Punching device for DIP packaging chip production

Abstract

The utility model discloses a punching device for DIP packaging chip production, which comprises a device main body, a moving seat is arranged in the device main body in a sliding manner, the right side of the device main body is provided with a rotating assembly I, the top of the moving seat is provided with a guide assembly, the moving seat is provided with a fixed frame I through the guide assembly, and the fixed frame I is provided with a fixed frame II through the guide assembly. And a clamping assembly is arranged at the top of the fixing frame I. According to the punching device for DIP packaging chip production, the clamping size can be conveniently and rapidly adjusted, the first gear is driven by the second rotating assembly, so that the first gear drives the rotating base to rotate forwards and backwards, the rotating base drives the clamping assembly to rotate forwards and backwards, and angle adjustment can be conveniently conducted on the punching assembly; the punching device for DIP packaging chip production solves the problem that an existing punching device for DIP packaging chip production cannot rapidly and stably clamp DIP chips according to different sizes of the DIP chips, avoids the situation that the chips cannot be punched in different directions when the chips are punched, and improves the applicability of the device.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a punching device for producing DIP packaged chips. Background Art

[0002] DIP refers to an integrated circuit chip packaged in a dual in-line package format. Most small and medium-scale integrated circuits use this packaging format, and the number of pins generally does not exceed 100. The CPU chip using DIP packaging has two rows of pins and needs to be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering.

[0003] A punching device is required for punching during the production process of DIP packaged chips. However, the existing punching device for DIP packaged chip production cannot quickly and stably clamp the DIP chips according to the different sizes of the chips, and cannot punch the chips in different directions during chip punching. Therefore, a punching device for DIP packaged chip production is proposed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a punching device for producing DIP packaged chips, which is used to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A punching device for producing DIP packaged chips comprises a device body, a movable seat is slidably arranged inside the device body, a rotating component 1 is arranged on the right side of the device body, a guide component is arranged on the top of the movable seat, a fixed frame 1 is arranged on the movable seat through the guide component, a clamping component is arranged on the top of the fixed frame 1, a support component is arranged inside the device body, a support frame is fixedly arranged on the rear side of the device body, a rotating component 2 is arranged on the top of the support frame, a gear 1 is arranged on the support frame through the rotating component 2, a rotating seat is fixedly arranged inside the gear 1, an annular frame is rotatably arranged on the surface of the rotating seat, the surface of the annular frame is fixedly arranged with the support frame, and a punching component is arranged inside the rotating seat.

[0007] Preferably, the rotating component 1 includes a motor 1 fixedly arranged on the right side of the device body, a bidirectional threaded rod is fixedly arranged at the output end of the motor 1, the bidirectional threaded rod is rotatably arranged with the device body, and the surface of the bidirectional threaded rod is threadedly arranged with the inner wall of the movable seat.

[0008] Preferably, the guide assembly includes a moving block fixedly arranged on the top of the moving seat, the top of the moving block is fixedly arranged on the bottom of the fixed frame, the moving block is slidably arranged on the inner wall of the device body, the inner wall of the moving block is slidably arranged with a limit rod, and the inner wall of the limit rod is fixedly arranged on the inner wall of the device body.

[0009] Preferably, the clamping assembly includes an electric push rod 1 fixedly arranged on the top of a fixing frame 1, and the output end of the electric push rod 1 passes through the top surface of the fixing frame 1 and extends to the inside of the fixing frame 1 where a clamping plate is fixedly arranged.

[0010] Preferably, the support assembly includes an electric push rod 2 fixedly arranged inside the device body, a support plate fixedly arranged at the output end of the electric push rod 2, the bottom of the support plate is overlapped with the top of the device body, and the front and rear sides of the support plate are overlapped with the moving block.

[0011] Preferably, the rotating component 2 includes a fixing frame 2 fixedly arranged on the top of the supporting frame, a motor 2 is fixedly arranged on the top of the fixing frame 2, an output end of the motor 2 passes through the top surface of the fixing frame 2 and extends to the interior of the fixing frame 2 where a gear 2 is fixedly arranged, and the gear 2 is meshed with the gear 1.

[0012] Preferably, the punching assembly includes an electric push rod three fixedly arranged inside the rotating seat, a knife seat is fixedly arranged at the output end of the electric push rod three, and a punching knife is fixedly arranged at the bottom of the knife seat.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the punching device for DIP package chip production drives the moving blocks to approach or move away from each other through the rotating component one, so that the moving blocks drive the fixed frame one and the clamping components to approach or move away from each other, which is convenient for quickly adjusting the clamping size; the rotating component two drives the gear one, so that the gear one drives the rotating seat to rotate forward and reverse, and the rotating seat drives the clamping component to rotate forward and reverse, which is convenient for adjusting the angle of the punching component, solves the problem that the existing punching device for DIP package chip production cannot quickly and stably clamp according to the different sizes of DIP chips, avoids the problem that the chip cannot be punched in different directions when punching the chip, and improves the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the structural survey drawing of the utility model;

[0015] Figure 2 This is a front cross-sectional view of the structure of the utility model;

[0016] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0017] Figure 4 Another front cross-sectional view of the structure of the utility model;

[0018] Figure 5 for Figure 4 Enlarged view of point B in the middle.

[0019] In the figure: 1. device body; 2. motor 1; 3. bidirectional threaded rod; 4. moving seat; 5. moving block; 6. limit rod; 7. fixed frame 1; 8. electric push rod 1; 9. clamping plate; 10. electric push rod 2; 11. support plate; 12. support frame; 13. fixed frame 2; 14. motor 2; 15. gear 2; 16. gear 1; 17. rotating seat; 18. ring frame; 19. electric push rod 3; 20. knife seat; 21. punching knife. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-5A punching device for producing DIP packaged chips comprises a device body 1, a movable seat 4 is slidably arranged inside the device body 1, a rotating assembly 1 is arranged on the right side of the device body 1, and the rotating assembly 1 comprises a motor 2 fixedly arranged on the right side of the device body 1, a bidirectional threaded rod 3 is fixedly arranged on the output end of the motor 2, the bidirectional threaded rod 3 is rotatably arranged with the device body 1, the surface of the bidirectional threaded rod 3 is threadedly arranged with the inner wall of the movable seat 4, the bidirectional threaded rod 3 is driven by the motor 2 to rotate forward and reversely, so that the bidirectional threaded rod 3 drives the movable seat 4 to move closer or farther from each other, so as to facilitate the change and adjustment of the clamping size range according to the chip size, a guide assembly is arranged on the top of the movable seat 4, and the movable seat 4 is provided with a fixed frame 7 through the guide assembly, and the guide assembly comprises A moving block 5 is fixedly arranged on the top of the moving seat 4, the top of the moving block 5 is fixedly arranged with the bottom of the fixed frame 7, the moving block 5 is slidably arranged with the inner wall of the device body 1, the inner wall of the moving block 5 is slidably arranged with a limit rod 6, the inner wall of the limit rod 6 is fixedly arranged with the inner wall of the device body 1, and the setting of the moving block 5 and the limit rod 6 can avoid the moving seat 4 from tilting and the serious friction with the inner wall of the device body 1. A clamping assembly is arranged on the top of the fixed frame 7, and the clamping assembly includes an electric push rod 8 fixedly arranged on the top of the fixed frame 7, the output end of the electric push rod 8 passes through the top surface of the fixed frame 7 and extends to the inside of the fixed frame 7 where a clamping plate 9 is fixedly arranged, and the clamping plate 9 is driven by the electric push rod 8 to clamp the chip, so as to avoid the chip moving during punching. In the case of the chip being in the position, a support assembly is arranged inside the device body 1, and the support assembly includes an electric push rod 2 10 fixedly arranged inside the device body 1, and a support plate 11 is fixedly arranged at the output end of the electric push rod 2 10, and the bottom of the support plate 11 is overlapped with the top of the device body 1, and the front and rear sides of the support plate 11 are overlapped with the moving block 5. The electric push rod 2 10 drives the support plate 11 to move upward to support the bottom of the chip, so as to avoid the situation that the force area of ​​the bottom of the chip is small during punching, and the force is uneven and deformation occurs. A support frame 12 is fixedly arranged on the rear side of the device body 1, and a rotating assembly 2 is arranged on the top of the support frame 12. The support frame 12 is provided with a gear 16 through the rotating assembly 2, and the rotating assembly 2 includes a fixed gear 16 arranged on the top of the support frame 12. A fixed frame 13, a motor 14 is fixedly arranged on the top of the fixed frame 13, an output end of the motor 14 penetrates the top surface of the fixed frame 13 and extends to the inside of the fixed frame 13, where a gear 15 is fixedly arranged, the gear 15 is meshed with the gear 16, and the stability of the motor 14 is improved by the arrangement of the fixed frame 13, a rotating seat 17 is fixedly arranged inside the gear 16, an annular frame 18 is rotatably arranged on the surface of the rotating seat 17, the surface of the annular frame 18 is fixedly arranged with the support frame 12, a punching assembly is arranged inside the rotating seat 17, and the punching assembly includes an electric push rod 3 19 fixedly arranged inside the rotating seat 17, a knife seat 20 is fixedly arranged on the output end of the electric push rod 3 19, and a punching knife 21 is fixedly arranged on the bottom of the knife seat 20,It is convenient to automatically punch the chip. The punching device for DIP package chip production drives the moving block 5 to move closer or farther from each other through the rotating component 1, so that the moving block 5 drives the fixed frame 17 and the clamping component to move closer or farther from each other, which is convenient for quickly adjusting the clamping size. The rotating component 2 drives the gear 16, so that the gear 16 drives the rotating seat 17 to rotate forward and reversely, and the rotating seat 17 drives the clamping component to rotate forward and reversely, which is convenient for adjusting the angle of the punching component. It solves the problem that the existing punching device for DIP package chip production cannot quickly and stably clamp according to the different sizes of DIP chips, avoids the problem that the chip cannot be punched in different directions when punching the chip, and improves the applicability of the device.

[0022] The punching device for producing DIP packaged chips is connected to a 220V mains power supply, and the main controller can be a conventional known device for controlling a computer or the like.

[0023] When in use: according to the width of the chip, start the motor 2 to drive the bidirectional threaded rod 3 to rotate forward or reverse, so that the bidirectional threaded rod 3 drives the two moving seats 4 to move closer or farther away from each other, so that the moving seat 4 drives the moving block 5, and the moving block 5 drives the fixed frame 7 to move closer or farther away from each other to adjust the clamping size, and then put the chip between the fixed frame 7 and the bottom of the clamping plate 9, start the electric push rod 18 to push the clamping plate 9 to fix the chip, and then start the electric push rod 2 10 to drive the support plate 11 to move upward, so that the top of the support plate 11 supports the bottom of the chip. , then start the electric push rod three 19 to drive the knife seat 20 to move downward, so that the knife seat 20 drives the punching knife 21 to move downward, and the chip can be punched. When the punching angle of the chip needs to be switched, it is only necessary to start the motor two 14 to drive the gear two 15 to rotate forward and reverse, so that the gear two 15 drives the gear one 16 to rotate forward and reverse, so that the gear one 16 drives the rotating seat 17 to rotate forward and reverse, and the rotating seat 17 drives the electric push rod three 19, so that the electric push rod three 19 drives the knife seat 20, so that the knife seat 20 drives the punching knife 21 to rotate forward and reverse, and the angle of the punching knife 21 can be adjusted.

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A punching device for producing DIP packaged chips, comprising a device body (1), characterized in that: A movable seat (4) is slidably arranged inside the device body (1), a rotating assembly 1 is arranged on the right side of the device body (1), a guide assembly is arranged on the top of the movable seat (4), a fixed frame 1 (7) is arranged on the movable seat (4) through the guide assembly, a clamping assembly is arranged on the top of the fixed frame 1 (7), a support assembly is arranged inside the device body (1), a support frame (12) is fixedly arranged on the rear side of the device body (1), a rotating assembly 2 is arranged on the top of the support frame (12), a gear 1 (16) is arranged on the support frame (12) through the rotating assembly 2, a rotating seat (17) is fixedly arranged inside the gear 1 (16), a ring frame (18) is rotatably arranged on the surface of the rotating seat (17), the surface of the ring frame (18) is fixedly arranged on the support frame (12), and a punching assembly is arranged inside the rotating seat (17).

2. A punching device for producing DIP packaged chips according to claim 1, characterized in that: The rotating assembly 1 comprises a motor 1 (2) fixedly arranged on the right side of the device body (1); a bidirectional threaded rod (3) is fixedly arranged at the output end of the motor 1 (2); the bidirectional threaded rod (3) is rotatably arranged with the device body (1); and the surface of the bidirectional threaded rod (3) is threadedly arranged with the inner wall of the moving seat (4).

3. A punching device for producing DIP packaged chips according to claim 1, characterized in that: The guide assembly comprises a moving block (5) fixedly arranged on the top of the moving seat (4); the top of the moving block (5) is fixedly arranged on the bottom of the fixed frame (7); the moving block (5) is slidably arranged on the inner wall of the device body (1); a limiting rod (6) is slidably arranged on the inner wall of the moving block (5); and the inner wall of the limiting rod (6) is fixedly arranged on the inner wall of the device body (1).

4. A punching device for producing DIP packaged chips according to claim 1, characterized in that: The clamping assembly comprises an electric push rod (8) fixedly arranged on the top of a fixing frame (7), and the output end of the electric push rod (8) passes through the top surface of the fixing frame (7) and extends to the inside of the fixing frame (7) where a clamping plate (9) is fixedly arranged.

5. The punching device for producing DIP packaged chips according to claim 1, characterized in that: The support assembly comprises an electric push rod 2 (10) fixedly arranged inside the device body (1), a support plate (11) fixedly arranged at the output end of the electric push rod 2 (10), the bottom of the support plate (11) being overlapped with the top of the device body (1), and the front and rear sides of the support plate (11) being overlapped with the moving block (5).

6. A punching device for producing DIP packaged chips according to claim 1, characterized in that: The rotating assembly 2 comprises a fixing frame 2 (13) fixedly arranged on the top of the supporting frame (12); a motor 2 (14) is fixedly arranged on the top of the fixing frame 2 (13); an output end of the motor 2 (14) passes through the top surface of the fixing frame 2 (13) and extends to the inside of the fixing frame 2 (13) where a gear 2 (15) is fixedly arranged; the gear 2 (15) is meshed with a gear 1 (16).

7. A punching device for producing DIP packaged chips according to claim 1, characterized in that: The punching assembly comprises an electric push rod three (19) fixedly arranged inside a rotating seat (17), a knife seat (20) being fixedly arranged at the output end of the electric push rod three (19), and a punching knife (21) being fixedly arranged at the bottom of the knife seat (20).

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