Cooling device and vacuum coating equipment

Abstract

The utility model provides a cooling device and vacuum coating equipment. The cooling device comprises a cooling main roller, an evaporation module and a cooling panel. The cooling main roller is configured to convey a base material and cool the base material; the evaporation module is configured to evaporate a target material so as to coat a film on the base material; the water-cooling panel is arranged between the cooling main roller and the evaporation module, at least part of the surface of the water-cooling panel sinks to form a cooling space, the cooling space is used for containing at least part of the cooling main roller, and the water-cooling panel is configured to cool the target material so as to coat a film on the base material, a cooling circulation pipeline is arranged in the water cooling panel and is configured to reduce the surface temperature of the water cooling panel. According to the cooling device provided by the invention, the phenomenon that the base material is damaged can be effectively avoided, splashing of the target material can be reduced, the problem of thermal damage caused by insufficient cooling effect in the vacuum copper plating process is solved, and the coating rate is greatly improved.

Description

Technical Field

[0001] The present disclosure relates to the field of vacuum coating technology, and in particular to a cooling device and vacuum coating equipment. Background Art

[0002] The working principle of vacuum evaporation coating technology is to heat the evaporation module under vacuum conditions to vaporize the metal in the evaporation module, and the vapor atoms or molecules are deposited on the substrate and condensed to form a thin film. When plating copper, a metal with high melting and boiling points, a lot of heat is generated, which will cause the surface temperature of the panel to be very high, resulting in insufficient water cooling effect. In addition, the panel is very close to the base film, which can easily cause burns on the base film surface and wrinkles. Utility Model Content

[0003] The purpose of the present disclosure is to provide a cooling device and a vacuum coating device to solve the technical problems in the related art. The specific scheme is as follows:

[0004] A first aspect of an embodiment of the present disclosure provides a cooling device, comprising: a cooling main roller, configured to convey a substrate and cool the substrate; a vapor deposition module, configured to evaporate a target material to coat the substrate; a water-cooled panel, disposed between the cooling main roller and the vapor deposition module, wherein at least a portion of a surface of the water-cooled panel is sunken to form a cooling space, wherein the cooling space is used to accommodate at least a portion of the cooling main roller, and the water-cooled panel is configured to cool the target material to coat the substrate, wherein a cooling circulation pipeline is disposed inside the water-cooled panel, configured to reduce the surface temperature of the water-cooled panel.

[0005] In some embodiments, the water-cooling panel includes: a containing space, disposed inside the water-cooling panel, configured to accommodate the cooling circulation pipeline, wherein the cooling circulation pipeline is coiled and folded in the containing space to increase the water cooling area.

[0006] In some embodiments, the cooling space is disposed through the water-cooling panel, and at least a portion of the cooling main roller is exposed at a lower surface of the water-cooling panel.

[0007] In some embodiments, a gap is provided between the outer surface of the cooling main roller and the inner surface of the cooling space, and the cooling main roller is rotatably disposed in the cooling space.

[0008] In some embodiments, in the thickness direction of the water-cooled panel, the projection of the cooling circulation pipeline surrounds the cooling main roller.

[0009] In some embodiments, the diameter of the cooling circulation pipeline is not less than 30 mm.

[0010] In some embodiments, the cooling device further includes: a quick-connect connector, which is disposed on an outer wall of the water-cooled panel, is connected to the cooling circulation pipeline, and is configured to connect an external water pipe to the cooling circulation pipeline.

[0011] In some embodiments, the water cooling panel is an integrally formed part.

[0012] In some embodiments, the cooling device further includes: a fixing mechanism, which is disposed on an edge of the water-cooling panel so that the water-cooling panel is fixed below the cooling main roller.

[0013] A second aspect of the embodiments of the present disclosure provides a vacuum coating device, including: the cooling device provided in the first aspect of the embodiments of the present disclosure.

[0014] Compared with the related art, the above solution of the embodiment of the present disclosure has at least the following beneficial effects:

[0015] In the cooling device and vacuum coating equipment provided by the present disclosure, a cooling circulation pipeline is arranged inside the water-cooling panel of the cooling device, and cold water is passed into the cooling circulation pipeline, which can effectively reduce the surface temperature of the water-cooling panel, so that during the substrate coating process, the target material or the substrate is cooled by the water-cooling panel to avoid damage to the substrate. The cooling device provided by the present disclosure is conducive to reducing the splashing of the target material and is conducive to the shaping of the substrate after coating, which solves the problem of thermal damage caused by insufficient cooling effect during the vacuum copper plating process, increases the water cooling area, and greatly improves the coating rate.

[0016] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 The figure is a schematic structural diagram of a water cooling panel according to an exemplary embodiment.

[0019] Figure 2 is a cross-sectional view of a water cooling panel according to an exemplary embodiment.

[0020] Figure 3 The figure is a schematic structural diagram of a cooling circulation pipeline according to an exemplary embodiment.

[0021] Figure 4 It is a schematic structural diagram of a cooling device and an evaporation module according to an exemplary embodiment.

[0022] Reference numerals:

[0023] Cooling the main roller 100, the first side 110, and the second side 120;

[0024] Water cooling panel 200, cooling space 201, cooling circulation pipeline 210, water inlet 211, water outlet 212, quick connector 220, fixing mechanism 230;

[0025] Evaporation module 300 . DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0027] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. The singular forms "a", "said" and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, and other quantifiers are similar.

[0028] It should be understood that, although the terms first, second, third, etc. may be used to describe in the disclosed embodiments, these descriptions should not be limited to these terms. These terms are only used to distinguish the described objects. For example, without departing from the scope of the disclosed embodiments, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0029] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include the plural forms, unless the context clearly indicates other meanings.

[0030] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0032] In the related art, when the composite current collector vacuum coating equipment is coating, the coating needs to be coated with base films of various sizes, and the width and radiation angle are mainly controlled by the panel. Some panels also have a cooling function. Most water-cooled panels of vacuum coating equipment weld water cooling pipes on the surface of the panel to achieve the cooling effect. When plating copper, a high melting point and boiling point metal, the evaporation source generates a lot of heat. Relying on the cooling main roller and the water cooling pipes welded on the outside is not enough to cool the substrate, and the water cooling effect will be insufficient, resulting in problems such as excessive surface temperature of the panel. Moreover, since the panel is very close to the substrate, only about 5mm, when the surface temperature of the panel exceeds 300°C, the high surface temperature of the panel will cause burns on the surface of the base film and wrinkles.

[0033] Based on the above description, the present invention provides a cooling device and a vacuum coating equipment, the cooling device comprising: a cooling main roller, configured to convey a substrate and cool the substrate; a evaporation module, configured to evaporate a target material to coat the substrate; a water-cooled panel, arranged between the cooling main roller and the evaporation module, at least part of the surface of the water-cooled panel is sunken to form a cooling space, the cooling space is used to accommodate at least part of the cooling main roller, the water-cooled panel is configured to cool the target material to coat the substrate, wherein a cooling circulation pipeline is arranged inside the water-cooled panel, configured to reduce the surface temperature of the water-cooled panel.

[0034] In the cooling device and vacuum coating equipment provided by the present disclosure, a cooling circulation pipeline is arranged inside the water-cooling panel of the cooling device, and cold water is passed into the cooling circulation pipeline, which can effectively reduce the surface temperature of the water-cooling panel, so that during the substrate coating process, the target material or the substrate is cooled by the water-cooling panel to avoid damage to the substrate. The cooling device provided by the present disclosure is conducive to reducing the splashing of the target material and is conducive to the shaping of the substrate after coating, which solves the problem of thermal damage caused by insufficient cooling effect during the vacuum copper plating process, increases the water cooling area, and greatly improves the coating rate.

[0035] In view of this, optional embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0036] A first aspect of an embodiment of the present disclosure provides a cooling device, including: a cooling main roller 100 , an evaporation module 300 , and a water-cooled panel 200 .

[0037] like Figure 1 As shown, the substrate wraps the outer surface of the cooling main roller 100 and is conveyed as the cooling main roller 100 rotates. During the conveying process of the substrate, the cooling main roller 100 has the ability or tendency to self-rotate and form a steady state, so that the substrate can fully utilize the cooling capacity of the cooling main roller 100, quickly remove the heat on the substrate, and better protect the finished product of the substrate coating.

[0038] In some embodiments, a target material is disposed inside the evaporation module 300 , and the target material is the material to be plated, and is used to coat the substrate.

[0039] Specifically, under vacuum conditions, the evaporation of metal or non-metal materials is much easier than under atmospheric pressure conditions, and the evaporation module 300 acts as an evaporation source to provide heat for the evaporation coating. The evaporation coating process can be considered as three stages: the evaporation process of the material to be plated - the migration process of the evaporation material particles - the precipitation process of the evaporation material particles.

[0040] During film coating, the evaporation module 300 heats the material to be plated, so that the evaporated material diffuses in the state of atoms or molecules. Under vacuum, at normal evaporation pressure, atoms or molecules migrate from the evaporation source to the surface of the substrate with almost no collision, so there is no energy loss during migration. When the atoms or molecules of the material to be plated are incident on a range of several atomic diameters close to the surface of the substrate, they enter the area of ​​action of the surface force of the substrate and are deposited on the surface of the substrate to form a thin film, wherein the material to be plated can be a copper material.

[0041] During the evaporation coating process, the temperature of the evaporation module 300 is high and the distance between the evaporation module 300 and the substrate is very small, which can easily cause the substrate surface to be burned or wrinkled. To avoid the substrate from being burned, it is necessary to increase the cooling area of ​​the cooling device, improve the cooling effect, and reduce the target material evaporation rate to improve the above problems.

[0042] To solve the above problem, the cooling capacity of the cooling main roller 100 alone is not enough to protect the substrate. Therefore, the present disclosure provides a water-cooled panel 200, such as Figure 1 As shown, the water-cooled panel 200 is arranged below the cooling main roller 100, and a cooling circulation pipeline 210 is arranged inside the water-cooled panel 200. The cooling circulation pipeline 210 is configured to reduce the temperature of the surface of the water-cooled panel 200 to achieve cooling of the target material, so that the target material can quickly form a film on the surface of the substrate to avoid burns or wrinkles on the surface of the substrate.

[0043] Specifically, the cooling circulation pipeline 210 has a water inlet end 211 and a water outlet end 212 , which are respectively used to communicate with external cold water, so that the external cold water flows into the cooling circulation pipeline 210 to cool the water-cooled panel 200 .

[0044] In some embodiments, Figure 2 As shown, at least part of the upper surface of the water-cooled panel 200 is sunken to form a cooling space 201, and the cooling space 201 is used to accommodate at least part of the cooling main roller 100, and the water-cooled panel 200 is configured to cool the target material. The cooling space 201 is used to accommodate at least part of the cooling main roller 100, so that the cooling main roller 100 is rotatably arranged in the cooling space 201. In response to the cooling main roller 100 driving the substrate to be transferred to the inside of the cooling space 201, the cooling main roller 100 and the water-cooled panel 200 work together to reduce the temperature of the substrate surface, and at the same time, reduce the temperature of the evaporated target material to prevent the target material splashing liquid from scalding the substrate surface.

[0045] In some embodiments, the cooling main roller 100 has a first side 110 and a second side 120. When the cooling main roller 100 rotates in a counterclockwise direction, the substrate is transported from the first side 110 to the second side 120. Since the water-cooling panel 200 surrounds the cooling main roller 100, that is, the water-cooling panel 200 cools the substrate twice when it passes through the first side 110 and the second side 120.

[0046] In some embodiments, the cooling space 201 can be a through hole, which is arranged through the water-cooled panel 200, and at least a portion of the cooling main roller 100 is arranged in the through hole. There is a gap between the inner surface of the cooling space 201 and at least a portion of the outer surface of the cooling main roller 100, and the cooling main roller 100 can rotate relative to the cooling space 201.

[0047] like Figure 2 The cooling space 201 is a through hole with a narrow top width, and the inner surface of the cooling space 201 has the same curvature as at least part of the outer surface of the cooling main roller 100. The cooling main roller 100 can be installed in the cooling space 201 and rotate freely in the cooling space 201. As a result, the cooling range of the cooling panel on the cooling main roller 100 is increased, and the temperature of the surface of the substrate and the evaporation target material can be reduced by the combined action of the cooling main roller 100 and the water-cooled panel 200, so as to reduce the deposition rate, speed up the film formation speed, and avoid damage to the substrate after evaporation.

[0048] In some embodiments, the coating area of ​​the substrate can be adjusted by adjusting the length and width of the cooling space 201 to achieve coating at different positions on the substrate surface or control the coating range on the substrate surface.

[0049] In some embodiments, at least a portion of the cooling main roller 100 is exposed on the lower surface of the water-cooling panel 200. Specifically, the exposed portion of the cooling main roller 100 is configured as a coating area of ​​the substrate.

[0050] When the cooling main roller 100 rotates in the counterclockwise direction, the substrate is transported from the first side 110 of the cooling main roller 100 to the second side 120 of the cooling main roller 100 through the coating area of ​​the cooling space 201. At this time, the evaporation source coats the substrate in the coating area. The water-cooling panel 200 is arranged around the cooling main roller 100 to rapidly cool the evaporation target after encountering the substrate, and to rapidly cool the substrate after coating, thereby ensuring the water-cooling effect and rapidly forming the coated substrate, thereby avoiding the over-high temperature of the water-cooling panel 200 causing scalding of the substrate.

[0051] In some embodiments, in order to avoid the problem of the substrate surface being scalded or wrinkled due to the over-high temperature of the cooling device, the water-cooling panel 200 may be made of pure aluminum. Since aluminum has good thermal conductivity, the water-cooling panel 200 of pure aluminum structure can quickly volatilize the heat on the surface of the water-cooling panel 200, thereby improving the cooling effect of the cooling circulation pipeline 210 on the water-cooling panel 200, and further cooling the substrate wrapped on the cooling main roller 100.

[0052] In some embodiments, the water-cooled panel 200 is provided with a receiving space inside, and the cooling circulation pipeline 210 is provided in the receiving space and configured to reduce the surface temperature of the water-cooled panel 200. Figure 4 As shown, the cooling circulation pipeline 210 is coiled and folded in the accommodating space, thereby increasing the flow path of cold water inside the water-cooled panel 200 to increase the cooling area on the surface of the water-cooled panel 200 .

[0053] In some embodiments, the outer wall of the water-cooled panel 200 is provided with a quick-connect connector 220, which is connected to the water inlet 211 and the water outlet 212 of the cooling circulation pipeline 210 inside the water-cooled panel 200, and is configured to connect external cold water to the cooling circulation pipeline 210 through the quick-connect connector 220, so that the cold water flows in the cooling circulation pipeline 210 to form a cold water circulation to cool the water-cooled panel 200. The surface temperature of the water-cooled panel 200 is reduced to accelerate the cooling rate of the target material, reduce the target material deposition rate, and avoid thermal damage that may occur during the evaporation process.

[0054] It should be noted that the water inlet end 211 and the water outlet end 212 of the cooling circulation pipeline 210 can be arranged on the same side or different sides of the water-cooled panel 200. Regardless of whether the water inlet end 211 and the water outlet end 212 are arranged on the same side or different sides of the water-cooled panel 200, it will not affect the cooling effect of the cooling circulation pipeline 210 on the water-cooled panel 200.

[0055] In some embodiments, in the thickness direction of the water-cooled panel 200, the projection of the cooling circulation pipeline 210 surrounds the cooling main roller 100. Thus, the cooling range of the water-cooled panel 200 is increased, the cooling effect is sufficient, the surface temperature of the cooling panel does not exceed 30°C, and wrinkles on the surface of the base film during film formation are avoided, resulting in poor appearance and other problems.

[0056] In some embodiments, to ensure that the cooling circulation pipeline 210 has a good cooling effect, the diameter of the cooling circulation pipeline 210 is not less than 30 mm. Large channel pipelines are conducive to increasing the flow rate of cold water, and at the same time, the cooling circulation pipeline 210 has a larger flow volume. The flowing cold water can quickly exchange heat with the surface of the substrate to avoid scalding or wrinkling of the substrate.

[0057] In some embodiments, in order to make the water-cooling panel 200 have a better cooling effect, the water-cooling panel 200 can be an integrally formed part. The integrally formed part has good mechanical strength, a smooth surface, and has the advantages of simple operation and high production efficiency during processing.

[0058] In some embodiments, the substrate can be a composite current collector material. As a substitute for aluminum foil and copper foil for positive and negative electrodes of lithium batteries, composite current collector materials are widely used in the preparation process of lithium battery products. Vacuum evaporation coating is the main processing method for composite current collector materials.

[0059] In some embodiments, the water cooling device also includes a temperature sensor for monitoring the surface temperature of the water cooling surface. The temperature sensor can be used to feedback information to control the flow rate of the cold water so that the water cooling surface maintains a temperature suitable for substrate processing and coating.

[0060] In some embodiments, the cooling device further includes a fixing mechanism 230, which is disposed at the edge of the water-cooled panel 200 to fix the water-cooled panel 200 below the cooling main roller 100. In response to the cooling main roller 100 driving the substrate to be coated, the cooling circulation pipeline 210 is connected to circulating cold water to reduce the surface temperature of the water-cooled panel 200, so as to cool the target material and the substrate.

[0061] The water cooling device provided in the first aspect of the embodiment of the present disclosure includes a water cooling panel 200, and a cooling circulation pipeline 210 is arranged inside the water cooling panel 200, which can make the surface temperature of the water cooling panel 200 not exceed 30 degrees Celsius, thereby reducing the surface temperature of the water cooling panel 200 to effectively cool the substrate.

[0062] A second aspect of the embodiments of the present disclosure provides a vacuum coating device, including: the cooling device provided in the first aspect of the embodiments of the present disclosure.

[0063] In some embodiments, the cooling main roller 100 is disposed on one side of the evaporation module 300 and is configured to convey the substrate. The cooling effect of the cooling main roller 100 can assist the evaporation module 300 in copper-plating the substrate, thereby reducing the surface temperature of the substrate during the coating process, allowing the coated substrate to be quickly formed, and avoiding damage to the substrate due to excessive temperature of the evaporation module 300.

[0064] Specifically, Figure 1As shown, the evaporation module 300 is disposed on a side of the water-cooled panel 200 away from the cooling main roller 100, facing the cooling space 201 of the water-cooled panel 200, and configured to evaporate the target material to coat the substrate. The surface of the cooling main roller 100 is wrapped with a substrate, at least part of the cooling main roller 100 is disposed in the cooling space 201 of the water-cooled panel 200, and at least part of the cooling main roller 100 passes through the cooling space 201, so that the substrate is exposed on the surface of the side of the water-cooled panel 200 adjacent to the evaporation module 300, and the substrate is coated through the evaporation module 300 under the rotation of the cooling main roller 100. Furthermore, the cold water flowing in the cooling circulation pipeline 210 inside the water-cooled panel 200 can cool the surface of the water-cooled panel 200, so that the maximum temperature of the surface of the water-cooled panel 200 is lower than 30°C, thereby improving the cooling effect. At the same time, the target material evaporated by the evaporation device 300 is cooled, and the film deposition rate is improved, so that the target material can be quickly formed into a film on the surface of the substrate, thereby avoiding heat loss of the substrate due to insufficient cooling capacity during the evaporation coating process. Compared with the related art, the water-cooled panel 200 provided in the present application has a cooling circulation pipeline 210 inside, and the water-cooled panel 200 and the cooling main roller 100 have a relatively close position relationship. Compared with the related art, the surface temperature of the water-cooled panel in the related art is reduced by at least 270°C.

[0065] In other embodiments, the evaporation module 300 may further include a protective plate, which is used to prevent the target material melt from splashing. A cooling circulation pipeline 210 may be provided on the surface of the protective plate to cool the coated substrate and at the same time reduce the surface temperature of the water-cooled panel 200.

[0066] In some embodiments, a reeling assembly and a reeling assembly may also be provided inside the vacuum coating equipment.

[0067] The unwinding assembly includes an unwinding shaft and an unwinding roller, wherein the unwinding roller is sleeved on the unwinding shaft and rotates synchronously with the rotation of the unwinding shaft. The substrate to be processed is rolled and arranged on the unwinding roller, and the substrate is released according to the rotation speed of the unwinding roller.

[0068] The winding assembly comprises a winding shaft and a winding roller, wherein the winding roller is sleeved on the winding shaft and rotates synchronously with the rotation of the winding shaft. The winding roller is used to receive the processed substrate and wind up the substrate.

[0069] Inside the vacuum evaporation device, the cooling device and the evaporation module 300 are arranged between the unwinding assembly and the winding assembly. Specifically, the substrate is mounted on the unwinding roller, and the unwinding roller rotates to unwind the substrate toward the cooling device. When the substrate is coated on the surface of the substrate by the evaporation module 300, the surface of the substrate will be coated with a target material of about one micron, which can be copper or aluminum.

[0070] Since the surface temperature of the substrate is relatively high, the surface of the substrate needs to be cooled down. Therefore, under the action of the cooling device, the substrate is transferred from the cooling main roller 100 to the winding roller direction, and is finally sorted and stored by the winding roller.

[0071] At this time, the surface temperature of the substrate passing through the evaporation module 300 is relatively high. If there is no cooling and shaping process of the cooling main roller 100, the substrate may have side effects during the winding process. Therefore, the cooling main roller 100 can cool and shape the coated substrate, so that most of the heat on the surface of the substrate is transferred to the cooling main roller 100. Further, the cooled substrate can be smoothly rolled up into the winding component, which is beneficial to eliminate wrinkles and dark lines on the surface of the substrate.

[0072] The specific structure, working principle, and beneficial effects of the cooling device and vacuum coating equipment provided by the embodiments of the present disclosure can refer to the cooling device and vacuum coating equipment described in any of the above embodiments, and will not be repeated here.

[0073] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the system or device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0074] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A cooling device, characterized in that: include: a cooling main roller configured to convey a substrate and cool the substrate; An evaporation module configured to evaporate a target material to coat the substrate; A water-cooling panel is disposed between the cooling main roller and the evaporation module, at least a portion of the surface of the water-cooling panel is sunken to form a cooling space, the cooling space is used to accommodate at least a portion of the cooling main roller, and the water-cooling panel is configured to cool the target material to coat the substrate. Wherein, a cooling circulation pipeline is arranged inside the water-cooling panel, which is configured to reduce the surface temperature of the water-cooling panel.

2. The cooling device according to claim 1, characterized in that: The water cooling panel comprises: The accommodating space is arranged inside the water-cooling panel and is configured to accommodate the cooling circulation pipeline. Wherein, the cooling circulation pipeline is coiled and folded in the accommodating space to increase the water cooling area.

3. The cooling device according to claim 1, characterized in that: The cooling space is provided through the water-cooling panel, and at least a portion of the cooling main roller is exposed at a lower surface of the water-cooling panel.

4. The cooling device according to claim 1, characterized in that: A gap is formed between the outer surface of the cooling main roller and the inner surface of the cooling space, and the cooling main roller is rotatably arranged in the cooling space.

5. The cooling device according to claim 2, characterized in that: In the thickness direction of the water-cooling panel, the projection of the cooling circulation pipeline surrounds the cooling main roller.

6. The cooling device according to claim 2, characterized in that: The diameter of the cooling circulation pipeline is not less than 30 mm.

7. The cooling device according to claim 1, characterized in that: Also includes: A quick-connect connector is disposed on an outer side wall of the water-cooling panel, is communicated with the cooling circulation pipeline, and is configured to connect an external water pipe to the cooling circulation pipeline.

8. The cooling device according to claim 1, characterized in that: The water cooling panel is an integrally formed part.

9. The cooling device according to claim 1, characterized in that: Also includes: The fixing mechanism is arranged on the edge of the water-cooling panel so as to fix the water-cooling panel below the cooling main roller.

10. A vacuum coating device, characterized in that: include: The cooling device according to any one of claims 1 to 9.

Images