Power module with heat dissipation device and integrated power element thereof

Abstract

The utility model relates to a power module with a heat dissipation device and an integrated power element thereof. The power module with the heat dissipation device comprises the integrated power element and a water stop gasket. The integrated power element comprises a radiator, the radiator comprises a heat dissipation bottom plate, and the heat dissipation bottom plate comprises a plurality of heat dissipation fins, a first groove and a second protrusion. The first grooves and the second protrusions surround the heat dissipation fins. The water stop gasket is installed on the integrated power element and comprises a first arc-shaped water stop part and a second arc-shaped water stop part, the first arc-shaped water stop part is suitable for being arranged in a first groove of a heat dissipation bottom plate of the radiator, and the second arc-shaped water stop part is suitable for being arranged on a second protrusion of the heat dissipation bottom plate. Therefore, the working temperature of the integrated power element is reduced.

Description

Technical Field

[0001] The utility model relates to a power module and an integrated power element thereof, and in particular to a power module with a heat dissipation device and an integrated power element thereof. Background Art

[0002] With the advancement of technology in recent years, electric motors have been widely used in various equipment and devices. The inverter system can convert direct current into alternating current with variable frequency and current to drive electric motors, which has also become an important development direction.

[0003] The DC to AC conversion method controls the switching sequence of each phase switch through a switching strategy, and uses frequency and current commands or torque commands to control the output size of the converter, thereby driving the power motor to provide speed and torque. The higher the frequency, the faster the power motor speed, the higher the output current, the stronger the power motor torque, and the greater the kinetic energy that can be provided.

[0004] Generally speaking, an electric motor drive inverter selects an appropriate type of power switch element according to the operating voltage and switching frequency range, such as a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), an Insulated Gate Bipolar Transistor (IGBT), or a Silicon Carbide (SiC) power element.

[0005] How to effectively reduce the operating temperature of the power module will help improve the working efficiency of the power module and the electric motor. Utility Model Content

[0006] The utility model summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This utility model summary is not a complete overview of the present disclosure, and its intention is not to point out the important / key elements of the embodiments of the utility model or to define the scope of the utility model.

[0007] An object of the present invention is to provide a power module with a heat dissipation device, which can reduce the operating temperature of the power module and improve the working efficiency and stability of the power module.

[0008] To achieve the above-mentioned purpose, a technical aspect of the present invention is about a power module with a heat dissipation device including an integrated power element and a water-stopping gasket. The integrated power element includes a heat sink, and the heat sink includes a heat dissipation base plate, and the heat dissipation base plate includes a plurality of heat dissipation fins, a first groove and a second protrusion, and the first groove and the second protrusion surround the heat dissipation fins. The water-stopping gasket is installed on the integrated power element, and the water-stopping gasket includes a first arc-shaped water-stopping portion and a second arc-shaped water-stopping portion, the first arc-shaped water-stopping portion is suitable for being arranged in the first groove of the heat dissipation base plate of the heat sink, and the second arc-shaped water-stopping portion is suitable for being arranged on the second protrusion of the heat dissipation base plate.

[0009] According to another technical aspect of the utility model, a power module with a heat dissipation device is disclosed, which includes an integrated power element, a water-cooling plate and a water-stopping gasket. The integrated power element includes a radiator, and the radiator includes a heat dissipation base plate, and the heat dissipation base plate includes a plurality of heat dissipation fins, a first groove and a second protrusion, and the first groove and the second protrusion surround the heat dissipation fins. The water-cooling plate includes a hollow chamber, an opening connected to the hollow chamber, a first protrusion, and a second groove, and the first protrusion and the second groove are arranged around the opening. The water-stopping gasket is installed on the integrated power element, and the water-stopping gasket includes a first arc-shaped water-stopping portion and a second arc-shaped water-stopping portion, the first arc-shaped water-stopping portion is suitable for being arranged between the first groove of the heat dissipation base plate of the radiator and the first protrusion of the water-cooling plate, and the second arc-shaped water-stopping portion is suitable for being arranged between the second protrusion of the heat dissipation base plate and the second groove of the water-cooling plate.

[0010] In some embodiments, the angle formed by the two side walls of the first groove of the heat dissipation base is the same as the angle formed by the two side walls of the first protrusion of the water cooling plate, and the angle formed by the two side walls of the second protrusion of the heat dissipation base is the same as the angle formed by the two side walls of the second groove of the water cooling plate.

[0011] In some embodiments, the water-stopping gasket further includes a connecting portion connected between the first arc-shaped water-stopping portion and the second arc-shaped water-stopping portion.

[0012] In some embodiments, the water-stopping gasket further includes a first flange and a second flange, the first flange is connected to one end of the first arc-shaped water-stopping portion, and the second flange is connected to one end of the second arc-shaped water-stopping portion.

[0013] In some embodiments, the heat sink includes a height-limiting protrusion, and the height of the height-limiting protrusion is approximately 50% to 90% of the thickness of the first flange.

[0014] In some embodiments, the angle formed by the two side walls of the first groove of the heat dissipation base plate is about 30 degrees to 120 degrees.

[0015] In some embodiments, the angle formed by the two side walls of the first arc-shaped water-stopping portion of the water-stopping gasket is approximately greater than the angle formed by the two side walls of the first groove of the heat dissipation base plate, which is approximately 1 degree to 10 degrees.

[0016] In some embodiments, the first groove is connected to the second protrusion to form a wavy surface.

[0017] In some embodiments, the cross-section of the heat dissipation fin is rhombus-shaped.

[0018] According to another technical aspect of the utility model, an integrated power element is provided, which is suitable for being installed on a water-cooling plate in combination with a water-stop gasket. The water-cooling plate includes a hollow chamber, and the water-cooling plate has an opening connected to the hollow chamber. The integrated power element includes a radiator, and the radiator includes a heat dissipation base plate. The heat dissipation base plate includes a plurality of heat dissipation fins and a groove. The heat dissipation fins are suitable for extending into the hollow chamber through the opening. The groove surrounds the heat dissipation fins, and is suitable for allowing the water-stop gasket to be set between the heat dissipation base plate and the water-cooling plate.

[0019] According to another technical aspect of the utility model, an integrated power element is provided, which is suitable for being installed on a water-cooling plate in combination with a water-stop gasket. The water-cooling plate includes a hollow chamber, and the water-cooling plate has an opening connected to the hollow chamber. The integrated power element includes a radiator, and the radiator includes a heat dissipation base plate. The heat dissipation base plate includes a plurality of heat dissipation fins and a protrusion. The heat dissipation fins are suitable for extending into the hollow chamber through the opening. The protrusion surrounds the heat dissipation fins, and is suitable for setting the water-stop gasket between the heat dissipation base plate and the water-cooling plate.

[0020] Therefore, the integrated power element and the power module with a heat dissipation device disclosed in the present invention fix the heat sink directly to the substrate of the power chip, which can effectively improve the heat dissipation efficiency of the power module, and use the water-stop gasket ring surrounding the opening of the water-cooling plate and the heat dissipation base plate of the heat sink of the integrated power element to further improve the tightness between the integrated power element and the water-cooling plate, effectively increase the safety and stability of the use of related electronic devices, and even increase the working efficiency of related electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0022] Figure 1 is an exploded schematic diagram of a power module with a heat dissipation device according to an embodiment of the present utility model;

[0023] Figure 2 is a cross-sectional schematic diagram of a power module with a heat dissipation device according to an embodiment of the present utility model;

[0024] Figure 3 It is a partial enlarged schematic diagram of a power module with a heat dissipation device according to an embodiment of the utility model;

[0025] Figure 4 is a partial enlarged schematic diagram of a power module with a heat dissipation device according to another embodiment of the utility model;

[0026] Figure 5 is a partial enlarged schematic diagram of a power module with a heat dissipation device according to another embodiment of the utility model;

[0027] Figure 6 It is a three-dimensional schematic diagram of an integrated power element of a power module with a heat dissipation device according to an embodiment of the present invention.

[0028]

Explanation of symbols

[0029] 100: Power module with heat dissipation device

[0030] 110: Integrated power components

[0031] 120: Water stop gasket

[0032] 122: First flange

[0033] 124: First arc-shaped water stop

[0034] 126: Second arc-shaped water stop

[0035] 128: Second flange

[0036] 129: Connection

[0037] 130: Water cooling plate

[0038] 132: Opening

[0039] 134: Hollow Chamber

[0040] 210:Substrate

[0041] 220: Power chip

[0042] 230: Pin

[0043] 240: Encapsulation shell

[0044] 250: Radiator

[0045] 252: Heat dissipation base

[0046] 254: Heat sink fins

[0047] 256: height limit protrusion

[0048] 301: Angle

[0049] 302: Angle

[0050] 303:Thickness

[0051] 304: Height

[0052] 305: Angle

[0053] 306: Angle

[0054] 310: First protrusion

[0055] 320: Second groove

[0056] 330: first groove

[0057] 332: Opening width

[0058] 334: Bottom width

[0059] 340: Second bulge

[0060] 342: Bottom width

[0061] 344: Top width DETAILED DESCRIPTION

[0062] The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be described with the same symbols.

[0063] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise specified. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of the present disclosure.

[0064] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0065] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0066] Figure 1 is an exploded schematic diagram of a power module with a heat dissipation device according to an embodiment of the present invention. Figure 2 The schematic cross-section diagram is as follows: Figures 3 to 5 FIG. 1 is a partially enlarged schematic diagram of a power module with a heat dissipation device according to multiple embodiments of the present invention. Figure 6 The invention is a three-dimensional schematic diagram showing an integrated power element of a power module with a heat dissipation device.

[0067] See first Figure 1 As shown in the figure, the power module 100 with a heat dissipation device includes an integrated power element 110 and a water-stopping gasket 120. Figure 2 As shown in the figure, the integrated power device 110 includes a substrate 210, a power chip 220, a plurality of pins 230, a package shell 240 and a heat sink 250. The heat sink 250 is fixed below the substrate 210, and the power chip 220 is installed above the substrate 210, so as to utilize the heat sink 250 to reduce the temperature of the power chip 220 when it is working.

[0068] In some embodiments, the heat sink 250 is soldered underneath the substrate 210 .

[0069] In some embodiments, the heat sink 250 is fixed under the substrate 210 , and the package shell 240 covers the substrate 210 , the power chip 220 , a portion of the pins 230 , and the heat dissipation base plate 252 of the heat sink 250 .

[0070] In some embodiments, the water-stopping gasket 120 is installed on the heat dissipation base plate 252 of the heat sink 250 of the integrated power device 110 to make the integrated power device 110 fit tightly with a water cooling plate 130 below, thereby improving the tightness between the integrated power device 110 and the water cooling plate 130 .

[0071] In addition, the heat sink 250 further includes a plurality of heat dissipation fins 254 extending downward from the heat dissipation base plate 252 . When the integrated power device 110 is mounted on the water cooling plate 130 , the heat dissipation fins 254 pass through the opening 132 to contact the heat dissipation fluid in the hollow chamber 134 of the water cooling plate 130 .

[0072] See also Figure 3 A first groove 330 is formed on the heat dissipation bottom plate 252 of the heat sink 250 of the integrated power device 110 , and the water cooling plate 130 further includes a first protrusion 310 surrounding the opening 132 .

[0073] In some embodiments, the opening width 332 of the first groove 330 of the heat dissipation base plate 252 is greater than the bottom width 334 of the first groove 330 , but the present invention is not limited thereto.

[0074] In some embodiments, the first groove 330 of the heat dissipation base plate 252 and the first protrusion 310 of the water cooling plate 130 are complementary in shape, such as a U-shaped groove and a U-shaped protrusion or a V-shaped groove and a V-shaped protrusion, or other complementary shapes, all without departing from the spirit and protection scope of the present invention.

[0075] In other words, the angle 305 formed by the two side walls of the first groove 330 of the heat dissipation base plate 252 and the angle 301 formed by the two side walls of the first protrusion 310 of the water cooling plate 130 are preferably the same, but the present invention is not limited thereto.

[0076] In some embodiments, the water-stopping gasket 120 includes a first arc-shaped water-stopping portion 124 disposed between the first groove 330 of the heat dissipation bottom plate 252 of the heat sink 250 and the first protrusion 310 of the water-cooling plate 130 .

[0077] In some embodiments, the water-stop gasket 120 further includes a second arc-shaped water-stop portion 126, the heat dissipation base plate 252 further includes a second protrusion 340, and the water-cooling plate 130 further includes a second groove 320, which is arranged around the opening 132, and the second arc-shaped water-stop portion 126 of the water-stop gasket 120 is arranged between the second protrusion 340 of the heat dissipation base plate 252 and the second groove 320 of the water-cooling plate 130.

[0078] In some embodiments, the first groove 330 of the heat dissipation base plate 252 is connected to the second protrusion 340 to form a wavy surface and a wavy structure.

[0079] In some embodiments, the first protrusion 310 of the water-cooling plate 130 is connected to the second groove 320 to form a wavy surface and a wavy structure.

[0080] In some embodiments, the bottom width 342 of the second protrusion 340 of the heat dissipation base plate 252 is greater than the top width 344 of the second protrusion 340 , but the present invention is not limited thereto.

[0081] In some embodiments, the second protrusion 340 of the heat dissipation base plate 252 and the second groove 320 of the water cooling plate 130 are complementary in shape, such as a U-shaped groove and a U-shaped protrusion or a V-shaped groove and a V-shaped protrusion, or other complementary shapes, which do not deviate from the spirit and protection scope of the present invention. In other words, the angle formed by the two side walls of the second protrusion 340 of the heat dissipation base plate 252 and the angle formed by the two side walls of the second groove 320 of the water cooling plate 130 are preferably the same, but the present invention is not limited thereto.

[0082] Further reading Figure 6 As shown in the figure, in some embodiments, the cross section of the heat dissipation fin 254 is rhombus-shaped, but the utility model is not limited thereto. In addition, the first groove 330 and the second protrusion 340 of the heat dissipation bottom plate 252 are disposed around the heat dissipation fin 254 .

[0083] In some embodiments, the second groove 320 of the water-cooling plate 130 surrounds the opening 132 and the first protrusion 310 .

[0084] In some embodiments, the first protrusion 310 of the water-cooling plate 130 surrounds the opening 132 and the second groove 320 , which also does not deviate from the spirit and protection scope of the present invention.

[0085] In some embodiments, the angle 302 formed by the two side walls on the inner side of the first arc-shaped water stop portion 124 is the same as the angle 301 formed by the two side walls of the first protrusion 310 of the water-cooling plate 130, and the angle 306 formed by the two side walls on the outer side of the first arc-shaped water stop portion 124 is the same as the angle 305 formed by the two side walls of the first groove 330 of the heat dissipation base plate 252. In some embodiments, the angle 302 formed by the two side walls on the inner side of the first arc-shaped water stop portion 124 is equal to the angle 306 formed by the two side walls on the outer side of the first arc-shaped water stop portion 124.

[0086] Further reading Figure 4 As shown in the figure, the angle 302 formed by the two side walls of the inner side of the first arc-shaped water stop portion 124 is approximately greater than the angle 301 formed by the two side walls of the first protrusion 310 of the water cooling plate 130, which is about 1 degree to 10 degrees. Similarly, the angle 306 formed by the two side walls of the outer side of the first arc-shaped water stop portion 124 of the water stop gasket 120 is approximately greater than the angle 305 formed by the two side walls of the first groove 330 of the heat dissipation bottom plate 252, which is about 1 degree to 10 degrees, but the utility model is not limited thereto.

[0087] In some embodiments, the water-stopping gasket 120 further includes a connecting portion 129 horizontally connected between the first arc-shaped water-stopping portion 124 and the second arc-shaped water-stopping portion 126 , but the present invention is not limited thereto.

[0088] See also Figure 5 As shown in the figure, the first arc-shaped water-stopping portion 124 of the water-stopping gasket 120 can also be directly connected to the second arc-shaped water-stopping portion 126, which does not deviate from the spirit and protection scope of the present utility model.

[0089] In some embodiments, the water-stop gasket 120 further includes a first flange 122 and a second flange 128. The first flange 122 is connected to one end of the first arc-shaped water-stop portion 124 and extends horizontally outward, while the second flange 128 is connected to one end of the second arc-shaped water-stop portion 126 and extends horizontally inward to increase the sealing ability.

[0090] In some embodiments, the heat sink 250 further includes a height limiting protrusion 256 , and a height 304 of the height limiting protrusion 256 is approximately 50% to 90% of a thickness 303 of the first flange 122 .

[0091] In some embodiments, the included angle 305 formed by the two side walls of the first groove 330 of the heat dissipation base plate 252 is approximately 30 degrees to 120 degrees.

[0092] In summary, the integrated power element and the power module with a heat dissipation device disclosed in the present invention fix the heat sink directly to the substrate of the power chip, which can effectively improve the heat dissipation efficiency of the power module, and utilize the water-stop gasket that surrounds the opening of the water-cooling plate in an annular shape and the heat dissipation base plate of the heat sink of the integrated power element to further improve the tightness between the integrated power element and the water-cooling plate, effectively increase the safety and stability of the use of related electronic devices, and even increase the working efficiency of related electronic devices.

[0093] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the definition of the attached claims.

Claims

1. A power module with a heat dissipation device, characterized in that: Include: An integrated power element includes a heat sink, wherein the heat sink includes a heat sink base plate, the heat sink base plate includes a plurality of heat sink fins, a first groove and a second protrusion, wherein the first groove and the second protrusion surround the plurality of heat sink fins; and A water-stop gasket is installed on the integrated power element, and the water-stop gasket includes a first arc-shaped water-stop portion and a second arc-shaped water-stop portion. The first arc-shaped water-stop portion is suitable for being set in the first groove of the heat dissipation base plate of the radiator, and the second arc-shaped water-stop portion is suitable for being set on the second protrusion of the heat dissipation base plate.

2. A power module with a heat dissipation device, characterized in that: Include: An integrated power element includes a heat sink, wherein the heat sink includes a heat sink base plate, wherein the heat sink base plate includes a plurality of heat sink fins, a first groove and a second protrusion, wherein the first groove and the second protrusion surround the plurality of heat sink fins; A water cooling plate, comprising a hollow chamber, an opening connected to the hollow chamber, a first protrusion, and a second groove, wherein the first protrusion and the second groove are arranged around the opening; and A water-stop gasket is installed on the integrated power element, and the water-stop gasket includes a first arc-shaped water-stop portion and a second arc-shaped water-stop portion. The first arc-shaped water-stop portion is suitable for being arranged between the first groove of the heat dissipation base plate of the radiator and the first protrusion of the water-cooling plate, and the second arc-shaped water-stop portion is suitable for being arranged between the second protrusion of the heat dissipation base plate and the second groove of the water-cooling plate.

3. The power module with heat dissipation device according to claim 2, characterized in that: The angle formed by the two side walls of the first groove of the heat dissipation base is the same as the angle formed by the two side walls of the first protrusion of the water cooling plate, and the angle formed by the two side walls of the second protrusion of the heat dissipation base is the same as the angle formed by the two side walls of the second groove of the water cooling plate.

4. The power module with a heat dissipation device according to claim 1 or 2, characterized in that: The water-stopping gasket further comprises a connecting portion connected between the first arc-shaped water-stopping portion and the second arc-shaped water-stopping portion.

5. The power module with a heat dissipation device according to claim 1 or 2, characterized in that: The water-stopping gasket further comprises a first flange and a second flange, wherein the first flange is connected to one end of the first arc-shaped water-stopping portion, and the second flange is connected to one end of the second arc-shaped water-stopping portion.

6. The power module with heat dissipation device according to claim 5, characterized in that: The heat sink includes a height-limiting protrusion, and the height of the height-limiting protrusion is 50% to 90% of the thickness of the first flange.

7. The power module with a heat dissipation device according to claim 1 or 2, characterized in that: The included angle formed by the two side walls of the first groove of the heat dissipation base plate is 30 degrees to 120 degrees.

8. The power module with heat dissipation device according to claim 7, characterized in that: The angle formed by the two side walls of the first arc-shaped water-stopping portion of the water-stopping gasket is greater than the angle formed by the two side walls of the first groove of the heat dissipation base plate, which is 1 degree to 10 degrees.

9. The power module with a heat dissipation device according to claim 1 or 2, characterized in that: The first groove is connected to the second protrusion to form a wave-shaped surface.

10. The power module with heat dissipation device according to claim 1 or 2, characterized in that: The cross-sections of the plurality of heat dissipation fins are rhombus-shaped.

11. An integrated power device, characterized in that: It is suitable for being installed on a water-cooling plate with a water-stop gasket, the water-cooling plate includes a hollow chamber, and the water-cooling plate has an opening connected to the hollow chamber, the integrated power element includes a radiator, and the radiator includes a heat dissipation base plate, the heat dissipation base plate includes a plurality of heat dissipation fins and a groove, the plurality of heat dissipation fins are suitable for extending into the hollow chamber through the opening, the groove surrounds the plurality of heat dissipation fins, and is suitable for the water-stop gasket to be set between the heat dissipation base plate and the water-cooling plate.

12. An integrated power device, characterized in that: It is suitable for being installed on a water-cooling plate with a water-stop gasket, the water-cooling plate includes a hollow chamber, and the water-cooling plate has an opening connected to the hollow chamber, the integrated power element includes a radiator, and the radiator includes a heat dissipation base plate, the heat dissipation base plate includes a plurality of heat dissipation fins and a protrusion, the plurality of heat dissipation fins are suitable for extending into the hollow chamber through the opening, the protrusion surrounds the plurality of heat dissipation fins, and is suitable for the water-stop gasket to be set between the heat dissipation base plate and the water-cooling plate.

Images