MEMS microphone audio acquisition system for probe station system

Abstract

The utility model discloses an MEMS microphone audio acquisition system for a probe station system, which belongs to the technical field of audio acquisition and comprises a power supply module, an acquisition module and a master control module which are electrically connected with one another, the acquisition module comprises a PDM microphone module and an I2S microphone module, and the master control module comprises an FPGA unit and a data interface unit. The PDM microphone module and the I2S microphone module are both electrically connected with the FPGA unit. By means of the mode, audio collection of the wafer-level loudspeaker is achieved; the acquisition system can be integrated on a small circuit board, the distribution of microphones can be properly adjusted according to the size and position of sound holes, and an output data interface can be flexibly configured, thereby facilitating subsequent development.

Description

Technical Field

[0001] The utility model relates to the technical field of audio acquisition, in particular to a MEMS microphone audio acquisition system for a probe station system. Background Art

[0002] The current audio acquisition systems mainly include two categories. One is the professional recording system, which is mostly mature solutions and products, equipped with a full set of equipment such as traditional analog microphones, sound cards and brackets, so that they can be put into use directly; the other is the acquisition solution based on digital microphones, which is divided into single-microphone acquisition used in noise reduction systems and microphone array acquisition.

[0003] For example, Chinese patent CN215300859U discloses a system for realizing USB acquisition of 32-channel PDM microphones, the system for realizing USB acquisition of 32-channel PDM microphones includes a control mainboard, the control mainboard is provided with a main control module, a storage module, a sound pickup module, a power supply conversion module and an output module, the output end of the sound pickup module is connected to the input end of the main control module, the output end of the main control module is connected to the input end of the output module, the output end of the storage module is connected to the input end of the main control module, and the power supply conversion module is electrically connected to the main control module.

[0004] However, the technology has the following problems: the structure, size, data interface, etc. of the general microphone array solution are fixed and cannot be used in the probe station system.

[0005] Based on this, the utility model designs a MEMS microphone audio acquisition system for a probe station system to solve the above problems. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the prior art, the utility model provides a MEMS microphone audio acquisition system for a probe station system.

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A MEMS microphone audio acquisition system for a probe station system, comprising a power module, an acquisition module and a main control module electrically connected to each other;

[0009] The acquisition module includes a PDM microphone module and an I2S microphone module, which are used to acquire the target audio signal and transmit it to the main control module;

[0010] The main control module includes an FPGA unit and a data interface unit, which are used to process the target audio signal;

[0011] The PDM microphone module and the I2S microphone module are both electrically connected to the FPGA unit.

[0012] Furthermore, the power module includes a power protection circuit, a first step-down circuit, a second step-down circuit and a power indicator light module, one end of the power indicator light module is electrically connected to the first step-down circuit and the second step-down circuit, and the other end of the power indicator light module is grounded, and the first step-down circuit is electrically connected to the second step-down circuit;

[0013] The second step-down circuit is electrically connected to the acquisition module, and the first step-down circuit is electrically connected to the main control module.

[0014] Furthermore, the PDM microphone module and the I2S microphone module are both electrically connected to the second step-down circuit.

[0015] Furthermore, the FPGA unit is electrically connected to the first step-down circuit.

[0016] Furthermore, the PDM microphone module includes at least one first stereo channel unit, each first stereo channel unit includes two first microphone chips, a resistor R6, a resistor R8, a capacitor C34 and a capacitor C35, the two first microphone chips are respectively a first-first microphone chip MIC1 and a first-second microphone chip MIC2, and the PDM microphone module is used to collect the target audio signal to the FPGA unit, and the target audio signal includes a data signal DATA and a clock signal CLK.

[0017] Furthermore, the first microphone chip includes six pins, pin 1 of the first microphone chip MIC1 is electrically connected to resistor R6, pin 1 of the first second microphone chip MIC2 is electrically connected to resistor R8, resistor R6 and resistor R8 are connected in parallel, that is, the data signals DATA of the first microphone chip MIC1 and the first second microphone chip MIC2 are connected in parallel and electrically connected to the FPGA unit.

[0018] Furthermore, pin 2 of the first microphone chip MIC1 and pin 4 of the capacitor C34 are electrically connected in sequence, pin 4 and pin 5 of the first microphone chip MIC1 are electrically connected to ground, and pin 2 of the first microphone chip MIC1 is connected to the second step-down circuit and grounded through the capacitor C34;

[0019] Pin 2 and pin 4 of the first-second microphone chip MIC2 are connected to the second step-down circuit and grounded through capacitor C35, and pin 5 is grounded; pin 3 of the first-first microphone chip MIC1 is connected in parallel with pin 3 of the first-second microphone chip MIC2, that is, the clock signals CLK of the first-first microphone chip MIC1 and the first-second microphone chip MIC2 are connected in parallel and electrically connected to the FPGA unit.

[0020] Furthermore, the I2S microphone module includes at least one second stereo channel unit, each of which includes two second microphone chips, capacitor C38 and capacitor C39, the two second microphone chips are divided into a second-first microphone chip S1 and a second-second microphone chip S2, and the I2S microphone module is used to collect the target audio signal to the FPGA unit, and the target audio signal includes left and right channel data selection signals.

[0021] Furthermore, the 4 pins of the second-first microphone chip S1 are connected in parallel with the 4 pins of the second-second microphone chip S2, that is, the clock signals SCK of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel and then electrically connected to the FPGA unit;

[0022] Pin 6 of the second-first microphone chip S1 is connected in parallel with pin 6 of the second-second microphone chip S2, that is, the audio data SD of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel, so that dual-channel transmission can be achieved;

[0023] Pin 5 of the second microphone chip S1 is connected to the second step-down circuit and grounded via capacitor C38, and pins 2 and 3 are grounded;

[0024] Pin 2 and pin 5 of the second microphone chip S2 are connected to the second step-down circuit and grounded through capacitor C39, and pin 3 is grounded.

[0025] Furthermore, the data interface unit includes 10 pins, all of which are electrically connected to the FPGA unit.

[0026] Compared with the prior art, the utility model has the following beneficial effects:

[0027] The utility model proposes a microphone acquisition circuit and system that can be used in a probe station system to realize audio acquisition of a wafer-level speaker; the acquisition system can be integrated on a small circuit board, the distribution of the microphones can be appropriately adjusted according to the size and position of the sound outlet, and the output data interface can be flexibly configured to facilitate subsequent development. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is an overall connection diagram of the MEMS microphone audio acquisition system for the probe station system of the utility model;

[0030] Figure 2 This is a block diagram of the power module of the utility model;

[0031] Figure 3 This is a block diagram of the acquisition module of the utility model;

[0032] Figure 4 This is a block diagram of the main control module of the utility model;

[0033] Figure 5 It is an overall block diagram of the MEMS microphone audio acquisition system for the probe station system of the utility model;

[0034] Figure 6 This is a layout diagram of the microphone of the utility model on the board;

[0035] Figure 7 It is a connection diagram of the power protection circuit of the utility model;

[0036] Figure 8 It is a connection diagram of the first step-down circuit of the utility model;

[0037] Fig. 9 It is a connection diagram of the second step-down circuit of the utility model;

[0038] Fig.10 This is a connection diagram of the power indicator light module of the utility model;

[0039] Fig.11 This is a connection diagram of the PDM microphone module of the utility model;

[0040] Fig.12 This is a connection diagram of the I2S microphone module of the present invention;

[0041] Fig.13 This is a schematic diagram of the connection between the FPGA unit and the data interface unit of the utility model.

[0042] The numbers in the figure represent:

[0043] 1. Power module 11. Power protection circuit 12. First step-down circuit 13. Second step-down circuit 14. Power indicator light module 2. Acquisition module 21. PDM microphone module 22. I2S microphone module 3. Main control module 31. FPGA unit 32. Data interface unit. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0045] Embodiment 1

[0046] In some embodiments, please refer to the attached instructions. Figure 1-13 , this embodiment proposes a MEMS microphone audio acquisition system for a probe station system, including a power module 1, an acquisition module 2 and a main control module 3 electrically connected to each other;

[0047] The acquisition module 2 acquires the audio signal and then transmits the acquired audio signal to the main control module 3; the main control module 3 caches and processes the data and then transmits it to the host computer for further processing and analysis.

[0048] The acquisition module 2 includes a PDM microphone module 21 and an I2S microphone module 22, which are used to acquire the target audio signal and transmit it to the main control module 3;

[0049] For example, when better fault tolerance and noise resistance are needed, the PDM microphone module 21 is selected; when the computing power of the main control module 3 or the host computer is limited, or the acquisition module 2 is far away from the main control module 3, the I2S microphone module 22 can be selected, and the I2S microphone module 22 requires less computing power.

[0050] The power module 1, PDM microphone module 21, I2S microphone module 22, and main control module 3 are all integrated on the same circuit board, which interacts with the host computer for data and can be flexibly set according to specific needs to be compatible with different serial port tools and suitable for different development application scenarios;

[0051] The board needs to reserve a hollow area consistent with the sound hole for audio collection;

[0052] like Figure 6 The figure shows a layout of microphones on a board. The surrounding square is the microphone, and the circular part in the middle is the hollow area of ​​the board, which is consistent with the sound outlet of the probe station and is the sound outlet of the sound source.

[0053] The hollowed-out area and the distance between the microphones can be adjusted accordingly according to the size of the sound hole, area restrictions, collection requirements, etc.

[0054] The main control module 3 includes an FPGA unit 31 and a data interface unit 32, which are used to process the target audio signal;

[0055] The PDM microphone module 21 and the I2S microphone module 22 are both electrically connected to the FPGA unit 31 .

[0056] The power module 1 includes a power protection circuit 11, a first step-down circuit 12, a second step-down circuit 13 and a power indicator light module 14, one end of the power indicator light module 14 is electrically connected to the first step-down circuit 12 and the second step-down circuit 13, the other end of the power indicator light module 14 is grounded, and the first step-down circuit 12 is electrically connected to the second step-down circuit 13;

[0057] The second step-down circuit 13 is electrically connected to the acquisition module 2 , and the first step-down circuit 12 is electrically connected to the main control module 3 .

[0058] The PDM microphone module 21 and the I2S microphone module 22 are electrically connected to the second step-down circuit 13 .

[0059] The FPGA unit 31 is electrically connected to the first step-down circuit 12 .

[0060] The PDM microphone module 21 includes at least one first stereo channel unit, each first stereo channel unit includes two first microphone chips, a resistor R6, a resistor R8, a capacitor C34 and a capacitor C35, the two first microphone chips are respectively a first-first microphone chip MIC1 and a first-second microphone chip MIC2, the PDM microphone module 21 is used to collect the target audio signal to the FPGA unit 31, and the target audio signal includes a data signal DATA and a clock signal CLK.

[0061] The first microphone chip includes six pins, pin 1 of the first microphone chip MIC1 is electrically connected to resistor R6, pin 1 of the first second microphone chip MIC2 is electrically connected to resistor R8, resistor R6 is connected in parallel with resistor R8, that is, data signals DATA of the first microphone chip MIC1 and the first second microphone chip MIC2 are connected in parallel and electrically connected to the FPGA unit 31.

[0062] Pin 2 of the first microphone chip MIC1 and pin 4 of the capacitor C34 are electrically connected in sequence, pin 4 and pin 5 of the first microphone chip MIC1 are electrically connected to ground, and pin 2 of the first microphone chip MIC1 is connected to the second step-down circuit 13 and grounded through the capacitor C34;

[0063] Pin 2 and pin 4 of the first-second microphone chip MIC2 are connected to the second step-down circuit 13 and grounded through capacitor C35, and pin 5 is grounded; pin 3 of the first-first microphone chip MIC1 is connected in parallel with pin 3 of the first-second microphone chip MIC2, that is, the clock signals CLK of the first-first microphone chip MIC1 and the first-second microphone chip MIC2 are connected in parallel and electrically connected to the FPGA unit 31.

[0064] The I2S microphone module 22 includes at least one second stereo channel unit, each of which includes two second microphone chips, a capacitor C38 and a capacitor C39, the two second microphone chips are divided into a second-first microphone chip S1 and a second-second microphone chip S2, and the I2S microphone module 22 is used to collect target audio signals to the FPGA unit 31, and the target audio signals include left and right channel data selection signals.

[0065] The 4 pins of the second-first microphone chip S1 are connected in parallel with the 4 pins of the second-second microphone chip S2, that is, the clock signals SCK of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel and then electrically connected to the FPGA unit 31;

[0066] Pin 6 of the second-first microphone chip S1 is connected in parallel with pin 6 of the second-second microphone chip S2, that is, the audio data SD of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel, so that dual-channel transmission can be achieved;

[0067] Pin 5 of the second microphone chip S1 is connected to the second step-down circuit 13 and grounded via capacitor C38, and pins 2 and 3 are grounded;

[0068] Pins 2 and 5 of the second microphone chip S2 are connected to the second step-down circuit 13 and grounded through the capacitor C39, and pin 3 is grounded.

[0069] The data interface unit 32 includes 10 pins, all of which are electrically connected to the FPGA unit 31 .

[0070] When the utility model is in use, the power protection circuit 11 inputs an initial voltage of 12V into the first buck circuit 12, the first buck circuit 12 is used to convert the input 12V voltage into a 5V voltage and supply power to the FPGA unit 31, the second buck circuit 13 is used to receive the 5V voltage output by the first buck circuit 12, and convert the 5V voltage into a 3.3V voltage, and then supply power to the PDM microphone module 21 and the I2S microphone module 22;

[0071] The PDM microphone module 21 can provide better sound quality; while the I2S microphone module 22 requires less external computing resources. The present invention selects the PDM microphone module 21 or the I2S microphone module 22 according to the needs. The FPGA unit 31 sends corresponding control commands to control the PDM microphone module 21 or the I2S microphone module 22 to perform the acquisition operation. The FPGA unit 31 also receives the audio data collected by the PDM microphone module 21 or the I2S microphone module 22. The FPGA unit 31 exchanges the collected audio data with the host computer through the data interface unit 32. Since the data interface unit 32 does not specify the data transmission format, it can be flexibly set according to specific needs to be compatible with different serial port tools and suitable for different development application scenarios.

[0072] The utility model realizes audio collection of wafer-level speakers. The collection system can be integrated on a small circuit board. The distribution of microphones can be properly adjusted according to the size and position of the sound outlet holes. Suitable microphone modules can be selected according to needs to work and collect audio data. The output data interface can be flexibly configured to facilitate subsequent development.

[0073] Embodiment 2

[0074] In some embodiments, Figure 5 As shown, as a preferred embodiment of the utility model, the microphone acquisition system is divided into two working modes, namely omnidirectional acquisition or near and far sound field acquisition, and in each acquisition mode only the corresponding microphone is selected to be in working state.

[0075] When in the omnidirectional acquisition mode, microphones M1, M2, M5, M6 or S1, S2, S5, S6 are in working state; when in the far and near sound field acquisition mode, microphones M1, M2, M3, M4 or S1, S2, S3, S4 are in working state.

[0076] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MEMS microphone audio acquisition system for a probe station system, characterized by: It comprises a power supply module (1), a collection module (2) and a main control module (3) which are electrically connected to each other; The acquisition module (2) comprises a PDM microphone module (21) and an I2S microphone module (22), which are used to acquire target audio signals and transmit them to the main control module (3); The main control module (3) comprises an FPGA unit (31) and a data interface unit (32), which are used to process the target audio signal; The PDM microphone module (21) and the I2S microphone module (22) are both electrically connected to the FPGA unit (31).

2. The MEMS microphone audio acquisition system for a probe station system according to claim 1, characterized in that: The power module (1) comprises a power protection circuit (11), a first step-down circuit (12), a second step-down circuit (13) and a power indicator light module (14); one end of the power indicator light module (14) is electrically connected to both the first step-down circuit (12) and the second step-down circuit (13); the other end of the power indicator light module (14) is grounded; and the first step-down circuit (12) is electrically connected to the second step-down circuit (13); The second step-down circuit (13) is electrically connected to the acquisition module (2), and the first step-down circuit (12) is electrically connected to the main control module (3).

3. The MEMS microphone audio acquisition system for a probe station system according to claim 2, characterized in that: The PDM microphone module (21) and the I2S microphone module (22) are both electrically connected to the second step-down circuit (13).

4. The MEMS microphone audio acquisition system for a probe station system according to claim 2, characterized in that: The FPGA unit (31) is electrically connected to the first step-down circuit (12).

5. The MEMS microphone audio acquisition system for a probe station system according to claim 3, characterized in that: The PDM microphone module (21) comprises at least one first stereo channel unit, each first stereo channel unit comprises two first microphone chips, a resistor R6, a resistor R8, a capacitor C34 and a capacitor C35, the two first microphone chips are respectively a first-first microphone chip MIC1 and a first-second microphone chip MIC2, the PDM microphone module (21) is used to collect a target audio signal to the FPGA unit (31), the target audio signal comprising a data signal DATA and a clock signal CLK.

6. The MEMS microphone audio acquisition system for a probe station system according to claim 5, characterized in that: The first microphone chip includes six pins, pin 1 of the first microphone chip MIC1 is electrically connected to resistor R6, pin 1 of the first microphone chip MIC2 is electrically connected to resistor R8, resistor R6 is connected in parallel with resistor R8, that is, data signals DATA of the first microphone chip MIC1 and the first microphone chip MIC2 are connected in parallel and then electrically connected to the FPGA unit (31).

7. The MEMS microphone audio acquisition system for a probe station system according to claim 6, characterized in that: Pin 2 of the first microphone chip MIC1 and pin 4 of the capacitor C34 are electrically connected in sequence, pin 4 and pin 5 of the first microphone chip MIC1 are electrically connected and grounded, and pin 2 of the first microphone chip MIC1 is connected to the second step-down circuit (13) and grounded through the capacitor C34; Pin 2 and pin 4 of the first second microphone chip MIC2 are connected to the second step-down circuit (13) and grounded through a capacitor C35, and pin 5 is grounded; pin 3 of the first first microphone chip MIC1 is connected in parallel with pin 3 of the first second microphone chip MIC2, that is, the clock signals CLK of the first first microphone chip MIC1 and the first second microphone chip MIC2 are connected in parallel and then electrically connected to the FPGA unit (31).

8. The MEMS microphone audio acquisition system for a probe station system according to claim 7, characterized in that: The I2S microphone module (22) comprises at least one second stereo channel unit, each of the second stereo channel units comprises two second microphone chips, a capacitor C38 and a capacitor C39, the two second microphone chips are divided into a second-first microphone chip S1 and a second-second microphone chip S2, the I2S microphone module (22) is used to collect a target audio signal to the FPGA unit (31), the target audio signal comprising a left and right channel data selection signal.

9. The MEMS microphone audio acquisition system for a probe station system according to claim 8, characterized in that: The 4 pins of the second-first microphone chip S1 are connected in parallel with the 4 pins of the second-second microphone chip S2, that is, the clock signals SCK of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel and then electrically connected to the FPGA unit (31); Pin 6 of the second-first microphone chip S1 is connected in parallel with pin 6 of the second-second microphone chip S2, that is, the audio data SD of the second-first microphone chip S1 and the second-second microphone chip S2 are connected in parallel, so that dual-channel transmission can be achieved; Pin 5 of the second microphone chip S1 is connected to the second step-down circuit (13) and grounded via a capacitor C38, and pins 2 and 3 are grounded; Pins 2 and 5 of the second microphone chip S2 are connected to a second step-down circuit (13) and grounded via a capacitor C39, and pin 3 is grounded.

10. The MEMS microphone audio acquisition system for a probe station system according to claim 9, characterized in that: The data interface unit (32) comprises 10 pins, all of which are electrically connected to the FPGA unit (31).

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