Integrated circuit lead frame facilitating chip installation

Abstract

The utility model relates to the technical field of lead frames, and discloses an integrated circuit lead frame convenient for chip installation, which comprises a base, a cover plate is hinged on the side wall of the base, a groove is arranged on the surface of the base, an installation assembly is arranged in the groove, the installation assembly comprises a sleeve, and the sleeve is sleeved on the cover plate. The sleeve is fixedly connected to the inner wall of the groove, a base plate is slidably connected to the interior of the sleeve, the base plate is elastically connected to the bottom face of the groove through a reset spring, a supporting rod is connected to the surface of the base plate, and a base plate is fixedly connected to the top end of the supporting rod. According to the utility model, the positioning plate and the limiting block are connected together through the connecting rod, the reset spring enables the positioning plate to rapidly return to the original position and limits the chip on the surface of the substrate, and the reset spring has stretching and compressing conditions, so that the position of the limiting block can adapt to chips with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to an integrated circuit lead frame which is convenient for installing chips. Background Art

[0002] Lead frame is the chip carrier of integrated circuit. It is a key structural component that uses composite materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frame is required in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

[0003] In the conventional technology, when a lead frame is used to install a chip, due to the diversity of chip sizes and structures, the lead frame cannot flexibly adapt to different types of chips, resulting in difficulties in the chip installation process. Therefore, an integrated circuit lead frame that is convenient for installing chips is proposed to solve the above problem. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides an integrated circuit lead frame that is easy to install chips, aiming to improve the problem in the prior art that due to the diversity of chip sizes and structures, the lead frame cannot flexibly adapt to different types of chips, resulting in difficulties in the chip installation process.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit lead frame that is convenient for installing chips, comprising a base, a cover plate hinged on the side wall of the base, a groove formed on the surface of the base, an installation component arranged inside the groove, the installation component comprising a sleeve, the sleeve being fixedly connected to the inner wall of the groove, a pad being slidably connected inside the sleeve, the pad being elastically connected to the bottom surface of the groove by a reset spring, a support rod being connected on the surface of the pad, and a substrate being fixedly connected to the top end of the support rod.

[0006] As a further description of the above technical solution:

[0007] The side wall of the sleeve is fixedly connected with four groups of limiting grooves distributed in an array, the limiting grooves are slidably connected with limiting blocks, and the limiting blocks are fixedly connected to the outer wall of the pad.

[0008] As a further description of the above technical solution:

[0009] The surface of the base plate is provided with four groups of symmetrically arranged mounting grooves, the interior of the mounting grooves is slidably connected with a positioning plate, and the side wall of the positioning plate is fixedly connected with a protrusion.

[0010] As a further description of the above technical solution:

[0011] A guide rod is fixedly connected between the inner walls of the installation groove, and the guide rod penetrates and is slidably connected to the side wall of the positioning plate.

[0012] As a further description of the above technical solution:

[0013] A connecting rod is hinged on the bottom surface of the positioning plate, and one end of the connecting rod away from the positioning plate is hinged to the limiting block.

[0014] As a further description of the above technical solution:

[0015] A plurality of heat dissipation slots distributed in an array are arranged on the surface of the cover plate.

[0016] The side walls of the base and the cover plate are both provided with through grooves and notches.

[0017] As a further description of the above technical solution:

[0018] A magnet is fixedly connected inside one group of the gaps, and an iron block is fixedly connected inside another group of the gaps, and the positions of the magnet and the iron block correspond.

[0019] The utility model has the following beneficial effects:

[0020] 1. In the utility model, the positioning plate and the limit block are connected together by a connecting rod. The movement of the limit block drives the positioning plate to move. The reset spring allows the positioning plate to quickly return to its original position, limiting the chip on the surface of the substrate. The reset spring has the conditions of tension and compression, so that the position of the positioning plate and the limit block can adapt to chips of different sizes.

[0021] 2. In the utility model, the cover plate can be easily opened and closed through the magnetic connection between the iron block and the magnet, thereby improving the convenience of chip installation, and the heat dissipation groove and the through groove cooperate with each other to improve the heat dissipation efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional schematic diagram of an integrated circuit lead frame for easy chip installation proposed by the utility model;

[0023] Figure 2 This is a schematic diagram of the overall disassembly structure of an integrated circuit lead frame that is convenient for installing a chip, as proposed by the utility model;

[0024] Figure 3 The utility model provides a schematic structural diagram of the disassembly of an installation component of an integrated circuit lead frame for facilitating chip installation.

[0025] Legend:

[0026] 1. Base; 2. Cover plate; 3. Groove; 4. Mounting assembly; 41. Sleeve; 42. Support rod; 43. Pad; 44. Limiting groove; 45. Limiting block; 46. Reset spring; 47. Base plate; 48. Mounting groove; 49. Positioning plate; 410. Bump; 411. Guide rod; 412. Connecting rod; 5. Through groove; 6. Notch; 61. Magnet; 62. Iron block; 7. Heat dissipation groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-3 The utility model provides an embodiment: an integrated circuit lead frame for easy installation of chips, including a base 1, the base 1 provides basic support and stability for the overall frame, the side wall of the base 1 is hinged with a cover plate 2, the cover plate 2 constitutes the upper covering part of the frame, and the hinged form makes the cover plate 2 more convenient to open. A groove 3 is provided on the surface of the base 1, the groove 3 provides a space for accommodating the internal components of the lead frame, and a mounting assembly 4 is arranged inside the groove 3, and the mounting assembly 4 is used to provide fast installation of chips of different sizes. The mounting assembly 4 includes a sleeve 41, the sleeve 41 is fixedly connected to the inner wall of the groove 3, the sleeve 41 is slidably connected to a pad 43, the side wall of the sleeve 41 is fixedly connected to four groups of array-distributed limit grooves 44, the limit grooves 44 are slidably connected to limit blocks 45, the limit blocks 45 are fixedly connected to the outer wall of the pad 43, the limit grooves 44 and the limit blocks 45 cooperate with each other, so as to limit the pad 43 and enable the pad 43 to move up and down stably inside the sleeve 41. The pad 43 is elastically connected to the bottom surface of the groove 3 through a reset spring 46. The reset spring 46 is used to elastically support the pad 43 so that the pad 43 can be quickly reset after the position of the pad 43 changes. The surface of the pad 43 is connected to a support rod 42, and the top of the support rod 42 is fixedly connected to a base plate 47. The support rod 42 is used to support the base plate 47, and the base plate 47 is used to place the chip.

[0029] The surface of the substrate 47 is provided with four groups of symmetrically arranged mounting grooves 48, and a positioning plate 49 is slidably connected inside the mounting groove 48. The mounting groove 48 is used to provide a moving track for the positioning plate 49. A protrusion 410 is fixedly connected to the side wall of the positioning plate 49. The positioning plate 49 is used to clamp and fix the chip. The protrusion 410 is used to clamp the chip, thereby limiting the chip on the surface of the substrate 47. A guide rod 411 is fixedly connected between the inner walls of the mounting groove 48. The guide rod 411 penetrates and is slidably connected to the side wall of the positioning plate 49. The positioning plate 49 is guided by the guide rod 411, so that the positioning plate 49 is stable in the mounting groove. 48 moves, the bottom surface of the positioning plate 49 is hinged with a connecting rod 412, and the end of the connecting rod 412 away from the positioning plate 49 is hinged to the limit block 45, and the positioning plate 49 and the limit block 45 are connected together by the connecting rod 412, so that when the limit block 45 moves, the positioning plate 49 can be driven to move, and at the same time, the reset spring 46 provides elastic support for the positioning plate 49 and the limit block 45, so that the positioning plate 49 can quickly return to its original position and limit the chip on the surface of the substrate 47, and the reset spring 46 has the conditions of tension and compression, so that the position of the positioning plate 49 and the limit block 45 can be adjusted to adapt to chips of different sizes.

[0030] The side walls of the base 1 and the cover plate 2 are provided with through grooves 5 and notches 6. A magnet 61 is fixedly connected to the inside of one group of notches 6, and an iron block 62 is fixedly connected to the inside of the other group of notches 6. The through grooves 5 are convenient for observing the inside of the base 1. The positions of the magnet 61 and the iron block 62 correspond. The notches 6 are used to install the magnet 61 and the iron block 62. Through the magnetic connection between the iron block 62 and the magnet 61, the cover plate 2 can be easily opened and closed, thereby improving the convenience of chip installation. A plurality of groups of heat dissipation grooves 7 distributed in an array are provided on the surface of the cover plate 2. The heat dissipation grooves 7 cooperate with the through grooves 5 to improve the heat dissipation efficiency of the chip.

[0031] Working principle: Through the magnetic connection between the iron block 62 and the magnet 61, the cover 2 can be easily opened and closed. When the cover 2 is opened, the position of the positioning plate 49 is moved, and the positioning plate 49 is driven to move upward through the connecting rod 412. At the same time, the reset spring 46 is stretched to place the chip on the surface of the substrate 47. The reset spring 46 pulls the positioning plate 49 to return to its original position. The positioning plate 49 clamps and fixes the chip, and the bump 410 clamps the chip, restricting the chip to the surface of the substrate 47, thereby completing the installation of the chip.

[0032] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit lead frame for facilitating chip installation, comprising a base (1), characterized in that: A cover plate (2) is hingedly connected to the side wall of the base (1); a groove (3) is provided on the surface of the base (1); a mounting assembly (4) is arranged inside the groove (3); the mounting assembly (4) comprises a sleeve (41); the sleeve (41) is fixedly connected to the inner wall of the groove (3); a pad (43) is slidably connected inside the sleeve (41); the pad (43) is elastically connected to the bottom surface of the groove (3) via a return spring (46); a support rod (42) is connected to the surface of the pad (43); and a base plate (47) is fixedly connected to the top of the support rod (42).

2. The integrated circuit lead frame for facilitating chip installation according to claim 1, characterized in that: Four groups of array-distributed limiting grooves (44) are fixedly connected to the side wall of the sleeve (41), and the limiting grooves (44) are slidably connected to limiting blocks (45), and the limiting blocks (45) are fixedly connected to the outer wall of the pad (43).

3. The integrated circuit lead frame for facilitating chip installation according to claim 1, characterized in that: The surface of the base plate (47) is provided with four groups of symmetrically arranged mounting grooves (48), the interior of the mounting grooves (48) is slidably connected to a positioning plate (49), and a protrusion (410) is fixedly connected to the side wall of the positioning plate (49).

4. The integrated circuit lead frame for facilitating chip installation according to claim 3, characterized in that: A guide rod (411) is fixedly connected between the inner walls of the installation groove (48), and the guide rod (411) passes through and is slidably connected to the side wall of the positioning plate (49).

5. The integrated circuit lead frame for facilitating chip installation according to claim 3, characterized in that: A connecting rod (412) is hingedly connected to the bottom surface of the positioning plate (49), and one end of the connecting rod (412) away from the positioning plate (49) is hingedly connected to the limiting block (45).

6. The integrated circuit lead frame for facilitating chip installation according to claim 1, characterized in that: A plurality of groups of heat dissipation grooves (7) distributed in an array are provided on the surface of the cover plate (2).

7. The integrated circuit lead frame for facilitating chip installation according to claim 1, characterized in that: The side walls of the base (1) and the cover plate (2) are both provided with through grooves (5) and notches (6).

8. The integrated circuit lead frame for facilitating chip installation according to claim 7, characterized in that: A magnet (61) is fixedly connected inside one group of the notches (6), and an iron block (62) is fixedly connected inside another group of the notches (6), and the positions of the magnet (61) and the iron block (62) correspond to each other.

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