Single-piece double-lap type photovoltaic module
By designing a single-chip double-fit structure and a specific jumper connection method in the photovoltaic module, the problems of excessive solder and low thermal escape ability during the welding process are solved, and higher thermal escape ability and overload current ability are achieved.
Patent Information
- Application Number
- CN202421377449.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-17
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-17
AI Technical Summary
Existing photovoltaic modules are prone to excessive soldering during the soldering process, resulting in dummy soldering, and the single-piece single-fit design leads to chip overload current and low thermal escape ability.
A single-chip double-match photovoltaic module is designed, which uses a rectangular projection at the inner end of the positive electrode sheet and a U-shaped notch at the inner end of the negative electrode sheet. The jumper is connected to the chip in the middle, and the two ends are connected to the U-shaped notch at the negative electrode sheet. A tin overflow hole and a stress removal hole are designed in the middle of the jumper.
Through this design, the welding contact area is increased, the chip's overload current capability is improved, and the thermal escape capability is enhanced. The maximum current can reach 35A and the thermal escape capability is increased by 1.5 times.
Smart Images
Figure CN222764213U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of photovoltaic modules, in particular to a single-chip double-mounted photovoltaic module. Background Art
[0002] Photovoltaic module is a device that converts solar energy into electrical energy. It is mostly used in situations where solar power generation is used, such as solar power plants, solar street lights, etc.
[0003] In the past, when soldering the jumper wires on the chips of photovoltaic modules, it was easy for too much solder to be generated between the jumper wire and the chip, resulting in cold solder joints. In addition, the jumper wire design was single-chip and single-stack, with the other end of the jumper wire connected to the end of the other pole piece. The chip was prone to overload current, and the maximum current during thermal runaway was only 2.2-2.4A, with poor thermal runaway capability. Summary of the invention
[0004] In order to solve the above technical problems, the utility model proposes a single-chip double-mounted photovoltaic module, which has an ingenious design, a reasonable and compact structure, and adopts a single-chip double-mounted method to improve the thermal escape capability.
[0005] The technical solution of this utility model:
[0006] A single-chip double-mounted photovoltaic module comprises a positive electrode sheet, a negative electrode sheet, a chip, a jumper and a plastic package body. A rectangular convex piece is designed at the inner end of the positive electrode sheet, a U-shaped notch is designed at the inner end of the negative electrode sheet, the rectangular convex piece of the positive electrode sheet is located in the U-shaped notch of the negative electrode sheet, a chip is welded on the rectangular convex piece, both sides of the jumper are welded on both sides of the U-shaped notch, and the middle of the jumper is welded on the chip. The jumper is designed to be a long sheet and arc convex pieces are respectively designed on both sides of the middle. A center hole is opened in the middle of the jumper, and two through holes are respectively designed on both sides of the jumper near the middle position; the plastic package body is plastic-wrapped around the rectangular convex piece of the positive electrode sheet, the U-shaped notch of the negative electrode sheet, the chip and the outer side of the jumper; the thickness of the jumper is set to 0.7±0.05mm.
[0007] The center hole is a tin overflow hole.
[0008] The through hole is designed as a stress relief hole.
[0009] Tin blocks are welded on the positive electrode sheet and the negative electrode sheet near the middle.
[0010] The positive electrode sheet and the negative electrode sheet are respectively provided with folded edges folded downward.
[0011] The roots of both sides of the folded edge are connected to the positive electrode sheet or the negative electrode sheet so as to be respectively provided with stress relief notches.
[0012] The outer edge of the rectangular protrusion is designed with a wave-like notch, and the inner side of the U-shaped notch of the negative electrode sheet is designed with a wave-like notch.
[0013] A rectangular groove is designed on the positive electrode sheet near the plastic package body, and a rectangular groove is also designed on the negative electrode sheet near the plastic package body.
[0014] The middle of the jumper is designed to be an upwardly arched trapezoidal shape, and a groove is also designed around the upper end of the center hole.
[0015] The plastic package body is designed to have the same thickness above and below the positive electrode sheet and the negative electrode sheet. There are ejector pin marks on the upper and lower parts of the plastic package body, and the cavity number is designed in the ejector pin mark at the bottom.
[0016] The advantages of the utility model are ingenious design, reasonable and compact structure, single-chip double-lap method, and a tin overflow hole in the center of the jumper to prevent the tin from overflowing when the amount of soldering tin is too large, thereby increasing the soldering contact area and increasing the chip overload current; for chips of the same size, the thermal escape capability is enhanced by 1.5 times; the jumper stress relief hole reduces the soldering thermal stress. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a top view schematic diagram of the utility model.
[0018] Figure 2 It is a side schematic diagram of the utility model.
[0019] Figure 3 It is a three-dimensional schematic diagram of the utility model. DETAILED DESCRIPTION
[0020] Refer to the attached Figure 1-3 A single-chip double-mounted photovoltaic module includes a positive electrode sheet 1, a negative electrode sheet 2, a chip 3, a jumper 4, and a plastic package 5. A rectangular convex piece 11 is designed at the inner end of the positive electrode sheet 1, and a U-shaped notch 21 is designed at the inner end of the negative electrode sheet 2. The rectangular convex piece 11 of the positive electrode sheet 1 is located in the U-shaped notch 21 of the negative electrode sheet 2. A chip 3 is welded on the rectangular convex piece 11. The two sides of the jumper 4 are welded on both sides of the U-shaped notch 21 and the middle of the jumper 4 is welded on the chip 3. The jumper 4 is designed as a long sheet and arc-shaped convex pieces are designed on both sides of the middle. A center hole 41 is opened in the middle of the jumper 4, and two through holes 42 are designed on both sides of the jumper 4 near the middle position; the plastic package 5 is plastic-wrapped around the rectangular convex piece 11 of the positive electrode sheet 1, the U-shaped notch 21 of the negative electrode sheet 2, the chip 3, and the outer side of the jumper 4; the thickness of the jumper 4 is set to 0.7±0.05mm. The jumper thickness design improves the thermal runaway performance of the chip.
[0021] The center hole 41 is a solder overflow hole. The middle of the jumper 4 is designed to be an upwardly arched trapezoidal shape, and a groove 43 is designed around the upper end of the center hole 41. The groove is designed to prevent excess solder from overflowing from the center hole into the groove. This welding method ensures a more solid welding, increases the welding contact area, and increases the chip overload current.
[0022] The through hole 42 is designed as a stress relief hole to improve the strength of the jumper and prevent deformation.
[0023] Tin blocks 6 are welded on the positive electrode sheet 1 and the negative electrode sheet 2 near the middle.
[0024] The positive electrode sheet 1 and the negative electrode sheet 2 are respectively provided with downwardly folded edges 7. The folded edge design can better dissipate heat.
[0025] The roots of both sides of the folded edge 7 are connected to the positive electrode sheet 1 or the negative electrode sheet 2 so as to be provided with stress relief notches 8 respectively.
[0026] The outer edge of the rectangular protrusion 11 is designed with a wave-shaped notch 9, and the inner side of the U-shaped notch 21 of the negative electrode sheet 2 is designed with a wave-shaped notch 9. The wave-shaped notch is designed to increase the overall strength of the plastic package after plastic packaging.
[0027] A rectangular groove 10 is designed on the positive electrode sheet 1 near the plastic package 5 , and a rectangular groove 10 is also designed on the negative electrode sheet 2 near the plastic package 5 .
[0028] The plastic seal body is designed to have the same thickness on the upper and lower sides of the positive and negative electrodes, and there are ejector pin marks on the upper and lower sides of the plastic seal body, and the cavity number is designed in the ejector pin mark at the bottom. The thickness of the plastic seal body is designed to be consistent on the upper and lower sides of the positive and negative electrodes, reflecting a 1:1 design, enhancing the strength of the plastic seal body, and ensuring zero damage to the product molding; the cavity number is for the convenience of later product defective product traceability analysis.
[0029] When the utility model is used, the jumper adopts a single-piece double-lap method, that is, the middle of the jumper is connected to the positive electrode sheet where the chip is located, and the two ends of the jumper are respectively connected to the two sides of the U-shaped notch of the negative electrode sheet at the same time. The center hole of the jumper is a tin overflow hole to prevent the tin from overflowing when the amount of welding tin is too large, thereby increasing the welding contact area and increasing the overload current of the chip; two through holes are designed on both sides of the middle of the jumper as stress relief holes to reduce welding thermal stress; for chips of the same size, the thermal escape capability is enhanced by 1.5 times; the thermal escape can carry a maximum current of 35A.
Claims
1. A single-chip double-mounted photovoltaic module, comprising a positive electrode sheet, a negative electrode sheet, a chip, a jumper and a plastic package, characterized in that: A rectangular convex piece is designed at the inner end of the positive electrode sheet, and a U-shaped notch is designed at the inner end of the negative electrode sheet. The rectangular convex piece of the positive electrode sheet is located in the U-shaped notch of the negative electrode sheet, a chip is welded on the rectangular convex piece, both sides of the jumper are welded on both sides of the U-shaped notch, and the middle of the jumper is welded on the chip. The jumper is designed as a long strip and arc-shaped convex pieces are designed on both sides of the middle. A center hole is opened in the middle of the jumper, and two through holes are designed on both sides of the jumper near the middle position; the plastic package body is wrapped around the rectangular convex piece of the positive electrode sheet, the U-shaped notch of the negative electrode sheet, the chip and the outside of the jumper; the thickness of the jumper is set to 0.7±0.05mm.
2. A single-chip double-mounted photovoltaic module according to claim 1, characterized in that: The center hole is a tin overflow hole.
3. A single-chip double-mounted photovoltaic module according to claim 1, characterized in that: The through hole is designed as a stress relief hole.
4. A single-chip double-mounted photovoltaic module according to claim 1, characterized in that: Tin blocks are welded on the positive electrode sheet and the negative electrode sheet near the middle.
5. A single-chip double-mounted photovoltaic module according to claim 1, characterized in that: The positive electrode sheet and the negative electrode sheet are respectively provided with folded edges folded downward.
6. A single-chip double-mounted photovoltaic module according to claim 5, characterized in that: The roots of both sides of the folded edge are connected to the positive electrode sheet or the negative electrode sheet so as to be respectively provided with stress relief notches.
7. The monolithic double-mounted photovoltaic module according to claim 1, characterized in that: The outer edge of the rectangular protrusion is designed with a wave-like notch, and the inner side of the U-shaped notch of the negative electrode sheet is designed with a wave-like notch.
8. The monolithic double-mounted photovoltaic module according to claim 1, characterized in that: A rectangular groove is designed on the positive electrode sheet near the plastic package body, and a rectangular groove is also designed on the negative electrode sheet near the plastic package body.
9. The single-chip double-mounted photovoltaic module according to claim 1, characterized in that: The middle of the jumper is designed to be an upwardly arched trapezoidal shape, and a groove is also designed around the upper end of the center hole.
10. The monolithic double-mounted photovoltaic module according to claim 1, characterized in that: The plastic package body is designed to have the same thickness above and below the positive electrode sheet and the negative electrode sheet. There are ejector pin marks on the upper and lower parts of the plastic package body, and the cavity number is designed in the ejector pin mark at the bottom.