Magnetic wireless charger with refrigeration function

Abstract

The utility model provides a magnetic attraction wireless charger with refrigeration, which comprises a shell, a semiconductor refrigeration assembly is arranged in the shell, the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet comprises a refrigeration surface and a heating surface; the refrigeration surface penetrates out of the shell or is directly contacted with the shell; a heat dissipation device is arranged on one side of the heating face and comprises a heat conduction piece and a heat dissipation piece. The semiconductor refrigeration assembly further comprises a magnetic part and a coil, the magnetic part and the coil are embedded into the semiconductor refrigeration sheet, and by means of the scheme, cold energy conduction is direct, loss is small, and the refrigeration effect is good; heat generated by the heating surface is firstly conducted to the heat dissipation piece through the heat conduction piece and then dissipated by the heat dissipation piece, that is, the heat dissipation piece and the semiconductor chilling plate are not stacked in the same direction, so that the thickness can be effectively reduced, and the charger can be made to be very thin and convenient to carry when a user goes out.

Description

Technical Field

[0001] The utility model relates to the technical field of charging equipment, and in particular to a magnetic wireless charger with refrigeration. Background Art

[0002] Mobile terminal chargers have gone through a long period of wired chargers. As people's requirements for convenience become higher and higher, wireless charging technology has emerged. Wireless charging technology uses coils between mobile terminals and chargers to achieve charging through electromagnetic conversion. Specifically: the wireless charger has a built-in transmitting coil, and a receiving coil is installed inside the mobile terminal. When the mobile terminal and the charger are close, the transmitting coil will generate a magnetic field, and the receiving coil will sense the magnetic field and convert it into electrical energy for charging. In order to improve the efficiency of charging, it is usually necessary to increase the charging power. We know that the greater the power, the greater the heat generation. When both the charger and the mobile terminal reach a high temperature, not only will the charger and the mobile terminal be easily damaged, but the charging power will also decrease. Therefore, it is necessary to find a way to cool the charger and the mobile terminal.

[0003] A wireless charging heat dissipation device and a wireless charger are disclosed in a patent document with the authorization announcement number CN220553839U, wherein the wireless charging heat dissipation device includes a transmitting module, a heat dissipation component and a metal shell, wherein the metal shell is connected to the side of the heat dissipation component for heat dissipation, and the metal shell has an annular placement surface facing away from the heat dissipation component and used to place a mobile terminal, and the transmitting module is arranged in the charging space enclosed by the annular placement surface and forms an electrical coupling with the receiving module of the mobile terminal. The metal shell has high thermal conductivity and can quickly conduct heat. The annular placement surface of the metal shell contacts the mobile terminal, thereby conducting the heat of the mobile terminal through the metal shell to the heat dissipation component, and the heat dissipation component is cooled. Such a setting can effectively improve the heat dissipation effect of the wireless charging heat dissipation device, and the mobile terminal can always maintain a low temperature and maintain a high charging power for charging. This solution can cool down the mobile terminal to a certain extent by setting up a heat dissipation component and a metal shell, but the cooling effect is not obvious, because the cooling plate 124 of this solution is in contact with the transmitting module 10, and the transmitting module includes a transmitting coil and a magnet, and a substrate is required to install the transmitting coil and the magnet, such as Figure 4 As shown in , the cold energy generated by the cooling sheet 124 needs to be transferred to the substrate first, and the cold energy will be absorbed by the substrate and the transmitting coil and magnet on the substrate. The remaining cold energy is then transferred to the mobile terminal through the substrate, the transmitting coil and the magnet. Since the transmitting coil also generates heat when working, the above structure can actually transfer very little cold energy to the mobile terminal, and the cooling effect is not very good. In addition, the transmitting module, metal shell, heat sink and fan of this structure are all stacked in the thickness direction, which makes the charger very thick and not suitable for carrying outside.

[0004] Therefore, it is necessary to design a new structure to solve the above problems. Utility Model Content

[0005] In order to solve the problems existing in the prior art, the utility model provides a magnetic wireless charger with refrigeration, which embeds magnetic parts and coils into semiconductor refrigeration sheets so that the refrigeration surface is in direct contact with the mobile terminal, thereby improving the refrigeration effect.

[0006] To achieve the above-mentioned purpose, the technical solution of the utility model is: a magnetic wireless charger with refrigeration, comprising a shell, in which a semiconductor refrigeration component and a control component are arranged, the semiconductor refrigeration component comprises a semiconductor refrigeration plate, and the semiconductor refrigeration plate comprises a cooling surface and a heating surface; the cooling surface passes through the shell or contacts the shell to transfer cold through the shell; a heat dissipation device is provided on one side of the heating surface, the heat dissipation device comprises a heat conductive member with a length, one end of the heat conductive member contacts the heating surface for heat transfer; a heat dissipation member for increasing the heat dissipation area or the heat storage capacity is provided at the other end of the heat conductive member; the semiconductor refrigeration component also comprises a magnetic member and a coil, and the magnetic member and the coil are embedded in the semiconductor refrigeration plate.

[0007] In the above structure, the cooling surface of the semiconductor refrigeration plate passes through the shell or directly contacts the shell, so that the cooling surface can directly contact the mobile terminal, or can contact the mobile terminal through a metal shell with good cooling effect. In the above two cases, the conduction of cold air is direct, the loss is small, and the cooling effect is good; the magnetic parts and coils are embedded in the semiconductor refrigeration plate, and will not form an obstacle to the contact between the cooling surface and the mobile terminal; the heat generated by the heating surface is first conducted to the heat sink through the heat conductive part, and then dissipated by the heat sink, that is, the heat sink and the semiconductor refrigeration plate are not stacked in the thickness direction, which can effectively reduce the thickness and make the charger very thin for easy carrying. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0009] Figure 2 This is a schematic diagram of the structure of the first embodiment of the utility model after removing the rear cover;

[0010] Figure 3 This is a schematic diagram of the structure decomposition of the first embodiment of the utility model;

[0011] Figure 4 This is a schematic diagram of the structure decomposition of the semiconductor refrigeration component in the first embodiment of the utility model;

[0012] Figure 5 It is a cross-sectional view of the semiconductor cooling sheet in the first embodiment of the utility model;

[0013] Figure 6 This is another structural schematic diagram of the semiconductor cooling plate in the first embodiment of the utility model;

[0014] Figure 7 This is a schematic diagram of the structure of the semiconductor refrigeration component in the second embodiment of the present utility model;

[0015] Figure 8 This is a schematic diagram of another structure of a semiconductor refrigeration component in the second embodiment of the present utility model;

[0016] Fig. 9 This is a schematic diagram of the structure of the third embodiment of the present utility model;

[0017] Fig.10 This is a schematic diagram of the structure decomposition of the third embodiment of the present utility model;

[0018] Fig.11 This is a schematic diagram of the structure of the fourth embodiment of the present utility model;

[0019] Fig.12 This is a schematic diagram of the structure decomposition of the fourth embodiment of the present utility model;

[0020] Fig.13 This is a schematic diagram of the structure of Embodiment 5 of the present utility model;

[0021] Fig.14 This is a schematic diagram of the structural decomposition of the fifth embodiment of the present utility model.

[0022] Fig.15 This is a schematic diagram of the structure in which the semiconductor refrigeration plate of an embodiment of the utility model is directly in contact with the shell. DETAILED DESCRIPTION

[0023] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0024] like Figures 1 to 14 As shown, a magnetic wireless charger with cooling includes a housing, and generally, the housing includes a front housing 1001 and a rear housing (not shown). Generally, the front housing 1001 is tightly connected to the rear housing by buckles, screws or welding. Both the front housing 1001 and the rear housing can be made of plastic or metal.

[0025] Embodiment 1: Figures 2 to 4 As shown, a through hole 1007a for installing a semiconductor cooling plate is provided on the front shell 1001.

[0026] A semiconductor refrigeration component 1003a, a control component and a battery 1005a are provided in the front shell 1001.

[0027] The semiconductor refrigeration component 1003a includes a heat sink 6a, and the control component includes a PCB board 1004a. The PCB board 1004a and the heat sink 6a are arranged side by side at the bottom of the front shell 1001; the battery 1005a is arranged on the upper part of the PCB board 1004a and the heat sink 6a.

[0028] In this embodiment, the heat sink 6a is a heat sink fin group. In order to enhance the heat dissipation of the heat sink fin group, a heat sink fan 7a is also provided on the heat sink fin group. The air inlet of the heat sink fan 7a is close to the heat sink fin group. Heat sink holes 1006a corresponding to the air outlet of the heat sink fan 7a are provided on the bottom wall of the front shell 1001 to enhance air convection and improve heat dissipation efficiency.

[0029] like Figure 3 and Figure 5 As shown, the semiconductor refrigeration component 1003a used in this embodiment includes a semiconductor refrigeration plate 1a, and the semiconductor refrigeration plate 1a includes a cooling surface 10a and a heating surface 11a. After power is turned on, the temperature of the cooling surface 10a drops rapidly to achieve cooling, and the temperature of the heating surface 11a rises rapidly. The principle of semiconductor refrigeration is a public existing technology and will not be repeated here.

[0030] In this embodiment, the semiconductor cooling plate 1a has a concave cavity 100a extending from the cooling surface 10a side to the heating surface 11a side, forming a cavity bottom cooling surface 101a and a cavity top cooling surface 102a with a height difference. When working, the cavity bottom cooling surface 101a and the cavity top cooling surface 102a cool simultaneously.

[0031] Usually, the cavity top cooling surface 102a is made of ceramic material, and the cavity top cooling surface 102a can be used to directly contact with the mobile terminal to directly cool the mobile terminal. There are two situations in which the cavity top cooling surface 102a directly contacts with the mobile terminal. The first is that the cavity top cooling surface 102a is flush with the top surface of the through hole 1007a, that is, flush with the positive surface of the front shell 1001; the second is that the cavity top cooling surface 102a is slightly higher than the top surface of the through hole 1007a. Usually, the cavity top cooling surface 102a is higher than the top surface of the through hole 1007a by less than 1 mm to prevent the front shell 1001 from being slightly deformed and affecting the reliable contact between the mobile terminal and the cavity top cooling surface 102a. Of course, decorative parts can also be set on the cavity top cooling surface 102a. The above is the structure of the cooling surface passing through the shell.

[0032] Another situation is that the cooling surface contacts the shell to transfer cold energy. The contact here includes direct contact and indirect contact. Direct contact means that the cavity top cooling surface 102a is directly against the front shell 1001. For example, a mounting countersunk hole is set on the front shell 1001 to install a semiconductor cooling plate. In this case, the front shell 1001 is usually made of metal with good thermal conductivity, and the cold energy can be conducted to the mobile terminal through the front shell 1001. Indirect contact is to set a material with good thermal conductivity between the cavity top cooling surface 102a and the front shell 1001, such as silicone grease, to increase the contact area and make the thermal conduction effect better.

[0033] The above settings are also suitable for subsequent embodiments.

[0034] Usually, the magnetic part adopts magnet 3a, and the concave cavity 100a can be used to accommodate the charging coil 2a and magnet 3a, etc. The cold energy generated by the cooling surface 101a at the bottom of the cavity can cool the charging coil 2a and magnet 3a, and can also cool the wireless terminal, so that the charging coil 2a, magnet 3a and wireless terminal are kept at a relatively low temperature. At the same time, the semiconductor cooling plate 1a, the charging coil 2a and the magnet 3a can be basically arranged in the same plane; the cold energy generated by the cooling surface 102a at the top of the cavity can directly act on the mobile terminal without the need for conduction through the charging coil 2a and magnet 3a, which greatly improves the cooling effect on the mobile terminal. The mobile terminal mentioned above can be a mobile phone, a tablet or a laptop.

[0035] In order to increase the contact area between the cooling surface and the mobile terminal, Figure 6 As shown, the shape of the semiconductor cooling sheet 1b is made into a rectangle, that is, the shape of the cavity top cooling surface 102b is rectangular; the cross section of the cavity bottom cooling surface 101b is circular. This solution allows the cavity top cooling surface 102b to directly contact the mobile terminal, so that the contact area is larger and the cooling effect is better.

[0036] The semiconductor refrigeration assembly 1003a further comprises a heat dissipation device arranged on one side of the heating surface 11a, the heat dissipation device comprises a heat conducting member 41a having a length, one end of the heat conducting member 41a contacts the heating surface 11a for heat transfer. The heat dissipation member 6a is arranged at the other end of the heat conducting member 41a.

[0037] In this embodiment, the heat conducting member 41 a is a VC liquid cooling vapor chamber, and the shape of one end of the VC liquid cooling vapor chamber in contact with the semiconductor cooling sheet 1 a matches the shape of the semiconductor cooling sheet 1 .

[0038] VC liquid cooling heat spreader is also called vacuum chamber heat spreader or temperature spreader. The English name of VC is Vapor Chamber. VC liquid cooling heat spreader is a component that transfers heat efficiently. It is a mature existing technology and its specific structure will not be described here.

[0039] To improve the effects of heat conduction and heat storage, the heat dissipation device may further include a heat storage member 42a. In this embodiment, the heat storage member 42a is an aluminum block or a copper block. The heat storage member 42a is located at the bottom of the heat conductive member 41a, and one end of the heat conductive member 41a may also be embedded in the heat storage member 42a.

[0040] In this embodiment, the heat conducting member may also be a graphene plate or a heat conducting tube. Usually, the heat conducting tube is a copper tube (not shown). The middle of the copper tube is bent to form a ring shape matching the shape of the semiconductor cooling plate; the two ends of the copper tube extend in parallel in a direction away from the ring. This arrangement can simplify the processing technology of the copper tube. The copper tube is embedded in the heat storage member 42a, which can also play a good role in heat storage and heat conduction.

[0041] A cooling member 5a is provided on one side of the cavity top cooling surface 102a of the semiconductor cooling sheet 1a, which can cover both the cavity top cooling surface 102a and the magnet 3a. At this time, the top surface of the cooling member 5a can be flush with the front surface of the front shell 1001; the top surface of the cooling member 5a can also be slightly higher than the front surface of the front shell 1001.

[0042] The cooling member 5a may be made of a metal material, or may be made of a thermally conductive silicone material, etc. The cooling member 5a is used to contact the mobile terminal.

[0043] In this embodiment, the cooling member 5a is formed by deep drawing and then stamping of aluminum alloy, and silicone grease is coated on the surface of the cooling member 5a in contact with the semiconductor cooling plate 1a to improve the efficiency of cooling.

[0044] In order to shield the charging coil 2a and improve the aesthetic effect, a non-metallic cover 1008a is usually provided outside the charging coil 2a.

[0045] In the above structure, the semiconductor cooling sheet 1a is installed in the through hole 1008a, so that the cavity top cooling surface 102a is flush with the outer surface of the through hole 1008a or protrudes from the outer surface of the through hole 1008a. The outer surface of the through hole 1008a is the outer surface of the front shell 1001, so that the cavity top cooling surface 102a can directly contact the mobile terminal; in another case, the cavity top cooling surface 102a can also be located in the through hole 1008a, and then by setting the cooling member 5a, the cooling member 5a can be used to shield the magnetic member and the coil, and the outer surface of the cooling member 5a is flush with the outer surface of the through hole 1008a. The outer surface of the through hole 1008a is flush with or protrudes, so that the cooling member 5a can also directly contact the mobile terminal. In the above two cases, the conduction of cold air is direct, the loss is small, and the cooling effect is good; the magnet 3a and the coil 2a are embedded in the semiconductor cooling sheet 1a, and will not form an obstacle to the contact between the cavity top cooling surface 102a and the mobile terminal; the heat generated by the heating surface 11a is firstly discharged through the heat conductor 41a, and then dissipated by the heat sink 6a, that is, the heat sink 6a and the semiconductor cooling sheet 1a are not stacked in the thickness direction, which can effectively reduce the thickness and make the charger very thin, which is convenient for carrying outside.

[0046] When the front shell 1001 is made of a material with good thermal or cold conductivity, especially a metal material, the mounting hole 1010 for mounting the semiconductor cooling plate 1a does not need to penetrate the front shell 1001. Fig.15 As shown, the mounting hole 1010 is set as a blind hole, and the cooling energy generated by the cooling surface 10a can be transferred to the mobile terminal through the front shell 1001. This method does not lose too much cooling energy and has a relatively good cooling effect on the mobile terminal. This method is also suitable for the following embodiments.

[0047] Embodiment 2: The structure of a magnetic wireless charger with refrigeration is basically similar to that of Embodiment 1, except that the structure of the semiconductor refrigeration component 1003c is as follows: Figures 7 and 8 As shown,

[0048] The semiconductor refrigeration component 1003c includes an annular semiconductor refrigeration plate. The cross-section of the semiconductor refrigeration plate is set to a circular ring, so it is called an annular semiconductor refrigeration plate 1c. Of course, the cross-section of the annular semiconductor refrigeration plate 1c can also be any required shape, such as a rectangle, diamond or ellipse. The cross-sectional shape does not affect the function and can meet the needs of product structure design. In this way, the center of the annular semiconductor refrigeration plate 1c has an accommodating space. Since the annular semiconductor refrigeration plate 1c is a mature existing technology, its specific structure is not repeated here.

[0049] The annular semiconductor refrigeration plate 1c has a cooling surface 10c and a heating surface 11c. After power is turned on, the temperature of the cooling surface 10c drops rapidly to achieve cooling, while the temperature of the heating surface 11c rises rapidly.

[0050] In order to increase the heat storage amount, a heat storage member 23c is further provided. In this embodiment, the heat storage member 23c is an aluminum block or a copper block, and the heat conducting member 21c can be embedded in the heat storage member 23c.

[0051] The structural features of the annular semiconductor cooling sheet 1c allow it to have a space inside for accommodating a charging coil (not shown) and a magnet 3c. The annular semiconductor cooling sheet 1c, the charging coil and the magnet 3c can be arranged in a substantially coplanar manner. Then, the cold generated by the cooling surface 10c can be directly conducted to the mobile terminal without the need for conduction through the charging coil and the magnet 3c, which greatly improves the cooling effect. At the same time, the heat conducting member 21c can timely conduct the heat generated by the heating surface 11c to the heat dissipating member 22c, and the heat dissipating member 22c can further improve the cooling effect of the annular semiconductor cooling sheet 1c. The magnet 3c can be arranged in the inner or outer ring of the annular semiconductor cooling sheet 1c to achieve magnetic adsorption of the mobile terminal, thereby improving the convenience of charging the mobile terminal. The heat dissipating member 22c and the semiconductor cooling sheet 1c of this solution are also not stacked in the thickness direction, which can effectively reduce the thickness of the cooling assembly and make the charger very thin, which is convenient for carrying out.

[0052] like Figure 8 As shown, the heat conducting member of this embodiment can also be a graphene plate or a heat conducting pipe. Usually, the heat conducting pipe is a copper pipe 21d. The middle part of the copper pipe 21d is bent to form a ring that matches the shape of the ring-shaped semiconductor cooling plate 1c; the two ends of the copper pipe 21d extend in parallel in a direction away from the ring. This arrangement can simplify the processing of the copper pipe. The copper pipe 21d is embedded in the heat storage member 23d. In this embodiment, the heat storage member 23d is an aluminum block or a copper block, which can also play a good role in heat storage and heat conduction.

[0053] Embodiment 3: Fig. 9 and Fig.10 As shown, the structure of this embodiment is basically the same as that of the first embodiment, with the difference that the heat sink is a heat sink 6e, which is in contact with the front shell 1001e. In this embodiment, the front shell 1001e is made of aluminum alloy, and the heat of the heat sink 6e can be dissipated through the aluminum alloy front shell 1001e. The heat sink 6e can also be in contact with the rear shell 1002e, which is also made of aluminum alloy, to further increase the heat dissipation area.

[0054] Grooves can also be made on the surface of the heat sink 6b to increase the heat dissipation area. In this way, there is no need to equip the heat sink 6b with a heat dissipation fan, which can reduce production costs. This method is suitable for situations where the cooling power is low and the heat generation is not large.

[0055] Embodiment 4: Fig.11 and Fig.12 As shown, this embodiment is another structure in which a cooling fan is not provided. In this embodiment, the width of the heat conductor 41f is widened to expand the heat conduction area, and the heat dissipation block 6f is arranged at the bottom of the front shell 1001f. The heat dissipation block 6f is in contact with the front shell 1001f. In this embodiment, the front shell 1001f is made of aluminum alloy, and the heat of the heat dissipation block 6f is dissipated through the front shell 1001f; the PCB board 1004f is arranged on the top of the front shell 1001f, and the battery 1005f is arranged between the heat dissipation block 6f and the PCB board 1004f.

[0056] Grooves can also be made on the surface of the heat sink 6f to increase the heat dissipation area. In this way, there is no need to equip the heat sink 6f with a heat dissipation fan, which can reduce production costs. This method is also suitable for situations where the cooling power is low and the heat generation is not large.

[0057] Embodiment 5: Fig.13 and Fig.14As shown, the difference between this embodiment and embodiment four is that: the heat sink is a combination of a heat sink fin group and a heat sink fan, that is, the heat sink is a heat sink fin group 6g, and a heat sink fan 7g is added to the heat sink fin group 6g. In this embodiment, the number of heat sink fans 7g is two, and heat sink holes corresponding to the air outlets of the heat sink fans 7g are opened at the bottom of the front shell 1001g.

[0058] A heat insulating block 1009g is provided between the heat conductor 41g and the battery 1005g to prevent the battery from overheating.

[0059] This solution is suitable for the case where the cooling power is large and the heat generation is large, and the heat dissipation fan 7g can quickly blow the heat transferred to the heat dissipation fin group 6g out of the housing, and the heat dissipation effect is good.

[0060] In the above-mentioned embodiments, a heat insulating block is provided between the heat conducting member and the battery to protect the battery and prevent the battery from overheating.

[0061] In the above embodiments, the cooling surface can directly contact the mobile terminal, so that the conduction of cold air is direct, the loss is small, and the cooling effect is good; the magnetic parts and coils are embedded in the semiconductor cooling plate, which will not form an obstacle to the contact between the cooling surface and the mobile terminal; the heat generated by the heating surface is first conducted to the heat sink through the heat conductor, and then dissipated by the heat sink, that is, the heat sink and the semiconductor cooling plate are not stacked in the thickness direction, which can effectively reduce the thickness and make the charger very thin, which is convenient for carrying outside.

[0062] The above scheme is not only suitable for making a charger, but also can be made into a portable power bank.

Claims

1. A magnetic wireless charger with refrigeration, comprising a housing, a semiconductor refrigeration component and a control component are arranged in the housing, the semiconductor refrigeration component comprises a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet comprises a cooling surface and a heating surface; characterized in that: The cooling surface passes through the shell or contacts the shell to transfer cooling energy from the shell; a heat dissipation device is provided on one side of the heating surface, and the heat dissipation device includes a heat conductive member with a length, one end of the heat conductive member contacts the heating surface to transfer heat; a heat dissipation member for increasing the heat dissipation area or the heat storage amount is provided on the other end of the heat conductive member; The semiconductor refrigeration component also includes a magnetic component and a coil, and the magnetic component and the coil are embedded in the semiconductor refrigeration sheet.

2. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: A heat dissipation hole corresponding to the heat dissipation element is provided at one end of the shell away from the semiconductor refrigeration plate.

3. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: A through hole for mounting a semiconductor refrigeration plate is provided on the shell, and the refrigeration surface is at the same height as the outer surface of the through hole or protrudes from the outer surface of the through hole; The upper surface of the magnetic member is at the same height as the refrigeration surface or the upper surface of the magnetic member is lower than the refrigeration surface.

4. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: The semiconductor cooling plate has a concave cavity extending from a cooling surface side to a heating surface side, forming a cavity bottom cooling surface and a cavity top cooling surface with a height difference, and the magnetic member and the coil are embedded in the concave cavity.

5. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: The semiconductor refrigeration plate is in a circular ring shape, and the magnetic member and the coil are embedded in the inner ring of the semiconductor refrigeration plate.

6. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: The control component comprises a PCB board, and the PCB board and the heat sink are arranged side by side at the bottom of the shell; a battery is also arranged in the shell, and the battery is arranged on the upper part of the PCB board and the heat sink.

7. The magnetic wireless charger with cooling according to claim 6, characterized in that: The PCB board is arranged on the top of the housing, and the battery is arranged between the heat sink and the PCB board.

8. The magnetic wireless charger with refrigeration according to claim 1, characterized in that: The heat dissipation device further comprises a heat storage member, one end of the heat conductive member being embedded in the heat storage member; The heat sink is a combination of a heat sink fin group and a heat sink fan or the heat sink is a heat sink block; the heat sink block contacts the housing to dissipate heat.

9. The magnetic wireless charger with cooling according to claim 8, characterized in that: The heat conducting member is a copper tube, a VC liquid cooling heat spreader or a graphene plate, and the heat storage member is an aluminum block or a copper block.

10. The magnetic wireless charger with cooling according to claim 1, characterized in that: The semiconductor refrigeration component also includes a surface cover that covers the coil, the magnetic component and the semiconductor refrigeration sheet at the same time or only covers the magnetic component and the coil.

Images