Spliced lead frame structure for integrated circuit

Abstract

The utility model relates to the field of integrated circuits, and discloses a spliced lead frame structure for an integrated circuit, which comprises a frame main body, pins arranged on the inner wall of the frame main body, a slide glass part arranged at the center of the frame, an insertion block fixedly connected with the side wall of the frame main body, and a slot arranged on the side wall of the frame main body, the outer walls of the inserting blocks are connected with the inner walls of the inserting grooves in an inserted mode, the inner walls of the inserting blocks are elastically connected with buckle assemblies through reset springs a, the buckle assemblies comprise clamping blocks, one ends of the reset springs a are fixedly connected with the bottom ends of the clamping blocks, the other ends of the reset springs a are fixedly connected with the inner walls of the inserting blocks, and clamping grooves are formed in the inner wall of the frame body. The top end of the clamping block makes contact with a pressing block, the top end of the buckle assembly makes contact with the bottom end of the pressing block, and the outer wall of the pressing block is slidably connected with the inner wall of the frame body. According to the utility model, the splicing between the frames is more convenient, and no extra dismounting tool is needed.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuits, in particular to a spliced ​​integrated circuit lead frame structure. Background Art

[0002] The spliced ​​integrated circuit lead frame structure is a common IC packaging structure, which is mainly used to connect the integrated circuit chip with external devices or circuit boards. During the integrated circuit manufacturing process, the circuit inside the chip needs to be connected to the external circuit, and the lead frame structure plays the role of connection and packaging.

[0003] The lead frame is usually made of metal materials, such as copper, aluminum, etc., and has certain conductivity and mechanical strength. The structure of the lead frame includes leads, pads and package. The leads connect the pins of the chip, the pads connect external devices or circuit boards, and the package is used to package and protect the chip.

[0004] At present, the splicing between the lead frame structures of spliced ​​integrated circuits is mostly fixed with screws and nuts, and disassembly and assembly require the use of additional disassembly tools, which is troublesome. Secondly, after the chip is loaded into the carrier, it may be damaged by impact or dust accumulation. There is no protective mechanism, which may affect the normal operation of the chip. Therefore, a spliced ​​integrated circuit lead frame structure is proposed to solve the above problems. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a spliced ​​integrated circuit lead frame structure, aiming to improve the problem in the prior art that splicing requires the aid of additional disassembly tools and the chip is not protected and easily damaged.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a spliced ​​integrated circuit lead frame structure, including a frame body, the inner wall of the frame body is provided with pins, the center of the frame is provided with a carrier part, the side wall of the frame body is fixedly connected with an insert block, the side wall of the frame body is provided with a slot, the inner wall of the insert block is elastically connected with a snap assembly through a reset spring a, and the top of the snap assembly is in contact with the bottom of the pressing block.

[0007] As a further description of the above technical solution:

[0008] The outer wall of the slide carrier is provided with a groove, the inner wall of the groove is detachably connected with a protective sleeve, the inner wall of the protective sleeve is elastically connected with a limiting bead through a reset spring b, and the inner wall of the groove is provided with a limiting groove.

[0009] As a further description of the above technical solution:

[0010] The buckle assembly includes a card block, one end of the return spring a is fixedly connected to the bottom end of the card block, the other end of the return spring a is fixedly connected to the inner wall of the plug block, a card slot is opened on the inner wall of the frame body, and the top of the card block contacts a pressing block.

[0011] As a further description of the above technical solution:

[0012] The outer wall of the plug block is plugged into the inner wall of the slot.

[0013] As a further description of the above technical solution:

[0014] The outer wall of the pressing block is slidably connected to the inner wall of the frame body.

[0015] As a further description of the above technical solution:

[0016] One end of the return spring b is fixedly connected to the inner wall of the protective sleeve, and the other end of the return spring b is fixedly connected to the back side of the limiting bead.

[0017] As a further description of the above technical solution:

[0018] The outer wall of the limiting bead is clamped with the inner wall of the limiting groove.

[0019] As a further description of the above technical solution:

[0020] The outer wall of the clamping block is clamped with the inner wall of the clamping slot.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, by setting a pressing block, an inserting block and a slot, when the frames are spliced ​​in pairs, the inserting block is aligned with the slot of another set of frames and inserted to fix the frames in pairs. When disassembly is required, the pressing block is pressed inward to press the card block out of the card slot to disassemble the frame. The disassembly and assembly is convenient and no additional disassembly tools are required.

[0023] 2. In the utility model, by setting a protective cover, when it is necessary to prevent the chip from accumulating dust or being impacted, the protective cover can be aligned with the groove and inserted, and the limit beads are fixed in the limit groove, so that the chip can be covered therein, which plays a certain protective role and prevents the chip from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an overall front schematic diagram of a spliced ​​integrated circuit lead frame structure proposed by the utility model;

[0025] Figure 2 A schematic cross-sectional view of a protective sleeve of a spliced ​​integrated circuit lead frame structure proposed by the utility model;

[0026] Figure 3 The utility model provides a spliced ​​integrated circuit lead frame structure Figure 2 Enlarged schematic diagram of part A.

[0027] Legend:

[0028] 1. Frame body; 2. Pins; 3. Carrier; 4. Insert block; 5. Slot; 6. Reset spring a; 7. Block; 8. Slot; 9. Press block; 10. Groove; 11. Protective cover; 12. Reset spring b; 13. Limiting bead; 14. Limiting slot. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Reference Figure 1-Figure 3 The utility model provides an embodiment: a spliced ​​integrated circuit lead frame structure, including a frame body 1, the inner wall of the frame body 1 is provided with pins 2, the center of the frame is provided with a carrier part 3 for installing a chip, the side wall of the frame body 1 is fixedly connected with an insert block 4, the side wall of the frame body 1 is provided with a slot 5, the outer wall of the insert block 4 is plugged into the inner wall of the slot 5, and the insert block 4 is inserted into the slot 5 of another set of frames, so that the two sets of frame bodies 1 can be spliced ​​together, the inner wall of the insert block 4 is elastically connected with a snap assembly through a reset spring a6, and the snap assembly includes a snap block 7, one end of the reset spring a6 is fixedly connected to the bottom end of the snap block 7, and the other end of the reset spring a6 is fixedly connected to the inner wall of the snap block 4, and the surface of the snap block 7 is set as an inclined surface, and the insert block 4 is inserted into the slot 5 of the other set of frames. During the process of inserting into the slot 5, the inner wall of the slot 5 squeezes the inclined surface of the card block 7 to squeeze the reset spring a6 to retract. At the same time, the elastic force generated by the deformation of the reset spring a6 gives the card block 7 an upward thrust to reset it. A card slot 8 is provided on the inner wall of the frame main body 1, and the outer wall of the card block 7 is engaged with the inner wall of the card slot 8. When the plug-in block 4 is fully inserted into the slot 5, the reset spring a6 pushes the card block 7 into the card slot 8 to fix the frame main bodies 1 together in pairs. The top of the card block 7 contacts with a pressing block 9, and the top of the buckle assembly contacts with the bottom of the pressing block 9. The outer wall of the pressing block 9 is slidably connected to the inner wall of the frame main body 1. Pressing the pressing block 9 downward can press the card block 7 out of the card slot 8. At this time, the plug-in block 4 can be pulled out of the slot 5, and the frame can be detached.

[0031] Reference Figure 1-Figure 3A groove 10 is provided on the outer wall of the carrier part 3, and a protective cover 11 is detachably connected to the inner wall of the groove 10. The inner wall of the protective cover 11 is elastically connected to the limiting bead 13 through a reset spring b12. One end of the reset spring b12 is fixedly connected to the inner wall of the protective cover 11, and the other end of the reset spring b12 is fixedly connected to the back of the limiting bead 13. In the process of inserting the protective cover 11 into the groove 10, the inner wall of the groove 10 squeezes the sliding surface of the limiting bead 13, so that it squeezes the reset spring b12 and retracts it. At the same time, the elastic force generated by the deformation of the reset spring b12 gives the limiting bead 13 an elastic force in the opposite direction, prompting it to reset. A limiting groove 14 is provided on the inner wall of the groove 10, and the outer wall of the limiting bead 13 is clamped with the inner wall of the limiting groove 14. A notch is provided on the side wall of the protective cover 11, and the protective cover 11 can be removed by utilizing the notch.

[0032] Working principle: when it is necessary to splice the frames together, align the plug block 4 with the slot 5 of another set of frame bodies 1 and insert it. During the insertion process, the inner wall of the slot 5 squeezes the inclined surface of the card block 7 to squeeze the reset spring a6 and retract it. After the plug block 4 is fully inserted into the slot 5, the reset spring a6 pushes the card block 7 into the card slot 8 to fix the frames together in pairs. When it is necessary to remove them, press the pressing block 9 downward to press the card block 7 out of the card slot 8 to remove the frames in pairs. After the chip is installed into the carrier part 3, align the bottom of the protective cover 11 with the groove 10 and insert it. The limiting bead 13 is squeezed and retracted by the inner wall of the groove 10. After the protective cover 11 is fully inserted, the reset spring b12 pushes the limiting bead 13 into the limiting groove 14 to fix the protective cover 11 to the carrier part 3, thereby achieving the effect of dust and collision prevention.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A spliced ​​integrated circuit lead frame structure, comprising a frame body (1), characterized in that: The inner wall of the frame body (1) is provided with a pin (2), the center of the frame is provided with a carrier portion (3), the side wall of the frame body (1) is fixedly connected with an insert block (4), the side wall of the frame body (1) is provided with a slot (5), the inner wall of the insert block (4) is elastically connected with a snap assembly via a return spring a (6), and the top end of the snap assembly is in contact with the bottom end of the pressing block (9).

2. The lead frame structure for a spliced ​​integrated circuit according to claim 1, characterized in that: The outer wall of the slide carrier (3) is provided with a groove (10), the inner wall of the groove (10) is detachably connected with a protective sleeve (11), the inner wall of the protective sleeve (11) is elastically connected to a limiting bead (13) via a return spring b (12), and the inner wall of the groove (10) is provided with a limiting groove (14).

3. The lead frame structure for a spliced ​​integrated circuit according to claim 1, characterized in that: The buckle assembly comprises a clamping block (7), one end of the return spring a (6) is fixedly connected to the bottom end of the clamping block (7), the other end of the return spring a (6) is fixedly connected to the inner wall of the insert block (4), a clamping groove (8) is provided on the inner wall of the frame body (1), and the top end of the clamping block (7) contacts a pressing block (9).

4. The lead frame structure for a spliced ​​integrated circuit according to claim 1, characterized in that: The outer wall of the insert block (4) is plugged into the inner wall of the slot (5).

5. The lead frame structure for a spliced ​​integrated circuit according to claim 1, characterized in that: The outer wall of the pressing block (9) is slidably connected to the inner wall of the frame body (1).

6. The lead frame structure for a spliced ​​integrated circuit according to claim 2, characterized in that: One end of the return spring b (12) is fixedly connected to the inner wall of the protective sleeve (11), and the other end of the return spring b (12) is fixedly connected to the back side of the limiting bead (13).

7. The lead frame structure for a spliced ​​integrated circuit according to claim 2, characterized in that: The outer wall of the limiting bead (13) is snap-fitted to the inner wall of the limiting groove (14).

8. The lead frame structure for a spliced ​​integrated circuit according to claim 3, characterized in that: The outer wall of the clamping block (7) is clamped with the inner wall of the clamping slot (8).

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