Thin film battery laser etching machine

Abstract

The utility model provides a laser etching machine for a thin film battery, and relates to the technical field of laser etching machines. The thin film battery laser etching machine comprises a base, an etching machine body and a magnetic suspension planar motor, the etching machine body and the magnetic suspension planar motor are both arranged on the base, the etching machine body is used for carrying out laser etching on a substrate, the magnetic suspension planar motor is used for bearing and transporting the substrate, and the requirement for higher motion precision can be met.

Description

Technical Field

[0001] The present application relates to the technical field of laser etcher, and in particular to a thin film battery laser etcher. Background Art

[0002] As the large-area process of perovskite batteries matures and efficiency continues to increase, the trend of industrialization is unstoppable. Existing laser etching equipment uses air flotation devices or linear guides to transport substrates when working on a large area, but the maximum motion accuracy of this transportation method can only reach the micron level, which cannot meet higher motion accuracy requirements. Utility Model Content

[0003] The purpose of the present application includes, for example, providing a thin film battery laser etcher that can meet higher motion accuracy requirements.

[0004] This application can be implemented as follows:

[0005] The present application provides a thin-film battery laser etcher, which includes a base, an etcher body and a magnetically levitated planar motor, wherein the etcher body and the magnetically levitated planar motor are both arranged on the base, the etcher body is used for laser etching a substrate, and the magnetically levitated planar motor is used for carrying and transporting the substrate.

[0006] Optionally, the magnetic levitation planar motor includes a coil array stage and a permanent magnet array stage, the permanent magnet array stage is arranged on the base, the permanent magnet array stage extends along a horizontal plane, and the coil array stage is used to carry a substrate.

[0007] Optionally, the permanent magnet array platform is a Halbach array, and the coil array platform is provided with a first thrust coil and a second thrust coil which are parallel to a horizontal plane and arranged perpendicularly to each other. The coil array platform and the permanent magnet array platform cooperate to generate magnetic levitation force and thrust force, so that the coil array platform can realize six-degree-of-freedom movement on the permanent magnet array platform.

[0008] Optionally, the number of the coil array platforms is one or more. When the number of the coil array platforms is plural, the multiple coil array platforms are arranged on the permanent magnet array platform at intervals.

[0009] Optionally, electromagnetic induction devices for generating electricity are provided on both sides of the base.

[0010] Optionally, the etcher body includes a laser module and a laser etching head, the laser module is arranged on the base, and the laser module is used to transmit laser to the laser etching head.

[0011] Optionally, the laser module includes a laser and a lens module, the laser is disposed on the base, and the laser is used to transmit laser light to the laser etching head through the lens module.

[0012] Optionally, the lens module includes a beam expander, a first reflector and a second reflector, the laser etching head includes a third reflector and a beam splitter, the laser is used to emit laser light to the substrate through the beam expander, the first reflector, the second reflector, the third reflector and the beam splitter in sequence, and the beam splitter is used to split the laser into several laser beams to etch the substrate.

[0013] Optionally, the etcher body includes a first cover body, a second cover body and a third cover body, the first cover body, the second cover body and the third cover body are all arranged on the base, the first cover body covers the collimator and the first reflector, the second cover body covers the second reflector, and the third cover body covers the third reflector and the beam splitter.

[0014] Optionally, the etcher body further comprises a connecting cover with openings at both ends, the two ends of the connecting cover respectively connect the first cover body and the second cover body, and the first cover body, the second cover body and the third cover body are all provided with through holes for the laser to pass through.

[0015] Optionally, the etcher body further includes a linear motor, which is disposed on the base and connected to the laser etching head to drive the laser etching head to move in a horizontal direction.

[0016] Optionally, a dust extraction system is provided on the etcher body, and the dust extraction system is used to receive waste generated by etching.

[0017] Optionally, a CCD camera for photographing the substrate is disposed on the base.

[0018] Optionally, spectrometers are provided on both sides of the etcher body along the horizontal direction of the base.

[0019] The beneficial effects of the thin film battery laser etcher of the present application include, for example: in order to meet the higher motion accuracy requirements, a thin film battery laser etcher is designed, the thin film battery laser etcher includes a base, an etcher body and a magnetic levitation planar motor, the etcher body and the magnetic levitation planar motor are both arranged on the base, the etcher body is used to perform laser etching on the substrate, and the magnetic levitation planar motor is used to carry and transport the substrate. When the substrate needs to be laser etched, the substrate is placed on the magnetic levitation planar motor, and the substrate is transported to the etcher body by the magnetic levitation planar motor for laser etching. The magnetic levitation planar motor does not require mechanical support, air floating support and other physical structures during the transportation of the substrate. There is no mechanical contact between the relatively moving parts of the magnetic levitation planar motor, and it has nanometer-level motion accuracy, which can meet relatively higher precision requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the overall structure of a thin-film battery laser etcher in an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the partial structure of the thin-film battery laser etcher in the embodiment of the present application.

[0023] Icons: 100-base; 110-substrate; 120-support base; 200-etching machine body; 210-laser module; 211-laser; 212-beam expander; 213-first reflector; 214-second reflector; 215-third reflector; 216-beam splitter; 220-first cover; 230-second cover; 240-third cover; 250-connecting cover; 260-linear motor; 300-magnetic levitation planar motor; 310-coil array stage; 320-permanent magnet array stage; 400-substrate; 500-CCD camera; 600-electromagnetic induction device. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, it is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0028] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0029] It should be noted that, in the absence of conflict, the features in the embodiments of the present application may be combined with each other.

[0030] The inventor of the present application has found that the existing laser etching equipment uses air flotation devices or linear guides to transport substrates when working on a large area, but the maximum motion accuracy of this transportation method can only reach the micron level and cannot meet the higher motion accuracy requirements. The embodiment of the present application provides a thin film battery laser etcher, which is at least used to solve this technical problem.

[0031] Please refer to Figure 1 , Figure 2 The thin-film battery laser etcher provided in the embodiment of the present application includes a base 100, an etcher body 200 and a magnetic levitation planar motor 300. The etcher body 200 and the magnetic levitation planar motor 300 are both arranged on the base 100. The etcher body 200 is used to laser etch a substrate 400, and the magnetic levitation planar motor 300 is used to carry and transport the substrate 400.

[0032] The base 100 includes a substrate 110 and a support base 120 disposed on the substrate 110. The substrate 110 and the support base 120 are made of marble and have high structural stability. The support base 120 is in a "door" shape. A part of the etching machine body 200 is disposed on the substrate 110, and another part is disposed on the support base 120. The magnetic levitation planar motor 300 is disposed on the substrate 110 and can carry and transport the substrate 400. The substrate 400 is processed by laser etching, coating and other processes to form a thin film battery.

[0033] When the substrate 400 needs to be laser etched, the substrate 400 is placed on the magnetic levitation planar motor 300, and the substrate 400 is transported to the etcher body 200 by the magnetic levitation planar motor 300 for laser etching. The magnetic levitation planar motor 300 does not require physical structures such as mechanical support and air floating support during the transportation of the substrate 400. There is no mechanical contact between the relatively moving parts of the magnetic levitation planar motor 300, and it has nanometer-level motion accuracy, which can meet relatively higher precision requirements.

[0034] In this embodiment, the magnetic levitation planar motor 300 includes a coil array stage 310 and a permanent magnet array stage 320 . The permanent magnet array stage 320 is disposed on the base 100 and extends along a horizontal plane. The coil array stage 310 is used to carry the substrate 400 .

[0035] The permanent magnet array platform 320 is a Halbach array, and the coil array platform 310 is provided with a first thrust coil and a second thrust coil which are parallel to the horizontal plane and arranged perpendicularly to each other. The coil array platform 310 and the permanent magnet array platform 320 cooperate to generate magnetic levitation force and thrust force, so that the coil array platform 310 can achieve six degrees of freedom movement on the permanent magnet array platform 320.

[0036] The permanent magnet array stage 320 passes through the "gate"-shaped support seat 120. As the permanent magnet array stage 320 applies magnetic force to the coil array stage 310, the coil array stage 310 is driven to pass through the etcher body 200, thereby facilitating the etcher body 200 to laser-etch the substrate 400 on the coil array stage 310.

[0037] It should be noted that the coil array stage 310 is also called a mover, and the permanent magnet array stage 320 is also called a stator. The permanent magnet array stage 320 uses the same electromagnetic energy to suspend the coil array stage 310 and can push the coil array stage 310 to move. The coil array stage 310 can obtain six degrees of freedom of movement in the magnetic suspension space. There is no mechanical contact between the permanent magnet array stage 320 and the coil array stage 310, and there is no wear and tear between them, and no abrasive particles will be generated. The movement accuracy can reach the nanometer level, and the cleaning and maintenance requirements can be greatly reduced. Compared with the method of using the magnetic suspension planar motor 300 to transport the substrate 400 in this embodiment, there is a mechanical connection between the existing linear guide rail and the carrier carrying the substrate 400, which will be subject to errors caused by friction vibration, etc.; the air floating support requires continuous introduction of gas with a stable pressure to ensure the stability of the carrier, and the air flow itself is a relatively difficult object to control. The height of the air floating and the disturbance of the gas will affect the movement accuracy.

[0038] In this embodiment, the number of the coil array stage 310 is one or more. When the number of the coil array stage 310 is more than one, the plurality of coil array stages 310 are arranged at equal intervals on the permanent magnet array stage 320 .

[0039] It should be noted that the horizontal movement range of the coil array stage 310 can be expanded as the area of ​​the permanent magnet array stage 320 is expanded. In order to meet the production cycle requirements, multiple coil array stages 310 can be evenly spaced on the permanent magnet array stage 320, and a substrate 400 is placed on each coil array stage 310. After the laser etching is completed, the substrate 400 on each coil array stage 310 only needs to be transported to the next process. Of course, when only one substrate 400 needs to be laser etched, it is sufficient to set one coil array stage 310 on the permanent magnet array stage 320.

[0040] Electromagnetic induction devices 600 for power generation are arranged on both sides of the base 100. The magnetic lines of force of the substrate 400 passing through the electromagnetic induction devices 600 change, thereby generating electromotive force to generate electricity for recovering electric energy for driving the magnetic levitation planar motor 300.

[0041] In this embodiment, the etcher body 200 includes a laser module 210 and a laser etching head. The laser module 210 is disposed on the base 100 , and the laser module 210 is used to transmit laser light to the laser etching head.

[0042] It should be pointed out that part of the laser module 210 is arranged on the substrate 110, and the other part is arranged on the support base 120. When the substrate 400 is laser-etched, a magnetic force is first applied to the coil array stage 310 through the permanent magnet array stage 320 to move the coil array stage 310 to the bottom of the laser etching head, and then the laser is transmitted to the laser etching head through the laser module 210, and then the laser etching head emits laser to etch the substrate 400.

[0043] In this embodiment, the laser module 210 includes a laser 211 and a lens module. The laser 211 is disposed on the base 100 . The laser 211 is used to transmit laser light to the laser etching head through the lens module.

[0044] It should be pointed out that the laser 211 is divided into two parts, one is arranged on the substrate 110, the other is arranged on the support seat 120. When the substrate 400 is laser-etched, the laser 211 emits laser light to the laser etching head through the lens module, and then the laser etching head emits laser light to etch the substrate 400.

[0045] In this embodiment, the lens module includes a beam expander 212, a first reflector 213 and a second reflector 214, and the laser etching head includes a third reflector 215 and a beam splitter 216. The laser 211 is used to emit laser light to the substrate 400 through the beam expander 212, the first reflector 213, the second reflector 214, the third reflector 215 and the beam splitter 216 in sequence, and the beam splitter 216 is used to split the laser into several laser beams to etch the substrate 400.

[0046] It should be pointed out that the beam expander 212 is arranged on the substrate 110, and can play a role in expanding the light spot; the first reflector 213 is arranged on the substrate 110, and the second reflector 214, the third reflector 215 and the beam splitter 216 are all arranged on the support seat 120, the second reflector 214 is located directly above the first reflector 213, the third reflector 215 is located on one side of the second reflector 214, and the third reflector 215 and the second reflector 214 are at the same height, and the beam splitter 216 is located directly below the third reflector 215. The beam splitter 216 can play a role in splitting a laser beam into multiple light beams, thereby improving work efficiency.

[0047] When laser etching is performed on the substrate 400, the laser emitted by the laser 211 is first expanded by the beam expander 212, and the expanded laser is reflected upward to the second reflector 214 through the first reflector 213. The second reflector 214 then reflects the laser to one side to the third reflector 215, and the third reflector 215 then reflects the laser downward to the beam splitter 216. Finally, the beam splitter 216 splits a beam of laser into multiple beams and emits them to the surface of the substrate 400 to etch the substrate 400.

[0048] In this embodiment, the etching machine body 200 includes a first cover body 220, a second cover body 230 and a third cover body 240. The first cover body 220, the second cover body 230 and the third cover body 240 are all arranged on the base 100. The first cover body 220 covers the collimator 212 and the first reflector 213, the second cover body 230 covers the second reflector 214, and the third cover body 240 covers the third reflector 215 and the beam splitter 216.

[0049] It should be pointed out that the first cover body 220 is arranged on the substrate 110, the second cover body 230 and the third cover body 240 are arranged on the support base 120, the first cover body 220 covers the beam expander 212 and the first reflector 213, the second cover body 230 covers the second reflector 214, and the third cover body 240 covers the third reflector 215 and the beam splitter 216. When the laser 211 emits a laser, the first cover body 220, the second cover body 230 and the third cover body 240 can block the laser, which can protect the staff to a certain extent.

[0050] In this embodiment, the etcher body 200 also includes a connecting cover 250 with openings at both ends. The two ends of the connecting cover 250 are respectively connected to the first cover body 220 and the second cover body 230. The first cover body 220, the second cover body 230 and the third cover body 240 are all provided with through holes for the laser to pass through.

[0051] The connecting cover 250 is cylindrical. When the laser emitted by the laser 211 is transmitted between the beam expander 212, the first reflector 213 and the second reflector 214, the first cover body 220, the second cover body 230 and the connecting cover 250 can block the laser. When the laser is transmitted between the third reflector 215 and the beam splitter 216, the third cover body 240 can block the laser, which can protect the staff to a certain extent.

[0052] In this embodiment, the etcher body 200 further includes a linear motor 260 . The linear motor 260 is disposed on the base 100 . The linear motor 260 is connected to the laser etching head to drive the laser etching head to move in a horizontal direction.

[0053] The linear motor 260 is arranged on the support seat 120, the third reflector 215 and the beam splitter 216 are connected to the linear motor 260 through a bracket, and the third cover 240 is fixed to the bracket, so that when the linear motor 260 is running, it can drive the third reflector 215 and the beam splitter 216 to move in the horizontal direction, thereby adjusting the etching position of the substrate 400.

[0054] In this embodiment, a dust extraction system is provided on the etcher body 200, and the dust extraction system is used to receive waste generated by etching to keep the etched workpiece clean.

[0055] In this embodiment, a CCD camera 500 for photographing the substrate 400 is disposed on the base 100 to feed back position information of the substrate 400 .

[0056] It should be noted that the CCD camera 500 is disposed on the substrate 110 and is used to photograph the substrate 400 and provide real-time feedback of the position information of the substrate 400. By observing the position information of the substrate 400, it can be determined whether the substrate 400 is located at a suitable processing position.

[0057] Along the horizontal direction of the base 100, spectrometers are arranged on both sides of the etcher body 200, and the spectrometers are used to observe the spectral absorption changes of the substrate 400 so as to monitor the etching effect in real time.

[0058] The beneficial effects of the thin-film battery laser etcher provided in the embodiment of the present application include at least: compared with the method of transporting the substrate 400 by an air flotation device or a linear guide rail, the solution of using a magnetic levitation planar motor 300 to carry and transport the substrate 400 can improve the movement accuracy from the micron level to the nanometer level; the use of the magnetic levitation planar motor 300 eliminates the mechanical guide components, greatly reducing the cleaning and maintenance requirements; the permanent magnet array table 320 has strong expandability, and by extending the permanent magnet array table 320 along the processing direction of the substrate 400, it is convenient to directly transfer the substrate 400 to the next process after the laser etching process is completed, and multiple coil array tables 310 can also be placed on the permanent magnet array table 320 to meet the production rhythm requirements.

[0059] In summary, the embodiment of the present application provides a thin-film battery laser etcher. When the substrate 400 needs to be laser etched, the substrate 400 is placed on the coil array table 310 of the magnetic levitation planar motor 300. The permanent magnet array table 320 exerts a magnetic force on the coil array table 310 to transport the substrate 400 to the bottom of the laser etching head for laser etching. Since there is no mechanical contact between the permanent magnet array table 320 and the coil array table 310, there is no wear between them and no abrasive particles are generated. The movement accuracy can reach the nanometer level, and the cleaning and maintenance requirements can be greatly reduced.

[0060] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A thin film battery laser etching machine, characterized in that: It includes a base, an etcher body and a magnetic levitation planar motor. The etcher body and the magnetic levitation planar motor are both arranged on the base. The etcher body is used for laser etching a substrate, and the magnetic levitation planar motor is used for carrying and transporting the substrate.

2. The thin film battery laser etching machine according to claim 1, characterized in that: The magnetic levitation planar motor comprises a coil array stage and a permanent magnet array stage. The permanent magnet array stage is arranged on the base and extends along a horizontal plane. The coil array stage is used to carry a substrate.

3. The thin film battery laser etching machine according to claim 2, characterized in that: The permanent magnet array platform is a Halbach array, and the coil array platform is provided with a first thrust coil and a second thrust coil which are parallel to a horizontal plane and arranged perpendicularly to each other. The coil array platform and the permanent magnet array platform cooperate to generate magnetic levitation force and thrust force, so that the coil array platform can realize six-degree-of-freedom movement on the permanent magnet array platform.

4. The thin-film battery laser etching machine according to claim 2, characterized in that: The number of the coil array platforms is one or more. When the number of the coil array platforms is plural, the plurality of coil array platforms are arranged on the permanent magnet array platform at intervals.

5. The thin-film battery laser etching machine according to claim 1, characterized in that: Electromagnetic induction devices for power generation are arranged on both sides of the base.

6. The thin-film battery laser etching machine according to claim 1, characterized in that: The etcher body comprises a laser module and a laser etching head. The laser module is arranged on the base, and the laser module is used to transmit laser to the laser etching head.

7. The thin-film battery laser etching machine according to claim 6, characterized in that: The laser module includes a laser and a lens module. The laser is arranged on the base. The laser is used to transmit laser light to the laser etching head through the lens module.

8. The thin-film battery laser etching machine according to claim 7, characterized in that: The lens module includes a beam expander, a first reflector, and a second reflector. The laser etching head includes a third reflector and a beam splitter. The laser is used to emit laser light to the substrate through the beam expander, the first reflector, the second reflector, the third reflector, and the beam splitter in sequence. The beam splitter is used to split the laser light into several laser beams to etch the substrate.

9. The thin-film battery laser etching machine according to claim 8, characterized in that: The etching machine body includes a first cover body, a second cover body and a third cover body. The first cover body, the second cover body and the third cover body are all arranged on the base. The first cover body covers the collimator and the first reflector, the second cover body covers the second reflector, and the third cover body covers the third reflector and the beam splitter.

10. The thin-film battery laser etching machine according to claim 9, characterized in that: The etcher body further comprises a connecting cover with openings at both ends, wherein the two ends of the connecting cover are respectively connected to the first cover body and the second cover body, and the first cover body, the second cover body and the third cover body are all provided with through holes for laser to pass through.

11. The thin-film battery laser etching machine according to claim 6, characterized in that: The etcher body further comprises a linear motor, which is arranged on the base and connected to the laser etching head to drive the laser etching head to move in a horizontal direction.

12. The thin-film battery laser etching machine according to claim 1, characterized in that: The etcher body is provided with a dust extraction system, and the dust extraction system is used to receive waste generated by etching.

13. The thin-film battery laser etching machine according to claim 1, characterized in that: The base is provided with a CCD camera for photographing the substrate to feed back the position information of the substrate.

14. The thin-film battery laser etching machine according to claim 1, characterized in that: Spectrometers are arranged on both sides of the etcher body along the horizontal direction of the base.

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