Special electrostatic protection chip for USB-C PD3.1 interface

Abstract

The utility model discloses a special electrostatic protection chip for a USB-C PD3.1 interface, and relates to the technical field of semiconductors. The one-way electrostatic protection chips are arranged on the silver paste solders of the first pin and the fifth pin of the metal lead frame respectively, the one-way electrostatic protection chips are one of one-way 28V electrostatic protection chips or one of one-way 36V electrostatic protection chips or one of one-way 48V electrostatic protection chips, and the two two-way 5V electrostatic protection chips are arranged on the silver paste solders of the third pin and the eighth pin in total. The two unidirectional electrostatic protection chips are electrically connected with a pin 3 and a pin 8 of the metal lead frame through metal wires; the two bidirectional 5V electrostatic protection chips are electrically connected with a pin 2 and a pin 4 of the metal lead frame through metal wires respectively; the periphery of each component is half wrapped with epoxy resin to form the electrostatic protection chip structure for the USB-C PD3.1 interface; according to the utility model, the number of components is small, the occupied area of the printed circuit board is reduced, wiring is simplified, patch frequency is reduced, and cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor technology, and in particular to a special electrostatic protection chip for a USB-C PD3.1 interface. Background Art

[0002] The USB-C PD3.1 specification has added an extended power range while maintaining the maximum power of 100W in the original PD3.0 standard power range. The maximum power is extended from the original 100W to 240W. Although the version is only an upgrade to 0.1, it is a major upgrade in terms of power alone. Compared with the original PD3.0, the new USB-C PD3.1 fast charging specification divides the power into a standard power range (SPR) and an extended power range (EPR). The standard power range is the mainstream USB-C PD3.0 PPS fast charging standard on the market, and the maximum charging power remains unchanged at 100W; the newly added 28V, 36V, and 48V voltages belong to the extended power range. The maximum output current corresponding to the three voltages is 5A, and the maximum output power can reach 240W, which makes PD3.1 fast charging have greater charging power and a new higher fast charging voltage.

[0003] The PD3.1 fast charging charger is a new charger that has emerged recently. It has the characteristics of high output voltage, high power and small size. It can be seen that the electrostatic protection device at the output end of the PD3.1 fast charging charger should be as small as possible under the voltage of the corresponding gear. However, the electrostatic protection scheme for its interface mostly uses four single electrostatic protection diodes. Since the number of devices used is as many as four, there are the following problems: it occupies a lot of printed circuit board area, the wiring is relatively complicated, the number of patch times is large, and the cost is high.

[0004] In order to solve the above problems, it is particularly necessary to design a new type of electrostatic protection chip dedicated to the USB-C PD3.1 interface. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a special electrostatic protection chip for a USB-CPD3.1 interface, which has a reasonable structural design, simplified wiring, and only uses one electrostatic protection device, which is small in number, reduces the area of ​​the printed circuit board, reduces the number of patch times, reduces costs, is highly practical, and is easy to promote and use.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions: a USB-C A dedicated electrostatic protection chip for a PD3.1 interface comprises a metal lead frame, silver paste solder, a unidirectional electrostatic protection chip, a bidirectional 5V electrostatic protection chip, a metal wire and epoxy resin, wherein silver paste solder is placed on pins 1, 3, 5 and 8 of the metal lead frame, wherein a unidirectional electrostatic protection chip is respectively placed on the silver paste solder of pins 1 and 5 of the metal lead frame, and two bidirectional 5V electrostatic protection chips are placed on the silver paste solder of pins 3 and 8, the two unidirectional electrostatic protection chips are electrically connected to pins 3 and 8 of the metal lead frame through metal wires, the two bidirectional 5V electrostatic protection chips are respectively electrically connected to pins 2 and 4 of the metal lead frame through metal wires, and pins 6, 7, 9 and 10 of the metal lead frame are empty; the metal lead frame, silver paste solder, unidirectional electrostatic protection chip, bidirectional 5V electrostatic protection chip and metal wire are half-wrapped with epoxy resin to form a dedicated electrostatic protection chip structure for a USB-C PD3.1 interface.

[0007] Preferably, pins 1 and 5 of the metal lead frame are 28V, 36V or 48V electrostatic protection function positions, which are directly connected to the CC1 and CC2 signal lines of the USB-C PD3.1 interface, reducing the connection distance between the two parties, thereby improving the electrostatic protection capability.

[0008] Preferably, pins 2 and 4 of the metal lead frame are 5V electrostatic protection function positions, which are directly connected to the D+ and D- signal lines of the USB-C PD3.1 interface, reducing the connection distance between the two parties, thereby improving the electrostatic protection capability.

[0009] Preferably, the unidirectional electrostatic protection chip adopts one of the unidirectional 28V, 36V or 48V electrostatic protection chips.

[0010] The beneficial effects of the utility model are as follows: the device only needs to use one electrostatic protection device, the number of components is small, the area occupied by the electrostatic protection device on the printed circuit board is greatly reduced, the wiring is simplified, the number of patches is reduced, the cost is reduced, the device is practical and reliable, and the application prospect is broad. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The utility model is described in detail below with reference to the accompanying drawings and specific implementation methods;

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 It is the internal circuit diagram of the utility model. DETAILED DESCRIPTION

[0014] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0015] Reference Figure 1-2 , this specific implementation adopts the following technical scheme: a USB-C PD3.1 interface dedicated electrostatic protection chip, including a metal lead frame A, a silver paste solder B, a unidirectional electrostatic protection chip C, a bidirectional 5V electrostatic protection chip D, a metal wire E and an epoxy resin F, the silver paste solder B is placed on the 1st, 3rd, 5th and 8th pins of the metal lead frame A, wherein a unidirectional electrostatic protection chip C is placed on the silver paste solder B on the 1st and 5th pins of the metal lead frame A, and the unidirectional electrostatic protection chip C adopts one of the unidirectional 28V, 36V or 48V electrostatic protection chips, and the silver paste solder on the 3rd and 8th pins of the metal lead frame A is placed on the unidirectional electrostatic protection chip C. Two bidirectional 5V electrostatic protection chips D are placed on B, and two unidirectional electrostatic protection chips C are electrically connected to pins 3 and 8 of the metal lead frame A through metal wires E. The two bidirectional 5V electrostatic protection chips D are electrically connected to pins 2 and 4 of the metal lead frame A through metal wires E respectively, and pins 6, 7, 9, and 10 of the metal lead frame A are empty; the metal lead frame A, silver paste solder B, unidirectional electrostatic protection chip C, bidirectional 5V electrostatic protection chip D, and metal wire E are half-wrapped with epoxy resin F to form a dedicated electrostatic protection chip structure for the USB-C PD3.1 interface.

[0016] In this specific embodiment, pins 1 and 5 of the metal lead frame A are 28V (or 36V, or 48V) electrostatic protection function positions, which can be directly connected to the CC1 and CC2 signal lines of the USB-C PD3.1 interface, and pins 2 and 4 are 5V electrostatic protection function positions, which can be directly connected to the D+ and D- signal lines of the USB-C PD3.1 interface, effectively reducing the connection distance between the two parties, thereby improving the electrostatic protection capability.

[0017] This specific implementation method consists of two bidirectional 5V and two unidirectional 28V (or 36V, or 48V) electrostatic protection chips, which are connected to a specified circuit through silver paste solder, metal lead frame, and metal wire, and then half-wrapped with epoxy resin to form an electrostatic protection chip containing two bidirectional 5V electrostatic protection channels and two unidirectional 28V (or 36V, or 48V) electrostatic protection channels. Its voltage arrangement and voltage gear selection are specially designed for the USB-C PD3.1 interface 28V (or 36V, or 48V) gear. This device can replace the current USB-C PD3.1 fast charging charger using four single electrostatic protection diodes with one component. Its technical advantages are:

[0018] ① Single-point grounding is possible, which simplifies PCB wiring;

[0019] ② The number of patch operations can be reduced by three times during SMT;

[0020] ③ Only one electrostatic protection device is needed, and the number of components is small, which greatly reduces the area occupied by the electrostatic protection device on the printed circuit board, and can further reduce the size of the PD3.1 fast charging charger;

[0021] ④ Effectively reduce the cost of the device itself and the patch, improve market competitiveness, and have broad market application prospects.

[0022] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A USB-C PD3.1 interface dedicated electrostatic protection chip, characterized in that: The invention comprises a metal lead frame (A), silver paste solder (B), a unidirectional electrostatic protection chip (C), a bidirectional 5V electrostatic protection chip (D), a metal wire (E) and an epoxy resin (F). The silver paste solder (B) is placed on pins 1, 3, 5 and 8 of the metal lead frame (A). A unidirectional electrostatic protection chip (C) is placed on the silver paste solder (B) on pins 1 and 5 of the metal lead frame (A), two bidirectional 5V electrostatic protection chips (D) are placed on the silver paste solder (B) on pins 3 and 8, and two unidirectional electrostatic protection chips (C) are placed on the silver paste solder (B) on pins 3 and 8. (C) are electrically connected to pins 3 and 8 of the metal lead frame (A) through metal wires (E), and two bidirectional 5V electrostatic protection chips (D) are electrically connected to pins 2 and 4 of the metal lead frame (A) through metal wires (E), respectively. Pins 6, 7, 9, and 10 of the metal lead frame (A) are empty; the metal lead frame (A), silver paste solder (B), unidirectional electrostatic protection chip (C), bidirectional 5V electrostatic protection chip (D), and metal wire (E) are half-wrapped with epoxy resin (F) to form a dedicated electrostatic protection chip structure for the USB-C PD3.1 interface.

2. The USB-C PD3.1 interface dedicated electrostatic protection chip according to claim 1, characterized in that: Pins 1 and 5 of the metal lead frame (A) are 28V, 36V or 48V electrostatic protection function positions, which are directly connected to the CC1 and CC2 signal lines of the USB-C PD3.1 interface.

3. The USB-C PD3.1 interface dedicated electrostatic protection chip according to claim 1, characterized in that: Pins 2 and 4 of the metal lead frame (A) are 5V electrostatic protection function positions, which are directly connected to the D+ and D- signal lines of the USB-C PD3.1 interface.

4. The USB-C PD3.1 interface dedicated electrostatic protection chip according to claim 1, characterized in that: The unidirectional electrostatic protection chip (C) is one of unidirectional 28V, 36V or 48V electrostatic protection chips.

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