of the third structure of the track slot;

[0040] Fig.10 Schematic diagram of the fourth structure of the track slot.

[0041] Reference numerals:

[0042] 1-fixing assembly; 11-pillar; 12-cover plate; 13-straight slot hole; 14-adjusting nut;

[0043] 2-centering assembly; 21-centering plate; 22-centering pin; 23-centering driving member; 231-first driven gear; 24-track slot;

[0044] 3-notch detection component; 31-signal amplifier; 32-connecting rod; 33-swing arm; 34-rotating cylinder; 35-sensor; 36-telescopic cylinder;

[0045] 4-rotating assembly; 41-carrier; 42-hollow shaft; 421-rotating joint; 43-rotating driving member; 431-second driven gear;

[0046] 5-driving motor; 51-motor shaft; 6-first driving gear; 7-second driving gear; 8-first motor; 9-second motor; 10-detection device. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0048] The core of the utility model is to provide a wafer automatic centering and notch detection mechanism, which can complete the wafer centering operation and notch detection operation on a set of devices and avoid damage to the wafer during the centering process.

[0049] Please refer to Figures 1 to 10 .

[0050] This specific embodiment provides a wafer automatic centering and notch detection mechanism, including:

[0051] A fixing assembly 1, comprising at least two pillars 11 and a cover plate 12 disposed at the upper end of each pillar 11, wherein the cover plate 12 is evenly provided with at least three straight slot holes 13 along the circumference of the center thereof, and each straight slot hole 13 is distributed toward the center of the cover plate 12;

[0052] The centering assembly 2 comprises a centering plate 21 arranged parallel to the bottom of the cover plate 12, a centering pin 22 and a centering driving member 23 connected to the centering plate 21. The centering plate 21 is provided with track slots 24 corresponding to the straight slots 13. The bottom of the centering pin 22 is slidably arranged in the track slots 24. The top of the centering pin 22 is inserted into the straight slots 13. When the centering plate 21 rotates, the centering pin 22 reciprocates along the track slots 24 under the guidance of the straight slots 13.

[0053] The rotating assembly 4 includes a carrier 41 for carrying the wafer, a hollow shaft 42, and a rotating driving member 43 connected to the hollow shaft 42. The hollow shaft 42 is passed through the center of the centering disk 21 and the cover plate 12. The top of the hollow shaft 42 is connected to the carrier 41. The bottom of the hollow shaft 42 is used for selective connection with the vacuum device. When the centering pin 22 moves to the innermost end of the straight slot hole 13, it contacts the outer periphery of the wafer.

[0054] The notch detection component 3 is movably disposed on the cover plate 12 and is used to detect the notch of the wafer.

[0055] It should be noted that the centering drive 23, the rotating drive 43 and the notch detection assembly 3 can all be connected to the control device to enable the device to achieve automatic control. Moreover, the common wafer diameter is 200-300 mm, and the diameter of the carrier 41 can usually be set to 100 mm. Therefore, when the wafer is placed on the carrier 41, the center of the wafer and the center of the carrier 41 may not coincide. At this time, the centering assembly 2 can be controlled to operate so that the centering pin 22 moves inward to push the wafer, and the position of the wafer is adjusted so that the wafer and the carrier 41 are concentrically arranged.

[0056] It should also be noted that the hollow shaft 42 can be connected to the cover plate 12 through a bearing and a bearing seat, so that the hollow shaft 42 can rotate relative to the cover plate 12, and a channel is processed in the center of the hollow shaft 42, so that the inside of the hollow shaft 42 is hollow. The carrier 41 can be set to a circular shape, and a flow channel is processed on the upper surface of the carrier 41, and the flow channel is connected to the channel of the hollow shaft 42. In addition, a rotary joint 421 can be set at the bottom of the hollow shaft 42, and the rotary joint 421 is connected to the vacuum device to avoid the frequent rotation of the hollow shaft 42 from twisting the air pipe of the vacuum device, so as to provide vacuum and compressed air for fixing or releasing the wafer, that is, the wafer can be fixed during the vacuum operation, and the wafer can be released after the vacuum operation is stopped.

[0057] During actual use, the shape, structure, size, material, position, etc. of the fixing component 1, the centering component 2, the rotating component 4 and the notch detection component 3 can be determined according to actual conditions and actual needs.

[0058] In one embodiment, Figure 1 As shown, it also includes a driving motor 5, the upper part of the motor shaft 51 of the driving motor 5 is sleeved with a first driving gear 6, and the lower part of the motor shaft 51 is sleeved with a second driving gear 7; the centering driving member 23 includes a first driven gear 231 meshing with the first driving gear 6, and the first driven gear 231 is arranged at the bottom of the centering disk 21; the rotating driving member 43 includes a second driven gear 431 meshing with the second driving gear 7, and the second driven gear 431 is sleeved at the lower part of the hollow shaft 42. That is, one driving motor 5 can be used to drive the centering driving member 23 and the rotating driving member 43 to operate, so that the device structure is more compact, and the problem that the wafer centering mechanism and the wafer notch detection mechanism in the prior art must rely on two motors to be realized can be solved.

[0059] In one embodiment, the first driving gear 6 and the second driving gear 7 are both provided with teeth on a semicircle, and the teeth of the two are relatively distributed; the teeth of the second driving gear 7 and the second driven gear 431 are matched so that when the second driving gear 7 rotates half a circle, the second driven gear 431 is driven to rotate one circle; the teeth of the first driving gear 6 and the first driven gear 231 are matched so that when the first driving gear 6 rotates half a circle, the first driven gear 231 is driven to rotate a preset angle, so that the centering pin 22 reciprocates once in the straight slot hole 13, wherein the preset angle is 360° / n, and n is the total number of the centering pins 22.

[0060] In one embodiment, the centering disk 21 has three centering pins 22 evenly distributed along the circumference, the trajectory slot 24 includes an arc-shaped slot, and the three arc-shaped slots are connected in sequence to form a triangular structure; the centering disk 21 has four centering pins 22 evenly distributed along the circumference, the trajectory slot 24 includes an arc-shaped slot, and the four arc-shaped slots are connected in sequence to form a quadrangular structure; the centering disk 21 has six centering pins 22 evenly distributed along the circumference, the trajectory slot 24 includes an arc-shaped slot, and the six arc-shaped slots are connected in sequence to form a hexagonal structure.

[0061] It should be noted that, the centering plate 21 is evenly distributed with 6 centering pins 22 along the circumferential direction, the track slot 24 includes an arc slot, and the six arc slots are connected in sequence to form a hexagonal structure. Figure 3 The teeth of the first driving gear 6, the first driven gear 231, the second driving gear 7 and the second driven gear 431 are arranged so that when the second driving gear 7 rotates half a circle, the second driven gear 431 can be driven to rotate one circle; when the first driving gear 6 (i.e. the semicircle with teeth and the second driven gear 431 rotate in coordination) rotates half a circle, the first driven gear 231 can be driven to rotate 60°.

[0062] During use, the driving motor 5 can be controlled to run, the driving motor 5 drives the first driving gear 6 to rotate, the first driving gear 6 can drive the first driven gear 231 to rotate, the first driven gear 231 drives the centering plate 21 to rotate, and six arc tracks (such as Figure 3 ), the centering pin 22 moves along the arc track; because the centering pin 22 can only move along the straight slot hole 13 of the cover plate 12 (such as Figure 2) moves, and finally the motion trajectory of the centering pin 22 is a periodic reciprocating motion along the straight slot hole 13 of the cover plate 12. By setting the tooth parameters of the first driving gear 6 and the first driven gear 231, the first driving gear 6 rotates half a circle (that is, the semicircle of the first driving gear 6 with teeth and the second driven gear 431 rotate in coordination), and the first driven gear 231 rotates exactly 60°, so that the centering pin 22 performs a reciprocating motion in the straight slot hole 13; when the first driving gear 6 rotates the remaining half circle, the first driven gear 231 contacts the semicircle without teeth and therefore remains stationary. This process can rely on the centering pin 22 to shrink toward the center to achieve the centering operation of the wafer.

[0063] After the wafer centering operation is completed, the hollow shaft 42 is connected to the vacuum pump to start the vacuum so that the wafer is adsorbed on the carrier 41. The driving motor 5 drives the half circle with teeth of the second driving gear 7 to rotate to a position where it is meshed and contacted with the second driven gear 431, and then the second driving gear 7 drives the second driven gear 431 to rotate, the second driven gear 431 drives the hollow shaft 42 and the carrier 41 to rotate, and the carrier 41 drives the wafer to rotate. By setting the parameters of the second driving gear 7 and the second driven gear 431, the second driving gear 7 rotates half a circle (that is, the half circle with teeth and the second driven gear 431 rotate in coordination), and the second driven gear 431 rotates exactly one circle; when the second driving gear 7 rotates the remaining half circle (that is, the half circle without teeth contacts the second driven gear 431), the second driven gear 431 is stationary, thereby realizing the intermittent motion of the second driven gear 431. This arrangement can make the device structure very compact, and only one drive motor 5 is needed to realize the wafer centering operation and the notch detection operation, and the above operations are performed sequentially without interfering with each other.

[0064] In one embodiment, the notch detection assembly 3 includes a rotary cylinder 34, a connecting rod 32, a driving swing arm 33 arranged parallel to the top of the carrier 41, and a sensor 35 arranged on the driving swing arm 33. The connecting rod 32 is used to vertically connect the rotating end of the rotary cylinder 34 to drive the swing arm 33, and the sensor 35 is used to detect the notch of the wafer. When the notch detection operation of the wafer needs to be performed, the rotary cylinder 34 can be controlled to rotate to drive the swing arm 33 to swing and move the sensor 35 to the detection position (i.e., the edge of the wafer). After the notch detection of the wafer is completed, the rotary cylinder 34 is controlled to rotate in the opposite direction to reset.

[0065] In order to further illustrate the above embodiment device ( Figures 1 to 3 The centering operation and notch detection operation of the device shown in the figure are described below with examples.

[0066] First, the detection device 10 can be used to detect whether there is a wafer on the carrier 41, and if so, a centering operation is performed. For example, the drive motor 5 can be controlled to rotate 90° so that each centering pin 22 moves toward the direction close to the center; when the drive motor 5 continues to rotate 90°, the centering pin 22 moves away from the center, and at the same time, the rotary cylinder 34 can be controlled to operate to drive the sensor 35 to swing to the detection position; then, the drive motor 5 is controlled to continue to rotate 180°, at which time the second driven gear 431 rotates one circle (the centering pin 22 is stationary at this time), driving the wafer to rotate one circle, so that the sensor 35 can be used to detect and locate the notch of the wafer.

[0067] Among them, by setting the relative angle between the second driving gear 7 and the first driving gear 6, the driving motor 5 drives the second driving gear 7 and the first driving gear 6 to rotate one circle. In the first half of the circle, only the first driving gear 6 drives the first driven gear 231 to perform the centering action, and the second driven gear 431 is stationary; in the second half of the circle, only the second driving gear 7 drives the second driven gear 431 to rotate and perform the notch detection operation, and the first driven gear 231 is stationary at this time.

[0068] In one embodiment, Figure 6 As shown, the centering drive member 23 includes a first motor 8, a first driving gear 6 sleeved on the output shaft of the first motor 8, and a first driven gear 231 meshing with the first driving gear 6, and the first driven gear 231 is arranged at the bottom of the centering disk 21; the rotating drive member 43 includes a second motor 9, a second driving gear 7 sleeved on the output shaft of the second motor 9, and a second driven gear 431 meshing with the second driving gear 7, and the second driven gear 431 is sleeved on the hollow shaft 42; the first motor 8 and the second motor 9 are respectively located on both sides of the hollow shaft 42.

[0069] That is, two motors can be used to perform the centering operation and the notch detection operation respectively, and the structure set in this way is also relatively compact and does not need to occupy a large space. Among them, the above-mentioned various motors are preferably stepper motors or servo motors. Of course, the type of motor can also be determined according to actual conditions and actual needs during actual use.

[0070] In one embodiment, each track slot 24 is distributed in sequence, and there is a spacing between adjacent track slots 24, and the distance from the center line of the track slot 24 to the center of the centering plate 21 in the clockwise or counterclockwise direction gradually increases, so that the centering pin 22 can be simultaneously retracted or simultaneously opened relative to the center of the carrier 41 to perform a centering operation on the wafer, so that the wafer and the carrier 41 are concentrically distributed. Among them, each track slot 24 can be set as a linear structure, such as Fig. 9 and Fig.10 As shown, it can also be set as a vortex line structure, such as Figure 7 and Figure 8 Of course, the track slot 24 can also be set to other shapes, but it is necessary to ensure that the centering pin 22 can achieve the centering effect on the wafer.

[0071] In one embodiment, Figure 5 As shown, the cover plate 12 is provided with a detection groove, and the notch detection component 3 includes a telescopic cylinder 36, a sensor 35 for detecting whether there is a wafer on the carrier 41, and a signal amplifier 31. The telescopic cylinder 36 is arranged below the cover plate 12, and the sensor 35 and the signal amplifier 31 are both arranged on the telescopic end of the telescopic cylinder 36, and the sensor 35 and the signal amplifier 31 are connected.

[0072] Therefore, when it is necessary to perform a notch detection operation on the wafer, the telescopic cylinder 36 can be controlled to operate so that the sensor 35 moves horizontally along the detection groove to the detection position (i.e., the periphery of the wafer), and then the wafer is controlled to rotate, and the sensor 35 is used to effectively detect the notch in the circumference of the wafer, and the signal amplifier 31 amplifies the detection signal of the sensor 35 and transmits it to the signal processor of the control device for analysis and processing. When the notch detection operation is completed, the telescopic cylinder 36 can be controlled to operate in the reverse direction so that the telescopic end of the telescopic cylinder 36 moves in the reverse direction, driving the sensor 35 away from the wafer. In addition, in order to transmit the notch position signal to the control device.

[0073] To further illustrate the present embodiment ( Figure 5 and Figure 6 The following is an explanation of the method of using the centering operation and the notch detection operation of the device shown in the figure.

[0074] First, the wafer is placed on the carrier 41 by an external device. After the detection device 10 obtains a signal that a wafer is placed on the carrier 41, it can be transmitted to the control device. The control device controls the first motor 8 to operate to drive the centering disk 21 to rotate, and then drives multiple centering pins 22 to move toward the center of the carrier 41. When the centering pins 22 move to the preset position (contacting the outer periphery of the wafer), the first motor 8 is controlled to stop operating. After that, the hollow shaft 42 is connected to the vacuum device and the vacuum operation is performed to make the carrier 41 absorb the wafer, and then the first motor 8 is controlled to operate in the reverse direction, so that the centering disk 21 rotates in the reverse direction, and the centering pins 22 move outward to the initial position to complete the centering operation of the wafer.

[0075] Then, the telescopic cylinder 36 is controlled to drive the sensor 35 to move to the working position (i.e., the peripheral attachment of the wafer), and the second motor 9 is controlled to operate to drive the hollow shaft 42 to rotate, so that the stage 41 and the wafer rotate synchronously. When the notch does not turn to the sensor 35 position, the optical signal of the sensor 35 is in a blocked state; when the notch of the wafer turns to the sensor 35 position, the optical signal of the sensor 35 passes, and the first edge of the wafer notch is detected. At this time, the encoder records the current pulse number as m; when the wafer continues to rotate and the optical signal is blocked again, the second edge of the wafer notch is detected, and the encoder records the current pulse number w. By calculation, the pulse number (m+w) / 2 is the center position of the wafer notch.

[0076] In one embodiment, a detection device 10 for detecting whether a wafer is placed on the carrier 41 is also included, and the detection device 10 is arranged on the cover plate 12. Therefore, when the wafer is placed on the carrier 41, the detection device 10 can detect whether there is a wafer in time, and feed back a signal to the control device, and the control device can control other components to cooperate to perform centering operations and notch detection operations on the wafer.

[0077] In one embodiment, an adjusting nut 14 is provided at the lower end of the pillar 11, and a leveling member for leveling the carrier 41 is provided on the cover plate 12. The upper end of the pillar 11 is connected to the cover plate 12, and the lower end of the pillar 11 is connected to the frame. At the same time, the adjusting nut 14 at the lower end of the pillar 11 can not only play a fixing role, but also be used to adjust the horizontality of the cover plate 12; and a leveling member is provided on the cover plate 12, through which the leveling member can ensure that the carrier 41 for carrying the wafer is level, so as to avoid the wafer from tilting and uneven and affecting subsequent operations.

[0078] It should be noted that the first driving gear 6 and the first driven gear 231, the second driving gear 7 and the second driven gear 431, the first motor 8 and the second motor 9 mentioned in the present invention, where the first and the second are only to distinguish the different positions, and there is no order of precedence.

[0079] In addition, it should be noted that the orientation or position relationship indicated by "upper" and "lower" etc. in the present invention is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of simplifying the description and facilitating understanding, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0080] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other. Any combination of all embodiments provided by the utility model is within the protection scope of this utility model and will not be described in detail here.

[0081] The above is a detailed introduction to the wafer automatic centering and notch detection mechanism provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A wafer automatic centering and notch detection mechanism, characterized in that: include: A fixing assembly (1), comprising at least two pillars (11) and a cover plate (12) arranged at the upper end of each of the pillars (11), wherein the cover plate (12) is evenly provided with at least three straight slot holes (13) along the circumference of the center thereof, and each of the straight slot holes (13) is distributed toward the center of the cover plate (12); A centering assembly (2), comprising a centering disk (21) arranged parallel to the bottom of the cover plate (12), a centering pin (22), and a centering drive member (23) connected to the centering disk (21), wherein the centering disk (21) is provided with track slot holes (24) distributed corresponding to the straight slot holes (13), the bottom of the centering pin (22) is slidably arranged in the track slot holes (24), the top of the centering pin (22) is inserted into the straight slot holes (13), and when the centering disk (21) rotates, the centering pin (22) reciprocates along the track slot holes (24) under the guidance of the straight slot holes (13); A rotating assembly (4), comprising a carrier (41) for carrying a wafer, a hollow shaft (42), and a rotating drive member (43) connected to the hollow shaft (42), wherein the hollow shaft (42) is inserted through the center of the centering disk (21) and the cover plate (12), the top of the hollow shaft (42) is connected to the carrier (41), and the bottom of the hollow shaft (42) is used for selective connection with a vacuum pumping device, and when the centering pin (22) moves to the innermost end of the straight slot hole (13), it contacts the outer periphery of the wafer; A notch detection component (3) is movably disposed on the cover plate (12), and the notch detection component (3) is used to detect a notch in the wafer.

2. The wafer automatic centering and notch detection mechanism according to claim 1, characterized in that: It also comprises a driving motor (5), wherein the upper part of the motor shaft (51) of the driving motor (5) is sleeved with a first driving gear (6), and the lower part of the motor shaft (51) is sleeved with a second driving gear (7); The centering drive member (23) comprises a first driven gear (231) meshing with the first driving gear (6), the first driven gear (231) being arranged at the bottom of the centering plate (21); the rotating drive member (43) comprises a second driven gear (431) meshing with the second driving gear (7), the second driven gear (431) being sleeved on the lower part of the hollow shaft (42).

3. The wafer automatic centering and notch detection mechanism according to claim 2, characterized in that: The first driving gear (6) and the second driving gear (7) are both provided with teeth on a semicircle, and the teeth of the two gears are arranged relative to each other; the teeth of the second driving gear (7) and the second driven gear (431) are arranged to cooperate with each other, so that when the second driving gear (7) rotates half a circle, it drives the second driven gear (431) to rotate one circle; The teeth of the first driving gear (6) and the first driven gear (231) are arranged to cooperate so that when the first driving gear (6) rotates half a circle, the first driven gear (231) is driven to rotate by a preset angle, so that the centering pin (22) reciprocates once in the straight slot hole (13), wherein the preset angle is 360° / n, and n is the total number of the centering pins (22).

4. The wafer automatic centering and notch detection mechanism according to claim 3, characterized in that: The centering disk (21) has three centering pins (22) evenly distributed along the circumferential direction, the track slot hole (24) comprises an arc-shaped slot, and three sections of the arc-shaped slots are connected in sequence to form a triangular structure; The centering disk (21) has four centering pins (22) evenly distributed along the circumferential direction, the track slot hole (24) comprises an arc-shaped slot, and four sections of the arc-shaped slots are connected in sequence to form a four-corner structure; The centering disk (21) has six centering pins (22) evenly distributed along the circumferential direction, and the track slot hole (24) comprises an arc-shaped slot, and six sections of the arc-shaped slots are connected in sequence to form a hexagonal structure.

5. The wafer automatic centering and notch detection mechanism according to claim 4, characterized in that: The notch detection component (3) comprises a rotating cylinder (34), a connecting rod (32), a driving swing arm (33) arranged parallel to the top of the carrier (41), and a sensor (35) arranged on the driving swing arm (33), wherein the connecting rod (32) is used to vertically connect the rotating end of the rotating cylinder (34) and the driving swing arm (33), and the sensor (35) is used to detect the notch of the wafer.

6. The wafer automatic centering and notch detection mechanism according to claim 1, characterized in that: The centering drive member (23) comprises a first motor (8), a first driving gear (6) sleeved on an output shaft of the first motor (8), and a first driven gear (231) meshing with the first driving gear (6), wherein the first driven gear (231) is arranged at the bottom of the centering plate (21); The rotary drive member (43) comprises a second motor (9), a second driving gear (7) sleeved on an output shaft of the second motor (9), and a second driven gear (431) meshing with the second driving gear (7), wherein the second driven gear (431) is sleeved on the hollow shaft (42); The first motor (8) and the second motor (9) are respectively located on two sides of the hollow shaft (42).

7. The wafer automatic centering and notch detection mechanism according to claim 6, characterized in that: The track slot holes (24) are distributed in sequence, and a spacing is provided between adjacent track slot holes (24), and the distance from the center line of the track slot hole (24) to the center of the centering disk (21) gradually increases in a clockwise or counterclockwise direction.

8. The wafer automatic centering and notch detection mechanism according to claim 7, characterized in that: The cover plate (12) is provided with a detection slot, and the notch detection component (3) comprises a telescopic cylinder (36), a sensor (35) for detecting whether there is a wafer on the carrier (41), and a signal amplifier (31), wherein the telescopic cylinder (36) is arranged below the cover plate (12), the sensor (35) and the signal amplifier (31) are both arranged on the telescopic end of the telescopic cylinder (36), and the sensor (35) and the signal amplifier (31) are connected.

9. The wafer automatic centering and notch detection mechanism according to any one of claims 1 to 8, characterized in that: It also comprises a detection device (10) for detecting whether the wafer is placed on the carrier (41), and the detection device (10) is arranged on the cover plate (12).

10. The wafer automatic centering and notch detection mechanism according to any one of claims 1 to 8, characterized in that: An adjusting nut (14) is provided at the lower end of the support column (11), and a leveling member for leveling the carrier (41) is provided on the cover plate (12).

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