Packaging structure adopting jumper wires and bonding wires

Abstract

The utility model discloses a packaging structure using a jumper wire and a bonding wire, and relates to the technical field of semiconductor packaging, the packaging structure comprises pins, the bonding wire, a chip, a base island, the jumper wire, a welding platform and a bonding platform, the chip is arranged on the base island, and the pins comprise a first pin and a second pin; one end of the jumper wire is connected with the source electrode of the chip, the other end of the jumper wire is connected with the welding platform, and the first pin is connected with the welding platform; one end of the bonding wire is connected with the gate pole of the chip, the other end of the bonding wire is connected with the bonding platform, and the second pin is connected with the bonding platform; the source electrode of the chip is connected with the welding platform through the jumper wire, the gate electrode of the chip is connected with the bonding platform through the bonding wire, the problem that parasitic resistance is large due to the fact that bonding wires are adopted for connection completely is solved, and the problem that internal stress is large due to the fact that jumper wire structures are adopted for connection completely is solved. And the quality and the market competitiveness of the product are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure using jumper wires and bonding wires. Background Art

[0002] Power semiconductor devices have been widely used in new energy vehicles, home appliances, industrial control and other fields. As the requirements for product performance become increasingly higher, higher requirements are also placed on semiconductor packaging structures and manufacturing methods.

[0003] Traditional power semiconductor packaging usually adopts the structure of lead frame and bonding wire or lead frame and jumper wire. This structure is simple and the technology is relatively mature, but the structure of lead frame and bonding wire has the problems of low production efficiency and large parasitic resistance, which cannot meet the electrical requirements. The structure of lead frame and jumper wire has the problem of large internal stress, which may cause gate cracking.

[0004] In view of this, there is an urgent need for a packaging structure using jumper wires and bonding wires to solve the above problems. Utility Model Content

[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A packaging structure using jumper wires and bonding wires, comprising: pins, bonding wires, a chip, a base island, jumper wires, a welding platform and a bonding platform, wherein the chip is arranged on the base island, and the pins include a first pin and a second pin;

[0008] One end of the jumper is connected to the source electrode of the chip, and the other end is connected to the welding platform, and the first pin is connected to the welding platform;

[0009] One end of the bonding wire is connected to the gate of the chip, and the other end is connected to the bonding platform, and the second pin is connected to the bonding platform.

[0010] Its further characteristic is that

[0011] A plurality of the first pins are provided.

[0012] The source electrode of the chip is provided with a first plating layer.

[0013] The material of the first plating layer is nickel, nickel-gold or nickel-palladium-gold.

[0014] The chip and the base island, the chip and the jumper wire, and the jumper wire and the welding platform are all connected through solder.

[0015] The gate of the chip is provided with a second plating layer.

[0016] The material of the second plating layer is aluminum, aluminum-copper alloy, nickel-gold or nickel-palladium-gold.

[0017] It also includes a plastic package, one end of the pin is located inside the plastic package, and the bonding wire, chip, base island, jumper, welding platform and bonding platform are all arranged inside the plastic package.

[0018] The surface of the bonding platform is provided with a silver coating.

[0019] The surface of the pin is provided with a tin plating layer.

[0020] The above structure of the utility model can achieve the following beneficial effects:

[0021] The source of the chip is connected to the welding platform with a jumper wire, and the gate of the chip is connected to the bonding platform with a bonding wire. This not only solves the problem of large parasitic resistance when all connections are made with bonding wires, but also solves the problem of large internal stress when all connections are made with jumper wire structures, thereby improving product quality and market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a side view of this embodiment;

[0023] Figure 2 It is a front view of this embodiment.

[0024] In the figure: 1. Pins; 2. Bonding wires; 3. Chip; 4. Base island; 5. Plastic package; 6. Jumper wire; 7. Soldering platform; 8. Solder; 9. Bonding platform. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0026] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0027] The following is combined with Figure 1-2 This application is described in further detail.

[0028] like Figure 1-2 As shown, a packaging structure using jumper wires and bonding wires includes: pins 1, bonding wires 2 (the material of the bonding wires can be gold, copper, aluminum or silver alloy, etc.), chips 3, base islands 4, jumper wires 6, welding platforms 7 and bonding platforms 9. The chip 3 is arranged on the base island 4, and the pin 1 includes a first pin (a plurality of first pins are arranged) and a second pin; one end of the jumper wire 6 is connected to the source of the chip 3, and the other end is connected to the welding platform 7, and the first pin is connected to the welding platform 7; one end of the bonding wire 2 is connected to the gate of the chip 3, and the other end is connected to the bonding platform 9, and the second pin is connected to the bonding platform 9. In this way, a lead frame and a jumper wire and a bonding wire are combined, that is, the source of the chip 3 is connected to the welding platform 7 by a jumper wire, and the gate of the chip 3 is connected to the bonding platform 9 by a bonding wire. This solves the problem of large parasitic resistance when all bonding wires are used for connection, meets the electrical requirements, and solves the problem of large internal stress when all jumper wire structures are used for connection, reduces the occurrence of gate cracking, and improves the quality and market competitiveness of the product.

[0029] like Figure 1-2 As shown, in order to expand the contact area between the pin 1 and the jumper 6, a plate-shaped welding platform 7 is provided at the end of the pin 1, and one end of the jumper 6 is connected to the pin 1 through the welding platform 7. In this way, the plate-shaped welding platform 7 is used to support the pin 1 and the jumper 6, so that the contact area is large, the processing is convenient, and the product performance is more stable.

[0030] Further optimization is that the source of chip 3 is provided with a first plating layer, the material of the first plating layer is nickel, nickel gold or nickel palladium gold (preferably nickel palladium gold), and the gate of chip 3 is provided with a second plating layer, the material of the second plating layer is aluminum, aluminum-copper alloy, nickel gold or nickel palladium gold (preferably aluminum-copper alloy). In this way, by respectively providing the first plating layer and the second plating layer on the source and gate of chip 3, the welding performance of the chip is improved.

[0031] like Figure 1-2 As shown, the chip 3 and the base island 4, the chip 3 and the jumper 6, and the jumper 6 and the welding platform 7 are all connected by solder 8. During actual processing, solder 8 is added between the chip 3 and the base island 4, between the chip 3 and the jumper 6, and between the jumper 6 and the welding platform 7. The solder 8 forms an adhesive force by melting at high temperature and then cooling and solidifying to fix the corresponding components. The metal component of the solder 8 can be lead-tin-silver alloy, lead-tin alloy, tin-silver-antimony alloy, tin-silver alloy or silver, preferably lead-tin-silver alloy.

[0032] Further optimization is that Figure 1-2As shown, the device also includes a plastic package 5, one end of the pin 1 is located inside the plastic package 5, and the bonding wire 2, chip 3, base island 4, jumper 6, welding platform 7 and bonding platform 9 are all arranged inside the plastic package 5. In this way, the exposed chip 3 and other components are encapsulated in the plastic material to protect and fix the chip 3 and other components, thereby solving the problems caused by the exposed state of the chip, such as easy damage, easy contamination, difficult to store, difficult to connect, etc., thereby ensuring the reliability and stability of the chip and extending the service life of the chip.

[0033] Further optimization is that the surface of the bonding platform 9 is provided with a silver plating layer, and the surface of the pin 1 is provided with a tin plating layer, so that the bonding platform 9 has good conductivity and reliable bonding effect. Of course, according to the equipment and process conditions, the surface of the bonding platform 9 is not provided with a silver plating layer, and the surface of the pin 1 is provided with a tin plating layer to prevent the pin 1 from oxidation and improve the conductivity and corrosion resistance of the pin 1.

[0034] As a further optimization, the bend of the jumper 6, the contact part between the jumper 6 and the chip 3, and the contact part between the jumper 6 and the welding platform 7 are all provided with through holes, and corresponding through holes are also provided on the welding platform 7 and the bonding platform 9.

[0035] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A packaging structure using jumper wires and bonding wires, characterized in that: include: Pins (1), bonding wires (2), a chip (3), a base island (4), a jumper wire (6), a welding platform (7) and a bonding platform (9), wherein the chip (3) is arranged on the base island (4), and the pins (1) include a first pin and a second pin; One end of the jumper wire (6) is connected to the source electrode of the chip (3), and the other end is connected to the welding platform (7), and the first pin is connected to the welding platform (7); One end of the bonding wire (2) is connected to the gate of the chip (3), and the other end is connected to the bonding platform (9), and the second pin is connected to the bonding platform (9).

2. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: A plurality of the first pins are provided.

3. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: The source electrode of the chip (3) is provided with a first plating layer.

4. The packaging structure using jumper wires and bonding wires according to claim 3, characterized in that: The material of the first plating layer is nickel, nickel-gold or nickel-palladium-gold.

5. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: The chip (3) and the base island (4), the chip (3) and the jumper wire (6), and the jumper wire (6) and the welding platform (7) are all connected via solder (8).

6. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: The gate of the chip (3) is provided with a second plating layer.

7. The packaging structure using jumper wires and bonding wires according to claim 6, characterized in that: The material of the second plating layer is aluminum, aluminum-copper alloy, nickel-gold or nickel-palladium-gold.

8. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: It also includes a plastic package (5), one end of the pin (1) is located inside the plastic package (5), and the bonding wire (2), chip (3), base island (4), jumper (6), welding platform (7) and bonding platform (9) are all arranged inside the plastic package (5).

9. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: The surface of the bonding platform (9) is provided with a silver coating.

10. The packaging structure using jumper wires and bonding wires according to claim 1, characterized in that: The surface of the pin (1) is provided with a tin plating layer.

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