Refrigerating and heating integrated cell culture module

Abstract

The utility model discloses a refrigerating and heating integrated cell culture module which comprises a shell and a support arranged in the shell and used for installing a culture bin, a semiconductor chilling plate is arranged on the shell and located between the shell and the support, and when the culture bin is installed on the support, the semiconductor chilling plate is fixed on the support. And the semiconductor chilling plate is used for heating or refrigerating the culture bin. According to the utility model, the effect of saving space can be further improved, and meanwhile, the structure is simpler.

Description

Technical Field

[0001] The utility model relates to a cell culture device, in particular to a cell culture module integrating refrigeration and heating. Background Art

[0002] Cell culture has extremely high requirements for temperature. Once the temperature control is unstable, the culture speed and survival rate will easily decrease, and even the culture may fail. The current cell isolators are generally equipped with multiple cell culture modules, and the culture modules are divided into cold zone culture modules and hot zone culture modules.

[0003] Referring to the utility model patent shown in publication number CN212770768U, a cell isolator with an embedded refrigeration and heating structure includes an isolator and a cover plate. A refrigeration cavity and a heating cavity are opened on the side wall of the isolator. The cover plate is installed outside the refrigeration cavity and the heating cavity and is fixed to the isolator. A refrigeration chamber and a heating chamber are recessed on the cover plate. The refrigeration chamber is correspondingly inserted into the refrigeration cavity. A refrigeration module for cooling the refrigeration chamber is also arranged in the refrigeration cavity. The heating chamber is correspondingly inserted into the heating cavity. A heating module for heating the heating chamber is also arranged in the heating cavity. A refrigeration chamber door for sealing the refrigeration chamber opening and a heating chamber door for sealing the heating chamber opening are installed on the cover plate.

[0004] However, this solution still has defects in the effect of saving space. It requires the use of a cooling cavity and a heating cavity, which means that cooling and heating occupy two cavities. The effect of saving space is still not obvious enough. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a cell culture module with integrated cooling and heating functions, which can further improve the space saving effect and make the structure simpler.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cell culture module with integrated cooling and heating, comprising an outer shell, and a bracket arranged in the outer shell for installing a culture chamber, wherein a semiconductor refrigeration sheet is arranged on the outer shell, and the semiconductor refrigeration sheet is located between the outer shell and the bracket, and when the culture chamber is installed on the bracket, the semiconductor refrigeration sheet heats or cools the culture chamber.

[0007] As a further improvement of the present invention, an aluminum plate is arranged between the bracket and the semiconductor refrigeration chip, one side of the aluminum plate is in contact with the semiconductor refrigeration chip, and the other side is used to cooperate with the bracket to install the culture chamber; one end of the semiconductor refrigeration chip is in contact with the aluminum plate, and the other end is installed on the outer shell.

[0008] As a further improvement of the present invention, an inner cavity sheet metal is further provided between the aluminum plate and the bracket, and the outer surface of the inner cavity sheet metal is in contact with the aluminum plate.

[0009] As a further improvement of the present invention, a plurality of positioning holes are provided on the aluminum plate, and positioning blocks are provided on the outer surface of the inner cavity sheet metal at positions corresponding to the positioning holes. When the aluminum plate and the inner cavity sheet metal are installed, the positioning blocks are inserted into the positioning holes.

[0010] As a further improvement of the present invention, the bracket has a platform with a plurality of ventilation holes, and the platform is located below the culture chamber, and a fan is provided at a position corresponding to the upper part of the inner cavity sheet metal to cooperate with the ventilation holes on the platform to form an inner cavity circulation.

[0011] As a further improvement of the utility model, a heat sink is installed on the shell, and the heat conduction surface of the heat sink corresponds to the semiconductor cooling plate, and a fan is installed on the heat sink.

[0012] As a further improvement of the utility model, a foam pad is arranged between the heat dissipation grille and the shell.

[0013] As a further improvement of the utility model, a through hole is provided on the shell at a position corresponding to the semiconductor refrigeration plate, the positions of the foam pad and the heat sink are both provided corresponding to the through hole, and the foam pad is attached to the semiconductor refrigeration plate through the through hole.

[0014] The beneficial effect of the utility model is that the semiconductor refrigeration sheet, as a component capable of both cooling and heating, can switch between heating and cooling modes simply by changing the direction of the applied current. At this time, the cell culture module can have both heating and cooling functions, so there is no need to specially prepare two cell culture modules for cooling and heating respectively, which can further save space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the front three-dimensional structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the back three-dimensional structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the front three-dimensional structure of the utility model (without inner cavity sheet metal);

[0018] Figure 4 This is a schematic diagram of the front three-dimensional structure of the utility model (partially without heat dissipation grille and fan);

[0019] Figure 5 This is a schematic diagram of the front structure of the utility model (partially without heat dissipation grille and fan);

[0020] Figure numbers: 1. Shell; 2. Bracket; 3. Semiconductor refrigeration plate; 4. Aluminum plate; 5. Inner cavity sheet metal; 6. Positioning hole; 7. Positioning block; 8. Platform; 9. Ventilation hole; 10. Heat dissipation grille; 11. Fan; 12. Foam pad; 13. Through hole; 14. Fan. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0022] Reference Figure 1-5 As shown,

[0023] A cell culture module with integrated cooling and heating comprises a shell 1, a bracket 2 arranged in the shell 1 for installing a culture chamber, a semiconductor refrigeration sheet 3 is arranged on the shell 1, and the semiconductor refrigeration sheet 3 is located between the shell 1 and the bracket 2. When the culture chamber is installed on the bracket 2, the semiconductor refrigeration sheet 3 heats or cools the culture chamber.

[0024] As a component capable of cooling and heating, the semiconductor refrigeration sheet 3 can switch between heating and cooling modes by simply changing the direction of the applied current. At this time, the cell culture module can have both heating and cooling functions, so there is no need to specially prepare two cell culture modules for cooling and heating respectively, which can further save space. The structure of the housing 1 and the bracket 2 can be implemented with reference to the technical solutions recorded in the prior art mentioned in the background technology, and the culture chamber can be assembled by inserting and withdrawing, which is more convenient in use.

[0025] In order to increase the thermal conductivity, as an optional implementation, an aluminum plate 4 is arranged between the bracket 2 and the semiconductor refrigeration chip 3, one side of the aluminum plate 4 is in contact with the semiconductor refrigeration chip 3, and the other side is used to cooperate with the bracket 2 to install the culture chamber; one end of the semiconductor refrigeration chip 3 is in contact with the aluminum plate 4, and the other end is installed on the outer shell 1.

[0026] The aluminum plate 4 can have better thermal conductivity, can quickly heat and cool the culture chamber, has high efficiency, and is light in weight, making it more convenient to install the cell culture template of this solution.

[0027] In order to protect the aluminum plate 4 and the semiconductor cooling plate 3 , an inner cavity sheet metal 5 is further provided between the aluminum plate 4 and the bracket 2 , and the outer surface of the inner cavity sheet metal 5 is in contact with the aluminum plate 4 .

[0028] The embedded sheet metal can be used as an inner tank. On the one hand, it can form a sealed space, and on the other hand, it can protect components such as the semiconductor refrigeration plate 3 and the aluminum plate 4. The inner cavity sheet metal 5 and the aluminum plate 4 are bonded to ensure the temperature transfer performance.

[0029] In a further configuration, a plurality of positioning holes 6 are provided on the aluminum plate 4 , and positioning blocks 7 are provided on the outer surface of the inner cavity sheet metal 5 at positions corresponding to the positioning holes 6 . When the aluminum plate 4 and the inner cavity sheet metal 5 are installed, the positioning blocks 7 are inserted into the positioning holes 6 .

[0030] The cooperation between the positioning block 7 and the positioning hole 6 facilitates the installation of the inner cavity sheet metal 5. As shown in the reference figure, the aluminum plate 4 can be composed of five pieces, corresponding to the upper, lower, left, right and rear surfaces of the inner cavity sheet metal 5 respectively. The cooperation between the positioning block 7 and the positioning hole 6 can form a positioning effect, and after the installation of the aluminum plate 4 is completed, the aluminum plate 4 can be tightly attached to the inner cavity sheet metal 5, and it has a high degree of stability.

[0031] The outer shell 1 can be shown in the figure. As a connecting piece for fixing the aluminum plate 4, the outer shell 1 is spliced ​​with connecting pieces and connected with screws to press the aluminum plate 4 onto the outer surface of the inner cavity sheet metal 5. This installation method is simpler, and both the aluminum plate 4 and the outer shell 1 only need regular processing, which reduces the processing difficulty.

[0032] As a preferred solution for better temperature control, the bracket 2 has a platform 8 with a plurality of ventilation holes 9, and the platform 8 is located below the culture chamber. A fan 14 is provided at the corresponding upper position of the inner cavity sheet metal 5 to cooperate with the ventilation holes on the platform 8 to form an inner cavity circulation.

[0033] The fan 14 blows air in the sealed inner cavity sheet metal 5, which can make the internal temperature more uniform, thereby achieving a more stable cell culture effect. In conjunction with the ventilation holes 9 of the platform 8, the air flow can circulate, especially at the bottom of the culture bin where the temperature is more difficult to control, and the through hole 13 can allow the air flow to circulate to the bottom of the culture bin.

[0034] In addition, in order to make the semiconductor cooling plate 3 work more stably, a heat sink 10 is installed on the housing 1 , and the heat conducting surface of the heat sink 10 corresponds to the semiconductor cooling plate 3 , and a fan 11 is installed on the heat sink 10 .

[0035] When the semiconductor refrigeration plate 3 cools the culture chamber, a hot end will be formed at the outer end, and the hot end needs to dissipate heat to maintain stable cooling. Therefore, the heat dissipation grid 10 is used in conjunction with the fan 11 to quickly cool down the outer end of the semiconductor refrigeration plate 3 when it is heated, thereby maintaining a stable cooling effect.

[0036] In addition, a foam pad 12 is provided between the heat sink 10 and the housing 1. The foam pad 12 needs to be made of a high temperature resistant material, otherwise it is easily damaged when the outer end of the semiconductor cooling plate 3 is heated. Under the action of the high temperature resistant foam pad 12, the vibration caused by the rotation of the fan 11 can be reduced and the noise can be reduced.

[0037] In a further configuration, a through hole 13 is provided on the housing 1 at a position corresponding to the semiconductor cooling plate 3 , the positions of the foam pad 12 and the heat sink 10 are both provided corresponding to the through hole 13 , and the foam pad 12 is attached to the semiconductor cooling plate 3 through the through hole 13 .

[0038] The through holes 13 can make the heat dissipation of the semiconductor cooling plate 3 more direct, thereby further improving the cooling performance.

[0039] It should be additionally explained in the above scheme that the semiconductor refrigeration plate 3 can be installed on the outer shell 1 by screws, the heat sink 10 can also be installed on the outer shell 1 by screws, and the foam pad 12 can be clamped and fixed by the clamping effect between the heat sink 10 and the outer shell 1; the fan 11 can be installed on the heat sink 10 by means of a clamp.

[0040] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A cell culture module with integrated cooling and heating, comprising a housing and a bracket arranged in the housing for installing a culture chamber, characterized in that: A semiconductor refrigeration sheet is arranged on the shell, and is located between the shell and the bracket. When the culture chamber is installed on the bracket, the semiconductor refrigeration sheet heats or cools the culture chamber.

2. The cell culture module with integrated cooling and heating according to claim 1, characterized in that: An aluminum plate is arranged between the bracket and the semiconductor refrigeration chip, one side of the aluminum plate is in contact with the semiconductor refrigeration chip, and the other side is used to cooperate with the bracket to install the culture chamber; one end of the semiconductor refrigeration chip is in contact with the aluminum plate, and the other end is installed on the shell.

3. The cell culture module with integrated cooling and heating according to claim 2, characterized in that: An inner cavity sheet metal is also arranged between the aluminum plate and the bracket, and the outer surface of the inner cavity sheet metal is in contact with the aluminum plate.

4. The cell culture module with integrated cooling and heating according to claim 3, characterized in that: The aluminum plate is provided with a plurality of positioning holes, and positioning blocks are provided on the outer surface of the inner cavity sheet metal at positions corresponding to the positioning holes. When the aluminum plate and the inner cavity sheet metal are installed, the positioning blocks are inserted into the positioning holes.

5. The cell culture module with integrated cooling and heating according to claim 3, characterized in that: The support has a platform with a plurality of ventilation holes, and the platform is located below the culture chamber. A fan is provided at a position corresponding to the upper portion of the inner cavity sheet metal to cooperate with the ventilation holes on the platform to form an inner cavity circulation.

6. The cell culture module with integrated cooling and heating according to claim 1 or 2 or 3 or 4 or 5, characterized in that: A heat dissipation grid is installed on the shell, and the heat conduction surface of the heat dissipation grid corresponds to the semiconductor refrigeration sheet, and a fan is installed on the heat dissipation grid.

7. The cell culture module with integrated cooling and heating according to claim 6, characterized in that: A foam pad is arranged between the heat dissipation grille and the shell.

8. The cell culture module with integrated cooling and heating according to claim 7, characterized in that: A through hole is arranged on the shell at a position corresponding to the semiconductor refrigeration plate, the positions of the foam pad and the heat sink are arranged corresponding to the through hole, and the foam pad is attached to the semiconductor refrigeration plate through the through hole.

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