Laser processing device and system

Abstract

The utility model provides a laser processing device and system. The laser processing device comprises a heat insulation cavity, a laser reflection assembly, a laser detection assembly and a heat insulation plate. A to-be-machined workpiece is placed in the heat insulation cavity. The laser reflection assembly is used for reflecting the incident laser to a to-be-processed workpiece in the heat insulation cavity; the laser detection assembly is arranged above the heat insulation cavity, an observation through hole is formed in the top of the heat insulation cavity, and the laser detection assembly is arranged towards the observation through hole so as to detect laser energy on the workpiece to be machined; according to the invention, the real-time temperature of the workpiece to be processed can be detected through the laser detection assembly, so that the power of the laser can be adjusted according to the detected real-time temperature; in addition, heat insulation plates are laid around the periphery of the heat insulation cavity, so that the laser detection assembly can be effectively protected, and normal work of the laser detection assembly is ensured.

Description

Technical Field

[0001] The present application belongs to the field of wafer technology, and in particular, relates to a laser processing device and system. Background Art

[0002] With the rapid development of semiconductor technology, wafers, as the basic materials of integrated circuits, have a vital impact on the development of the entire semiconductor industry in terms of processing accuracy and efficiency. Laser processing technology has been widely used in the field of wafer processing due to its significant advantages such as high precision, high efficiency, and low damage. Laser processing technology uses the high energy density, high directionality, and high brightness of laser beams to convert light energy into heat energy to perform cutting, welding, surface treatment, and other processing on materials. Laser processing technology can achieve micron-level or even nanometer-level processing accuracy, which is of great significance for improving the quality and performance of wafers.

[0003] During wafer processing, laser processing equipment needs to precisely control the energy density and irradiation time of the laser beam to achieve precise processing of the wafer surface. However, due to the high laser energy, the heat generated during the processing is difficult to effectively control, which can easily cause the surface temperature of a certain part of the wafer to be too high, thus affecting the processing quality and performance of the wafer.

[0004] Therefore, how to improve the control accuracy of laser energy is a problem that technicians in this field currently need to solve. Utility Model Content

[0005] The purpose of the present application is to provide a laser processing device and system, aiming to solve the problem of low control accuracy of laser energy.

[0006] A first aspect of an embodiment of the present application provides a laser processing device, comprising:

[0007] A heat-insulating chamber, wherein the heat-insulating chamber is used for placing a workpiece to be processed;

[0008] A laser reflection component, used for reflecting incident laser light onto the workpiece to be processed in the heat-insulating chamber;

[0009] A laser detection assembly is arranged above the heat-insulating chamber, an observation through hole is arranged on the top of the heat-insulating chamber, and the laser detection assembly is arranged toward the observation through hole to detect the laser energy on the workpiece to be processed;

[0010] A heat insulation board is laid around the four sides of the heat insulation chamber.

[0011] In some embodiments of the present application, the heat-insulating chamber includes a bottom plate and a side plate arranged around the bottom plate, and the bottom plate and the side plate enclose an inner space of the heat-insulating chamber;

[0012] The bottom plate is a heating plate, and the bottom plate is configured to heat the workpiece to be processed during laser processing of the workpiece to be processed.

[0013] In some embodiments of the present application, a first groove is provided on the bottom plate, and the first groove is used to accommodate the workpiece to be processed.

[0014] In some embodiments of the present application, a first cooling water channel is provided on the heat insulation board, and the first cooling water channel is provided on the heat insulation board in an S shape to cool the heat insulation board.

[0015] In some embodiments of the present application, at least two through holes are arranged at intervals on the heat insulation board; the laser processing device further comprises a frame, the frame comprises a first fixing plate arranged at intervals above the heat insulation board, at least two fixing columns are arranged on the first fixing plate, and at least two of the fixing columns correspond to at least two of the through holes one by one;

[0016] The heat insulation board is configured to pass through the through hole through a screw and be threadedly connected to the fixing column, and the screw can be rotated to adjust the distance between the heat insulation board and the fixing column.

[0017] In some embodiments of the present application, the laser detection component includes a spot camera and a first displacement component, the spot camera is used to obtain a spot image of the workpiece to be processed, the first displacement component is connected to the spot camera, the first displacement component is arranged on the first fixed plate, and is used to adjust the position of the spot camera relative to the workpiece to be processed.

[0018] In some embodiments of the present application, the laser reflection component includes:

[0019] a first reflector, the first reflector being used to receive externally input laser light and reflect the laser light along a first optical path, wherein the first optical path is perpendicular to the heat shield;

[0020] a second reflector, the second reflector being used to reflect the laser light on the first optical path and reflect the laser light along a second optical path, wherein an angle between the first optical path and the second optical path is an obtuse angle;

[0021] a third reflector, the third reflector being used to reflect the laser light on the second optical path and reflect the laser light along a third optical path, wherein an angle between the third optical path and the second optical path is an obtuse angle;

[0022] A focusing mirror, which is used to reflect the laser light on the third optical path and focus the reflected laser light onto the workpiece to be processed;

[0023] Wherein, the first reflector, the second reflector and the third reflector are plane mirrors; and the focusing mirror is a concave mirror.

[0024] In some embodiments of the present application, the laser reflection assembly further includes a second displacement assembly, and the second displacement assembly is used to rotate the focusing mirror.

[0025] In some embodiments of the present application, the laser processing device further includes a frame, the frame includes a second fixing plate spaced apart and arranged above the heat insulation plate; the laser reflection assembly further includes a reflection chamber, the first reflection mirror, the second reflection mirror and the third reflection mirror are all arranged in the reflection chamber;

[0026] At least two fixing rods are arranged on the outer top wall of the reflection chamber, and the fixing rods are connected to the second fixing plate. At least two of the fixing rods are configured to be telescopically arranged to adjust the angle between the reflection chamber and the second fixing plate.

[0027] In a second aspect, the present application also provides a laser processing system, comprising the above-mentioned laser processing device.

[0028] Compared with the prior art, the beneficial effects of the embodiments of the utility model are as follows: the above-mentioned laser processing device and system, the laser processing device includes a heat-insulating chamber, a laser reflecting component, a laser detecting component and a heat-insulating plate; the heat-insulating chamber is used to place the workpiece to be processed; the laser reflecting component is used to reflect the incident laser to the workpiece to be processed in the heat-insulating chamber; the laser detecting component is arranged above the heat-insulating chamber, and an observation through hole is arranged on the top of the heat-insulating chamber, and the laser detecting component is arranged toward the observation through hole to detect the laser energy on the workpiece to be processed; the present application can detect the laser energy distribution of the workpiece to be processed by the laser detecting component, so as to adjust the power and position of the laser according to the detected laser energy distribution; the present application can also effectively protect the laser detecting component by arranging the heat-insulating plate to be laid around the four sides of the heat-insulating chamber to ensure the normal operation of the laser detecting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of a laser processing device provided in one embodiment of the present application;

[0030] Figure 2 An embodiment of the present application provides Figure 1 Schematic diagram of the local A enlarged structure;

[0031] Figure 3 An embodiment of the present application provides Figure 1 Schematic diagram of the local B enlarged structure;

[0032] Figure 4A schematic diagram of the structure of a laser processing device provided in one embodiment of the present application;

[0033] Figure 5 An embodiment of the present application provides Figure 4 Schematic diagram of the local C enlarged structure;

[0034] Figure 6 An embodiment of the present application provides Figure 4 Schematic diagram of the local D enlarged structure.

[0035] Specific element symbol description: 100-insulation chamber, 110-observation hole, 120-side plate, 130-bottom plate, 200-laser reflection assembly, 210-first reflection mirror, 220-second reflection mirror, 230-third reflection mirror, 240-focusing mirror, 250-second displacement assembly, 300-laser detection assembly, 310-spot camera, 320-first displacement assembly, 400-insulation board, 500-frame, 510-first fixed plate, 511-fixed column, 520-second fixed plate, 521-fixed rod. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0037] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the terms "length", "width", "up", "down", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] It is important to know that with the rapid advancement of semiconductor technology, the processing accuracy and efficiency of wafers, as the core material for integrated circuit manufacturing, have become key factors in driving the entire semiconductor industry forward. In this era of pursuing higher integration, smaller size and more excellent performance, traditional processing systems have gradually been unable to meet the growing manufacturing needs. At this time, laser processing technology has been widely used in the field of wafer processing with its unique advantages of high precision, high efficiency and low damage.

[0041] The reason why laser processing technology can occupy an important position in wafer processing is mainly due to its unique processing principle. This technology uses the high energy density, high directionality and high brightness of the laser beam to efficiently convert light energy into heat energy, and then perform fine processing such as cutting, welding, and surface treatment on the wafer. This processing method is not only fast, but also can achieve micron-level or even nano-level processing accuracy, providing unprecedented possibilities for wafer manufacturing.

[0042] However, laser processing technology also faces some challenges during wafer processing. Due to the high laser energy, if the heat generated during the processing cannot be effectively controlled, it may cause the surface temperature of part of the wafer to be too high. This high temperature state will not only affect the processing accuracy, but may also cause thermal damage to the wafer material, thereby reducing its performance and reliability. Therefore, how to accurately control the energy density and irradiation time of the laser beam to ensure that the processing process is carried out within the appropriate temperature range has become an urgent problem to be solved in the field of wafer processing.

[0043] Therefore, the present application improves the relevant laser processing devices and systems based on this.

[0044] See also Figure 1 and Figure 2 , Figure 1 FIG. 1 shows a schematic structural diagram of a laser processing device provided in this embodiment. Figure 2 This embodiment provides Figure 1 A schematic diagram of the enlarged structure of local A of the present embodiment. A laser processing device and system, the laser processing device includes a heat-insulating chamber 100, a laser reflecting assembly 200, a laser detecting assembly 300 and a heat-insulating plate 400; the heat-insulating chamber 100 is used to place the workpiece to be processed; the laser reflecting assembly 200 is used to reflect the incident laser to the workpiece to be processed in the heat-insulating chamber; the laser detecting assembly 300 is arranged above the heat-insulating chamber 100, and the top of the heat-insulating chamber 100 is provided with an observation through hole 110, and the laser detecting assembly 300 is arranged toward the observation through hole 110 to detect the laser energy on the workpiece to be processed; the heat-insulating plate 400 is laid around the heat-insulating chamber 100.

[0045] It should be explained that the heat-insulating chamber 100 can be made of a material that is resistant to high temperatures and has good heat-insulating properties, ensuring that external heat can be effectively isolated during laser processing while reducing internal heat loss. The laser reflection component 200 generally includes a plurality of high-precision mirrors or lenses, which can guide the laser beam to the workpiece to be processed in the heat-insulating chamber according to a set path. The laser detection component 300 can detect the laser spot on the workpiece to be processed to detect the laser energy.

[0046] In current laser processing devices, it is easy for the local laser energy to be too large, resulting in damage to the workpiece. However, the present application can detect the real-time temperature of the workpiece to be processed through the laser detection component 300, so as to adjust the power of the laser according to the detected real-time temperature; the present application also provides a heat insulation board 400 to be laid around the heat insulation chamber 100, which can effectively protect the laser detection component 300 to ensure the normal operation of the laser detection component 300.

[0047] In some embodiments of this application, please continue to refer to Figure 2 The heat-insulating chamber 100 of this embodiment includes a bottom plate 130 and a side plate 120 arranged around the bottom plate 130, and the bottom plate 130 and the side plate 120 enclose an inner space of the heat-insulating chamber 100; the bottom plate 130 is a heating plate, and the bottom plate 130 is configured to heat the workpiece to be processed during laser processing of the workpiece to be processed.

[0048] Specifically, the heating plate can heat the wafer during the processing to prevent it from being broken due to excessive temperature difference during laser processing, and at the same time can deepen the heating depth of the wafer by the laser.

[0049] In some embodiments of the present application, a first groove is provided on the bottom plate 130, and the first groove is used to accommodate the workpiece to be processed. It should be explained that the bottom plate 130 is usually made of a strong and stable material, such as metal or engineering plastic. The first groove is designed according to the size and shape of the workpiece to be processed to ensure that the workpiece can be firmly placed in the groove, reducing vibration and displacement during the processing.

[0050] In some embodiments of the present application, a first cooling water channel is provided on the heat insulation board 400, and the first cooling water channel is provided on the heat insulation board 400 in an S shape to cool the heat insulation board 400. The heat insulation board 400 is mainly used to block the temperature on the heating plate and the wafer from being transferred upward to prevent high temperature from affecting the operation of the sensors above. The first cooling water channel inside the heat insulation board 400 reduces the temperature by passing cooling water.

[0051] In some embodiments of this application, please refer to Figure 3 , Figure 3 This embodiment provides Figure 1Schematic diagram of the enlarged structure of the local B; the heat insulation board 400 of this embodiment is provided with at least two through holes at intervals; the laser processing device also includes a frame 500, the frame 500 includes a first fixed plate 510 arranged above the heat insulation board 400 at intervals, the first fixed plate 510 is provided with at least two fixed columns 511, and the at least two fixed columns 511 correspond to the at least two through holes one by one; wherein the heat insulation board 400 is configured to be threadedly connected to the fixed columns 511 through the through holes through a screw member, and the screw member can be rotated to adjust the distance between the heat insulation board 400 and the fixed columns 511. In this way, the pitch and height of the entire heat insulation board 400 can be adjusted through the pitch adjustment rod (fixed column 511).

[0052] In some embodiments of this application, please refer to Figure 4 and Figure 5 , Figure 4 FIG. 1 shows a schematic structural diagram of a laser processing device provided in this embodiment. Figure 5 This embodiment provides Figure 4 Schematic diagram of the local C enlarged structure. The laser detection component 300 of this embodiment includes a spot camera 310 and a first displacement component 320. The spot camera 310 is used to obtain the spot image of the workpiece to be processed. The first displacement component 320 is connected to the spot camera 310. The first displacement component 320 is set on the first fixed plate 510 and is used to adjust the position of the spot camera 310 relative to the workpiece to be processed. The spot analysis uses a spot camera 310 (CCD) to sample and analyze the laser spot to monitor the spot. The entire CCD is installed on an XY translation stage (first displacement component 320) to facilitate alignment of the laser spot.

[0053] In some embodiments, the laser processing device also includes a high and low temperature sensor, which can monitor the temperature of the workpiece before and during processing, so as to facilitate changing the energy of the laser at any time to increase or decrease the surface temperature of the wafer, thereby achieving a certain temperature uniformity of the wafer surface.

[0054] In some embodiments of this application, please continue to refer to Figure 4 Also see Figure 6 , Figure 6 This embodiment provides Figure 4Schematic diagram of the local C enlarged structure; the laser reflecting component 200 of this embodiment includes a first reflecting mirror 210, a second reflecting mirror 220, a third reflecting mirror 230 and a focusing mirror 240; the first reflecting mirror 210 is used to receive external laser input and reflect the laser along a first optical path, and the first optical path is perpendicular to the heat insulation board 400; the second reflecting mirror 220 is used to reflect the laser on the first optical path and reflect the laser along the second optical path, and the angle between the first optical path and the second optical path is an obtuse angle; the third reflecting mirror 230 is used to reflect the laser on the second optical path and reflect the laser along the third optical path, and the angle between the third optical path and the second optical path is an obtuse angle; the focusing mirror 240 is used to reflect the laser on the third optical path and focus the reflected laser on the workpiece to be processed; wherein the first reflecting mirror 210, the second reflecting mirror 220 and the third reflecting mirror 230 are plane mirrors; and the focusing mirror 240 is a concave mirror.

[0055] It should be explained that the three plane reflectors are mainly used to guide the laser, and the first reflector 210 is installed on a three-dimensional adjustment frame to facilitate the alignment of the laser.

[0056] In some embodiments, a second cooling water circuit is provided on the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240, and the second cooling water circuit can cool the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240 to prevent the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240 from heating up after absorbing part of the laser and causing deformation of the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240.

[0057] In some embodiments, temperature sensors are provided on the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240, which can monitor the temperatures of the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240 at any time to prevent the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240 from deforming due to high temperature and affecting the stability of the laser. A temperature sensor is also installed on the mounting plate on which the polarizer is mounted to monitor its temperature at any time.

[0058] In some embodiments of this application, please continue to refer to Figure 6 The laser reflection assembly 200 of this embodiment further includes a second displacement assembly 250, which is used to rotate the focusing mirror 240. The second displacement assembly 250 of this embodiment is a focusing motor module, and the translation motor module of the focusing mirror 240 is installed on the focusing motor module, which is convenient for adjusting the focal length by focusing the focusing mirror 240; the rotating motor module and the translation motor module are mainly used to align the laser focus position.

[0059] In some embodiments of this application, please continue to refer to Figure 6 The laser processing device of this embodiment also includes a frame 500, and the frame 500 includes a second fixed plate 520 spaced apart above the heat insulation plate 400; the laser reflection assembly 200 also includes a reflection chamber, and the first reflection mirror 210, the second reflection mirror 220 and the third reflection mirror 230 are all arranged in the reflection chamber; at least two fixing rods 521 are arranged on the outer top wall of the reflection chamber, and the fixing rods 521 are connected to the second fixed plate 520, and at least two fixing rods 521 are configured so that the fixing rods 521 can be retracted to adjust the angle between the reflection chamber and the second fixed plate 520.

[0060] It should be explained that the entire laser reflection assembly 200 is fixed on the mounting plate by a plurality of fixing rods 521, so that the entire optical path can be adjusted up and down and in pitch.

[0061] In some embodiments, the laser processing device also includes a third displacement component, which can move the wafer in the XY direction, can realize the transportation and movement of the wafer, and can also cooperate with the laser to realize rapid scanning and heating of the wafer surface.

[0062] In some embodiments, an air inlet is provided on the reflection chamber for introducing nitrogen; on the one hand, a positive pressure can be generated in the chamber to prevent unclean gas outside the chamber from entering; on the other hand, the oxidation rate of the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240 in the chamber can be slowed down, thereby increasing the service life of the first reflector 210, the second reflector 220, the third reflector 230 and the focusing mirror 240.

[0063] In some embodiments, the laser processing device also includes a laser rangefinder, which can be used to conveniently detect the thickness of the wafer before processing, and then change the laser focus position to adapt to the heating requirements of wafers of different thicknesses.

[0064] In some embodiments, the laser processing device also includes a reflective light well, which is arranged on the side of the insulation chamber 100 away from the laser reflection component 200; since the laser is not completely absorbed when it hits the wafer, part of the laser will be reflected, so a laser light well is added to absorb the reflected laser to prevent damage to other components.

[0065] Furthermore, in order to better implement the laser processing device in any of the above embodiments, based on the above laser processing device, the present application also provides a laser processing system, including the above laser processing device.

[0066] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0067] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0068] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0069] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus facilitate the understanding of one or more utility model embodiments, in the foregoing description of the embodiments of this application, multiple features are sometimes grouped into one embodiment, drawing, or description thereof. However, this disclosure system does not mean that the subject matter of this application requires more features than those mentioned in the claims. In fact, the features of an embodiment are less than all the features of a single embodiment disclosed above.

[0070] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A laser processing device, characterized in that: include: A heat-insulating chamber, wherein the heat-insulating chamber is used for placing a workpiece to be processed; A laser reflection component, used for reflecting incident laser light onto the workpiece to be processed in the heat-insulating chamber; A laser detection assembly is arranged above the heat-insulating chamber, an observation through hole is arranged on the top of the heat-insulating chamber, and the laser detection assembly is arranged toward the observation through hole to detect the laser energy on the workpiece to be processed; A heat insulation board is laid around the four sides of the heat insulation chamber.

2. The laser processing device according to claim 1, characterized in that: The heat-insulating chamber comprises a bottom plate and a side plate arranged around the bottom plate, wherein the bottom plate and the side plate enclose an inner space of the heat-insulating chamber; The bottom plate is a heating plate, and the bottom plate is configured to heat the workpiece to be processed during laser processing of the workpiece to be processed.

3. The laser processing device according to claim 2, characterized in that: The bottom plate is provided with a first groove portion, and the first groove portion is used for accommodating the workpiece to be processed.

4. The laser processing device according to any one of claims 1 to 3, characterized in that: The heat insulation board is provided with a first cooling water channel, and the first cooling water channel is provided on the heat insulation board in an S shape to cool the heat insulation board.

5. The laser processing device according to claim 4, characterized in that: At least two through holes are arranged at intervals on the heat insulation board; the laser processing device further comprises a frame, the frame comprises a first fixing plate arranged at intervals above the heat insulation board, at least two fixing columns are arranged on the first fixing plate, and at least two of the fixing columns correspond to at least two of the through holes one by one; The heat insulation board is configured to pass through the through hole through a screw and be threadedly connected to the fixing column, and the screw can be rotated to adjust the distance between the heat insulation board and the fixing column.

6. The laser processing device according to claim 5, characterized in that: The laser detection component includes a spot camera and a first displacement component, the spot camera is used to obtain the spot image of the workpiece to be processed, the first displacement component is connected to the spot camera, the first displacement component is set on the first fixed plate, and is used to adjust the position of the spot camera relative to the workpiece to be processed.

7. The laser processing device according to claim 1, characterized in that: The laser reflection component comprises: a first reflector, the first reflector being used to receive externally input laser light and reflect the laser light along a first optical path, wherein the first optical path is perpendicular to the heat shield; a second reflector, the second reflector being used to reflect the laser light on the first optical path and reflect the laser light along a second optical path, wherein an angle between the first optical path and the second optical path is an obtuse angle; a third reflector, the third reflector being used to reflect the laser light on the second optical path and reflect the laser light along a third optical path, wherein an angle between the third optical path and the second optical path is an obtuse angle; A focusing mirror, which is used to reflect the laser light on the third optical path and focus the reflected laser light onto the workpiece to be processed; Wherein, the first reflector, the second reflector and the third reflector are plane mirrors; and the focusing mirror is a concave mirror.

8. The laser processing device according to claim 7, characterized in that: The laser reflection assembly further comprises a second displacement assembly, and the second displacement assembly is used for rotating the focusing mirror.

9. The laser processing device according to claim 7, characterized in that: The laser processing device further includes a frame, wherein the frame includes a second fixing plate spaced apart and arranged above the heat insulation plate; the laser reflection assembly further includes a reflection chamber, wherein the first reflection mirror, the second reflection mirror and the third reflection mirror are all arranged in the reflection chamber; At least two fixing rods are arranged on the outer top wall of the reflection chamber, and the fixing rods are connected to the second fixing plate. At least two of the fixing rods are configured to be telescopically arranged to adjust the angle between the reflection chamber and the second fixing plate.

10. A laser processing system, characterized in that: A laser processing device comprising the laser processing device according to any one of claims 1 to 9.

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