Tray module for transferring panels

Abstract

A tray module for transferring a panel is provided. The tray module includes: a tray accommodating a plurality of target panels, each of the plurality of target panels having a front surface displaying an image and a rear surface opposite to the front surface, and including circuit components disposed on the rear surface; and a buffer sheet having a multi-layer structure and disposed between a first target panel and a second target panel which are sequentially stacked among the plurality of target panels. The buffer sheet may include: a first sheet disposed on a rear surface of the first target panel, and in which a cut-out portion corresponding to the circuit component is defined; and a second sheet disposed directly on the first sheet and covering a front surface of the second target panel.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0085069, filed on June 30, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure herein relates to a pallet module for transferring a panel, and more particularly, to a pallet module for transferring a panel including a cushion sheet having a multi-layer structure. Background Art

[0004] The pallet for transferring the target panel is used to stack and store at least one target panel or transfer the target panel between operations in the process. In order to reduce costs, a plurality of target panels are stacked in the pallet for storage and transfer.

[0005] When a plurality of target panels are stacked and stored, a buffer pad for reducing impact is provided between the plurality of target panels to prevent the target panels from being damaged. Here, a component (such as a flexible circuit board) provided on one surface of the target panel may directly contact the buffer pad. Utility Model Content

[0006] The present disclosure provides a pallet module for transferring panels, the pallet module including a buffer sheet for preventing damage caused by contact and collision between a plurality of target panels when the plurality of target panels are stacked.

[0007] The present disclosure provides a tray module for transferring a panel, in which a cutoff portion corresponding to a circuit component is defined in a buffer sheet to prevent the circuit component from being damaged due to contact and collision between the circuit component and the buffer sheet.

[0008] The embodiment of the present disclosure provides a tray module for transferring a panel, the tray module comprising: a tray, the tray accommodating a plurality of target panels, each of the plurality of target panels having a front surface for displaying an image and a rear surface opposite to the front surface, and comprising a circuit component disposed on the rear surface; and a buffer sheet having a multilayer structure and disposed between a first target panel and a second target panel stacked sequentially among the plurality of target panels. The buffer sheet comprises: a first sheet, the first sheet being disposed on the rear surface of the first target panel, and a truncation portion corresponding to the circuit component being defined in the first sheet; and a second sheet, the second sheet being directly disposed on the first sheet and covering the front surface of the second target panel.

[0009] In an embodiment, in cross section, the first sheet has a thickness equal to or greater than a thickness of the circuit component.

[0010] In an embodiment, the first sheet includes: a first covering layer; a first foam coating, the first foam coating being directly disposed on the first covering layer; and a second covering layer, the second covering layer being directly disposed on the first foam coating, wherein the first foam coating has a thickness greater than a thickness of each of the first covering layer and the second covering layer.

[0011] In an embodiment, the first foam coating has a thickness of 0.2 mm to 20 mm, and each of the first cover layer and the second cover layer has a thickness of 10 μm to 12 μm.

[0012] In an embodiment, the first foam coating has a thickness greater than a thickness of each of the first cover layer and the second cover layer.

[0013] In an embodiment, the first foam coating has a thickness of 0.2 mm to 20 mm.

[0014] In an embodiment, each of the first cover layer and the second cover layer is a polyethylene film.

[0015] In an embodiment, each of the first cover layer and the second cover layer has a thickness of 10 μm to 12 μm.

[0016] In an embodiment, the second sheet includes: a third covering layer, which is directly disposed on the second covering layer; a second foam coating, which is directly disposed on the third covering layer; and a fourth covering layer, which is directly disposed on the second foam coating, wherein the second foam coating has a thickness of 0.2 mm to 20 mm.

[0017] In an embodiment, the second foam coating has a thickness of 0.2 mm to 20 mm.

[0018] In an embodiment, the tray includes: a first accommodation space in which a plurality of target panels are accommodated; and a second accommodation space spaced apart from the first accommodation space. The plurality of target panels are sequentially stacked inside each of the first accommodation space and the second accommodation space.

[0019] In an embodiment, the first sheet comprises: a first covering layer; and a first foam coating, the first foam coating being directly disposed on the first covering layer, wherein the second sheet comprises: a second covering layer, the second covering layer being directly disposed on the first foam coating; a second foam coating, the second foam coating being directly disposed on the second covering layer; and a third covering layer, the third covering layer being directly disposed on the second foam coating.

[0020] In an embodiment, the second sheet includes: a second cover layer, the second cover layer is directly disposed on the first foam coating; a second foam coating, the second foam coating is directly disposed on the second cover layer; and a third cover layer, the third cover layer is directly disposed on the second foam coating.

[0021] In an embodiment of the present disclosure, a tray module for transferring a panel includes: a tray accommodating a plurality of target panels, each of the plurality of target panels having a front surface displaying an image and a rear surface opposite to the front surface, and including a circuit component disposed on the rear surface; and a buffer sheet having a multilayer structure and disposed between a first target panel and a second target panel stacked sequentially among the plurality of target panels. The buffer sheet includes: a first sheet including a first sheet portion overlapping with the circuit component and having a shape corresponding to the circuit component and a second sheet portion not overlapping with the circuit component and disposed on the front surface of the second target panel; and a second sheet, the second sheet being directly disposed on the first sheet and only overlapping with the second sheet portion.

[0022] In an embodiment, a run-off portion having a shape corresponding to the first sheet portion is defined in the second sheet.

[0023] In an embodiment, the first sheet includes: a first covering layer; a first foam coating, the first foam coating is directly disposed on the first covering layer; and a second covering layer, the second covering layer is directly disposed on the first foam coating, wherein the second sheet includes: a third covering layer, the third covering layer is directly disposed on the second covering layer; a second foam coating, the second foam coating is directly disposed on the third covering layer; and a fourth covering layer, the fourth covering layer is directly disposed on the second foam coating.

[0024] In an embodiment, the second sheet includes: a third cover layer disposed directly on the second cover layer; a second foam coating disposed directly on the third cover layer; and a fourth cover layer disposed directly on the second foam coating.

[0025] In an embodiment, the second sheet includes: a second foam coating layer disposed directly on the second cover layer; and a third cover layer disposed directly on the second foam coating layer.

[0026] In an embodiment, each of the first cover layer and the second cover layer may be a polyethylene film. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. In the drawings:

[0028] Figure 1 is a perspective view of a tray module for transferring panels according to an embodiment of the present disclosure;

[0029] Figure 2 is a plan view of a target panel according to an embodiment of the present disclosure;

[0030] Figure 3 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure;

[0031] Figure 4A and Figure 4B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure;

[0032] Figure 5 is a cross-sectional view of a stacked target panel and a buffer sheet according to an embodiment of the present disclosure;

[0033] Figure 6 is a cross-sectional view of a buffer sheet according to an embodiment of the present disclosure;

[0034] Figure 7 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure;

[0035] Fig. 8A and Figure 8B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure;

[0036] Fig. 9 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure;

[0037] Fig. 10A and Fig. 10B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure; and

[0038] Fig.11 is a cross-sectional view of a stacked target panel and a buffer sheet according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0039] It will be understood that when an element (or region, layer, section, etc.) is referred to as being "on", "connected to" or "coupled to" another element, it can be directly disposed on, connected to or coupled to the other element, or a third intervening element may be disposed between the elements.

[0040] Throughout the text, the same reference numerals or symbols refer to the same elements. In addition, in the drawings, in order to effectively describe the technical content, the thickness, ratio and size of the elements are exaggerated. The term "and / or" includes one or more combinations that can be limited by the relevant elements.

[0041] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates otherwise.

[0042] In addition, terms such as "below", "below", "on", and "above" are used to explain the relationship of elements shown in the drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0043] It will be further understood that terms such as “include” or “have” when used in this document specify the presence of stated features, numbers, steps, operations, elements, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, parts, or combinations thereof.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0045] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0046] Figure 1 is a perspective view of a tray module for transferring a panel according to an embodiment of the present disclosure.

[0047] refer to Figure 1 The tray module TRM for transferring the panel may include a tray TR and a buffer sheet CP. A plurality of target panels DP may be accommodated in the tray TR. The buffer sheet CP may be disposed between the plurality of target panels DP to prevent the plurality of target panels DP from being damaged due to impact applied to the plurality of target panels DP.

[0048] Figure 1 The top direction and bottom direction of the tray module TRM for transferring panels illustrated in the figure are indicated by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and may be changed to other directions. In the present disclosure, the state "when viewed on a plane" may mean the state when viewed in the third direction DR3. In addition, the "thickness direction" may mean the third direction DR3.

[0049] The tray TR may include a receiving part SP and a protrusion PP protruding from the receiving part SP. Receiving spaces SF1 and SF2 for receiving the target panel DP may be defined in the receiving part SP. The protrusion PP may protrude along the upper edge of the receiving part SP in the third direction DR3 as the top direction. The receiving spaces SF1 and SF2 may be defined by the protrusion PP and the receiving part SP.

[0050] The accommodation spaces SF1 and SF2 may include a first accommodation space SF1 and a second accommodation space SF2 (hereinafter, for convenience of explanation, the accommodation space SFn and the nth accommodation space SFn indicate the same features and are not particularly distinguished in description). The first accommodation space SF1 and the second accommodation space SF2 may be disposed to be spaced apart from each other on a plane. Figure 1 An example of the accommodation spaces SF1 and SF2 is illustrated, and the number of the accommodation spaces SF1 and SF2 is not limited thereto. For example, the accommodation space may include eight accommodation spaces spaced apart from each other inside the tray TR.

[0051] A plurality of target panels DP may be stacked in sequence in each of the first accommodation space SF1 and the second accommodation space SF2. The first target panel DP1 and the second target panel DP2 may be stacked and accommodated in the first accommodation space SF1. The third target panel DP3 and the fourth target panel DP4 may be stacked and accommodated in the second accommodation space SF2. The first buffer sheet CP1 may be disposed between the first target panel DP1 and the second target panel DP2. The second buffer sheet CP2 may be disposed above the second target panel DP2. The third buffer sheet CP3 may be disposed between the third target panel DP3 and the fourth target panel DP4. The fourth buffer sheet CP4 may be disposed above the fourth target panel DP4. Figure 1 An example of a plurality of target panels DP and a buffer sheet CP accommodated inside the accommodating spaces SF1 and SF2 is illustrated, and the number of the plurality of target panels DP and the number of the plurality of buffer sheets CP accommodated inside each of the accommodating spaces SF1 and SF2 may be changed as needed.

[0052] The workbenches STG1 and STG2 may be respectively disposed in the accommodation spaces SF1 and SF2 as the inner spaces of the accommodation part SP. The workbenches STG1 and STG2 may include a first workbenches STG1 and a second workbenches STG2 (hereinafter, for the convenience of explanation, the workbenches STGn and the nth workbenches STGn indicate the same features and are not particularly distinguished in the description). The first workbenches STG1 may be disposed inside the first accommodation space SF1, and the second workbenches STG2 may be disposed inside the second accommodation space SF2.

[0053] A receiving surface on which the target panel is placed may be defined on each of the worktables STG1 and STG2. The receiving surface may be parallel to a plane defined by the first direction DR1 and the second direction DR2. In an embodiment, the worktables STG1 and STG2 may be omitted, and the receiving surface may be defined on a lower portion of the receiving part SP.

[0054] Each of the workbenches STG1 and STG2 may be made of a material for absorbing shocks to prevent the received target panel from being damaged due to shocks applied during transfer. In an embodiment, each of the workbenches STG1 and STG2 may be made of a Styrofoam material such as expanded polystyrene (EPS) or expanded polypropylene (EPP). Each of the workbenches STG1 and STG2 may provide a receiving surface on which the target panel is placed, and also perform a function for preventing the components connected to the target panel from sagging.

[0055] The protrusion PP may protrude along an upper edge of the receiving part SP and extend in the first direction DR1 and the second direction DR2 .

[0056] Each of the plurality of target panels DP accommodated in the tray TR may include a circuit component PD and a panel body component PNL. The panel body component PNL may be parallel to a plane defined by the first direction DR1 and the second direction DR2. The panel body component PNL may have a front surface FS displaying an image and a rear surface BS opposite to the front surface FS. The circuit component PD may be disposed on the rear surface BS of the panel body component PNL. The circuit component PD may be electrically connected to the panel body component PNL and protrude from the rear surface BS of the panel body component PNL in the third direction DR3.

[0057] The first target panel DP1 may include a first panel body part PNL1 and a first circuit part PD1 disposed on a back surface BS of the first panel body part PNL1. The second target panel DP2 may include a second panel body part PNL2 and a second circuit part PD2 disposed on a back surface BS of the second panel body part PNL2. The third target panel DP3 may include a third panel body part PNL3 and a third circuit part PD3 disposed on a back surface BS of the third panel body part PNL3. The fourth target panel DP4 may include a fourth panel body part PNL4 and a fourth circuit part PD4 disposed on a back surface BS of the fourth panel body part PNL4.

[0058] The buffer sheet CP may be disposed between two target panels stacked in sequence among a plurality of target panels DP. The buffer sheet CP may have a multilayer structure. The buffer sheet CP may include a first sheet LA1 and a second sheet LA2. The buffer sheet CP may include a first sheet LA1 in which a truncation portion PA is defined and a second sheet LA2 directly disposed on the first sheet LA1. The first sheet LA1 may be disposed on a rear surface BS of a target panel DP disposed below the first sheet LA1. The truncation portion PA corresponding to the circuit component PD may be defined in the first sheet LA1. The second sheet LA2 may be disposed directly on the first sheet LA1 and disposed on a front surface FS of a target panel DP disposed above the second sheet LA2. The first sheet LA1 may protect the rear surface BS of the target panel DP, and the second sheet LA2 may protect the front surface FS of the target panel DP and the circuit component PD.

[0059] Each of the first buffer sheet CP1, the second buffer sheet CP2, the third buffer sheet CP3 and the fourth buffer sheet CP4 may have a multilayer structure in which two sheets are stacked. That is, the first buffer sheet CP1 may have a multilayer structure in which the (1-1)th sheet LA11 and the (1-2)th sheet LA12 are stacked. The second buffer sheet CP2 may have a multilayer structure in which the (2-1)th sheet LA21 and the (2-2)th sheet LA22 are stacked. The third buffer sheet CP3 may have a multilayer structure in which the (3-1)th sheet LA31 and the (3-2)th sheet LA32 are stacked. The fourth buffer sheet CP4 may have a multilayer structure in which the (4-1)th sheet LA41 and the (4-2)th sheet LA42 are stacked.

[0060] Figure 2 is a plan view of a target panel according to an embodiment of the present disclosure. As an example, refer to Figure 2 The first target panel DP1 is described, and reference is made to Figure 2 The description applies to all multiple target panels DP (see Figure 1 ).

[0061] refer to Figure 2 , the first target panel DP1 may include a first panel main body part PNL1 and a first circuit part PD1. The first target panel DP1 may be used for various display devices, such as a personal computer (PC) (e.g., a notebook computer, a tablet PC), a mobile phone (e.g., a smart phone), a TV, or a game console. For example, the first target panel DP1 may be a display panel used in a tablet PC having a size of about 10 inches or more. The first target panel DP1 may be a display panel that is foldable or rollable around a folding axis. The first target panel DP1 may be a rigid display panel.

[0062] The first panel main body part PNL1 may have a front surface FS on which an image is displayed and a rear surface BS opposite to the front surface FS. Figure 1 ), the front surface FS of the first panel main body part PNL1 may be disposed to face each of the accommodating spaces SF1 and SF2. The first panel main body part PNL1 may include a plurality of pixels, each of which is electrically connected to the first circuit part PD1 and receives a signal from the first circuit part PD1 to emit light.

[0063] The first circuit part PD1 may be disposed on the back surface BS of the first panel body part PNL1. The first circuit part PD1 may be disposed adjacent to the side surface and the bottom surface of the first panel body part PNL1. The first circuit part PD1 may include a first directional circuit part PD11 and a second directional circuit part PD12.

[0064] The first directional circuit part PD11 may be disposed adjacent to one side surface of the first panel body part PNL1 and extend in the second direction DR2. The first directional circuit part PD11 may include a circuit board FCB and a driving chip DIC. The circuit board FCB may be disposed on the rear surface BS of the first panel body part PNL1 and disposed adjacent to one side surface of the first panel body part PNL1. The circuit board FCB may extend in the second direction DR2. The driving chip DIC may be disposed on the circuit board FCB and include a driving element for driving the pixels of the first panel body part PNL1. For example, the driving chip DIC may include a data driving circuit.

[0065] The second directional circuit component PD12 may be disposed adjacent to the lower side surface of the first panel main body component PNL1 and extend in the first direction DR1. Like the first directional circuit component PD11, the second directional circuit component PD12 may include a circuit board and a driving chip. However, the components of each of the first directional circuit component PD11 and the second directional circuit component PD12 are not limited thereto, and may include any components for applying signals to a plurality of pixels. For example, each of the first directional circuit component PD11 and the second directional circuit component PD12 may include signal lines and data lines connected to a plurality of pixels and a plurality of pads connected to the signal lines and the data lines.

[0066] Figure 3 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure. Figure 3 Only the arrangement and configuration of the first target panel DP1, the second target panel DP2, and the first buffer sheet CP1 are described, but reference is made to Figure 3The contents described above can be commonly applied to the first target panel DP1, the second target panel DP2, the third target panel DP3 and the fourth target panel DP4 (see Figure 1 ) and the first buffer sheet CP1, the second buffer sheet CP2, the third buffer sheet CP3 and the fourth buffer sheet CP4 (see Figure 1 ).

[0067] refer to Figure 3 , the first buffer sheet CP1 may be disposed such that the bottom surface of the (1-1)th sheet LA11 faces the back surface BS of the first target panel DP1, and the top surface of the (1-2)th sheet LA12 faces the front surface FS of the second target panel DP2. A truncation portion PA corresponding to the first circuit part PD1 of the first target panel DP1 may be defined in the (1-1)th sheet LA11 such that the (1-1)th sheet LA11 and the first circuit part PD1 do not contact each other.

[0068] The (1-2)th sheet LA12 may include a first sheet portion PTA1 and a second sheet portion PTA2. The first sheet portion PTA1 may have a shape corresponding to the first circuit component PD1 of the first target panel DP1. That is, the first sheet portion PTA1 may include a first portion elongated in the second direction DR2 and a second portion extending from the first portion in a direction opposite to the first direction DR1. The second sheet portion PTA2 may be a remaining portion excluding the first sheet portion PTA1 from the entire (1-2)th sheet LA12. The second sheet portion PTA2 may not overlap with the first circuit component PD1. The first sheet portion PTA1 and the second sheet portion PTA2 may not be separately separated components, but may be parts of a flat plate-shaped (1-2)th sheet LA12. The first sheet portion PTA1 and the second sheet portion PTA2 may cover the entire front surface FS of the second target panel DP2.

[0069] Figure 4A and Figure 4B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure.

[0070] refer to Figure 4A and Figure 4B , the truncation portion PA may include a first truncation portion PA1 and a second truncation portion PA2. The second truncation portion PA2 may extend along the side surface of the (1-1)th sheet LA11 in the second direction DR2. The first truncation portion PA1 may extend from the second truncation portion PA2 in a direction opposite to the first direction DR1. The truncation portion PA may overlap with the first sheet portion PTA1 of the (1-2)th sheet LA12. The (1-1)th sheet LA11 may overlap only with the second sheet portion PTA2 of the (1-2)th sheet LA12.

[0071] Figure 5 is a cross-sectional view of a stacked target panel and a buffer sheet according to an embodiment of the present disclosure. More specifically, Figure 5 is along Figure 3 A cross-sectional view taken along line II' in FIG.

[0072] refer to Figure 5 , the first target panel DP1 and the second target panel DP2 may be stacked in the third direction DR3, wherein the first buffer sheet CP1 is between the first target panel DP1 and the second target panel DP2. The first circuit part PD1 of the first target panel DP1 may be disposed in the truncation portion PA defined in the (1-1)th sheet LA11. Therefore, the first circuit part PD1 may be prevented from being damaged due to contact or collision with the (1-1)th sheet LA11 and the (1-2)th sheet LA12.

[0073] The bottom surface of the (1-1)th sheet LA11 may be in contact with the back surface BS of the first panel body part PNL1. The top surface of the (1-2)th sheet LA12 may be in contact with the front surface FS of the second panel body part PNL2. The bottom surface of the (1-1)th sheet LA11 and the top surface of the (1-2)th sheet LA12 may be parallel to a plane defined by the first direction DR1 and the second direction DR2.

[0074] The (1-1)th sheet LA11 may have a thickness TH1 equal to or greater than the thickness THP of the first circuit component PD1. When the thickness TH1 of the (1-1)th sheet LA11 is less than the thickness THP of the first circuit component PD1, the top surface of the first circuit component PD1 may be disposed above the top surface of the (1-1)th sheet LA11. Here, when the first target panel DP1, the first buffer sheet CP1, and the second target panel DP2 are stacked, an external impact and the self-weight of each of the (1-2)th sheet LA12 and the second target panel DP2 disposed above the first circuit component PD1 may be transferred to the first circuit component PD1. The thickness TH1 of the (1-1)th sheet LA11 may be made equal to or greater than the thickness THP of the first circuit component PD1 so as to prevent the external impact and the first circuit component PD1 from being damaged due to the self-weight of each of the (1-2)th sheet LA12 and the second target panel DP2.

[0075] In addition, when the thickness TH1 of the (1-1)th sheet LA11 is greater than the thickness THP of the first circuit part PD1, the top surface of the first circuit part PD1 can be set to be separated from the bottom surface of the (1-2)th sheet LA12 by a predetermined distance. Therefore, when the first target panel DP1 and the second target panel DP2 are stacked, impact can be prevented from being applied to the first circuit part PD1.

[0076] Figure 6is a cross-sectional view of a buffer sheet according to an embodiment of the present disclosure. As an example, Figure 6 The cross-sectional structure of the first buffer sheet CP1 is shown in the figure, but reference Figure 6 The same / similar contents described apply to the second buffer sheet CP2, the third buffer sheet CP3 and the fourth buffer sheet CP4 (see Figure 1 ).

[0077] refer to Figure 6 , the (1-1)th sheet LA11 may include a first cover layer PEF1, a first foam coating FO1, and a second cover layer PEF2. The first cover layer PEF1 may be a first target panel DP1 (see Figure 5 ) of the rear surface BS (see Figure 5 ) is in contact with the first covering layer PEF1. The first covering layer PEF1 may be a layer disposed at the lowermost portion of the (1-1)th sheet LA11. The first covering layer PEF1 may cover the first foam coating layer FO1 to prevent the first foam coating layer FO1 from being damaged due to external impact. The first covering layer PEF1 may be a polyethylene film. For example, the first covering layer PEF1 may be made of low-density polyethylene (LDPE) or high-density polyethylene (HDPE). The first covering layer PEF1 may perform an antistatic function.

[0078] The first cover layer PEF1 may have a thickness THa1 of about 10 μm to about 12 μm. When the thickness THa1 of the first cover layer PEF1 is less than about 10 μm, the first foam coating layer FO1 may not be protected. When the thickness THa1 of the first cover layer PEF1 is greater than about 12 μm, the thickness of the first buffer sheet CP1 may increase. Preferably, the thickness THa1 of the first cover layer PEF1 may be about 11 μm.

[0079] The first foam coating FO1 may be directly disposed on the first cover layer PEF1 and include a foam resin. The first foam coating FO1 may be made of expanded polyethylene (EPE). The first foam coating FO1 may be disposed on a plurality of target panels DP (see Figure 1 ) between them in order to prevent multiple target panels DP (see Figure 1 ) in each of the multiple target panels DP (see Figure 1 ) and be damaged by the impact generated between them.

[0080] The first foam coating FO1 may be disposed directly between the first cover layer PEF1 and the second cover layer PEF2. An adhesive layer may not be disposed between the first foam coating FO1 and each of the first cover layer PEF1 and the second cover layer PEF2. The first foam coating FO1 may have a thickness THf1 greater than each of a thickness THa1 of the first cover layer PEF1 and a thickness THa2 of the second cover layer PEF2.

[0081] The thickness THf1 of the first foam coating layer FO1 may be about 0.2 mm to about 20 mm. When the thickness THf1 of the first foam coating layer FO1 is less than about 0.2 mm, the plurality of target panels DP (see Figure 1 ) may not be protected from external impact. When the thickness THf1 of the first foam coating FO1 exceeds about 20 mm, the thickness of the first buffer sheet CP1 may increase. Here, it is possible to be stacked and accommodated in the accommodation spaces SF1 and SF2 (see Figure 1 ) in multiple target panels DP (see Figure 1 ) can be reduced.

[0082] The second covering layer PEF2 may be a layer in contact with the bottom surface of the (1-2)th sheet LA12. The second covering layer PEF2 may be a layer disposed at the uppermost portion of the (1-1)th sheet LA11. The second covering layer PEF2 may be disposed directly on the first foam coating layer FO1. The second covering layer PEF2 may cover the first foam coating layer FO1 together with the first covering layer PEF1 to prevent the first foam coating layer FO1 from being damaged due to external impact. The second covering layer PEF2 may be a polyethylene film. For example, the second covering layer PEF2 may be made of low-density polyethylene (LDPE) or high-density polyethylene (HDPE). The second covering layer PEF2 may perform an antistatic function.

[0083] The thickness THa2 of the second cover layer PEF2 may be about 10 μm to about 12 μm. When the thickness THa2 of the second cover layer PEF2 is less than about 10 μm, the first foam coating layer FO1 may not be protected. When the thickness THa2 of the second cover layer PEF2 exceeds about 12 μm, the thickness of the first buffer sheet CP1 may increase. Preferably, the thickness THa2 of the second cover layer PEF2 may be about 11 μm.

[0084] The (1-2)th sheet LA12 may include a third covering layer PEF3, a second foam coating FO2, and a fourth covering layer PEF4. The third covering layer PEF3 may be in contact with the top surface of the (1-1)th sheet LA11. The third covering layer PEF3 may be directly disposed on the second covering layer PEF2. The third covering layer PEF3 may be a layer disposed at the lowermost portion of the (1-2)th sheet LA12. The third covering layer PEF3 may cover the second foam coating FO2 to prevent the second foam coating FO2 from being damaged due to external impact. The third covering layer PEF3 may be a polyethylene film. The third covering layer PEF3 may perform an antistatic function.

[0085] The third cover layer PEF3 may have a thickness THa3 of about 10 μm to about 12 μm. When the thickness THa3 of the third cover layer PEF3 is less than about 10 μm, the second foam coating layer FO2 may not be protected. When the thickness THa3 of the third cover layer PEF3 exceeds about 12 μm, the thickness of the first buffer sheet CP1 may increase. Preferably, the thickness THa3 of the third cover layer PEF3 may be about 11 μm.

[0086] The second foam coating FO2 may be directly disposed on the third cover layer PEF3 and include a foamed resin. The second foam coating FO2 may be made of expanded polyethylene (EPE).

[0087] The second foam coating FO2 may be disposed directly between the third cover layer PEF3 and the fourth cover layer PEF4. An adhesive layer may not be disposed between the second foam coating FO2 and each of the third cover layer PEF3 and the fourth cover layer PEF4. The second foam coating FO2 may have a thickness THf2 greater than each of a thickness THa3 of the third cover layer PEF3 and a thickness THa4 of the fourth cover layer PEF4.

[0088] The thickness THf2 of the second foam coating FO2 may be about 0.2 mm to about 20 mm. When the thickness THf2 of the second foam coating FO2 is less than about 0.2 mm, the plurality of target panels DP (see Figure 1 ) may not be protected from external impact. When the thickness THf2 of the second foam coating layer FO2 exceeds about 20 mm, the thickness of the first buffer sheet CP1 may be increased.

[0089] The fourth cover layer PEF4 may be formed with the second panel body part PNL2 (see Figure 5 ) of the front surface FS (see Figure 5 ) in contact with the second foam coating FO2. The fourth covering layer PEF4 may be a layer disposed at the uppermost portion of the (1-2)th sheet LA12. The fourth covering layer PEF4 may be disposed directly on the second foam coating FO2. The fourth covering layer PEF4 may cover the second foam coating FO2 together with the third covering layer PEF3 to prevent the second foam coating FO2 from being damaged due to external impact. The fourth covering layer PEF4 may be a polyethylene film. For example, the fourth covering layer PEF4 may be made of low-density polyethylene (LDPE) or high-density polyethylene (HDPE). The fourth covering layer PEF4 may perform an antistatic function.

[0090] The thickness THa4 of the fourth cover layer PEF4 may be about 10 μm to about 12 μm. When the thickness THa4 of the fourth cover layer PEF4 is less than about 10 μm, the second foam coating layer FO2 may not be protected. When the thickness THa4 of the fourth cover layer PEF4 exceeds about 12 μm, the thickness of the first buffer sheet CP1 may increase. Preferably, the thickness THa4 of the fourth cover layer PEF4 may be about 11 μm.

[0091] The (1-2)th slice LA12 may have a first slice portion PTA1 corresponding to the truncation portion PA. The (1-2)th slice LA12 may have a second slice portion PTA2 not corresponding to the truncation portion PA. The second slice portion PTA2 may overlap the (1-1)th slice LA11.

[0092] Figure 7 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure. Hereinafter, the same / similar elements as those described above are denoted by the same / similar reference numerals or symbols, and redundant descriptions are omitted.

[0093] refer to Figure 7 , the first circuit component PD1 may include a plurality of circuit components spaced apart from each other. The first circuit component PD1 may include a (1-1)th circuit component PD1-1 and a (1-2)th circuit component PD1-2. The (1-1)th circuit component PD1-1 and the (1-2)th circuit component PD1-2 may be disposed to be spaced apart from each other in the second direction DR2. The (1-1)th circuit component PD1-1 may be disposed adjacent to one short side of the first target panel DP1, and include a first portion extending in the first direction DR1 and a second portion extending from the first portion in the second direction DR2. The (1-2)th circuit component PD1-2 may be disposed adjacent to the other short side of the first target panel DP1, and include a third portion extending in the first direction DR1 and a fourth portion extending from the third portion in a direction opposite to the second direction DR2.

[0094] The second circuit component PD2 may include a (2-1)th circuit component PD2-1 and a (2-2)th circuit component PD2-2. The (2-1)th circuit component PD2-1 and the (2-2)th circuit component PD2-2 may be arranged to be spaced apart from each other in the second direction DR2. The (2-1)th circuit component PD2-1 may be arranged to be adjacent to one short side of the second target panel DP2, and include a first portion extending in the first direction DR1 and a second portion extending from the first portion in the second direction DR2. The (2-2)th circuit component PD2-2 may be arranged to be adjacent to the other short side of the second target panel DP2, and include a third portion extending in the first direction DR1 and a fourth portion extending from the third portion in a direction opposite to the second direction DR2.

[0095] Here, the shape of each of the (1-1)th circuit component PD1-1, the (1-2)th circuit component PD1-2, the (2-1)th circuit component PD2-1, and the (2-2)th circuit component PD2-2 is an example, and various changes may be made as needed. For example, the (1-1)th circuit component PD1-1 may be disposed adjacent to the short side of the first target panel DP1 and extend in the first direction DR1, and the (1-2)th circuit component PD1-2 may be disposed adjacent to the long side of the first target panel DP1 and extend in the second direction DR2.

[0096] The cut-off portion PA corresponding to the first circuit part PD1 (see Fig. 8A ) may be defined in the (1-1)th sheet LA11. The (1-2)th sheet LA12 may include a first sheet portion PTA1 having a shape corresponding to the first circuit part PD1 and a second sheet portion PTA2 not overlapping the first circuit part PD1.

[0097] Fig. 8A and Figure 8B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure.

[0098] refer to Fig. 8A , the cut-off portion PA may include a first cut-off portion PA1 and a second cut-off portion PA2. The first cut-off portion PA1 may have a similar shape to the (1-1)th circuit component PD1-1 (see Figure 7 ). The second truncation portion PA2 may have a shape corresponding to the shape of the (1-2)th circuit component PD1-2 (see Figure 7) corresponding to the shape of the first truncation portion PA1. The first truncation portion PA1 may include a (1-1)th truncation portion PA1-1, a (1-2)th truncation portion PA1-2, and a (1-3)th truncation portion PA1-3. The (1-1)th truncation portion PA1-1 may be disposed adjacent to the upper short side of the (1-1)th sheet LA11 and extend in the first direction DR1. Each of the (1-2)th truncation portion PA1-2 and the (1-3)th truncation portion PA1-3 may extend from the (1-1)th truncation portion PA1-1 in the second direction DR2. The (1-2)th truncation portion PA1-2 and the (1-3)th truncation portion PA1-3 may be disposed to be spaced apart from each other by a predetermined distance in the first direction DR1.

[0099] The second truncation portion PA2 may include a (2-1)th truncation portion PA2-1, a (2-2)th truncation portion PA2-2, and a (2-3)th truncation portion PA2-3. The (2-1)th truncation portion PA2-1 may be disposed adjacent to the lower short side of the (1-1)th sheet LA11 and extend in the first direction DR1. Each of the (2-2)th truncation portion PA2-2 and the (2-3)th truncation portion PA2-3 may extend from the (2-1)th truncation portion PA2-1 in a direction opposite to the second direction DR2. The (2-2)th truncation portion PA2-2 and the (2-3)th truncation portion PA2-3 may be disposed to be spaced apart from each other by a predetermined distance in the first direction DR1.

[0100] refer to Fig. 8A and Figure 8B , the first slice part PTA1 may overlap each of the first truncation part PA1 and the second truncation part PA2. The (1-1)th slice LA11 may overlap only the second slice part PTA2 of the (1-2)th slice LA12.

[0101] Fig. 9 is a perspective view of a target panel and a buffer sheet according to an embodiment of the present disclosure. Hereinafter, the same / similar elements as those described above are denoted by the same / similar reference numerals or symbols, and redundant descriptions are omitted.

[0102] refer to Fig. 9 , the first circuit part PD1 may be disposed to be spaced a predetermined distance from the long side of the first panel main body part PNL1 in the first direction DR1. The first circuit part PD1 may extend in the second direction DR2. The second circuit part PD2 may be disposed to be spaced a predetermined distance from the long side of the second panel main body part PNL2 in the first direction DR1. The second circuit part PD2 may extend in the second direction DR2.

[0103] The cutout portion PA has a shape corresponding to that of the first circuit part PD1 (see Fig. 10A) may be defined in the (1-1)th sheet LA11. The first sheet portion PTA1 of the (1-2)th sheet LA12 may have a shape corresponding to the first circuit part PD1. The first sheet portion PTA1 may be aligned with the cutout portion PA (see Fig. 10A ). The second sheet portion PTA2 of the (1-2)th sheet LA12 may not overlap with the first circuit part PD1. The (1-1)th sheet LA11 may overlap with the second sheet portion PTA2.

[0104] Fig. 10A and Fig. 10B is a plan view of a first sheet and a second sheet according to an embodiment of the present disclosure.

[0105] refer to Fig. 10A and Fig. 10B , the truncation portion PA may be disposed to be spaced a predetermined distance from the long side of the (1-1)th sheet LA11 in the first direction DR1. The truncation portion PA may extend in the second direction DR2. The first sheet portion PTA1 may have a shape corresponding to the truncation portion PA. The second sheet portion PTA2 may not overlap the truncation portion PA.

[0106] Fig.11 is a cross-sectional view of a stacked target panel and a buffer sheet according to an embodiment of the present disclosure. Figure 6 The same / similar elements as those described are denoted by the same / similar reference numerals or symbols, and description thereof is omitted.

[0107] refer to Fig.11 , the (1-1)th sheet LA11 may include a first cover layer PEF1 and a first foam coating FO1. The (1-2)th sheet LA12 may include a third cover layer PEF3, a second foam coating FO2 and a fourth cover layer PEF4. Fig.11 The (1-1) piece LA11 and Figure 6 The difference between the (1-1)th piece LA11 shown in the figure is that Figure 6 The second cover layer PEF2 of the (1-1) sheet LA11 shown in FIG. Figure 6 ) is omitted.

[0108] The third cover layer PEF3 may be disposed directly on the first foam coating FO1. The first foam coating FO1 may be disposed directly between the first cover layer PEF1 and the third cover layer PEF3. The first foam coating FO1 may have a top surface and a bottom surface covered by the third cover layer PEF3 and the first cover layer PEF1, respectively. Figure 6 Compared with the (1-1) piece LA11 in the figure, Fig.11The (1-1)th sheet LA11 shown in the figure may omit one cover layer to reduce the thickness of the (1-1)th sheet LA11.

[0109] A tray module for transferring a panel according to an embodiment of the present disclosure may include a buffer sheet disposed between a plurality of stacked target panels, thereby preventing damage caused by contact and collision between the target panels.

[0110] In addition, the buffer sheet according to the embodiment of the present disclosure may have a multi-layer structure, and a cut-off portion corresponding to a circuit component may be defined in the first sheet, thereby preventing the circuit component from being damaged due to contact and collision between the circuit component and the buffer sheet.

[0111] Although the embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these embodiments, but can be variously changed and modified by a person of ordinary skill in the art within the spirit and scope of the present disclosure claimed hereinafter. Therefore, the technical scope of the present disclosure is not limited to the contents described in the specific embodiments of the specification, but should be determined by the claims.

Claims

1. A tray module for transferring panels, characterized in that: The tray module comprises: a tray accommodating a plurality of target panels, each of the plurality of target panels having a front surface displaying an image and a rear surface opposite to the front surface, and including a circuit component disposed on the rear surface; and a buffer sheet having a multi-layer structure and disposed between a first target panel and a second target panel stacked sequentially among the plurality of target panels, Wherein, the buffer sheet comprises: a first sheet disposed on a rear surface of the first target panel and having a cutout portion defined therein corresponding to the circuit component; and A second sheet is disposed directly on the first sheet and covers a front surface of the second target panel.

2. The tray module for transferring panels according to claim 1, characterized in that: In cross section, the first sheet has a thickness equal to or greater than a thickness of the circuit component.

3. The tray module for transferring panels according to claim 1, characterized in that: The first sheet comprises: a first covering layer; a first foam coating disposed directly on the first cover layer; and a second covering layer, the second covering layer being disposed directly on the first foam coating, wherein the first foam coating has a thickness greater than a thickness of each of the first cover layer and the second cover layer.

4. The tray module for transferring panels according to claim 3, characterized in that: The first foam coating has a thickness of 0.2 mm to 20 mm, and Each of the first cover layer and the second cover layer has a thickness of 10 μm to 12 μm.

5. The tray module for transferring panels according to claim 3, characterized in that: The second sheet comprises: a third covering layer, the third covering layer being disposed directly on the second covering layer; a second foam coating disposed directly on the third cover layer; and a fourth covering layer, the fourth covering layer being disposed directly on the second foam coating, Wherein, the second foam coating has a thickness of 0.2 mm to 20 mm.

6. The tray module for transferring panels according to claim 1, characterized in that: The tray comprises: a first accommodating space, wherein the plurality of target panels are accommodated in the first accommodating space; and a second accommodation space, the second accommodation space being spaced apart from the first accommodation space, The plurality of target panels are sequentially stacked inside each of the first receiving space and the second receiving space.

7. The tray module for transferring panels according to claim 1, characterized in that: The first sheet comprises: a first covering layer; and a first foam coating, the first foam coating being disposed directly on the first cover layer, Wherein, the second sheet comprises: a second cover layer disposed directly on the first foam coating; a second foam coating disposed directly on the second cover layer; and A third cover layer is disposed directly on the second foam coating.

8. A tray module for transferring panels, characterized in that: The tray module comprises: a tray accommodating a plurality of target panels, each of the plurality of target panels having a front surface displaying an image and a rear surface opposite to the front surface, and including a circuit component disposed on the rear surface; and a buffer sheet having a multi-layer structure and disposed between a first target panel and a second target panel stacked sequentially among the plurality of target panels, Wherein, the buffer sheet comprises: a first sheet including a first sheet portion overlapping the circuit component and having a shape corresponding to the circuit component and a second sheet portion not overlapping the circuit component and disposed on a front surface of the second target panel; and A second sheet is disposed directly on the first sheet and only partially overlaps the second sheet.

9. The tray module for transferring panels according to claim 8, characterized in that: A cut-off portion having a shape corresponding to that of the first sheet portion is defined in the second sheet.

10. The tray module for transferring panels according to claim 8, characterized in that: The first sheet comprises: a first covering layer; a first foam coating disposed directly on the first cover layer; and a second covering layer, the second covering layer being disposed directly on the first foam coating, Wherein, the second sheet comprises: a third covering layer, the third covering layer being disposed directly on the second covering layer; a second foam coating disposed directly on the third cover layer; and A fourth cover layer is disposed directly on the second foam coating.

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