High-thermal-conductivity shielding film material

Abstract

The utility model relates to the technical field of heat conduction shielding materials, in particular to a high heat conduction shielding film material, which comprises a support frame, a circuit board and a shielding layer, the inner side of the support frame is fixedly connected with the circuit board, the upper end of the circuit board is provided with the shielding layer, the lower end of the shielding layer is provided with an adhesive layer, and the upper end of the shielding layer is fixedly connected with an anti-corrosion layer. The upper end of the anti-corrosion layer is fixedly connected with a flame-retardant layer, the upper end of the flame-retardant layer is fixedly connected with a waterproof layer, the upper end of the waterproof layer is fixedly connected with an efficient heat dissipation block, the upper end of the efficient heat dissipation block is fixedly connected with a soft film layer, heat dissipation holes are formed in the inner side of the soft film layer, and a first isolation film is arranged at the lower end of the adhesive layer. When the circuit board is used, heat can be generated, the efficient heat dissipation blocks can increase the overall heat dissipation area of the shielding film, heat on the shielding film is conducted in time and then dissipated out of the heat dissipation holes, the effect of timely heat dissipation is achieved, and therefore the influence of the heat on the viscidity of the shielding film is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat-conducting shielding materials, in particular to a high-heat-conducting shielding film material. Background Art

[0002] Electromagnetic shielding film is mainly made of thin film with conductive properties to suppress electromagnetic interference. Electronic products are widely used in modern society, and there are various electromagnetic waves in the air. Electromagnetic shielding is required in some special places or electronic products. The electromagnetic shielding film is pasted on the circuit board to isolate electromagnetic wave radiation and protect the circuit board.

[0003] When the electromagnetic shielding film is installed and used, the shielding film is cut according to the size of the circuit board, and then aligned to the position, the isolation film is removed, and the electromagnetic shielding film is pasted on the circuit board. However, during the pasting process, the electromagnetic shielding film is easily pasted crookedly and needs to be peeled off and pasted again. At this time, the viscosity of the shielding film will be reduced, which will affect the pasting effect. At the same time, when the circuit board is used, heat will be generated, and the heat will reduce the viscosity of the shielding film. Therefore, in response to the above problems, we have proposed a high thermal conductivity shielding film material. Summary of the invention

[0004] The purpose of the utility model is to provide a high thermal conductivity shielding film material to solve the problem that the electromagnetic shielding film is easily pasted crookedly during the pasting process and needs to be peeled off and pasted again. At this time, the viscosity of the shielding film will be reduced, thereby affecting the pasting effect. At the same time, when the circuit board is used, heat will be generated, and the heat will reduce the viscosity of the shielding film.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A high thermal conductivity shielding film material comprises a supporting frame, a circuit board and a shielding layer, wherein a circuit board is fixedly connected to the inner side of the supporting frame, a shielding layer is provided at the upper end of the circuit board, an adhesive layer is provided at the lower end of the shielding layer, an anti-corrosion layer is fixedly connected to the upper end of the shielding layer, a flame retardant layer is fixedly connected to the upper end of the anti-corrosion layer, a waterproof layer is fixedly connected to the upper end of the flame retardant layer, an efficient heat dissipation block is fixedly connected to the upper end of the waterproof layer, a soft film layer is fixedly connected to the upper end of the efficient heat dissipation block, heat dissipation holes are opened on the inner side of the soft film layer, a first isolation film is provided at the lower end of the adhesive layer, a second isolation film is provided at the lower end of the adhesive layer, a first adhesive paper is provided on the upper end surface of the first isolation film, and a second adhesive paper is provided on the upper end surface of the first isolation film.

[0007] Preferably, the support frame is rectangular in shape, the support frame is hollow inside, and the circuit board is rectangular in shape.

[0008] Preferably, there are a plurality of high-efficiency heat dissipation blocks, each of which is rectangular in shape and evenly arranged.

[0009] Preferably, there are a plurality of heat dissipation holes, the heat dissipation holes are evenly arranged, and the heat dissipation holes and the high-efficiency heat dissipation blocks are arranged alternately up and down.

[0010] Preferably, the lower end of the first isolation membrane is in contact with the upper surface of the circuit board, the lower end of the first isolation membrane is in contact with the upper surface of the support frame, the lower end of the second isolation membrane is in contact with the upper surface of the circuit board, and the first adhesive paper and the second adhesive paper are the same size.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] In the utility model, by setting a first isolation film, a second isolation film, a first adhesive paper and a second adhesive paper, the shielding film is aligned with the circuit board, and then the first adhesive paper and the second adhesive paper are torn off, so that the first adhesive paper and the second adhesive paper are pasted to the left and right ends of the first isolation film and the support frame, the shielding film is fixed, and then the right end of the shielding film is lifted up, and the second isolation film is torn off, so that the adhesive layer at the right end is pasted to the circuit board, and one end of the shielding film is pasted to determine the position, and then the first adhesive paper and the second adhesive paper are torn off again, the left end of the shielding film is lifted up, and then the first isolation film is torn off, so that the adhesive layer at the left end is pasted to the circuit board. The operation process is simple, and the shielding film is limited and fixed, reducing the movement and skewing during pasting, thereby reducing the number of lifting times and maintaining the viscosity of the shielding film. By setting an efficient heat dissipation block and a heat dissipation hole, the circuit board will generate heat when in use, and the efficient heat dissipation block will increase the overall heat dissipation area of ​​the shielding film, conduct the heat on the shielding film in time, and then dissipate it from the heat dissipation hole, so as to achieve the effect of timely heat dissipation, thereby reducing the influence of heat on the viscosity of the shielding film. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the top view of the circuit board of the utility model.

[0015] In the figure: 1. support frame; 2. circuit board; 3. shielding layer; 4. adhesive layer; 5. anti-corrosion layer; 6. flame retardant layer; 7. waterproof layer; 8. high-efficiency heat dissipation block; 9. soft film layer; 10. heat dissipation hole; 11. first isolation film; 12. second isolation film; 13. first adhesive paper; 14. second adhesive paper. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] See also Figure 1-2 , the utility model provides a technical solution:

[0018] A high thermal conductivity shielding film material comprises a supporting frame 1, a circuit board 2 and a shielding layer 3, wherein the circuit board 2 is fixedly connected to the inner side of the supporting frame 1, the shielding layer 3 is provided at the upper end of the circuit board 2, the shielding layer 3 is provided at the lower end of the adhesive layer 4, the upper end of the shielding layer 3 is fixedly connected to an anti-corrosion layer 5, the upper end of the anti-corrosion layer 5 is fixedly connected to a flame retardant layer 6, the upper end of the flame retardant layer 6 is fixedly connected to a waterproof layer 7, the upper end of the waterproof layer 7 is fixedly connected to an efficient heat dissipation block 8, the upper end of the efficient heat dissipation block 8 is fixedly connected to a soft film layer 9, the inner side of the soft film layer 9 is provided with heat dissipation holes 10, the lower end of the adhesive layer 4 is provided with a first isolation film 11, the lower end of the adhesive layer 4 is provided with a second isolation film 12, the upper end surface of the first isolation film 11 is provided with a first adhesive paper 13, and the upper end surface of the first isolation film 11 is provided with a second adhesive paper 14.

[0019] The support frame 1 is rectangular in shape, the support frame 1 is hollow inside, the circuit board 2 is rectangular in shape, the number of high-efficiency heat dissipation blocks 8 is several, the high-efficiency heat dissipation blocks 8 are rectangular in shape, the high-efficiency heat dissipation blocks 8 are evenly arranged, the number of heat dissipation holes 10 is several, the heat dissipation holes 10 are evenly arranged, the heat dissipation holes 10 and the high-efficiency heat dissipation blocks 8 are staggered up and down, the lower end of the first isolation film 11 is attached to the upper surface of the circuit board 2, the lower end of the first isolation film 11 is attached to the upper surface of the support frame 1, the lower end of the second isolation film 12 is attached to the upper surface of the circuit board 2, the first adhesive paper 13 and the second adhesive paper 14 are the same size, and the inner side of the support frame 1 is fixedly connected A circuit board 2 is provided, a shielding layer 3 is provided at the upper end of the circuit board 2, an adhesive layer 4 is provided at the lower end of the shielding layer 3, an anti-corrosion layer 5 is fixedly connected to the upper end of the shielding layer 3, a flame retardant layer 6 is fixedly connected to the upper end of the anti-corrosion layer 5, a waterproof layer 7 is fixedly connected to the upper end of the flame retardant layer 6, and an efficient heat dissipation block 8 is fixedly connected to the upper end of the waterproof layer 7, so that the efficient heat dissipation block 8 and the heat dissipation hole 10 are conveniently arranged. When the circuit board 2 is used, heat is generated, and the efficient heat dissipation block 8 increases the overall heat dissipation area of ​​the shielding film, conducts the heat on the shielding film in time, and then dissipates it from the heat dissipation hole 10, so as to achieve the effect of timely heat dissipation, thereby reducing the influence of heat on the viscosity of the shielding film. The upper end of the efficient heat dissipation block 8 is fixedly connected to a soft film layer 9, and a heat dissipation hole 10 is opened on the inner side of the soft film layer 9. The lower end of the adhesive layer 4 is provided with a first isolation film 11, which is convenient for setting the first isolation film 11, the second isolation film 12, the first adhesive paper 13 and the second adhesive paper 14. The shielding film is aligned with the circuit board 2, and then the first adhesive paper 13 and the second adhesive paper 14 are torn off, so that the first adhesive paper 13 and the second adhesive paper 14 are pasted to the left and right ends of the first isolation film 11 and the support frame 1, and the shielding film is fixed. Then, the right end of the shielding film is lifted, and the second isolation film 12 is torn off, so that the adhesive layer on the right end 4 is pasted on the circuit board 2, and one end of the shielding film is pasted to determine the position, and then the first adhesive paper 13 and the second adhesive paper 14 are torn off again, the left end of the shielding film is lifted up, and then the first isolation film 11 is torn off, so that the left end adhesive layer 4 is pasted on the circuit board 2. The operation process is simple, and the shielding film is limited and fixed to reduce the movement and skew during pasting, thereby reducing the number of times of lifting up and maintaining the stickiness of the shielding film; the second isolation film 12 is provided at the lower end of the adhesive layer 4, the first isolation film 11 is provided with a first adhesive paper 13 on the upper end surface, and the first isolation film 11 is provided with a second adhesive paper 14 on the upper end surface.

[0020] Working process: when the device is in use, the shielding layer 3 and the adhesive layer 4 form a shielding film, and the circuit board 2 is fixedly connected to the inner side of the support frame 1. The shielding film is placed on the circuit board 2 and then aligned. The lower end of the shielding layer 3 is provided with an adhesive layer 4, and the lower end of the adhesive layer 4 is provided with a first isolation film 11 and a second isolation film 12. The upper end surface of the first isolation film 11 is provided with a first adhesive paper 13 and a second adhesive paper 14. The first adhesive paper 13 and the second adhesive paper 14 are torn off, so that the first adhesive paper 13 and the second adhesive paper 14 are pasted to the left and right ends of the first isolation film 11 and the support frame 1, and the shielding film is fixed. Then, the right end of the shielding film is lifted up, and the second isolation film 12 is torn off, so that the adhesive layer 4 at the right end is pasted to the circuit board 2. One end of the shielding film is pasted to determine the position, and then the first adhesive paper 13 and the second adhesive paper 14 are torn off again, and the left end of the shielding film is lifted up, and then the first isolation film 11 is torn off, so that the adhesive layer 4 at the left end is pasted to the circuit board 2. This operation The operation process is simple, and the shielding film is limited and fixed to reduce the movement and skewing during pasting, thereby reducing the number of times of lifting and maintaining the viscosity of the shielding film. After pasting is completed, the upper end of the shielding layer 3 is fixedly connected with the anti-corrosion layer 5, thereby enhancing the anti-corrosion performance of the shielding film, and the upper end of the anti-corrosion layer 5 is fixedly connected with the flame retardant layer 6, thereby enhancing the fire retardant performance of the shielding film, the flame retardant effect is better, and it is not easy to burn. The upper end of the flame retardant layer 6 is fixedly connected with the waterproof layer 7, thereby enhancing the waterproof performance of the shielding film, reducing moisture from entering the circuit board 2 through the shielding film, and protecting the circuit board 2. The upper end of the waterproof layer 7 is fixedly connected with an efficient heat dissipation block 8, and the upper end of the efficient heat dissipation block 8 is fixedly connected with a soft film layer 9. The inner side of the soft film layer 9 is provided with a heat dissipation hole 10. When the circuit board 2 is in use, heat is generated. The efficient heat dissipation block 8 increases the overall heat dissipation area of ​​the shielding film, conducts the heat on the shielding film in time, and then dissipates it from the heat dissipation hole 10, so as to achieve the effect of timely heat dissipation, thereby reducing the influence of heat on the viscosity of the shielding film.

[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity shielding film material, comprising a support frame (1), a circuit board (2) and a shielding layer (3), characterized in that: A circuit board (2) is fixedly connected to the inner side of the support frame (1); a shielding layer (3) is provided at the upper end of the circuit board (2); an adhesive layer (4) is provided at the lower end of the shielding layer (3); an anti-corrosion layer (5) is fixedly connected to the upper end of the shielding layer (3); a flame retardant layer (6) is fixedly connected to the upper end of the anti-corrosion layer (5); a waterproof layer (7) is fixedly connected to the upper end of the flame retardant layer (6); a high-efficiency heat dissipation block (8) is fixedly connected to the upper end of the waterproof layer (7); a soft film layer (9) is fixedly connected to the upper end of the high-efficiency heat dissipation block (8); a heat dissipation hole (10) is provided on the inner side of the soft film layer (9); a first isolation film (11) is provided at the lower end of the adhesive layer (4); a second isolation film (12) is provided at the lower end of the adhesive layer (4); a first adhesive paper (13) is provided on the upper end surface of the first isolation film (11); and a second adhesive paper (14) is provided on the upper end surface of the first isolation film (11).

2. A high thermal conductivity shielding film material according to claim 1, characterized in that: The support frame (1) has a rectangular shape, the interior of the support frame (1) is hollow, and the circuit board (2) has a rectangular shape.

3. The high thermal conductivity shielding film material according to claim 1, characterized in that: The efficient heat dissipation blocks (8) are provided in a certain number, the efficient heat dissipation blocks (8) are rectangular in shape, and the efficient heat dissipation blocks (8) are evenly arranged.

4. The high thermal conductivity shielding film material according to claim 1, characterized in that: The heat dissipation holes (10) are present in a certain number, the heat dissipation holes (10) are evenly arranged, and the heat dissipation holes (10) and the high-efficiency heat dissipation blocks (8) are arranged in an alternating manner up and down.

5. The high thermal conductivity shielding film material according to claim 1, characterized in that: The lower end of the first isolation film (11) is bonded to the upper surface of the circuit board (2), the lower end of the first isolation film (11) is bonded to the upper surface of the support frame (1), the lower end of the second isolation film (12) is bonded to the upper surface of the circuit board (2), and the first adhesive paper (13) and the second adhesive paper (14) are of the same size.

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