Bypass diode and photovoltaic module
By designing a bypass diode with symmetrical connection area between the electrical connection sheet and the chip in a photovoltaic module, the problem of thermal stress differences in chip caused by the module diode is solved, and the reliability and heat dissipation effect of the chip are improved.
Patent Information
- Application Number
- CN202421534458.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-28
AI Technical Summary
In existing photovoltaic modules, the design of the module diodes leads to differences in thermal stress on both sides of the chip, increasing the risk of hidden cracks and affecting the heat dissipation effect.
A bypass diode is designed, and the electrical connection sheet includes a first sheet and a second sheet arranged partially overlapping along the first direction. The chip is located in the overlapping area of the two sheets. The connecting surfaces on both sides are the same as the connecting area of the sheet to avoid thermal stress differences.
By making the connection areas on both sides of the chip the same, the risk of hidden cracking is reduced, and the reliability of the chip is improved and the heat dissipation effect is improved.
Smart Images
Figure CN222775319U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of photovoltaic power generation, and in particular to a bypass diode and a photovoltaic module. Background Art
[0002] Bypass diodes play a vital role in photovoltaic modules. They can effectively protect photovoltaic modules and improve the performance and reliability of photovoltaic systems. Therefore, the design of bypass diodes directly affects the reliability of photovoltaic modules. Diodes used in photovoltaic modules can mainly include surface mount diodes, axial diodes, module diodes, etc. Among them, with the continuous improvement of the efficiency of batteries and modules, the current requirements for junction boxes are also getting higher and higher. Module diodes gradually reflect their design advantages in high current.
[0003] In the related art, the module diode usually uses a jumper to connect the copper sheet with the chip soldered to another copper sheet. The chip is located between the copper sheet and the jumper. In this connection method, the connection area between the jumper and the chip is usually smaller than the connection area between the copper sheet and the chip. This will cause the two sides of the chip to be soldered to the copper sheet and the jumper later. Due to the difference in connection area, there will be a difference in thermal stress on both sides of the chip. This difference in thermal stress will directly lead to the risk of hidden cracks in the chip, affecting the reliability of the chip. In addition, due to the difference in connection area between the two sides of the chip and the copper sheet and the jumper, the heat dissipation effect of the chip will be further affected. Utility Model Content
[0004] The purpose of the present disclosure is to provide a bypass diode and a photovoltaic module to avoid the risk of hidden cracks in the chip due to the different connection areas with the electrical connecting pieces on both sides of the chip, to improve the reliability and heat dissipation effect of the chip, and to at least partially solve the related technical problems.
[0005] In order to achieve the above object, according to a first aspect of the present disclosure, a bypass diode is provided. The bypass diode comprises:
[0006] An electrical connection sheet, comprising a first sheet body and a second sheet body arranged to partially overlap along a first direction; and
[0007] A chip, wherein the chip is located in the overlapping area of the first sheet and the second sheet, and the chip includes a first connecting surface and a second connecting surface that are relatively arranged, the first connecting surface is adhered or welded to the first sheet and is electrically connected to the first sheet, and the second connecting surface is adhered or welded to the second sheet and is electrically connected to the second sheet.
[0008] Optionally, the bypass diode further includes an insulating member located in the overlapping region, and the insulating member is disposed between the first sheet and the second sheet.
[0009] Optionally, the insulating member includes insulating glue, and the insulating glue is connected to the first sheet body and the second sheet body and is arranged around the circumference of the chip.
[0010] Optionally, the insulating glue is filled in the overlapping area except the chip.
[0011] Optionally, an auxiliary connecting piece is further provided between the chip and the electrical connecting piece, and the auxiliary connecting piece is a conductive adhesive, and the chip is bonded to the electrical connecting piece through the conductive adhesive.
[0012] Optionally, an auxiliary connecting piece is further provided between the chip and the electrical connecting piece, the auxiliary connecting piece is a flux material, and the chip is soldered to the electrical connecting piece through the flux material.
[0013] Optionally, a first through groove is formed on the first sheet, and a second through groove is formed on the second sheet. The first through groove is used for allowing a first bus bar of the battery string to pass through and be electrically connected to the first sheet, and the second through groove is used for allowing a second bus bar of the battery string to pass through and be electrically connected to the second sheet.
[0014] Optionally, a flux material is provided on the area of the first sheet body for connecting with the first bus bar; and
[0015] A flux material is disposed on the second sheet in an area for connecting with the second bus bar.
[0016] Optionally, the first sheet and the second sheet are configured as flat plates.
[0017] According to a second aspect of the present disclosure, a photovoltaic assembly is provided, which includes a plurality of the bypass diodes described above.
[0018] Through the above technical solution, a bypass diode and a photovoltaic module are provided. Wherein, the bypass diode includes an electrical connection sheet and a chip. During assembly, the chip is located in the overlapping area of the first sheet and the second sheet, so that the first connection surface of the chip can be bonded or welded to the first sheet and electrically connected to the first sheet. Correspondingly, the second connection surface of the chip can be bonded or welded to the second sheet and electrically connected to the second sheet. In the technical solution provided by the present disclosure, the chip can be directly connected between the first sheet and the second sheet, so that the connection area between the first connection surface of the chip and the first sheet is the same as the connection area between the second connection surface of the chip and the second sheet, that is, the two sides of the chip can have the same connection area relative to the electrical connection sheet, avoiding the risk of hidden cracks in the chip due to the different connection areas on both sides of the chip with the electrical connection sheet, and improving the reliability and heat dissipation effect of the chip.
[0019] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0021] Figure 1 is a schematic diagram of the structure of a bypass diode provided according to an embodiment of the present disclosure;
[0022] Figure 2 is a simplified schematic diagram of the structure of a bypass diode provided according to an embodiment of the present disclosure.
[0023] Description of Reference Numerals
[0024] 100. Bypass diode; 1. Electrical connection sheet; 11. First sheet body; 111. First through groove; 12. Second sheet body; 121. Second through groove; 2. Chip; 3. Insulating member; 4. Soldering material. DETAILED DESCRIPTION
[0025] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0026] In the present disclosure, unless otherwise specified, directional words such as "up, down, left, right" generally refer to the position when used by the user; "inside, outside" refer to the inside and outside of the corresponding component contour; in addition, it should be noted that the terms used, such as "first, second", etc., are intended to distinguish one element from another.
[0027] According to the first aspect of the present disclosure, Figure 1 As shown, a bypass diode 100 is provided. The bypass diode 100 may include an electrical connection sheet 1 and a chip 2. The electrical connection sheet 1 may include a first sheet 11 and a second sheet 12 partially overlapped along a first direction. The first direction may be specifically referred to as Figure 1 The direction indicated by x in the figure. For example, the first direction can be understood as the thickness direction of the chip 2. The chip 2 is located in the overlapping area of the first sheet 11 and the second sheet 12. The chip 2 includes a first connection surface and a second connection surface that are arranged opposite to each other. The first connection surface is bonded or welded to the first sheet 11 and is electrically connected to the first sheet 11. The second connection surface is bonded or welded to the second sheet 12 and is electrically connected to the second sheet 12.
[0028] In the technical solution provided by the present invention, the chip 2 can be directly connected between the first sheet 11 and the second sheet 12, so that the connection area between the first connection surface of the chip 2 and the first sheet 11 is the same as the connection area between the second connection surface of the chip 2 and the second sheet 12, that is, the two sides of the chip 2 can have the same connection area relative to the electrical connection sheet 1, avoiding the risk of hidden cracks in the chip 2 due to the different connection areas on both sides of the chip 2 with the electrical connection sheet 1, thereby improving the reliability of the chip 2 and the heat dissipation effect.
[0029] It should be noted that the electrical connecting sheet 1 can be a copper sheet, an aluminum sheet or a copper-aluminum composite material, which is not limited here, and those skilled in the art can make design adjustments according to actual conditions.
[0030] In some embodiments, Figure 1 As shown, the bypass diode 100 may further include an insulating member 3 located in the overlapping area. The insulating member 3 is disposed between the first sheet 11 and the second sheet 12. The provision of the insulating member 3 can prevent the first sheet 11 and the second sheet 12 from contacting in the overlapping area except for the chip 2, thereby causing a short circuit. The provision of the insulating member 3 improves the reliability of the bypass diode 100. For example, the insulating member 3 may include insulating glue. On the one hand, the insulating glue can achieve the purpose of preventing short circuits, and on the other hand, the insulating glue has good thermal conductivity, which is conducive to the heat dissipation of the chip 2. In a specific embodiment, the insulating glue can be connected to the first sheet 11 and the second sheet 12 and arranged around the circumference of the chip 2. This arrangement can form a more reliable insulating layer around the chip 2, thereby improving the reliability of the insulating glue. Further, the insulating glue can be filled in the area except for the chip 2 in the overlapping area. Such a setting method enables the area on the electrical connection sheet 1 except for the position where the chip 2 is installed to be covered by the insulating glue, thereby improving the reliability of the insulating glue. It is also worth mentioning that the provision of the insulating member 3 can also achieve fixation between the first sheet 11 and the second sheet 12 to avoid relative movement between the first sheet 11 and the second sheet 12 .
[0031] In some embodiments, Figure 1 As shown, an auxiliary connector can also be provided between the chip 2 and the electrical connection sheet 1. The auxiliary connector is a conductive adhesive. The chip 2 is bonded to the electrical connection sheet 1 through the conductive adhesive. In this embodiment, a conductive adhesive is used, which has good adhesion and can reliably achieve the connection between the chip 2 and the electrical connection sheet 1. In addition, the bonding method can reduce the concentration of thermal stress, ensure the strength of the chip 2, and improve the fatigue life of the electrical connection sheet 1. The heat resistance and thermal conductivity of the thermal conductive adhesive are relatively excellent, which is beneficial to the heat dissipation of the chip 2.
[0032] In other embodiments, Figure 1As shown, an auxiliary connector may be provided between the chip 2 and the electrical connection sheet 1. The auxiliary connector is a flux material. The chip 2 is soldered to the electrical connection sheet 1 through the flux material. For example, the flux material may be solder paste. In this embodiment, the use of flux material to achieve the connection between the chip 2 and the electrical connection sheet 1 can improve the connection reliability of the chip 2. Of course, it is understandable that the flux material may also be other materials, which are not limited here, and those skilled in the art may adjust according to actual conditions.
[0033] It should be noted that, except for the auxiliary connector, no other structure is provided between the chip 2 and the electrical connection sheet 1, that is, the chip 2 is directly electrically connected to the electrical connection sheet 1 through the auxiliary connector. Such an arrangement can reduce the size of the bypass diode 100 in the thickness direction and reduce the manufacturing cost.
[0034] In some embodiments, Figure 1 As shown, a first through slot 111 is provided on the first sheet 11. A second through slot 121 is provided on the second sheet 12. The first through slot 111 is used for the first bus bar of the battery string to pass through and be electrically connected to the first sheet 11. The second through slot 121 is used for the second bus bar of the battery string to pass through and be electrically connected to the second sheet 12. The arrangement of the first through slot 111 and the second through slot 121 can facilitate the connection between the bypass diode 100 and the battery string. The first bus bar passes through the first through slot 111 and is electrically connected to the first sheet 11, and the second bus bar passes through the second through slot 121 and is electrically connected to the second sheet 12. Such a connection arrangement is more reasonable.
[0035] In some embodiments, Figure 1 As shown, the area on the first sheet 11 for connecting with the first bus bar is provided with a flux material 4. And the area on the second sheet 12 for connecting with the second bus bar is provided with a flux material 4. For example, the flux material 4 can be solder paste. The connection between the first bus bar and the first sheet 11 and the connection between the second bus bar and the second sheet 12 are achieved by using the flux material 4, which can effectively improve the connection reliability between the first bus bar and the second bus bar and the electrical connection sheet 1. Of course, it can be understood that the flux material 4 can also be other, which is not limited here, and those skilled in the art can adjust it according to actual conditions.
[0036] In some embodiments, the first sheet 11 and the second sheet 12 may be constructed as flat plates. The flat plate structure can avoid stress damage caused by bending of the first sheet 11 and the second sheet 12, thereby increasing the fatigue life of the electrical connection sheet 1.
[0037] According to a second aspect of the present disclosure, a photovoltaic module is provided. The photovoltaic module may include a plurality of the bypass diodes 100 described above. The bypass diodes 100 may be connected to a plurality of battery strings of the photovoltaic module. The connection between the bypass diodes 100 and the battery strings may be connected by an existing connection method, which will not be described in detail herein. The photovoltaic module connected with the bypass diodes 100 described above can have good reliability in use.
[0038] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0039] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0040] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.
Claims
1. A bypass diode, characterized in that: include: The electrical connection sheet comprises a first sheet body and a second sheet body which are partially overlapped and arranged along a first direction; and A chip, wherein the chip is located in the overlapping area of the first sheet and the second sheet, and the chip includes a first connecting surface and a second connecting surface that are relatively arranged, the first connecting surface is adhered or welded to the first sheet and is electrically connected to the first sheet, and the second connecting surface is adhered or welded to the second sheet and is electrically connected to the second sheet.
2. The bypass diode according to claim 1, characterized in that: The bypass diode further includes an insulating member located in the overlapping region, wherein the insulating member is disposed between the first sheet and the second sheet.
3. The bypass diode according to claim 2, characterized in that: The insulating member includes insulating glue, and the insulating glue is connected to the first sheet body and the second sheet body and is arranged around the circumference of the chip.
4. The bypass diode according to claim 3, characterized in that: The insulating glue is filled in the overlapping area except the chip.
5. The bypass diode according to claim 1, characterized in that: An auxiliary connecting piece is further provided between the chip and the electrical connecting piece. The auxiliary connecting piece is a conductive adhesive, and the chip is bonded to the electrical connecting piece through the conductive adhesive.
6. The bypass diode according to claim 1, characterized in that: An auxiliary connection piece is further provided between the chip and the electrical connection piece. The auxiliary connection piece is a flux material, and the chip is welded to the electrical connection piece through the flux material.
7. The bypass diode according to claim 1, characterized in that: The first sheet is provided with a first through slot, and the second sheet is provided with a second through slot. The first through slot is used for allowing a first bus bar of a battery string to pass through and be electrically connected to the first sheet, and the second through slot is used for allowing a second bus bar of the battery string to pass through and be electrically connected to the second sheet.
8. The bypass diode according to claim 7, characterized in that: A flux material is disposed on the area of the first sheet body for connecting with the first bus bar; and A flux material is disposed on the second sheet in an area for connecting with the second bus bar.
9. The bypass diode according to claim 1, characterized in that: The first plate and the second plate are configured as flat plates.
10. A photovoltaic module, characterized in that: The invention comprises a plurality of bypass diodes as claimed in any one of claims 1 to 9.