Audio module with closed laminated structure

Abstract

The utility model discloses an audio module with a closed laminated structure. The audio module is used for improving the heat dissipation performance and stability of the audio module. The electronic device comprises a metal shell, an upper PCB, a lower PCB and a connecting pin guiding assembly. The upper PCB and the lower PCB are connected and fixed through the connecting guide pin assembly, and the upper PCB and the lower PCB are connected in a parallel laminated mode. The metal shell wraps the outer peripheral surface of the upper PCB and the outer peripheral surface of the lower PCB; a gap part between the upper PCB and the lower PCB is filled with heat-conducting glue; and a gap part between the top plane of the upper PCB and the top plane of the metal shell is filled with sealant.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to an audio module with a closed laminated structure. Background Art

[0002] An audio module is a control circuit module used for network audio transmission. Existing audio modules usually adopt a single-chip double-sided printed circuit board (PCB) structure or a multi-layer PCB structure, that is, the circuit is designed on a PCB board and related components are mounted to meet the function of audio conditioning.

[0003] At present, in the production and processing of audio modules, two methods are usually used to package the audio modules: air-sealed or sealed. When the air-sealed method is used, welding with the shell is usually used for fastening. This method has good heat dissipation, but its overall stability is poor; when the sealed method is used, sealant is usually used for fastening. This method can effectively improve the overall stability of the audio module, but its heat dissipation is poor. It can be seen that under the existing packaging method, it is difficult for the audio module to meet the functional requirements of heat dissipation and stability at the same time. Utility Model Content

[0004] The present application provides an audio module with a closed laminated structure, which can improve the heat dissipation and stability of the audio module.

[0005] The present application provides an audio module of a closed laminated structure, comprising: a metal housing, an upper PCB board, a lower PCB board, and a connecting pin assembly;

[0006] The upper PCB board and the lower PCB board are connected and fixed by the connecting pin assembly, and the upper PCB board and the lower PCB board are connected in parallel stacking;

[0007] The metal shell wraps the outer circumference of the upper PCB board and the lower PCB board;

[0008] The gap between the upper PCB board and the lower PCB board is filled with thermal conductive glue;

[0009] The gap between the top plane of the upper PCB board and the top plane of the metal shell is partially filled with sealant.

[0010] Optionally, the audio module further includes: two high steps and two low steps;

[0011] The two high steps and the two low steps are respectively arranged on the four inner corners of the metal shell, and the two low steps and the two high steps are arranged diagonally. The two low steps are used to support the lower PCB board, and the two high steps are used to support the upper PCB board.

[0012] Optionally, a groove is provided on the high step, and the groove is used to fix the thermal conductive glue and the sealant;

[0013] Optionally, the inner wall of the metal shell is provided with concave and convex points, and the concave and convex points are used to fix the thermal conductive glue and the sealant;

[0014] Optionally, the device-free area and the wiring-free area of ​​the upper PCB board are exposed copper without covering oil or are hollowed out.

[0015] Optionally, the metal shell is in the shape of a semi-enclosed rectangular box with five closed sides and a hollow bottom.

[0016] Optionally, the connecting needle assembly includes 6 connecting needles, namely a first connecting needle, a second connecting needle, a third connecting needle, a fourth connecting needle, a fifth connecting needle and a sixth connecting needle;

[0017] Optionally, the large packaged components mounted on the bottom layer of the upper PCB board and the large packaged components mounted on the top layer of the lower PCB board are arranged in a cross-staggered manner.

[0018] Optionally, the upper PCB board is an audio amplification and conditioning board, and the upper PCB board is provided with two 0805 package capacitors, one 0603 package capacitor, an amplifier chip, two 0402 package capacitors, a voltage regulator diode, two switching diodes, a comparator chip and eleven 0402 package resistors, forming a power supply filter circuit and an output DC isolation processing circuit.

[0019] Optionally, the lower PCB board is a threshold detection enabling board, and is provided with four 10uF 1206 package capacitors, two 0402 package resistors, two 22uF 1206 package capacitors, one 0603 package capacitor, two 0402 package capacitors, two amplifier chips and nine 0402 package resistors, forming an input signal detection circuit, a signal feedback circuit and a delay circuit.

[0020] It can be seen from the above technical solutions that this application has the following effects:

[0021] The upper PCB board and the lower PCB board are connected and fixed by connecting the lead pin assembly, and the upper PCB board and the lower PCB board are connected in parallel lamination; the metal shell wraps the outer peripheral surface of the upper PCB board and the lower PCB board; the gap between the upper PCB board and the lower PCB board is filled with thermal conductive glue; the gap between the top plane of the upper PCB board and the top plane of the metal shell is filled with sealant. In this way, the mounting space of components can be widened by the parallel lamination connection structure of the double PCB boards to reduce the situation that the heat dissipation of the chip is difficult due to the too close arrangement of components on the PCB board, the difficulty of routing and the lack of copper plating area, thereby improving the heat dissipation. By filling the gap between the upper PCB board and the lower PCB board with thermal conductive glue, it can be beneficial to the transfer of heat, and then the heat is dissipated to the surrounding air by the outer metal shell, so as to further improve the heat dissipation. By filling the gap between the top plane of the upper PCB board and the top plane of the metal shell with sealant, the corrosion resistance, mildew resistance, salt spray resistance and the overall stability of the audio module can be improved. As can be seen from the above, the heat dissipation and stability of the audio module can be improved at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of the audio module in this application;

[0023] Figure 2 is a schematic top view of the audio module in this application;

[0024] Figure 3 It is a front view schematic diagram of the audio module in this application;

[0025] Figure 4 is a side view schematic diagram of the audio module in this application;

[0026] Figure 5 This is a top schematic diagram of the lower PCB board in this application;

[0027] Figure 6 This is a bottom schematic diagram of the lower PCB board in this application;

[0028] Figure 7 This is a top schematic diagram of the upper PCB board in this application;

[0029] Figure 8 This is a bottom schematic diagram of the upper PCB board in this application. DETAILED DESCRIPTION

[0030] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only used to illustrate the relative positional relationships between the various components or components, and do not particularly limit the specific installation orientations of the various components or components.

[0031] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0032] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In addition, the structures, proportions, sizes, etc. drawn in the drawings in the present application are only used to match the contents disclosed in the specification for the technical personnel in this field to understand and read, and are not used to limit the restrictive conditions under which the present application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in the present application without affecting the effects and purposes that can be achieved by the present application.

[0034] The present application provides an audio module with a closed laminated structure, which is used to improve the heat dissipation and stability of the audio module.

[0035] See also Figure 1 and Figure 2 As shown, the audio module of the closed laminated structure in this embodiment includes: a metal shell 1, an upper PCB board 2, a lower PCB board 3 and a connecting pin assembly 4; the upper PCB board 2 and the lower PCB board 3 are connected and fixed by the connecting pin assembly 4, and the upper PCB board 2 and the lower PCB board 3 are connected in parallel lamination; the metal shell 1 wraps the outer peripheral surfaces of the upper PCB board 2 and the lower PCB board 3; the gap between the upper PCB board 2 and the lower PCB board 3 is filled with thermal conductive glue; the gap between the top plane of the upper PCB board 2 and the top plane of the metal shell 1 is filled with sealant.

[0036] In this embodiment, according to the packaging structure in the prior art, the component mounting space of the audio module has only two sides. By arranging the upper PCB board 2 and the lower PCB board 3 in parallel and fixing them with the connecting pin assembly 4 to form a double PCB board stacking connection structure, the component mounting space can be increased to 4 sides, thereby effectively widening the component mounting space. By filling the thermal conductive glue between the upper PCB board 2 and the lower PCB board 3, the heat emitted by the components on the double PCB can be effectively conducted to the peripheral metal shell 1. Since the metal has good thermal conductivity, the metal shell 1 can accelerate the temperature exchange between the internal heat and the external air, thereby accelerating the heat dissipation of the double PCB board. It is worth mentioning that the metal shell 1 can be made of copper, aluminum or aluminum alloy materials with good thermal conductivity, and the specific metal material is not limited here. By filling the gap between the top plane of the upper PCB board 2 and the top plane of the metal shell 1 with sealant, the periphery of the entire audio module can be closed to improve the overall stability.

[0037] Optional, see Figure 2 As shown, the audio module in this embodiment also includes: two high steps 5 and two low steps 6; the two high steps 5 and the two low steps 6 are respectively arranged on the four inner corners of the metal shell 1, and the two low steps 6 and the two high steps 5 are arranged diagonally, the two low steps 6 are used to support the lower PCB board 3, and the two high steps 5 are used to support the upper PCB board 2.

[0038] In this embodiment, the shapes of the high step 5 and the low step 6 may be the same or different, but the height of the high step 5 must be higher than the low step 6. Moreover, the heights of the two high steps 5 must be consistent, and the heights of the two low steps 6 must also be consistent. The high steps 5 are arranged diagonally with the high steps 5, and the low steps 6 are arranged diagonally with the low steps 6. The upper PCB board 2 is placed on the two high steps 5 and fixed, and the lower PCB board 3 is placed on the two low steps 6 and fixed. In this way, the distance between the upper PCB board 2 and the lower PCB board 3 can be controlled to prevent the upper PCB board 2 and the lower PCB board 3 from squeezing and rubbing against each other.

[0039] Optional, see Figure 1 As shown, in this embodiment, the high step 5 is provided with a groove, and the groove is used to fix the thermal conductive glue and the sealant;

[0040] Optional, see Figure 1 As shown, the inner wall of the metal shell 1 in this embodiment is provided with concave and convex points, which are used to fix the thermal conductive glue and the sealant;

[0041] In this embodiment, a plurality of grooves can be provided on the column of the high step 5, and the grooves can fix the thermal conductive glue and the sealant to reduce the possibility of loosening. In another possible implementation, a plurality of concave and convex points can be provided on the inner wall of the metal shell 1, and the positions of the concave and convex points are staggered with the positions of the upper PCB board 2 and the lower PCB board 3, and the concave and convex points can also fix the thermal conductive glue and the sealant to reduce the possibility of loosening.

[0042] Optional, see Figure 1 As shown, the device-free area and the wiring-free area of ​​the upper PCB board 2 in this embodiment are exposed copper without covering oil or hollowed-out design.

[0043] In this embodiment, the device-free area is an area on the upper PCB board 2 where no components are mounted, and the routing-free area is an area on the upper PCB board 2 where no routing between any components is arranged. The device-free area and the routing-free area can be exposed copper without covering oil to facilitate heat dissipation. The device-free area and the routing-free area can also be hollowed out to facilitate uniform inflow and full filling of thermal conductive glue and sealant.

[0044] Optional, see Figure 1 As shown, the metal shell 1 in this embodiment is in the shape of a semi-enclosed rectangular box with five closed sides and a hollow bottom.

[0045] In this embodiment, the bottom surface of the metal shell 1 is hollow, and the other five surfaces fully wrap the upper PCB board 2 and the lower PCB board 3, and a gap is left between the bottom surface and the lower PCB board 3 to facilitate the installation and processing of the low step 6.

[0046] Optional, see Figure 2 As shown, the connection lead needle assembly 4 in this embodiment includes 6 connection lead needles, namely a first connection lead needle 41, a second connection lead needle 42, a third connection lead needle 43, a fourth connection lead needle 44, a fifth connection lead needle 45 and a sixth connection lead needle 46;

[0047] In this embodiment, the installation positions of the first connecting pin 41, the second connecting pin 42, the third connecting pin 43, the fourth connecting pin 44, the fifth connecting pin 45 and the sixth connecting pin 46 can be changed and adjusted according to the specific practical application, and the height, structure and size of each connecting pin must be kept consistent to ensure the stability and parallelism between the upper PCB board 2 and the lower PCB board 3.

[0048] Optional, see Figure 3 and Figure 4 As shown, the large packaged components mounted on the bottom layer of the upper PCB board 2 and the large packaged components mounted on the top layer of the lower PCB board 3 in this embodiment are arranged in a staggered manner.

[0049] In this embodiment, the large packaged devices mounted on the bottom layer of the upper PCB board 2 and the large packaged devices mounted on the top layer of the lower PCB board 3 need to be arranged crosswise and staggered to reduce the friction of position conflicts between the packaged devices.

[0050] Optional, see Figure 3 , Figure 4 , Figure 7 and Figure 8 As shown, the upper PCB board 2 in this embodiment is an audio amplifier and conditioning board. The upper PCB board 2 is provided with two 0805 package capacitors 21, one 0603 upper package capacitor 22, one upper amplifier chip 23, two 0402 upper package capacitors 24, one voltage regulator diode 25, two switching diodes 26, one comparator chip 27 and eleven 0402 upper package resistors 28, which constitute a power supply filtering circuit and an output DC isolation processing circuit.

[0051] Optional, see Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the lower PCB board 3 in this embodiment is a threshold detection enabling board, and the lower PCB board 3 is provided with four 10uF 1206 package capacitors 31, two 22uF 1206 package capacitors 32, one 0603 lower package capacitor 33, two 0402 lower package capacitors 34, two lower amplifier chips 35 and nine 0402 lower package resistors 36, which constitute an input signal detection circuit, a signal feedback circuit and a delay circuit.

[0052] In this embodiment, the upper PCB board 2 is used as an audio amplifier and conditioning board, and has a power filter circuit and an output DC isolation process. Two 0805 package capacitors 21 of the upper PCB board 2 form the power filter of the lower PCB board 3, a 0603 upper package capacitor 22 is used as an input signal DC isolation, an upper amplifier chip 23 and two 0402 upper package capacitors 24 are located on the top layer of the upper PCB board 2, a voltage regulator diode 25, two switch diodes 26 and a comparator chip 27 are located on the bottom layer of the upper PCB board 2, and the upper PCB board 2 also has eleven 0402 upper package resistors 28.

[0053] The lower PCB board 3 is used as a threshold detection enabling board, which has an input signal detection circuit, a signal feedback circuit and a delay circuit. The four 10uF 1206 package capacitors 31 on the top layer of the lower PCB board 3 and the two 0402 lower package resistors 36 on the bottom layer form the input power supply filter, and the two 22uF 1206 package capacitors 32 on the top layer are used to isolate the output DC and reduce the mutual interference between the modules when the audio modules are connected in parallel. A 0603 lower package capacitor 33 is used as an input signal DC isolation, two 0402 lower package capacitors 34 are located on the top layer of the upper PCB board 2, and the two lower amplifier chips 35 on the bottom layer are the core functional components of the audio module. The lower PCB board 3 also has nine 0402 lower package resistors 36.

[0054] It is worth mentioning that the positions of the components on the upper and lower PCB boards 3 can be adjusted and placed in different ways and methods. For example, the switching diode 26, the comparator chip 27, the 0402 packaged capacitor 24 and the 0402 packaged resistor 28 of the upper PCB board 211 can be placed on the top layer or the bottom layer of the upper PCB board 2 according to different situations. The voltage regulator diode 25 needs to be staggered with the four 10uF 1206 packaged capacitors 31 and the two 22uF 1206 packaged capacitors 32 of the lower PCB board 3. Any one of the two 22uF 1206 packaged capacitors 32 can be removed, or all can be retained, but at least one needs to be retained.

[0055] In another possible implementation, the detection circuit composed of the comparator chip 27, the amplifier chip 23, the voltage stabilizing diode 25, the switch diode 26, the 0402 package capacitor 24 and the 0402 package resistor 28 can also be a MOS tube switch circuit. When the input signal voltage exceeds a certain threshold, the MOS tube will be turned on to control whether the circuit module is enabled. The enabling detection circuit of the upper PCB board 2 can also be removed, and only the lower PCB board 3 is retained. In this case, the module needs to provide an enabling signal outside.

[0056] In this way, by combining the instrumentation amplifier core circuit and the self-enabling detection circuit, the performance of the audio module is effectively improved and the power consumption of the audio module is reduced. At the same time, the combination of the DC blocking capacitor at the output end and the enabling function effectively prevents mutual influence between modules when multiple modules are connected in parallel.

[0057] It should be stated that the above utility model content and specific implementation methods are intended to demonstrate the practical application of the technical solution provided by this application and should not be interpreted as limiting the scope of protection of this application. Those skilled in the art can make various modifications, equivalent substitutions or improvements within the spirit and principles of this application. The scope of protection of this application shall be subject to the attached claims.

Claims

1. An audio module with a closed laminated structure, characterized in that: include: Metal housing, upper PCB board, lower PCB board and connecting pin assembly; The upper PCB board and the lower PCB board are connected and fixed by the connecting pin assembly, and the upper PCB board and the lower PCB board are connected in parallel stacking; The metal shell wraps the outer circumference of the upper PCB board and the lower PCB board; The gap between the upper PCB board and the lower PCB board is filled with thermal conductive glue; The gap between the top plane of the upper PCB board and the top plane of the metal shell is partially filled with sealant.

2. The audio module according to claim 1, characterized in that: The audio module further comprises: two high steps and two low steps; The two high steps and the two low steps are respectively arranged on the four inner corners of the metal shell, and the two low steps and the two high steps are arranged diagonally. The two low steps are used to support the lower PCB board, and the two high steps are used to support the upper PCB board.

3. The audio module according to claim 2, characterized in that: The high step is provided with a groove, and the groove is used to fix the heat conductive glue and the sealant.

4. The audio module according to claim 2, characterized in that: The inner wall of the metal shell is provided with concave and convex points, and the concave and convex points are used to fix the thermal conductive glue and the sealing glue.

5. The audio module according to claim 1, characterized in that: The device-free area and the wiring-free area of ​​the upper PCB board are exposed copper without covering oil or are hollowed out.

6. The audio module according to claim 1, characterized in that: The metal shell is in the shape of a semi-enclosed rectangular box with five closed sides and a hollow bottom.

7. The audio module according to claim 1, characterized in that: The connecting needle assembly includes 6 connecting needles, namely a first connecting needle, a second connecting needle, a third connecting needle, a fourth connecting needle, a fifth connecting needle and a sixth connecting needle.

8. The audio module according to claim 1, characterized in that: The large packaged components mounted on the bottom layer of the upper PCB board and the large packaged components mounted on the top layer of the lower PCB board are arranged in a cross-staggered manner.

9. The audio module according to any one of claims 1 to 8, characterized in that: The upper PCB board is an audio amplifier and conditioning board. The upper PCB board is provided with two 0805 package capacitors, one 0603 upper package capacitor, one upper amplifier chip, two 0402 upper package capacitors, one voltage regulator diode, two switching diodes, one comparator chip and eleven 0402 upper package resistors, forming a power supply filtering circuit and an output DC isolation processing circuit.

10. The audio module according to any one of claims 1 to 8, characterized in that: The lower PCB board is a threshold detection enabling board, and is provided with four 10uF 1206 package capacitors, two 22uF 1206 package capacitors, one 0603 lower package capacitor, two 0402 lower package capacitors, two lower amplifier chips and nine 0402 lower package resistors, forming an input signal detection circuit, a signal feedback circuit and a delay circuit.

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