Connecting structure and double-layer circuit board

By changing one side of the guide column from the internal thread to a pin and opening a set position hole on the circuit board, and connecting the double-layer circuit board through welding, the problem of high stress damage to the connection of the double-layer circuit board in the prior art is solved, and the effect of simplifying assembly and reducing wear is achieved.

CN222763204UActive Publication Date: 2025-04-15CAMEL GRP BATTERY TRADING CO LTD
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Patent Information

Application Number
CN202421497145.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-04-15
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

The existing double-layer circuit board connection method has a high risk of stress damage to the circuit board, and the assembly steps are complicated, which are prone to slipping of screws, wear of circuit board surfaces and screw holes.

Method used

A connection structure is designed, one side of the guide column is changed from the original internal thread structure to a pin structure, and a positioning hole matching the pin is opened on one of the circuit boards, and a screw connection in the prior art is replaced by welding the pin to the positioning hole.

Benefits of technology

It reduces the number of screws used, simplifies the assembly process, reduces costs, and effectively avoids the problems of screw slippage, circuit board surface and screw hole wear, reducing the risk of damage to the stress of the veneer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a connecting structure and a double-layer circuit board, the connecting structure is used for connecting the double-layer circuit board, the connecting structure comprises a guide pillar, a positioning hole and a through hole, one side of the guide pillar is provided with a pin, and the other side of the guide pillar is provided with an internal thread; the positioning hole is formed in one circuit board of the double-layer circuit board, and the positioning hole is matched with the pin and is in welded connection with the pin; and the through hole is formed in the other circuit board of the double-layer circuit board and is fixedly connected with one side, with the internal threads, of the guide post. According to the utility model, the technical problems that the stress damage risk of the existing double-layer circuit board connection method to the circuit board is large, the assembly steps are complicated, the screw slip is easy to occur, and the surface of the circuit board and the screw hole are easy to abrade are solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of double-layer circuit board welding and manufacturing, in particular to a connection structure and a double-layer circuit board. Background Art

[0002] At present, double-layer circuit boards are generally connected by screwing the two sides of the guide pillar (usually copper pillars) to the two circuit boards respectively. The specific steps are: first, one side of the guide pillar needs to be inserted into the through hole of circuit board one and fixed by tooling; then, the screw is locked in the internal thread of the guide pillar on this side by an electric screwdriver to lock the guide pillar with circuit board one; after that, circuit board two is fixed to circuit board one with the guide pillar installed by tooling; finally, the screw is locked in the internal thread of the guide pillar by an electric screwdriver to lock circuit board two with the guide pillar. However, this connection method requires locking the screws on both sides of the guide pillar separately, which has a greater risk of stress damage to the circuit board; and the assembly steps are complicated, which is prone to problems such as screw slippage and wear of the circuit board surface and screw holes.

[0003] After searching, it was found that the Chinese utility model patent with announcement number CN210298195U discloses "a double-layer PCB board assembly with high heat dissipation", but the patent technology only solves the problem of how to improve the overall heat dissipation performance of the double-layer PCB board, and does not involve the shortcomings of the existing connection method proposed in the utility model. Therefore, it is necessary to propose a new connection method for double-layer circuit boards. Utility Model Content

[0004] The utility model aims to provide a connection structure and a double-layer circuit board. The connection structure is used for connecting the double-layer circuit board, which solves the technical problems that the existing connection method of the double-layer circuit board has a high risk of stress damage to the circuit board, and the assembly steps are complicated and the screws are prone to slippage, and the circuit board surface and screw holes are worn.

[0005] The technical solution adopted by the utility model to solve its technical problems is as follows:

[0006] A connection structure for connecting a double-layer circuit board, comprising:

[0007] A guide post, wherein one side of the guide post has a pin and the other side of the guide post has an internal thread;

[0008] A positioning hole, the positioning hole is opened on one of the double-layer circuit boards, the positioning hole matches the pin and is welded to the pin;

[0009] A through hole is provided on another circuit board in the double-layer circuit board, and the through hole is fixedly connected to a side of the guide column having the internal thread.

[0010] In some embodiments, a metal layer is electroplated in the positioning hole.

[0011] In some embodiments, a pad is packaged on one side of the positioning hole to be welded to the pin.

[0012] In some embodiments, a protrusion extending away from the guide pillar is formed in the middle of one side of the guide pillar, and the protrusion constitutes the pin.

[0013] In some embodiments, the diameter of the protrusion is smaller than the diameter of the guide post.

[0014] In some embodiments, a recess extending toward the center of the guide post is formed in the middle of the other side of the guide post, and the internal threads are arranged around the recess.

[0015] In some embodiments, the diameter of the recess is smaller than the diameter of the guide post.

[0016] In some embodiments, the guide pillar, the protrusion and the recess are an integrally formed structure.

[0017] In some embodiments, a screw is further included, wherein the screw is cooperatively connected with the internal thread and is used to fix the other side of the guide column in the through hole.

[0018] In addition, the utility model also provides a double-layer circuit board, including a first circuit board, a second circuit board and the connection structure provided by the utility model, wherein two sides of the connection structure are respectively connected to the first circuit board and the second circuit board.

[0019] Compared with the prior art, the beneficial effects of the utility model mainly include:

[0020] The utility model provides a connection structure, which is an optimized design based on the existing guide column structure (usually refers to a copper column). Specifically, one side of the guide column is changed from the original internal thread structure to a pin structure, and accordingly, a positioning hole matching the pin is opened on one of the circuit boards, and the pin and the positioning hole are welded to replace the screw connection in the prior art. In this way, the number of screws used can be reduced, the assembly process is simplified, and the cost is reduced; and the connection structure provided by the utility model is used to connect the upper circuit board. Since the screw assembly process is reduced, the assembly frequency is reduced, thereby greatly reducing the risk of single board stress damage in the double-layer circuit board, and reducing the problems of screw slippage and wear of the circuit board surface and screw holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a plan view of the guide post of the utility model;

[0022] Figure 2It is a plan view of the positioning hole described in the utility model;

[0023] Figure 3 It is a plan view of the through hole described in the utility model.

[0024] The following are the descriptions of the reference numerals:

[0025] 1. Guide pin, 11. Pin, 12. Internal thread;

[0026] 2. Positioning hole;

[0027] 3. Through hole;

[0028] 4. The first circuit board;

[0029] 5. The second circuit board. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0031] In the existing welding manufacturing process of double-layer circuit boards, guide pillars are usually used to pass through the two circuit boards and are tightened and fixed with screws to connect the upper and lower circuit boards. However, the frequent tightening of the screws not only causes great stress damage to a single circuit board, but also complicates the assembly steps and is prone to problems such as screw slippage and wear of the circuit board and the screw holes.

[0032] In view of the above technical problems, the utility model designs a connection structure, which is simply to optimize one side of the guide column 1 from the original screw connection to welding, so as to avoid the above technical problems caused by the screw connection. Specifically:

[0033] The utility model provides a connection structure for connecting a double-layer circuit board, comprising a guide column 1, a positioning hole 2 and a through hole 3, wherein one side of the guide column 1 has a pin 11, and the other side thereof has an internal thread 12; the double-layer circuit board comprises a first circuit board 4 and a second circuit board 5, the positioning hole 2 is opened on the first circuit board 4, the position and size of the positioning hole 2 match those of the pin 11 and are welded and connected; the through hole 3 is opened on the second circuit board 5, and the through hole 3 is fixedly connected to the side of the guide column 1 with the internal thread 12.

[0034] That is to say, the first circuit board 4 and the second circuit board 5 of the utility model are connected through the guide post 1. What is different from the prior art is that one side of the guide post 1 is a pin 11 and the other side is an internal thread 12. The first circuit board 4 is provided with a positioning hole 2, and the pin 11 is connected to the positioning hole 2 by welding; the second circuit board 5 is provided with a through hole 3, and the side of the guide post 1 with the internal thread 12 passes through the through hole 3 and is tightened and fixed in the internal thread 12 by a screw to complete the connection between the first circuit board 4 and the second circuit board 5. This connection method reduces the number of screws used and simplifies the assembly process, thereby reducing costs; and the utility model reduces the assembly frequency by reducing the screw assembly process, thereby greatly reducing the risk of single board stress damage to the first circuit board 4 or the second circuit board 5, and effectively avoiding the problems of screw slippage and wear of the circuit board surface and screw holes.

[0035] In a preferred embodiment, a metal layer is electroplated in the positioning hole 2 .

[0036] In a preferred embodiment, a pad is packaged on one side of the positioning hole 2 where the pin 11 is welded.

[0037] In a preferred embodiment, a protrusion extending away from the guide pillar 1 is formed in the middle of one side of the guide pillar 1 , and the protrusion constitutes the pin 11 .

[0038] In a preferred embodiment, the diameter of the protrusion is smaller than the diameter of the guide pillar 1 .

[0039] In a preferred embodiment, a depression extending toward the center of the guide pillar 1 is formed in the middle of the other side of the guide pillar 1 , and the internal threads 12 are arranged around the depression.

[0040] In a preferred embodiment, the diameter of the recess is smaller than the diameter of the guide pillar 1 .

[0041] In a preferred embodiment, the guide pillar 1, the protrusion and the depression are an integrally formed structure.

[0042] In a preferred embodiment, a screw is further included, and the screw is matched with the internal thread to fix the side of the guide column 1 with the internal thread 12 in the through hole 3.

[0043] In addition, the utility model further provides a double-layer circuit board, including a first circuit board 4 and a second circuit board 5, and the connection structure described in the above technical solution of the utility model, the two sides of the connection structure are respectively connected to the first circuit board 4 and the second circuit board 5, that is, the first circuit board 4 and the second circuit board 5 are connected through the connection structure, and the specific connection process is:

[0044] 1. Solder one end of the guide pillar 1 with the pin 11 and the positioning hole 2 of the first circuit board 4 together by selective wave soldering. During welding, use a selective wave soldering tool to fix the guide pillar 1 and the first circuit board 4 to ensure the verticality and fit of the guide pillar 1;

[0045] 2. Fix the first circuit board 4 and the second circuit board 5 welded with the guide column 1 in the screw-driving tool, pass the side of the guide column 1 with the internal thread 12 through the through hole 3 of the second circuit board 5, and use an electric screwdriver to tighten the screw in the internal thread 12 to fix the second circuit board 5 and the guide column 1. At this point, the connection between the first circuit board 4 and the second circuit board 5 is completed.

[0046] The specific implementation methods of the utility model described above do not constitute a limitation on the protection scope of the utility model. Any other corresponding changes and modifications made according to the technical concept of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A connection structure for connecting a double-layer circuit board, characterized in that: include: A guide post, wherein one side of the guide post has a pin and the other side of the guide post has an internal thread; A positioning hole, the positioning hole is opened on one of the double-layer circuit boards, the positioning hole matches the pin and is welded to the pin; A through hole is provided on another circuit board in the double-layer circuit board, and the through hole is fixedly connected to a side of the guide column having the internal thread.

2. The connection structure according to claim 1, characterized in that: A metal layer is electroplated in the positioning hole.

3. The connection structure according to claim 2, characterized in that: A soldering pad is packaged on one side of the positioning hole and the pin for soldering.

4. The connection structure according to claim 3, characterized in that: A protrusion extending away from the guide pillar is formed in the middle of one side of the guide pillar, and the protrusion constitutes the pin.

5. The connection structure according to claim 4, characterized in that: The diameter of the protrusion is smaller than the diameter of the guide post.

6. The connection structure according to claim 5, characterized in that: A depression extending toward the center of the guide post is formed in the middle of the other side of the guide post, and the internal threads are arranged around the depression.

7. The connection structure according to claim 6, characterized in that: The diameter of the recess is smaller than the diameter of the guide post.

8. The connection structure according to claim 7, characterized in that: The guide column, the protrusion and the depression are an integrally formed structure.

9. The connection structure according to claim 1, characterized in that: It also includes a screw, which is matched with the internal thread and is used to fix the other side of the guide column in the through hole.

10. A double-layer circuit board, comprising a first circuit board and a second circuit board, characterized in that: It also includes the connection structure according to any one of claims 1 to 9, wherein two sides of the connection structure are respectively connected to the first circuit board and the second circuit board.

Citation Information

Patent Citations

  • Double-layer PCB assembly with high heat dissipation

    CN210298195U