Thermoelectric separation composite board

Abstract

The utility model relates to a thermoelectric separation composite board in the composite board field, comprising a support layer, the top of the support layer is provided with a heat conduction layer through cold rolling, the top of the heat conduction layer is connected with an electric conduction layer through an insulation layer, the middle part of the electric conduction layer is symmetrically provided with two isolation layers, one end of each isolation layer is provided with a projection, and the other end of each isolation layer is provided with an insulation layer. A filling notch is formed between every two adjacent isolation layers and connected with a filling layer, the bottom of each filling layer abuts against the top of the corresponding heat conduction layer, and the supporting layer, the heat conduction layers, the insulation layers and the electric conduction layers are subjected to cold rolling compounding to form the composite board, so that the heat conductivity and the electric performance are enhanced; the production process technology is effectively simplified, the production difficulty is reduced, the product quality is more controllable, the heat dissipation performance of the composite board can be enhanced through the design of the filling notch and the filling layer, the surface mounting technology is planned and designed, the weight of the composite board is reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of composite plates, in particular to a thermoelectric separation composite plate. Background Art

[0002] The substrate is the basic material for manufacturing PCB. Generally speaking, the substrate is a copper-clad laminate. In the manufacturing of single-sided and double-sided printed boards, holes are selectively processed, copper is electroplated, and etching is performed on the copper-clad laminate of the substrate material to obtain the required circuit pattern. The substrates used are usually copper-coated aluminum substrates, copper-coated copper substrates, and ceramic substrates. Among these three types, aluminum substrates usually have the worst thermal conductivity, and copper substrates are average. Aluminum substrates and copper substrates cannot solve the problems of thermal conductivity and electrical properties very well, while ceramic substrates have high thermal conductivity but are more expensive and not easily widely used. The manufacture of thermoelectric separation composite boards also uses the inner core thin copper-clad laminate as the base, and alternately laminates and bonds the conductive pattern layer and the prepreg together through one-time lamination to form more than three layers of conductive pattern layer interconnection. It has the functions of thermal conductivity, electrical conductivity, insulation and support.

[0003] In the existing technology, the high thermal conductivity demand of devices has been an inevitable problem since the electrical age, especially in the information age. The integrated mounting substrate makes the heat of each device more concentrated. One device due to poor thermal conductivity will cause the entire product to be scrapped. Therefore, a mounting substrate with good thermal conductivity can effectively solve the corresponding problem. Therefore, it is urgent to develop a thermoelectric separation composite substrate for the installation of optoelectronic, electronic, electric power and other devices, especially in the field where the device requires good thermal conductivity. Utility Model Content

[0004] The purpose of the utility model is to solve the above defects and provide a thermoelectric separation composite plate to solve the problems mentioned in the above background technology.

[0005] The purpose of the utility model is achieved by the following methods:

[0006] A thermoelectric separation composite plate comprises a support layer, a heat conductive layer is provided on the top of the support layer by cold rolling, an electrical conductive layer is connected to the top of the heat conductive layer through an insulating layer, two isolation layers are symmetrically provided in the middle of the electrical conductive layer, a protrusion is provided at one end of the isolation layer, the protrusions are matched and buckled on the top of the electrical conductive layer, a filling notch is provided between two adjacent isolation layers, a filling layer is connected to the filling notch, and the bottom of the filling layer abuts against the top of the heat conductive layer.

[0007] Further in the above description, the top of the support layer and the bottom of the heat conductive layer are cold-rolled and shaped by a rolling machine, the support layer can be set to more than multiple layers, the heat conductive layer is set on the top of the support layer by cold rolling, and is annealed in an annealing furnace to form a substrate.

[0008] Further in the above description, the bottom of the conductive layer is in contact with the insulating layer and is symmetrically arranged on one side of the isolation layer. The supporting layer, thermal conductive layer, conductive layer and insulating layer are shaped by cold rolling and then annealed in an annealing furnace to form a laminated composite substrate.

[0009] Further in the above description, the bottom of the isolation layer is in contact with the thermal conductive layer, and the isolation layer is in an inverted L-shape. Through the inverted L-shape, one end of the protrusion is buckled and arranged on the top of the conductive layer, and one side of the isolation layer is in contact with the conductive layer and the insulating layer to enhance thermal conductivity.

[0010] In the above description, further, the thickness of the filling layer is set to be the same as the combination of the conductive layer and the isolation layer, and the isolation layer is symmetrically wrapped around the inner side of the filling notch.

[0011] In the above description, further, the insulating layer is disposed between the thermal conductive layer and the electrical conductive layer by coating.

[0012] Further in the above description, the support layer, thermal conductive layer, electrical conductive layer and filling layer are all set as metal structures, and the support layer, thermal conductive layer and filling layer can also be set as non-metallic structures, the insulating layer and isolation layer materials can be set as organic polymers and oxides, and the electrical conductive layer can also be set as a conductor or metal oxide structure.

[0013] The beneficial effects of the utility model are as follows: a composite plate is formed by cold-rolling the support layer, the thermal conductive layer, the insulating layer and the electrical conductive layer, which is beneficial to enhancing thermal conductivity and electrical properties, effectively simplifying the production process, reducing production difficulty, making product quality more controllable, and enhancing the heat dissipation performance of the composite plate and the planning and design of the mounting process through the design of the filling slot and the filling layer, reducing the weight of the composite plate and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view of a thermoelectric separation composite plate of the utility model in a first state;

[0015] Figure 2 This is a front view of a thermoelectric separation composite plate of the utility model in the second state;

[0016] The reference numerals in the figure are: 1-support layer, 2-thermal conductive layer, 3-insulating layer, 4-electrical conductive layer, 5-isolating layer, 6-protrusion, 7-filling notch, 8-filling layer. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0018] Embodiment 1

[0019] Reference Figure 1A thermoelectric separation composite plate specifically implemented therein comprises a support layer 1, a thermal conductive layer 2 is provided on the top of the support layer 1 by cold rolling, an electrical conductive layer 4 is connected to the top of the thermal conductive layer 2 through an insulating layer 3, two isolation layers 5 are symmetrically provided in the middle of the electrical conductive layer 4, a protrusion 6 is provided at one end of the isolation layer 5, the protrusion 6 is matched and buckled on the top of the electrical conductive layer 4, a filling notch 7 is provided between two adjacent isolation layers 5, a filling layer 8 is connected to the filling notch 7, and the bottom of the filling layer 8 is abutted against the top of the thermal conductive layer 2.

[0020] The top of the support layer 1 and the bottom of the thermal conductive layer 2 are cold-rolled and shaped by a rolling machine. The support layer 1 can be set to more than multiple layers. The thermal conductive layer 2 is set on the top of the support layer 1 by cold rolling, and is annealed in an annealing furnace to form a substrate. The bottom of the electrically conductive layer 4 is in contact with the insulating layer 3 and is symmetrically arranged on one side of the isolation layer 5. The support layer 1, the thermal conductive layer 2, the electrically conductive layer 4 and the insulating layer 3 are annealed in an annealing furnace by cold rolling to form a laminated composite substrate. The insulating layer 3 is set between the thermal conductive layer 2 and the electrically conductive layer 4 by coating. The support layer 1, the thermal conductive layer 2, the electrically conductive layer 4 and the filling layer 8 are all metal structures, and the support layer 1, the thermal conductive layer 2 and the filling layer 8 can also be set as a non-metallic structure. The materials of the insulating layer 3 and the isolation layer 5 can be set as organic polymers and oxides, and the electrically conductive layer 4 can also be set as a conductor or a metal oxide structure.

[0021] A support layer 1, a thermal conductive layer 2, two insulating layers 3 and two electrically conductive layers 4 are sequentially laminated together and then placed in a rolling mill for cold rolling and compounding to form a composite plate. The support layer 1, the thermal conductive layer 2, the electrically conductive layer 4 and the filling layer 8 are all set to metal material structures, and the support layer 1 and the thermal conductive layer 2 can also be set to non-metal structures. The insulating layer 3 can be made of organic polymers and oxides. The isolation layer 5 is symmetrically arranged between the electrically conductive layer 4 and the insulating layer 3. The filling notch 7 is kept in a hollow state according to the device installation. The composite plate after cold rolling is conducive to enhancing thermal conductivity and electrical properties, effectively simplifying the production process, reducing production difficulty, and making product quality more controllable.

[0022] Embodiment 2

[0023] Reference Figure 2 The thickness of the filling layer 8 in its specific implementation is the same as the combination of the conductive layer 4 and the isolation layer 5. The isolation layer 5 is symmetrically wrapped and arranged on the inner side of the filling notch 7. The bottom of the isolation layer 5 abuts against the thermal conductive layer 2. The isolation layer 5 is arranged in an inverted L shape. Through the inverted L shape, one end of the protrusion 6 is buckled and arranged on the top of the conductive layer 4. One side of the isolation layer 5 abuts against the conductive layer 4 and the insulating layer 3 to enhance thermal conductivity.

[0024] After the composite board is cold-rolled, an isolation layer 5 is provided on the top of the thermal conductive layer 2, and a filling slot 7 is provided between the two isolation layers 5. The filling slot 7 can be adjusted according to the installation size of the device. The filling slot 7 is filled with a filling layer 8, and the filling layer 8 can also be set to a metal or non-metal material structure. The design of the filling slot 7 and the filling layer 8 enhances the heat dissipation performance of the composite board and the planning and design of the mounting process, enhances the thermal conductivity and electrical properties, and is beneficial to the use of the composite board.

[0025] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A thermoelectric separation composite plate, comprising a support layer, characterized in that: A thermal conductive layer is provided on the top of the support layer through cold rolling, and an electrical conductive layer is connected to the top of the thermal conductive layer through an insulating layer. Two isolation layers are symmetrically provided in the middle of the electrical conductive layer, and a protrusion is provided at one end of the isolation layer. The protrusions are matched and buckled on the top of the electrical conductive layer. A filling notch is provided between two adjacent isolation layers, and a filling layer is connected to the filling notch. The bottom of the filling layer abuts against the top of the thermal conductive layer.

2. The thermoelectric separation composite plate according to claim 1, characterized in that: The top of the support layer and the bottom of the heat-conducting layer are cold-rolled and shaped by a rolling machine.

3. The thermoelectric separation composite plate according to claim 1, characterized in that: The bottom of the conductive layer abuts against the insulating layer and is symmetrically arranged on one side of the isolation layer.

4. A thermoelectric separation composite plate according to claim 3, characterized in that: The bottom of the isolation layer abuts against the heat-conducting layer, and the isolation layer is arranged in an inverted L shape.

5. A thermoelectric separation composite plate according to claim 4, characterized in that: The thickness of the filling layer is the same as the combination of the conductive layer and the isolation layer, and the isolation layer is symmetrically wrapped around the inner side of the filling notch.

6. A thermoelectric separation composite plate according to any one of claims 1 to 4, characterized in that: The insulating layer is disposed between the thermal conductive layer and the electrical conductive layer by coating.

7. A thermoelectric separation composite plate according to any one of claims 1 to 4, characterized in that: The support layer, the heat-conducting layer, the electrical-conducting layer and the filling layer are all metal structures.

Images