Double-plate thermal printing head with superposed structure and capable of realizing standardized production

Abstract

The utility model discloses a double-plate thermal printing head with a superposed structure and capable of realizing standardized production, and belongs to the technical field of thermal printing heads. Comprising a ceramic substrate and a PCB, the lower surface of one end of the ceramic substrate is fixed to the upper surface of one end of the PCB in a lap joint mode, a control chip is arranged on the PCB, the control chip is electrically connected with the PCB and an electrode, a resistance heating body is connected with the electrode and located on a ground coat layer of the ceramic substrate, and a protection layer is arranged outside the resistance heating body. The PCB conveying jig has the advantages that the PCB is used for replacing a heat dissipation plate to serve as a conveying carrier, the specifications and the sizes of the PCBs are uniform, therefore, conveying operation in the process can be achieved only through the conveying jig of the same specification, production cost is reduced, and meanwhile production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a double-plate thermal printing head with a superimposed structure which can realize standardized production and belongs to the technical field of thermal printing heads. Background Art

[0002] The existing dual-board thermal print head, that is, the thermal print head of PCB + ceramic substrate, the PCB and the ceramic substrate are on the same plane (such as Figure 1 As shown in the figure, the two are difficult to fix, and need to be fixed by a heat sink, and then used as a carrier to transport them to subsequent processing stations. The heat sinks are not uniform in shape and size, and cannot be produced in a standardized manner. Different jigs need to be used for transportation, which increases production costs. In addition, the switching of jigs wastes time, resulting in a decrease in overall production efficiency. Utility Model Content

[0003] In order to solve the defects of the prior art, the purpose of the utility model is to provide a double-plate thermal print head with a superimposed structure that can achieve standardized production, reduce production costs and improve production efficiency.

[0004] The technical solution of the utility model is: a double-plate thermal print head with a superimposed structure that can achieve standardized production, including a ceramic substrate and a PCB, wherein the lower surface of one end of the ceramic substrate is overlapped and fixed to the upper surface of one end of the PCB, a control chip is provided on the PCB, the control chip is electrically connected to the PCB and electrodes, a resistance heating element is connected to the electrodes, the resistance heating element is located on the bottom glaze layer of the ceramic substrate, and a protective layer is provided on the outside of the resistance heating element.

[0005] The ceramic substrate and the overlapping surface of the PCB are bonded and fixed by double-sided adhesive.

[0006] The control chip is packaged on the PCB by packaging resin.

[0007] The control chip is electrically connected to the PCB and the electrodes through gold wires.

[0008] The PCB 4 and the ceramic substrate 1 are bonded and fixed on the heat sink 3 .

[0009] The beneficial effects of the utility model are: using PCB instead of heat sink as a conveying carrier, the PCB specifications and sizes are unified, so only the same specification of conveying fixtures are needed to realize the conveying operation in the process, realize standardized operation, reduce production costs and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 Schematic diagram of the existing dual-plate thermal print head structure;

[0011] Figure 2It is a structural schematic diagram of the utility model.

[0012] The reference numerals in the figure are as follows: 1. ceramic substrate, 2. double-sided tape, 3. heat sink, 4. PCB, 5. gold wire, 6. packaging resin, 7. control chip. DETAILED DESCRIPTION

[0013] The following is combined with Figure 2 The utility model is further described as follows:

[0014] A double-plate thermal print head with a superimposed structure that can be produced in a standardized manner, comprising a ceramic substrate 1 and a PCB4, wherein the lower surface of one end of the ceramic substrate 1 overlaps the upper surface of one end of the PCB4, the overlapping surfaces of the ceramic substrate 1 and the PCB4 are bonded and fixed by double-sided tape 2, a control chip 7 is encapsulated on the PCB4 by an encapsulation resin 6, the control chip 7 is electrically connected to the PCB4 and electrodes by gold wires 5, the encapsulation resin 6 is used to protect the control chip 7 and the gold wires, a resistive heating element is connected to the electrode, the resistive heating element is located on the bottom glaze layer of the ceramic substrate 1, a protective layer is provided on the outside of the resistive heating element, the PCB4 and the ceramic substrate 1 are bonded and fixed on a heat sink 3, and excess heat generated during printing is conducted through the heat sink 3.

[0015] PCB4 adopts a uniform size and shape design. Before processing, PCB4 and the ceramic substrate 1 are first bonded and fixed as a whole, with PCB4 as a conveying carrier. In this way, a corresponding set of conveying channels can be used to complete the conveying operation during the processing, thereby realizing the standardized operation of the processing equipment. After the processing is completed, the bonded ceramic substrate 1 and PCB4 are bonded and fixed to heat sinks 3 of different forms.

[0016] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A double-plate thermal print head with a superimposed structure capable of achieving standardized production, characterized in that: The invention comprises a ceramic substrate (1) and a PCB (4), wherein the lower surface of one end of the ceramic substrate (1) is overlapped and fixed to the upper surface of one end of the PCB (4), a control chip (7) is provided on the PCB (4), the control chip (7) is electrically connected to the PCB (4) and an electrode, a resistance heating element is connected to the electrode, the resistance heating element is located on the bottom glaze layer of the ceramic substrate (1), and a protective layer is provided on the outside of the resistance heating element.

2. A double-plate thermal print head with a superimposed structure capable of achieving standardized production according to claim 1, characterized in that: The overlapping surfaces of the ceramic substrate (1) and the PCB (4) are bonded and fixed by means of double-sided adhesive (2).

3. A double-plate thermal print head with a superimposed structure capable of achieving standardized production according to claim 1, characterized in that: The control chip (7) is packaged on the PCB (4) via a packaging resin (6).

4. A double-plate thermal print head with a stacked structure capable of achieving standardized production according to claim 1, characterized in that: The control chip (7) is electrically connected to the PCB (4) and the electrodes via gold wires (5).

5. A double-plate thermal print head with a stacked structure capable of achieving standardized production according to claim 1, characterized in that: The PCB (4) and the ceramic substrate (1) are bonded and fixed on the heat dissipation plate (3).

Images