Wire temperature monitoring device

Abstract

The utility model discloses a lead temperature monitoring device, and relates to the field of lead temperature monitoring. The utility model provides a lead temperature monitoring device comprising a temperature acquisition board, a terminal main control board and a signal radio frequency board which are connected in sequence. The signal radio frequency board comprises a 433MHZ communication module; and the 433MHZ communication module is connected with the terminal main control board. According to the utility model, the 433MHZ wireless communication module conforming to the 6lowPan ad hoc network protocol is adopted, so that the safety of data messages can be guaranteed to the maximum extent; in the aspect of signal acquisition, a temperature acquisition board is adopted, so that temperature data can be accurately and stably acquired.

Description

Technical Field

[0001] The utility model relates to the field of wire temperature monitoring, in particular to a wire temperature monitoring device. Background Art

[0002] With the acceleration of the construction of new power systems and the digital transformation of power grids, various online monitoring products, including conductor temperature monitoring devices, have entered a period of rapid development.

[0003] During the operation of overhead transmission lines, wire breakage and strand breakage accidents caused by excessive conductor temperature can easily cause huge economic losses and even casualties. Therefore, it is of great application significance to use an online monitoring device with high safety performance, long service life and high monitoring accuracy to detect the body temperature of the ground conductor.

[0004] To solve the above problems, there are many ways to measure the temperature of the wire. For example, in the Chinese invention patent application CN107820224A, a temperature sensor is used to collect the temperature value of the wire body, and it is sent to the MCU through the GPIO port. After data processing, the data is sent to the back-end system platform via the NB-iot wireless module. In the utility model patent CN201497588U, a one-line digital temperature sensor DS18B20 is used to collect temperature signals, and then the temperature signals are transmitted to the P89C58 microcontroller for data processing, and the data is transmitted to the monitoring center of the municipal bureau via the ZigBee transmission module.

[0005] However, most existing wire temperature measurement devices use traditional communication modules such as IoT communication modules and Zigbee wireless communication modules for data communication, which has low data security. In addition, they all use existing temperature sensors on the market for data collection, and the accuracy of data collection needs to be improved. Utility Model Content

[0006] In order to solve the above problems existing in the prior art, the utility model provides a conductor temperature monitoring device.

[0007] To achieve the above purpose, the utility model provides the following solutions:

[0008] A wire temperature monitoring device comprises a temperature acquisition board, a terminal main control board and a signal radio frequency board which are connected in sequence; the signal radio frequency board comprises a 433MHZ communication module; the 433MHZ communication module is connected to the terminal main control board;

[0009] The temperature acquisition board is used to generate a digital signal based on the wire temperature;

[0010] The terminal main control board is used to obtain the temperature data of the wire based on the digital signal, and to provide power for the temperature acquisition board and the signal radio frequency board; the signal radio frequency board is used to send the temperature data.

[0011] Optionally, the temperature collection board is connected to the terminal main control board in the form of a socket strip.

[0012] Optionally, the signal radio frequency board is connected to the terminal main control board in the form of a socket strip.

[0013] Optionally, the temperature acquisition board includes: a constant current source circuit, a PT100 platinum resistor, a resistor and an A / D acquisition circuit;

[0014] The resistor is connected to the constant current source circuit and the PT100 platinum resistor respectively; the PT100 platinum resistor and the resistor are both connected to the A / D acquisition circuit; the PT100 platinum resistor is installed on the surface of the overhead line ground wire, and the PT100 platinum resistor is used to sense the conductor temperature; the A / D acquisition circuit is used to obtain the voltage of the resistor and the voltage of the PT100 platinum resistor, and convert the gain voltage of the resistor and the gain voltage of the PT100 platinum resistor into digital signals; the constant current source circuit is used to provide current.

[0015] Optionally, the A / D acquisition circuit includes: a first operational amplifier, a second operational amplifier and an A / D conversion chip;

[0016] The A / D conversion chip is respectively connected to the first operational amplifier, the second operational amplifier and the terminal main control board; the first operational amplifier is used to obtain the gain voltage of the resistor; the second operational amplifier is used to obtain the gain voltage of the PT100 platinum resistor; the A / D conversion chip is used to convert the gain voltage of the resistor and the gain voltage of the PT100 platinum resistor into digital signals; the terminal main control board is used to determine the temperature value of the wire based on the digital signal to generate the temperature data.

[0017] Optionally, the terminal main control board includes a single-chip microcomputer; the single-chip microcomputer is connected to the temperature collection board.

[0018] Optionally, the model of the single chip microcomputer is STM32L431.

[0019] According to the specific embodiments provided by the utility model, the utility model discloses the following technical effects:

[0020] The conductor temperature monitoring device provided by the utility model adopts a 433MHZ wireless communication module that complies with the 6lowPan self-organizing network protocol, which can maximize the security of data messages; in terms of signal collection, the utility model adopts a temperature collection board, which can accurately and stably collect temperature data. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of the conductor temperature monitoring device provided by the utility model;

[0023] Figure 2 The structural principle diagram of the temperature collection board provided by the utility model;

[0024] Figure 3 This is a flowchart of the implementation of the framework program implanted in the terminal main control board provided by the utility model. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The utility model aims to provide a conductor temperature monitoring device, which can improve the accuracy of temperature data collection while improving data security.

[0027] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0028] like Figure 1 As shown, the wire temperature monitoring device provided by the utility model comprises a temperature acquisition board, a terminal main control board and a signal radio frequency board which are sequentially connected in a plug-in form. Among them, the signal radio frequency board comprises a 433MHZ communication module. The 433MHZ communication module is connected to the terminal main control board.

[0029] The temperature acquisition board is used to generate a digital signal based on the wire temperature.

[0030] The terminal main control board is used to obtain the temperature data of the wire based on the digital signal, and is used to provide power for the temperature acquisition board and the signal radio frequency board. The signal radio frequency board is used to send the temperature data.

[0031] In actual application, the terminal main control board supplies 3.3V voltage to the temperature acquisition board, which can be disconnected according to the working status, and uses the SPI interface (SS chip select, MISO, MOSI, SCLK) for data communication. The terminal main control board supplies 3.3V voltage to the signal radio frequency board, which can be disconnected according to the working status, uses the USART serial port for communication, and has the function of controlling the sleep of the 433MHZ communication module.

[0032] Furthermore, in order to achieve accurate collection and safe transmission of the conductor temperature, the utility model uses PT100 platinum resistance as the core component of the temperature acquisition board at the hardware level, and designs related circuits to achieve the purpose of accurately collecting the conductor temperature. The core component of the terminal main control board is stm32L431, which mainly processes the collected AD signal and is equipped with a low-power program framework to achieve ultra-low power operation of the terminal device. The signal radio frequency board is mainly equipped with a 433Mhz wireless communication module, and the main control board controls the working state of the wireless communication module to realize the sending and receiving of data messages. At the software level, the terminal program is burned on the stm32L431 of the terminal main control board, and the stm32L431 controls functions such as temperature signal acquisition, data reporting and sleep.

[0033] Based on the above description, the temperature acquisition board uses PT100 platinum resistor as the core component. The resistance range of PT100 platinum resistor is (18.52, 332.79), the temperature range is (-200℃, 660℃), and there is a strong linear relationship between temperature and resistance. Therefore, the temperature acquisition board provided by the utility model also includes a constant current source circuit, a resistor and an A / D acquisition circuit, such as Figure 2 shown. Figure 2 middle, I m is the stable current output by the constant current source circuit, R ref is the resistance value of the resistor, R pt is the resistance value of PT100 platinum resistor, A1 is the gain coefficient of the first operational amplifier in the A / D acquisition circuit, A2 is the gain coefficient of the second operational amplifier in the A / D acquisition circuit, V ref is the input voltage of the first conversion channel of the A / D conversion chip in the A / D acquisition circuit, V pt is the input voltage of the second conversion channel of the A / D conversion chip in the A / D acquisition circuit. Based on the designed temperature acquisition board, according to the principle of dual-integral ADC, we can get:

[0034] V pt =V ref1·((N2·T0) / (N1·T0))=V ref1 ·(N2 / N1).

[0035] V ref =A1·I m ·R ref .

[0036] V pt =A2·I m ·R pt .

[0037] Among them, T0 is the counting cycle, N1 is the output value of the first conversion channel, and N2 is the output value of the second conversion channel. After sorting, we get:

[0038] R pt =R ref ·(N2 / N1).

[0039] It can be seen that the resistance of the platinum resistor is linearly related to the output value of the two conversion channels. Only by obtaining the digital value of the two conversion channels can the temperature at the collection point be calculated. Therefore, the temperature collection board uses the PT100 platinum resistor as the core component, designs the corresponding constant current source circuit and AD collection circuit, and can obtain the precise resistance value of the PT100 platinum resistor. The PT100 platinum resistor is installed on the surface of the overhead line ground wire to obtain the surface temperature of the ground wire.

[0040] Furthermore, the core component of the terminal main control board can be a single-chip microcomputer. For example, the model of the single-chip microcomputer used can be STM32L431. Based on this, the main program framework in the wire temperature monitoring device provided by the utility model can be written on the single-chip microcomputer STM32L431. The main framework program includes ADC acquisition program, temperature calculation program, 433MHZ packet sending program, single-chip microcomputer low power consumption program, etc. The implementation process of the framework program is as follows: Figure 3 shown.

[0041] After the wire temperature monitoring device is powered on, the MCU is initialized first. After the initialization is completed, the MCU main() main program is entered, and the AD acquisition subroutine is run. After the AD value acquisition is completed, the temperature calculation subroutine is run. After the temperature calculation is completed, the 433MHZ module packet sending program is entered. According to the micro-power wireless networking protocol, the calculated temperature value is sent to the edge agent. After the sending is completed, it enters the sleep state. After the wire temperature monitoring device enters the sleep state, the MCU timer starts working. After the timer threshold is reached, the MCU program is executed from running the AD acquisition subroutine. In this way, the wire temperature monitoring device can realize the function of reporting temperature data at a fixed period.

[0042] Based on the above description, the wire temperature monitoring device provided by the utility model adopts a 433MHZ wireless communication module that complies with the 6lowPan self-organizing network protocol, which can maximize the security of data messages. In terms of signal acquisition, the utility model is based on PT100 platinum resistance and designs an accurate and stable signal acquisition circuit. Compared with the existing temperature sensors on the market, it can not only accurately sense the temperature, but also effectively calibrate the wire temperature, thereby increasing the credibility of the data message.

[0043] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0044] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. At the same time, for those skilled in the art, according to the ideas of the utility model, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A conductor temperature monitoring device, characterized in that: It includes a temperature acquisition board, a terminal main control board and a signal radio frequency board which are connected in sequence; the signal radio frequency board includes a 433MHZ communication module; the 433MHZ communication module is connected to the terminal main control board; The temperature acquisition board is used to generate a digital signal based on the wire temperature; The terminal main control board is used to obtain the temperature data of the wire based on the digital signal, and to provide power for the temperature acquisition board and the signal radio frequency board; The signal radio frequency board is used to send the temperature data.

2. The conductor temperature monitoring device according to claim 1, characterized in that: The temperature collection board is connected to the terminal main control board in the form of a socket strip.

3. The conductor temperature monitoring device according to claim 1, characterized in that: The signal radio frequency board is connected to the terminal main control board in the form of a socket strip.

4. The conductor temperature monitoring device according to claim 1, characterized in that: The temperature acquisition board includes: a constant current source circuit, a PT100 platinum resistor, a resistor and an A / D acquisition circuit; The resistor is connected to the constant current source circuit and the PT100 platinum resistor respectively; the PT100 platinum resistor and the resistor are both connected to the A / D acquisition circuit; the PT100 platinum resistor is installed on the surface of the overhead line ground wire, and the PT100 platinum resistor is used to sense the conductor temperature; the A / D acquisition circuit is used to obtain the voltage of the resistor and the voltage of the PT100 platinum resistor, and convert the gain voltage of the resistor and the gain voltage of the PT100 platinum resistor into digital signals; the constant current source circuit is used to provide current.

5. The conductor temperature monitoring device according to claim 4, characterized in that: The A / D acquisition circuit includes: a first operational amplifier, a second operational amplifier and an A / D conversion chip; The A / D conversion chip is respectively connected to the first operational amplifier, the second operational amplifier and the terminal main control board; the first operational amplifier is used to obtain the gain voltage of the resistor; the second operational amplifier is used to obtain the gain voltage of the PT100 platinum resistor; the A / D conversion chip is used to convert the gain voltage of the resistor and the gain voltage of the PT100 platinum resistor into digital signals; the terminal main control board is used to determine the temperature value of the wire based on the digital signal to generate the temperature data.

6. The conductor temperature monitoring device according to claim 1, characterized in that: The terminal main control board includes a single chip microcomputer; the single chip microcomputer is connected to the temperature collection board.

7. The conductor temperature monitoring device according to claim 6, characterized in that: The model of the single chip microcomputer is STM32L431.

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