Bending protection structure of FPC (Flexible Printed Circuit) soft board

Abstract

The utility model belongs to the technical field of flexible circuit boards, and particularly relates to a bending protection structure of a flexible printed circuit (FPC), which comprises the FPC, the internal structure of the FPC is composed of a conductive layer, a covering layer and a supporting layer, the conductive layer is arranged at the central position in the FPC, the conductive layer is made of conductive materials, and the covering layer is arranged on the supporting layer. Various circuit patterns or circuits are designed and arranged inside the flexible printed circuit board, the supporting layers are made of polyimide, the structures of the supporting layers are arranged in a net-shaped structure and are arranged in a staggered mode, through cooperation of the net-shaped structures of the supporting layers, better supporting and stability can be provided, meanwhile, certain flexibility can be kept, stress can be effectively dispersed when the flexible printed circuit board is bent, and the service life of the flexible printed circuit board is prolonged. According to the flexible printed circuit board, the stress concentration is reduced, so that the bending resistance of the flexible printed circuit board is improved, the raised grain grooves are formed in the edge of the flexible printed circuit board, and the flexible printed circuit board with the curved edge can reduce the stress, distribute the stress more uniformly and reduce the damage risk through the matching of the raised grain grooves, and meanwhile, the flexibility can be enhanced.

Description

Technical Field

[0001] The utility model belongs to the technical field of flexible circuit boards, in particular to a bending protection structure of an FPC soft board. Background Art

[0002] FPC, the full name of which is flexible printed circuit board, is a printed circuit board with high reliability and excellent flexibility. It is made of polyester film or polyimide as the substrate. By embedding the circuit design on a flexible and thin plastic sheet, a large number of precision components can be stacked in a narrow and limited space to form a flexible circuit. This circuit board has excellent electrical properties, can meet the needs of smaller and higher density installation designs, and helps to reduce assembly processes and enhance reliability.

[0003] The existing FPC soft board is mainly composed of the following parts: substrate, cover film, via, components, etc. The working principle is: by designing a specific circuit pattern, connecting various components to achieve the transmission and control of electrical signals. When the current passes through the FPC soft board, it will flow along the designed circuit path to achieve various functions.

[0004] At present, the FPC soft board in the prior art has the following disadvantages: the FPC soft board is often installed inside a device with a small space, and it needs to be bent to reduce the space occupied inside the device, and the bent FPC soft board produces excessive stress concentration, thereby affecting the performance and life of the FPC soft board; therefore, a bending protection structure of the FPC soft board is proposed to address the above problems. Utility Model Content

[0005] In order to make up for the shortcomings of existing FPC soft boards, a bending protection structure for FPC soft boards is proposed to solve the problem that FPC soft boards are often installed inside devices with narrow spaces and need to be bent to reduce the space occupied inside the devices, while the bent FPC soft boards produce excessive stress concentration, thereby affecting the performance and life of the FPC soft boards.

[0006] The technical solution adopted by the utility model to solve its technical problem is: the utility model describes a bending protection structure of an FPC soft board, comprising an FPC soft board, the internal structure of the FPC soft board consisting of a conductive layer, a covering layer, and a supporting layer, the conductive layer being arranged at the inner center position of the FPC soft board, the conductive layer being made of a conductive material, and various circuit patterns or lines being designed and arranged internally to meet the requirements of electronic equipment in terms of signal transmission, power supply, etc., and the overall structural reliability of the FPC soft board is improved by redesigning and coordinating the FPC soft board architecture, thereby preventing the problem of loss caused by bending of the FPC soft board, which results in a reduction in service life.

[0007] Preferably, there are two groups of covering layers, which are respectively located directly above and directly below the conductive layer. The covering layers are made of polyimide and are fixedly connected to the conductive layer through an adhesive. Through the cooperation of the covering layers, the internal circuits and electronic components of the conductive layer are protected from erosion and damage by the external environment.

[0008] Preferably, the material of the support layer is polyimide, and the structure of the support layer is a mesh structure layout, which is staggered. Through the cooperation of the mesh structure of the support layer, it can provide better support and stability while maintaining a certain flexibility. When the FPC soft board is bent, it can effectively disperse stress and reduce stress concentration, thereby improving the bending resistance of the FPC soft board.

[0009] Preferably, there are two groups of support layers, which are respectively located at the top of the upper covering layer and the bottom of the lower covering layer, and are fixedly connected by an adhesive. The cooperation of the two groups of support layers arranged at the top and the bottom provides more comprehensive protection.

[0010] Preferably, the edge of the FPC soft board is provided with a wavy groove. Through the cooperation of the wavy groove, the FPC soft board with a curved edge can reduce stress, distribute stress more evenly, reduce the risk of damage, and enhance flexibility.

[0011] Preferably, a rubber pad is fixedly provided on the edge of the FPC soft board by an adhesive, and the edge of the FPC soft board is protected by the cooperation of the rubber pad to prevent damage caused by bumping the edge.

[0012] Beneficial effects of the utility model:

[0013] The utility model provides a bending protection structure of an FPC soft board, wherein the supporting layers located at the top and bottom of the conductive layer are mesh structures, which can provide better support and stability for the FPC soft board, while maintaining a certain flexibility, and can effectively disperse stress and reduce stress concentration, thereby improving the bending resistance of the FPC soft board, and can also provide buffer protection for the FPC soft board, in addition, the mesh structure can also reduce the weight of the entire structure and help dissipate heat, which is crucial for electronic equipment that requires high performance and long life; and the edge of the FPC soft board is provided with a wavy groove, and the curved shape of the edge can better adapt to the internal space of equipment with various complex shapes and structures, making the FPC soft board easier to install and fix, reducing the difficulty during installation, and reducing the risk of damage caused by mismatching, while reducing stress concentration, the curved edge can distribute stress more evenly when bending, reducing the phenomenon of stress concentration, helping to prevent the FPC soft board from being damaged due to excessive stress during the bending process, thereby improving its durability and reliability, and can enhance the flexibility of the FPC soft board to further increase its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0015] Figure 1 It is a three-dimensional picture of the whole;

[0016] Figure 2 It is a structural cross-sectional view of the FPC soft board;

[0017] Figure 3 This is an enlarged cross-sectional view of the FPC soft board structure;

[0018] Figure 4 This is a top view of the structure of the FPC soft board;

[0019] Legend:

[0020] 1. FPC soft board; 2. Conductive layer; 3. Covering layer; 4. Support layer; 5. Wave groove; 6. Rubber pad. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Specific examples are given below.

[0023] See also Figure 1-Figure 4The utility model discloses a bending protection structure of an FPC soft board, comprising an FPC soft board 1, wherein the internal structure of the FPC soft board 1 is composed of a conductive layer 2, a covering layer 3, and a supporting layer 4, wherein the conductive layer 2 is arranged at the inner center of the FPC soft board 1, and the conductive layer 2 is made of a conductive material, and various circuit patterns or lines are designed and arranged inside to meet the requirements of electronic equipment in terms of signal transmission, power supply, etc., wherein the covering layer 3 is provided with two groups, and is respectively located directly above and directly below the conductive layer 2, and the material of the covering layer 3 is polyimide, and the covering layer 3 is fixedly connected to the conductive layer 2 by an adhesive The material of the support layer 4 is polyimide, and the structure of the support layer 4 is a mesh structure layout, staggered arrangement, there are two groups of the support layer 4, which are respectively located at the top of the upper cover layer 3 and the bottom of the lower cover layer 3, and are fixedly connected by an adhesive. The edge of the FPC soft board 1 is provided with a wavy groove 5, and the edge of the FPC soft board 1 is fixedly provided with a rubber pad 6 by an adhesive. When working, in order to improve the structural reliability of the FPC soft board 1 and prevent the FPC soft board 1 from generating excessive stress concentration after bending, thereby affecting the performance and life of the FPC soft board 1, first, when the staff installs the FPC soft board 1 on the electronic device When the FPC board 1 is bent inside the device, stress, tension and pressure will be generated in the structure, which will affect the service life of the FPC board 1. When the FPC board 1 is bent, the support layer 4 located at the top and bottom of the conductive layer 2 is a mesh structure, which can provide better support and stability for the FPC board 1, while maintaining a certain flexibility, and can effectively disperse stress and reduce stress concentration, thereby improving the bending resistance of the FPC board 1, and also providing buffer protection for the FPC board 1. In addition, the mesh structure can also reduce the weight of the entire structure and help dissipate heat, which is very important for high performance and long life. The FPC soft board 1 is crucial for the life of electronic devices; and the edge of the FPC soft board 1 is provided with a wavy groove 5, the curved shape of the edge can better adapt to the internal space of equipment with various complex shapes and structures, making the FPC soft board 1 easier to install and fix, reducing the difficulty during installation, and reducing the risk of damage caused by mismatching. At the same time, it can reduce stress concentration. The curved edge can distribute stress more evenly when bending, reducing the phenomenon of stress concentration, which helps to prevent the FPC soft board 1 from being damaged due to excessive stress during the bending process, thereby improving its durability and reliability, and can enhance the flexibility of the FPC soft board 1 to further increase its service life.

[0024] Working principle: In order to improve the structural reliability of the FPC soft board 1 and prevent the FPC soft board 1 from generating excessive stress concentration after bending, thereby affecting the performance and life of the FPC soft board 1, first, when the staff installs the FPC soft board 1 inside the electronic equipment and bends it, the FPC soft board 1 structure will generate stress, tension, and pressure, which will affect the service life of the FPC soft board 1. When the FPC soft board 1 is bent, the support layer 4 located at the top and bottom of the conductive layer 2 is a mesh structure, which can provide better support and stability for the FPC soft board 1, while maintaining a certain flexibility, and can effectively disperse stress and reduce stress concentration, thereby improving the bending resistance of the FPC soft board 1, and also providing a buffer for the FPC soft board 1 Protection, in addition, the mesh structure can also reduce the weight of the entire structure and help dissipate heat, which is crucial for electronic devices that require high performance and long life; and the edge of the FPC soft board 1 is provided with a wavy groove 5, the curved shape of the edge can better adapt to the internal space of equipment with various complex shapes and structures, making the FPC soft board 1 easier to install and fix, reducing the difficulty during installation, and reducing the risk of damage caused by mismatch, while reducing stress concentration. The curved edge can distribute stress more evenly when bending, reducing stress concentration, helping to prevent the FPC soft board 1 from being damaged due to excessive stress during the bending process, thereby improving its durability and reliability, and can enhance the flexibility of the FPC soft board 1 to further increase its service life.

[0025] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0026] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A bending protection structure for an FPC soft board, characterized in that: The invention comprises an FPC soft board (1), wherein the internal structure of the FPC soft board (1) is composed of a conductive layer (2), a covering layer (3), and a supporting layer (4), wherein the conductive layer (2) is arranged at the inner center of the FPC soft board (1), and the conductive layer (2) is made of a conductive material, and various circuit patterns or lines are designed and arranged inside the FPC soft board (1); The covering layer (3) is provided with two groups, and is respectively located directly above and directly below the conductive layer (2); the covering layer (3) is made of polyimide, and the covering layer (3) is fixedly connected to the conductive layer (2) via an adhesive; the supporting layer (4) is made of polyimide, and has a mesh structure layout and is staggered.

2. The bending protection structure of an FPC soft board according to claim 1 is characterized in that: There are two groups of support layers (4), which are respectively located on the top of the upper covering layer (3) and the bottom of the lower covering layer (3), and are fixedly connected by an adhesive.

3. The bending protection structure of an FPC soft board according to claim 1, characterized in that: The edge of the FPC soft board (1) is provided with a wavy groove (5).

4. The bending protection structure of an FPC soft board according to claim 1, characterized in that: A rubber pad (6) is fixedly provided on the edge of the FPC soft board (1) by means of an adhesive.

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