Energy storage converter

Abstract

The utility model discloses an energy storage converter, which relates to the technical field of energy storage devices and comprises a shell and a module inner core, the module inner core comprises a water-cooling substrate and two sets of IGBT modules respectively mounted on two surfaces of the water-cooling substrate, and each set of IGBT module comprises two rows of IGBT components; the circuit board and the driving bottom plate are respectively arranged on the surfaces of the first column of IGBT assemblies and the second column of IGBT assemblies; the first laminated busbar is connected to a connecting terminal at the outer side of the first column of IGBT assemblies; the second laminated busbar is connected between the two columns of IGBT assemblies; the alternating current output bar is connected to a connecting terminal at the outer side of the second column of IGBT assemblies; the mounting plate and the driving plate are sequentially mounted on the outer side of the surface of the second laminated busbar in a laminated manner, a gap is formed between the mounting plate and the second laminated busbar, and a gap is formed between the mounting plate and the driving plate. The energy storage converter is compact in installation, small in occupied space and capable of being used in a small space.

Description

Technical Field

[0001] The utility model relates to the technical field of energy storage devices, in particular to an energy storage converter. Background Art

[0002] With the rapid development of my country's economic level, the strategic position of renewable energy represented by photovoltaic and wind power has become prominent, and energy storage, as a key technology to support the development of renewable energy, is also developing rapidly. Energy storage mainly includes three types of energy storage, thermal energy storage and hydrogen energy storage according to different forms of energy storage, among which electric energy storage is the most important energy storage method. In electric energy storage technology, PCS can not only realize the efficient conversion and storage of energy, but also improve the stability and reliability of the power grid. The working principle of the energy storage converter is a four-quadrant converter device with controllable AC and DC sides to realize the AC and DC bidirectional conversion of electric energy. The energy storage converter (PCS) consists of hardware such as IGBT modules, PCB boards (printed circuit boards), wires and cables. It performs constant power or constant current control through microgrid monitoring instructions to charge or discharge the battery, and at the same time smooth the output of fluctuating power sources such as wind power and solar energy. As a core device, the energy storage converter (PCS) plays a vital role in electrochemical energy storage.

[0003] In the prior art, components such as the laminated busbars, circuit boards, drive boards, mounting boards, and AC output boards in the energy storage converter are laid horizontally on a water-cooled substrate, which requires a large area of ​​the water-cooled substrate, is costly, and occupies a large space. It cannot be used in locations with small spaces, making it inconvenient to use.

[0004] In summary, how to effectively solve the problem of large space occupied by energy storage converters is an urgent problem that technicians in this field need to solve. Utility Model Content

[0005] The utility model aims to provide an energy storage converter, which has compact installation, occupies a small space and can be used in a small space.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0007] An energy storage converter comprises a shell and a module core, wherein the module core comprises a water-cooled substrate, two sets of IGBT modules respectively mounted on both sides of the water-cooled substrate, each set of the IGBT modules comprises two columns of IGBT components; further comprising a circuit board and a drive base plate respectively mounted on the surfaces of the first column of IGBT components and the second column of IGBT components, a first laminated busbar connected to the outer connecting terminals of the first column of IGBT components, a second laminated busbar connected between the two columns of IGBT components, an AC output bar connected to the outer connecting terminals of the second column of IGBT components, a mounting plate and a drive plate sequentially laminated and mounted on the outer side of the surface of the second laminated busbar, a gap being provided between the mounting plate and the second laminated busbar, and a gap being provided between the mounting plate and the drive plate.

[0008] Optionally, it also includes a first insulating column and a second insulating column, the lower ends of the first insulating column and the second insulating column both have external threads, the water-cooled base plate and the mounting plate have threaded holes that are compatible with the external threads of the first insulating column and the second insulating column, the upper ends of the first insulating column and the second insulating column both have internal screw holes, the mounting plate and the drive plate have through holes that are compatible with the internal screw holes of the first insulating column and the second insulating column, and the mounting plate and the drive plate are respectively connected to the first insulating column and the second insulating column through screws.

[0009] Optionally, the first stacked busbar is L-shaped, the horizontal surface of the first stacked busbar is perpendicular to the vertical surface, the vertical surface of the first stacked busbar is located at an end away from the water-cooled substrate, the vertical surface of the first stacked busbar is bent toward a side away from the water-cooled substrate, the vertical surface of the first stacked busbar is located on the outside of the rear cover plate of the outer shell, the front end of the horizontal surface of the first stacked busbar is connected to the outer connection terminal of the first column IGBT component, and the wiring port of the vertical surface of the first stacked busbar is connected to the input wire.

[0010] Optionally, it also includes an insulating support beam connected to the rear end face of the water-cooled substrate, the surface of the insulating support beam is flush with the surface of the outer connecting terminal of the first column IGBT component, the transverse surface of the first laminated busbar is in contact with the surface of the outer connecting terminal of the first column IGBT component and the surface of the insulating support beam, and the transverse surface of the first laminated busbar is connected to the surface of the insulating support beam.

[0011] Optionally, the AC output row includes an upper horizontal plate, a lower horizontal plate and an inclined plate connecting the upper horizontal plate and the lower horizontal plate, the lower horizontal plate is connected to the outer connecting terminal of the second column IGBT component, the upper horizontal plate is connected to the output wire, and the connection point between the upper horizontal plate and the inclined plate is closer to the outer connecting terminal of the second column IGBT component than the connection point between the lower horizontal plate and the inclined plate.

[0012] Optionally, a terminal block extends horizontally outward from the middle position of the outer edge of the upper horizontal plate, the horizontal projection of the terminal block exceeds the horizontal projection of the water-cooled base plate, and the front sealing plate of the housing has an opening adapted to the terminal block.

[0013] Optionally, it also includes a copper bar insulation plate, which is in contact with and connected to the water-cooled substrate, and there is a gap between the outer connecting terminals of the second column IGBT components and the water-cooled substrate, and the side of the copper bar insulation plate close to the second column IGBT components is inserted into the gap, and the horizontal projection of the copper bar insulation plate close to the side of the second column IGBT components exceeds the horizontal projection of the lower cross plate close to the side of the second column IGBT components.

[0014] Optionally, an insulator is further included, the bottom surface of the insulator is mounted on the water-cooled base plate, the upper transverse plate is overlapped on the insulator and connected by fasteners, and the lower transverse plate and the upper transverse plate are parallel to the surface of the insulator.

[0015] Optionally, the copper busbar insulating plate has an avoidance opening, the avoidance opening faces one side of the insulator, the avoidance opening is clamped on the insulator, and the bottom surface and side surface of the outer connecting terminal of the second column IGBT component are connected by an arc.

[0016] Optionally, the IGBT modules and connecting holes on both sides of the water-cooled substrate are distributed in mirror symmetry, and the shell includes a module base, a module top plate, module side plates connected to both sides of the module base and the module top plate, a module left front sealing plate and a module right front sealing plate connected to the front end of the module base and the module top plate, and a module left rear sealing plate and a module right rear sealing plate connected to the rear end of the module base and the module top plate. The front end of the water-cooled substrate is clamped between the module left front sealing plate and the module right front sealing plate, and the front end surface of the water-cooled substrate is flush with the module left front sealing plate and the module right front sealing plate. The insulating support beam is clamped between the module left rear sealing plate and the module right rear sealing plate, and the rear end surface of the insulating support beam is flush with the module left rear sealing plate and the module right rear sealing plate. There are gaps between the module left rear sealing plate and the insulating support beam, and between the module right rear sealing plate and the insulating support beam, and the rear end of the horizontal surface and the vertical surface of the first laminated busbar pass through the gap.

[0017] The energy storage inverter provided by the utility model comprises a shell and a module core, a cooling water channel is arranged in a water-cooled base plate, a water inlet and a water outlet are arranged on the front side of the water-cooled base plate, two ends of the cooling water channel are respectively connected with the water inlet and the water outlet, a water nozzle is connected at the water inlet and the water outlet, water is taken in and discharged from the water nozzle, and the heat dissipation efficiency of the module core is improved by water cooling.

[0018] There are two sets of IGBT modules, which are respectively installed on the two sides of the water-cooling substrate. The water-cooling substrate is located in the middle. The two sets of IGBT modules are in contact with the two sides of the water-cooling substrate. The two sides of one water-cooling substrate respectively cool the two sets of IGBT modules, thereby improving the utilization rate of the water-cooling substrate. In addition, the two sets of IGBT modules are located on both sides of the water-cooling substrate and are closely attached to the water-cooling substrate, thereby eliminating the spacing between the two sets of IGBT modules stacked up and down, and the structural arrangement perpendicular to the direction of the water-cooling substrate is more compact, saving space.

[0019] Each set of IGBT modules includes two rows of IGBT components, the first row of IGBT components is located in the rear row of the water-cooled base plate, and the second row of IGBT components is located in the front row of the water-cooled base plate. The circuit board and the drive base plate are respectively installed on the surface of the first row of IGBT components and the second row of IGBT components. The first stacked busbar is connected to the outer connecting terminal of the first row of IGBT components. The second stacked busbar is connected between the two rows of IGBT components, and the two ends of the second stacked busbar are respectively connected to the inner connecting terminal of the first row of IGBT components and the inner connecting terminal of the second row of IGBT components. The AC output row is connected to the outer connecting terminal of the second row of IGBT components. The mounting plate and the drive plate are sequentially stacked and installed on the outer side of the surface of the second stacked busbar, that is, the mounting plate is installed at the upper set position of the second stacked busbar, and there is a gap between the mounting plate and the second stacked busbar; the drive plate is installed at the upper set position of the mounting plate, and there is a gap between the mounting plate and the drive plate. There is no contact between the IGBT module, the second stacked busbar, the mounting plate, and the drive plate, which meets the electrical spacing requirements, prevents heat accumulation, and does not interfere with each other.

[0020] The energy storage converter provided by the utility model is installed in a double-sided installation manner, so that the structure of the module core perpendicular to the direction of the water-cooled substrate is installed compactly; the IGBT module, the mounting plate, and the drive plate are connected in a laminated busbar manner, and the connection manner of the IGBT module, the mounting plate, and the drive plate in the prior art, which is flat on the water-cooled substrate, is converted into a laminated connection manner, and the IGBT module with a larger heat generation is installed close to the water-cooled substrate, and the heat is taken away by the cooling circulating water. On the basis of not affecting the heat dissipation efficiency of the module, the area of ​​the water-cooled substrate can be relatively reduced, so that the structure of the module core along the direction of the water-cooled substrate is more compact and small, thereby reducing the overall volume and the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A first structural schematic diagram of an energy storage converter provided in a specific implementation manner of the utility model;

[0023] Figure 2 is a second structural schematic diagram of the energy storage converter;

[0024] Figure 3 This is an exploded view of the energy storage converter;

[0025] Figure 4 It is a schematic diagram of the structure of the module kernel;

[0026] Figure 5 This is a breakdown of the module kernel;

[0027] Figure 6 Schematic diagram of the structure of the water-cooled base plate.

[0028] The following are marked in the accompanying drawings:

[0029] 1-water-cooled base plate, 2-IGBT module, 3-second stacked busbar, 4-circuit board, 5-mounting plate, 6-first stacked busbar, 7-drive board, 8-first insulating column, 9-second insulating column, 10-drive bottom plate, 11-AC output row, 12-copper bar insulating plate, 13-insulator, 14-handle, 15-water outlet nozzle, 16-water inlet nozzle, 17-module base, 18-module top plate, 19-module side plate, 20-insulating support beam, 21-module left rear cover plate, 22-module right rear cover plate, 23-module left front cover plate, 24-module right front cover plate. DETAILED DESCRIPTION

[0030] The core of the utility model is to provide an energy storage converter, which is compactly installed, occupies a small space, and can be used in a small space.

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Please refer to Figures 1 to 6 , Figure 1 A first structural schematic diagram of an energy storage converter provided in a specific implementation manner of the utility model; Figure 2 is a second structural schematic diagram of the energy storage converter; Figure 3 This is an exploded view of the energy storage converter; Figure 4 It is a schematic diagram of the structure of the module kernel; Figure 5 This is a breakdown of the module kernel; Figure 6 Schematic diagram of the structure of the water-cooled base plate.

[0033] In a specific embodiment, the energy storage converter provided by the utility model includes a shell and a module core, the module core includes a water-cooled substrate 1, two sets of IGBT modules 2 respectively installed on both sides of the water-cooled substrate 1, each set of IGBT modules 2 includes two columns of IGBT components; it also includes a circuit board 4 and a drive base plate 10 respectively installed on the surfaces of the first column of IGBT components and the second column of IGBT components, a first stacked busbar 6 connected to the outer connecting terminals of the first column of IGBT components, a second stacked busbar 3 connected between the two columns of IGBT components, an AC output row 11 connected to the outer connecting terminals of the second column of IGBT components, and a mounting plate 5 and a driving plate 7 stacked and installed on the outer side of the surface of the second stacked busbar 3 in sequence, with a gap between the mounting plate 5 and the second stacked busbar 3, and a gap between the mounting plate 5 and the driving plate 7.

[0034] In the above structure, the energy storage converter includes a shell and a module core, and the shell structure is composed of components such as a module base 17, a module top plate 18, and a module cover plate. Among them, the module base 17, the module top plate 18, and the module side plate 19 are made of high-strength cold-rolled steel plate sprayed with plastic, and the module rear cover plate and the module front cover plate are made of insulating plates. The shell protection level meets IP2X.

[0035] The module core includes a water-cooled substrate 1, an IGBT module 2, a circuit board 4, a drive base plate 10, a first stacked busbar 6, a second stacked busbar 3, an AC output bar 11, a mounting plate 5 and a drive plate 7. The functions of the components of the module core are the same as those of the existing components. A cooling water channel is provided in the water-cooled substrate 1. A water inlet and a water outlet are provided on the front side of the water-cooled substrate 1. The two ends of the cooling water channel are connected to the water inlet and the water outlet respectively. The water inlet is connected to a water inlet nozzle 16, and the water outlet is connected to a water outlet nozzle 15. Water is introduced and discharged from the nozzles, and the heat dissipation efficiency of the module core is improved by water cooling.

[0036] The IGBT module 2 is an insulated gate bipolar transistor, which is a common component on the market. It is a composite fully controlled voltage-driven power semiconductor device composed of BJT (bipolar junction transistor) and MOS (insulated gate field effect transistor), and has the advantages of both the high input impedance of MOSFET and the low on-state voltage drop of GTR.

[0037] There are two sets of IGBT modules 2, which are respectively installed on the two sides of the water-cooling substrate 1, with the water-cooling substrate 1 located in the middle. The two sets of IGBT modules 2 are in contact with the two sides of the water-cooling substrate 1, and the two sides of one water-cooling substrate 1 respectively perform water cooling on the two sets of IGBT modules 2, thereby improving the utilization rate of the water-cooling substrate 1; and the two sets of IGBT modules 2 are located on both sides of the water-cooling substrate 1 and are closely attached to the water-cooling substrate 1, thereby eliminating the spacing between the two sets of IGBT modules 2 stacked up and down, and the structural arrangement perpendicular to the direction of the water-cooling substrate 1 is more compact, thereby saving space.

[0038] Each set of IGBT modules 2 includes two rows of IGBT components, the first row of IGBT components is located in the rear row of the water-cooled substrate 1, and the second row of IGBT components is located in the front row of the water-cooled substrate 1. The circuit board 4 and the drive base plate 10 are respectively mounted on the surfaces of the first row of IGBT components and the second row of IGBT components. The first laminated busbar 6 is connected to the outer connecting terminals of the first row of IGBT components. The second laminated busbar 3 is connected between the two rows of IGBT components, and the two ends of the second laminated busbar 3 are respectively connected to the inner connecting terminals of the first row of IGBT components and the inner connecting terminals of the second row of IGBT components. The AC output row 11 is connected to the outer connecting terminals of the second row of IGBT components. The mounting plate 5 and the driving plate 7 are sequentially stacked and installed on the outer side of the surface of the second laminated busbar 3, that is, the mounting plate 5 is installed at a set position above the second laminated busbar 3, and there is a gap between the mounting plate 5 and the second laminated busbar 3; the driving plate 7 is installed at a set position above the mounting plate 5, and there is a gap between the mounting plate 5 and the driving plate 7. There is no contact between the IGBT module 2, the second laminated busbar 3, the mounting plate 5, and the driving plate 7, so the electrical spacing requirements are met, heat accumulation is prevented, and there is no interference with each other.

[0039] The energy storage converter provided by the utility model is installed in a double-sided installation manner, so that the structure of the module core in the direction perpendicular to the water-cooling substrate 1 is installed compactly; the IGBT module 2, the mounting plate 5, and the driving plate 7 are connected in a laminated busbar manner, and the connection manner of the IGBT module 2, the mounting plate 5, and the driving plate 7 in the prior art, which is flat on the water-cooling substrate 1, is converted into a laminated connection manner, and the IGBT module 2 with a larger heat generation is installed close to the water-cooling substrate 1, and the heat is taken away by the cooling circulating water. On the basis of not affecting the heat dissipation efficiency of the module, the area of ​​the water-cooling substrate 1 can be relatively reduced, so that the structure of the module core along the direction of the water-cooling substrate 1 is more compact and small, thereby reducing the overall volume and the occupied space.

[0040] On the basis of the above-mentioned specific embodiments, it also includes a first insulating column 8 and a second insulating column 9. The lower ends of the first insulating column 8 and the second insulating column 9 both have external threads. The water-cooled base plate 1 and the mounting plate 5 have threaded holes that are compatible with the external threads of the first insulating column 8 and the second insulating column 9. The upper ends of the first insulating column 8 and the second insulating column 9 both have internal screw holes. The mounting plate 5 and the drive plate 7 have through holes that are compatible with the internal screw holes of the first insulating column 8 and the second insulating column 9. The mounting plate 5 and the drive plate 7 are respectively connected to the first insulating column 8 and the second insulating column 9 through screw parts.

[0041] In a specific embodiment, the lower ends of the first insulating column 8 and the second insulating column 9 both have external threads, and there are threaded holes on the water-cooled substrate 1 and the mounting plate 5. The first insulating column 8 is screwed into the threaded hole of the water-cooled substrate 1, and the lower end external thread of the second insulating column 9 is screwed into the threaded hole of the mounting plate 5. The threaded connection is convenient for connection and disassembly.

[0042] The upper ends of the first insulating column 8 and the second insulating column 9 are provided with inner screw holes, the mounting plate 5 and the driving plate 7 are provided with through holes, and the mounting plate 5 and the driving plate 7 are respectively connected to the first insulating column 8 and the second insulating column 9 through screws.

[0043] Furthermore, the effective height of the first insulating column 8 is greater than the thickness of the second laminated busbar 3, and the effective height of the second insulating column 9 is greater than the thickness of the mounting plate 5, ensuring that the spacing between the second laminated busbar 3, the mounting plate 5, and the driving plate 7 meets electrical requirements.

[0044] When connecting, the external thread at the lower end of the first insulating column 8 is connected to the threaded hole of the water-cooled base plate 1, the through hole of the mounting plate 5 is aligned with the internal threaded hole of the first insulating column 8, and the threaded parts are connected in the through hole and the internal threaded hole, and the mounting plate 5 is connected to the first insulating column 8 through the threaded parts.

[0045] After the mounting plate 5 and the first insulating column 8 are connected, the external thread of the lower end of the second insulating column 9 is connected to the threaded hole of the mounting plate 5, the through hole of the driving plate 7 is aligned with the internal threaded hole of the second insulating column 9, and the threaded parts are connected in the through hole and the internal threaded hole, and the driving plate 7 is connected to the mounting plate 5 through the threaded parts.

[0046] In a preferred embodiment, the lower ends of the first insulating column 8 and the second insulating column 9 have stepped shafts, with a small diameter at the lower end and a large diameter at the upper end. The external thread is opened on the small diameter at the lower end. When the insulating column is connected to the threaded hole, the step surface of the insulating column abuts against the upper surface of the water-cooled base plate 1 and the mounting plate 5 to locate the axial connection position of the insulating column.

[0047] The first insulating column 8 and the second insulating column 9 can be made of nylon, which has good heat resistance and electrical insulation properties; they can also be made of plastic, which is resistant to high temperatures, light and strong, or other suitable materials.

[0048] In the above embodiment, the drive plate 7 and the mounting plate 5 are supported and installed by using an insulating column installation method to ensure an electrical gap and facilitate heat dissipation from the gap to prevent heat accumulation.

[0049] On the basis of the above-mentioned specific embodiments, the first stacked busbar 6 is L-shaped, the horizontal surface of the first stacked busbar 6 is perpendicular to the vertical surface, the vertical surface of the first stacked busbar 6 is located at the end away from the water-cooled substrate 1, the vertical surface of the first stacked busbar 6 is bent to the side away from the water-cooled substrate 1, the vertical surface of the first stacked busbar 6 is located on the outside of the rear cover plate of the shell, the front end of the horizontal surface of the first stacked busbar 6 is connected to the outer connection terminal of the first column IGBT component, and the wiring port of the vertical surface of the first stacked busbar 6 is connected to the input wire.

[0050] In a specific embodiment, the first laminated busbar 6 includes a transverse surface and a vertical surface, and an edge of the transverse surface is connected to the vertical surface. The transverse surface of the first laminated busbar 6 is perpendicular to the vertical surface and is L-shaped.

[0051] The vertical surface of the first stacked busbar 6 is located at the rear end of the water-cooled substrate 1, that is, at the end away from the water-cooled substrate 1. The vertical surface of the first stacked busbar 6 is located outside the rear cover of the housing, and the vertical surface is parallel to the rear cover of the housing, which facilitates the connection of the wiring port of the vertical surface of the first stacked busbar 6 with the input wire. The front end of the horizontal surface of the first stacked busbar 6 is connected to the outer connection terminal of the first column IGBT assembly to turn on the IGBT module 2.

[0052] The horizontal plate and the vertical plate of the first stacked busbar 6 can be bent into an integral shape, and the vertical surface of the first stacked busbar 6 is bent toward the side away from the water-cooled substrate 1, avoiding the vertical plate on the other side of the water-cooled substrate 1 to prevent mutual interference. In other words, the vertical plates on both sides of the water-cooled substrate 1 are opposite and far apart, which prevents the input wires from crossing and facilitates the arrangement of the wires.

[0053] On the basis of the above-mentioned specific embodiments, it also includes an insulating support beam 20 connected to the rear end face of the water-cooled substrate 1, the surface of the insulating support beam 20 is flush with the surface of the outer connecting terminal of the first column IGBT component, the transverse surface of the first stacked busbar 6 is in contact with the surface of the outer connecting terminal of the first column IGBT component and the surface of the insulating support beam 20, and the transverse surface of the first stacked busbar 6 is connected to the surface of the insulating support beam 20.

[0054] In a specific embodiment, the insulating support beam 20 is made of an insulating board and is waterproof and insulated. The insulating support beam 20 is installed on the rear end face of the water-cooled base plate 1. Specifically, there is a sink hole on the insulating support beam 20, and there is a screw hole on the rear end face of the water-cooled base plate 1. The insulating support beam 20 and the water-cooled base plate 1 are connected by screws.

[0055] The surface of the insulating support beam 20 is flush with the surface of the outer connecting terminal of the first column IGBT assembly, and the transverse surface of the first stacked busbar 6 is overlapped with the surface of the outer connecting terminal of the first column IGBT assembly. The transverse surface of the first stacked busbar 6 is parallel to the surface of the insulating support beam 20 and the surface of the connecting terminal, and the transverse surface is completely in contact with the surface of the outer connecting terminal of the first column IGBT assembly and the surface of the insulating support beam 20. The insulating support beam 20 is placed in the suspended space below the first stacked busbar 6 to support the first stacked busbar 6 to prevent the first stacked busbar 6 from being twisted, deformed or even broken only at the outer connecting terminal of the first column IGBT assembly.

[0056] Furthermore, the transverse surface of the first laminated busbar 6 and the surface of the insulating support beam 20 are provided with matching connection holes, and the two are connected by screws, which not only reinforces the connection of the first laminated busbar 6, but also connects the first laminated busbar 6 and the insulating support beam 20 to prevent relative displacement between the two.

[0057] Based on the above-mentioned specific embodiments, the AC output row 11 includes an upper horizontal plate, a lower horizontal plate and an inclined plate connecting the upper horizontal plate and the lower horizontal plate, the lower horizontal plate is connected to the outer connecting terminal of the second column IGBT component, the upper horizontal plate is connected to the output wire, and the connection point between the upper horizontal plate and the inclined plate is closer to the outer connecting terminal of the second column IGBT component than the connection point between the lower horizontal plate and the inclined plate.

[0058] In a specific embodiment, the AC output row 11 includes an upper horizontal plate, a lower horizontal plate and an inclined plate, and the inclined plate connects the upper horizontal plate and the lower horizontal plate. The AC output row 11 is in an inverted Z shape, and the connection point between the upper horizontal plate and the inclined plate is closer to the outer connection terminal of the second column IGBT assembly than the connection point between the lower horizontal plate and the inclined plate. The outer side of the lower horizontal plate away from the connection point is close to the outer connection terminal of the second column IGBT assembly, and the lower horizontal plate is connected to the outer connection terminal of the second column IGBT assembly. The outer side of the upper horizontal plate away from the connection point is close to the front end of the water-cooled substrate 1, and the upper horizontal plate is connected to the output wire.

[0059] In the above embodiment, the distance between the upper horizontal plate and the water-cooled substrate 1 is greater than the distance between the lower horizontal plate and the water-cooled substrate 1, and the AC output row 11 is close to the water-cooled substrate 1 only at the lower horizontal plate, and other positions are far away from the water-cooled substrate 1, which can effectively prevent the discharge problem caused by the water-cooled substrate 1 and the AC output row 11 being too close, thereby reducing safety hazards.

[0060] Based on the above specific embodiments, a terminal block extends horizontally outward from the middle position of the outer edge of the upper horizontal plate, the horizontal projection of the terminal block exceeds the horizontal projection of the water-cooled base plate 1, and the front sealing plate of the shell has an opening adapted to the terminal block.

[0061] In a specific embodiment, the outer edge of the upper horizontal plate extends outward, and optionally, the edge does not extend, and only the wiring board is horizontally extended outward in the middle position, and the upper horizontal plate is T-shaped to save materials. The wiring board has wiring terminals, and the output wires are connected to the wiring terminals of the wiring board.

[0062] The horizontal projection of the wiring board exceeds the horizontal projection of the water-cooling base plate 1, and the other positions of the upper horizontal plate are slightly shorter than the edge of the water-cooling base plate 1, avoiding the shell. The front sealing plate of the shell has an opening, and the part of the wiring board that exceeds the water-cooling base plate 1 extends out of the opening, which is convenient for connection with the output wire.

[0063] In a preferred embodiment, the upper horizontal plate, the inclined plate and the lower horizontal plate of the AC output row 11 can be formed by bending, and the connection parts are rounded to reduce concentrated stress. The upper horizontal plate and the connecting plate can be formed by stamping, which has a simple structure, saves materials and reduces weight.

[0064] In order to prevent discharge between the water-cooled base plate 1 and the AC output row 11, the following measures can be taken:

[0065] In the first case, it also includes a copper busbar insulating plate 12, which is in contact with the water-cooled substrate 1. There is a gap between the outer connecting terminal of the second column IGBT assembly and the water-cooled substrate 1. The side of the copper busbar insulating plate 12 close to the second column IGBT assembly is inserted into the gap, and the horizontal projection of the copper busbar insulating plate 12 close to the second column IGBT assembly exceeds the horizontal projection of the lower cross plate close to the second column IGBT assembly.

[0066] In a specific embodiment, a copper bar insulation board 12 is arranged between the water-cooled substrate 1 and the AC output bar 11, and the copper bar insulation board 12 is in contact with the water-cooled substrate 1. Specifically, the copper bar insulation board 12 can be fixed to the water-cooled substrate 1 by bolts.

[0067] The lower horizontal plate of the AC output row 11 is closest to the water-cooled substrate 1, and a copper bar insulation plate 12 is particularly required to be arranged between the lower horizontal plate and the water-cooled substrate 1. The bottom surface of the outer connecting terminal of the second column IGBT assembly moves up, and a gap is formed between the bottom surface of the outer connecting terminal and the water-cooled substrate 1. The gap is greater than the thickness of the copper bar insulation plate 12. The copper bar insulation plate 12 is inserted into the gap on the side close to the second column IGBT assembly. The lower horizontal plate is isolated from the water-cooled substrate 1 by the copper bar insulation plate 12. The copper bar insulation plate 12 is used for composite insulation in the high-discharge area to effectively isolate the charged body.

[0068] The horizontal projection of the copper bar insulation board 12 near the second column IGBT assembly side exceeds the horizontal projection of the lower horizontal board near the second column IGBT assembly side. In other words, the copper bar insulation board 12 can cover the entire board surface of the lower horizontal board, with a large protection range, eliminating the hidden danger of discharge.

[0069] In the second case, a conductive block is further included, which is connected between the outer connection terminal of the second column IGBT assembly and the lower horizontal plate. The conductive block is used to raise the installation position of the lower horizontal plate, thereby increasing the distance between the lower horizontal plate and the water-cooled base plate 1 and reducing the possibility of discharge.

[0070] On the basis of the above specific embodiments, an insulator 13 is further included, the bottom surface of the insulator 13 is installed on the water-cooled base plate 1, the upper cross plate is overlapped on the insulator 13 and connected by fasteners, and the lower cross plate and the upper cross plate are parallel to the surface of the insulator 13.

[0071] In a specific embodiment, the bottom surface of the insulator 13 is mounted on the water-cooled base plate 1, and can be specifically connected by threads. The height of the insulator 13 is equal to the distance from the upper cross plate to the water-cooled base plate 1, the upper cross plate is overlapped on the insulator 13, the lower cross plate and the upper cross plate are parallel to the surface of the insulator 13, and the cantilever upper cross plate is supported by the insulator 13 to maintain the force balance between the upper cross plate and the lower cross plate of the AC output bar 11, improve the stability of the AC output bar 11, and reduce the risk of torsional deformation and fracture of the lower cross plate.

[0072] Optionally, there are connection holes on the upper cross plate and the insulator 13 , and the two are connected by fasteners to improve the connection stability of the AC output bar 11 .

[0073] Based on the above specific embodiments, the copper busbar insulating plate 12 has an avoidance opening, which faces one side of the insulator 13 and is clamped on the insulator 13. The bottom and side surfaces of the outer connecting terminals of the second column IGBT components are connected by an arc.

[0074] In a specific embodiment, the copper bar insulation board 12 has an escape opening, and optionally, the shape and size of the escape opening are consistent with the shape and size of the insulator 13, and the escape opening faces one side of the insulator 13. When the copper bar insulation board 12 is inserted into the gap between the bottom surface of the outer connecting terminal of the second column IGBT assembly and the water-cooled substrate 1, the escape opening is stuck on the insulator 13, and the insulator 13 positions the copper bar insulation board 12 laterally to prevent the copper bar insulation board 12 from moving left and right.

[0075] The bottom and side surfaces of the outer connection terminals of the second column IGBT components are connected by an arc, and the copper bar insulating plate 12 is inserted into the gap along the arc. The distance between the gap opening and the gap is large, so that the copper bar insulating plate 12 can quickly enter the gap.

[0076] On the basis of the above-mentioned specific embodiments, the IGBT modules 2 and the connection holes on both sides of the water-cooled substrate 1 are distributed in a mirror-symmetrical manner, and the housing includes a module base 17, a module top plate 18, a module side plate 19 connected to both sides of the module base 17 and the module top plate 18, a module left front sealing plate 23 and a module right front sealing plate 24 connected to the front end of the module base 17 and the module top plate 18, and a module left rear sealing plate 21 and a module right rear sealing plate 22 connected to the rear end of the module base 17 and the module top plate 18. The front end of the water-cooled substrate 1 is clamped on the module The front end face of the water-cooled substrate 1 is flush with the left front cover plate 23 and the right front cover plate 24 of the module, the insulating support beam 20 is sandwiched between the left rear cover plate 21 and the right rear cover plate 22 of the module, and the rear end face of the insulating support beam 20 is flush with the left rear cover plate 21 and the right rear cover plate 22 of the module, there are gaps between the left rear cover plate 21 and the insulating support beam 20, and between the right rear cover plate 22 and the insulating support beam 20, the rear end of the horizontal surface and the vertical surface of the first laminated busbar 6 pass through the gap.

[0077] In a specific embodiment, components are installed in a mirror-image manner on both sides of the water-cooled substrate 1, that is, the IGBT modules 2 and the connection holes on both sides of the water-cooled substrate 1 are distributed in a mirror-image symmetrical manner. The water-cooled substrate 1 can be positioned once to process the connection holes on both sides, which is more convenient.

[0078] The module base 17 and the module top plate 18 are aligned in parallel, and the module base 17 and the module top plate 18 can be connected to the bottom surface and the top surface of the water-cooled base plate 1 by fasteners. Two module side plates 19 are connected to both sides of the module base 17 and the module top plate 18, the bottom of the module side plate 19 is inserted into the positioning groove of the module base 17, and the top of the module side plate 19 is connected to the module top plate 18 by screws.

[0079] The module left front sealing plate 23 and the module right front sealing plate 24 are connected to the front ends of the module base 17 and the module top plate 18, and can be connected specifically by screws. The front end of the water-cooled substrate 1 is sandwiched between the module left front sealing plate 23 and the module right front sealing plate 24, and the front end surface of the water-cooled substrate 1 is flush with the module left front sealing plate 23 and the module right front sealing plate 24. The water inlet nozzle 16, the water outlet nozzle 15, and the handle 14 are arranged on the front end surface of the water-cooled substrate 1, and the water inlet nozzle 16, the water outlet nozzle 15, and the handle 14 are exposed to the outside for convenient use. The module left front sealing plate 23 and the module right front sealing plate 24 correspond to the IGBT modules 2 on both sides of the water-cooled substrate 1, respectively. The openings are arranged on the module left front sealing plate 23 and the module right front sealing plate 24, and the portion of the terminal block that exceeds the water-cooled substrate 1 extends out of the opening.

[0080] The module left rear sealing plate 21 and the module right rear sealing plate 22 are connected to the rear ends of the module base 17 and the module top plate 18, and the insulating support beam 20 is sandwiched between the module left rear sealing plate 21 and the module right rear sealing plate 22, and the rear end surface of the insulating support beam 20 is flush with the module left rear sealing plate 21 and the module right rear sealing plate 22, which is flat and beautiful. There are gaps between the module left rear sealing plate 21 and the insulating support beam 20, and between the module right rear sealing plate 22 and the insulating support beam 20. The rear end of the horizontal surface and the vertical surface of the first laminated busbar 6 pass through the gap, and the vertical surface is parallel to the rear sealing plate, with a compact structure. There is a gap between the vertical plate and the rear sealing plate to facilitate the connection of input wires.

[0081] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0082] The energy storage converter provided by the utility model is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model. Therefore, the utility model will not be limited to the embodiments shown in this article, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. An energy storage converter, characterized in that: The invention comprises a housing and a module core, wherein the module core comprises a water-cooled substrate (1), two sets of IGBT modules (2) respectively mounted on two sides of the water-cooled substrate (1), each set of the IGBT modules (2) comprising two rows of IGBT components; and further comprises a circuit board (4) and a drive base plate (10) respectively mounted on the surfaces of the first row of IGBT components and the second row of IGBT components, a first laminated busbar (6) connected to the outer connecting terminals of the first row of IGBT components, a second laminated busbar (3) connected between the two rows of IGBT components, an AC output busbar (11) connected to the outer connecting terminals of the second row of IGBT components, and a mounting plate (5) and a drive plate (7) sequentially laminated and mounted on the outer side of the surface of the second laminated busbar (3), wherein a gap is provided between the mounting plate (5) and the second laminated busbar (3), and a gap is provided between the mounting plate (5) and the drive plate (7).

2. The energy storage converter according to claim 1, characterized in that: The water-cooling substrate (1) and the mounting plate (5) are provided with threaded holes matching the external threads of the first insulating column (8) and the second insulating column (9); the upper ends of the first insulating column (8) and the second insulating column (9) are provided with internal threaded holes; the mounting plate (5) and the driving plate (7) are provided with through holes matching the internal threaded holes of the first insulating column (8) and the second insulating column (9); and the mounting plate (5) and the driving plate (7) are respectively connected to the first insulating column (8) and the second insulating column (9) through threaded parts.

3. The energy storage converter according to claim 1, characterized in that: The first laminated busbar (6) is L-shaped, the horizontal surface of the first laminated busbar (6) is perpendicular to the vertical surface, the vertical surface of the first laminated busbar (6) is located at an end away from the water-cooled substrate (1), the vertical surface of the first laminated busbar (6) is bent toward a side away from the water-cooled substrate (1), the vertical surface of the first laminated busbar (6) is located on the outside of the rear cover plate of the housing, the front end of the horizontal surface of the first laminated busbar (6) is connected to the outer connection terminal of the first column IGBT assembly, and the wiring port of the vertical surface of the first laminated busbar (6) is connected to the input wire.

4. The energy storage converter according to claim 3, characterized in that: It also includes an insulating support beam (20) connected to the rear end surface of the water-cooled substrate (1), the surface of the insulating support beam (20) being flush with the surface of the outer connecting terminal of the first column of IGBT components, the transverse surface of the first laminated busbar (6) being in contact with the surface of the outer connecting terminal of the first column of IGBT components and the surface of the insulating support beam (20), and the transverse surface of the first laminated busbar (6) being connected to the surface of the insulating support beam (20).

5. The energy storage converter according to claim 1, characterized in that: The AC output row (11) comprises an upper horizontal plate, a lower horizontal plate and an inclined plate connecting the upper horizontal plate and the lower horizontal plate, the lower horizontal plate is connected to the outer connecting terminal of the second column IGBT component, the upper horizontal plate is connected to the output wire, and the connection point between the upper horizontal plate and the inclined plate is closer to the outer connecting terminal of the second column IGBT component than the connection point between the lower horizontal plate and the inclined plate.

6. The energy storage converter according to claim 5, characterized in that: A wiring board extends horizontally outward from the middle position of the outer edge of the upper horizontal plate, the horizontal projection of the wiring board exceeds the horizontal projection of the water-cooling base plate (1), and the front sealing plate of the housing has an opening adapted to the wiring board.

7. The energy storage converter according to claim 5, characterized in that: It also comprises a copper bar insulation plate (12), the copper bar insulation plate (12) being in contact with and connected to the water-cooling base plate (1), a gap being provided between the outer connecting terminals of the second-column IGBT components and the water-cooling base plate (1), a side of the copper bar insulation plate (12) close to the second-column IGBT components being inserted into the gap, and a horizontal projection of the side of the copper bar insulation plate (12) close to the second-column IGBT components exceeding a horizontal projection of the side of the lower horizontal plate close to the second-column IGBT components.

8. The energy storage converter according to claim 7, characterized in that: It also includes an insulator (13), the bottom surface of the insulator (13) being mounted on the water-cooled base plate (1), the upper transverse plate overlapping the insulator (13) and connected via fasteners, and the lower transverse plate and the upper transverse plate being parallel to the surface of the insulator (13).

9. The energy storage converter according to claim 8, characterized in that: The copper bar insulating plate (12) has an escape opening, the escape opening faces one side of the insulator (13), the escape opening is clamped on the insulator (13), and the bottom surface and side surface of the outer connecting terminal of the second column IGBT assembly are connected by an arc.

10. The energy storage converter according to claim 4, characterized in that: The IGBT modules (2) and the connection holes on both sides of the water-cooled substrate (1) are distributed in a mirror-symmetrical manner. The housing comprises a module base (17), a module top plate (18), a module side plate (19) connected to both sides of the module base (17) and the module top plate (18), a module left front sealing plate (23) and a module right front sealing plate (24) connected to the front ends of the module base (17) and the module top plate (18), and a module left rear sealing plate (21) and a module right rear sealing plate (22) connected to the rear ends of the module base (17) and the module top plate (18). The front end of the water-cooled substrate (1) is clamped between the module left front sealing plate (23) and the module The insulating support beam (20) is sandwiched between the module left rear sealing plate (21) and the module right rear sealing plate (22), and the rear end face of the insulating support beam (20) is flush with the module left rear sealing plate (21) and the module right rear sealing plate (22). There are gaps between the module left rear sealing plate (21) and the insulating support beam (20), and between the module right rear sealing plate (22) and the insulating support beam (20), and the rear end and vertical face of the first laminated busbar (6) pass through the gaps.

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