LED die bonder with ultra-large platform

Abstract

The utility model discloses an LED die bonder with a super-large platform, and relates to the technical field of die bonding equipment. The support module is used for conveying a support PCB, and the support PCB comprises two die bonding areas; the two symmetrical die bonding modules are arranged on the two sides of the support module respectively and used for providing chips for the chip modules, the die bonding machine head comprises a stand column, a swing arm assembly and a moving assembly, the stand column is arranged on the workbench, the swing arm assembly is used for sucking the chips on the chip modules and placing the chips on the support PCB, and the moving assembly is used for moving the chips on the support PCB. The two swing arm assemblies and the two die bonding areas are arranged in a one-to-one correspondence mode, and the moving assembly is connected with the stand column and the swing arm assemblies and drives the swing arm assemblies to move so as to be close to or away from the support PCB. The oversized platform LED die bonder provided by the technical scheme of the utility model can be compatible with support PCBs of different sizes, and the application range of the die bonder is expanded.

Description

Technical Field

[0001] The utility model relates to the technical field of solid crystal equipment, in particular to an ultra-large platform LED solid crystal machine. Background Art

[0002] The die bonder is the middle equipment of the LED packaging production line and one of the most important links in LED packaging. The work content of the die bonder is to pick up the chip from the blue film and move it to the bracket PCB board for dispensing glue or brushing solder paste.

[0003] At present, the bracket PCB board is fixed on a large workbench. Under certain conditions, the two bonding modules each occupy half of the bonding area of ​​the bracket PCB board. When the size of the bracket PCB board is reduced, the bonding modules on both sides of the bracket PCB board cannot evenly distribute the area on the bracket PCB board, resulting in a longer bonding completion time for the small-size bracket PCB board than that for the large-size bracket PCB board, and low bonding efficiency, which seriously affects the efficiency of the bonding machine. Utility Model Content

[0004] The main purpose of the utility model is to provide an ultra-large platform LED die bonding machine, aiming to fill the defects of the current ultra-large platform die bonding equipment and improve the die bonding efficiency and die bonding quality.

[0005] To achieve the above-mentioned purpose, the ultra-large platform LED die bonding machine proposed by the utility model comprises:

[0006] Workbench;

[0007] A support module, the support module is arranged on the workbench and is used to transport a support PCB board, the support PCB board includes two die-bonding areas; and

[0008] Two crystal bonding modules are symmetrically arranged on the workbench, and the two crystal bonding modules are respectively arranged on both sides of the bracket module. The crystal bonding modules include a crystal bonding head and a chip supply module respectively installed on the workbench, the chip supply module is used to provide chips, and the crystal bonding head includes a column, a swing arm assembly and a moving assembly, wherein the column is arranged on the workbench, the swing arm assembly is used to absorb the chip on the chip supply module and place the chip on the bracket PCB board, and the two swing arm assemblies are arranged in a one-to-one correspondence with the two crystal bonding areas, the moving assembly is slidably connected to the column, the swing arm assembly is fixedly connected to the moving assembly, and the moving assembly drives the swing arm assembly to move, thereby approaching or moving away from the bracket PCB board.

[0009] In one embodiment, the moving assembly includes: a moving plate, a screw seat, a bearing seat and a moving screw, wherein the swing arm assembly is arranged on the moving plate, the column is provided with a sliding seat, the moving plate is slidingly connected to the column and the sliding seat respectively, the bearing seat is arranged on the column, the screw seat is arranged on the moving plate, the moving screw is respectively connected to the bearing seat and the screw seat, and a moving handwheel is provided at one end of the moving screw close to the bearing seat, and rotating the moving handwheel drives the moving screw to rotate and thereby drives the moving plate to move.

[0010] In one embodiment, the die bonding head further includes a fixing assembly, which includes a mounting plate, a fixing block and an adjusting rod, wherein the mounting plate is connected to the column, the mounting plate is provided with a clamping cylinder, the clamping cylinder is used to press the movable plate against the column, the fixing block is provided on the column, the movable plate is provided with an adjusting block, and the adjusting rod is respectively connected to the fixing block and the adjusting block.

[0011] In one embodiment, the swing arm assembly has a crystal suction position for sucking chips and a crystal fixing position for placing chips on the bracket PCB board. The swing arm assembly includes: a swing arm motor and two swing arms. The angle between the two swing arms is 180 degrees. The swing arm motor drives the two swing arms to rotate, so that one of the two swing arms is in the crystal suction position and the other is in the crystal fixing position.

[0012] In one embodiment, the support module comprises: a support conveying mechanism and a clamping mechanism, wherein the support conveying mechanism is connected to the clamping mechanism and drives the clamping mechanism to move on the workbench, wherein:

[0013] The clamp mechanism includes a clamp base plate, a lifting assembly and a conveyor line assembly. The clamp base plate is connected to the bracket conveying mechanism. The conveyor line assembly is arranged on the lifting assembly for conveying the bracket PCB board. The lifting assembly is arranged on the clamp base plate. The clamp base plate is also slidably connected with an adsorption pad. The lifting assembly cooperates with the adsorption pad to clamp the bracket PCB board.

[0014] In one embodiment, the bracket module further comprises a blocking mechanism, wherein the blocking mechanism is disposed on the fixture bottom plate to block the bracket PCB board; and / or,

[0015] The jacking assembly includes a jacking cylinder, a first downward pressing plate and a second downward pressing plate, a plate guide seat is slidably provided on the clamp bottom plate, the first downward pressing plate and the second downward pressing plate are respectively slidably provided on the plate guide seats and are provided on two opposite sides of the adsorption pad, the first downward pressing plate and the second downward pressing plate are both provided with a top plate, and the conveying line body assembly is provided on two opposite side walls of the first downward pressing plate and the second downward pressing plate, and the retraction of the jacking cylinder drives the first downward pressing plate and the second downward pressing plate to move downward and enables the top plate and the adsorption pad to clamp the bracket PCB board.

[0016] In one embodiment, the crystal bonding module also includes a chip supply module, the chip supply module includes a pin assembly and a crystal ring assembly, the crystal ring assembly includes a crystal ring base, a crystal ring conveying mechanism and a disc assembly, the crystal ring base is arranged on the workbench, the crystal ring conveying mechanism is arranged on the crystal ring base, the crystal ring conveying mechanism is also connected to the disc assembly and drives the disc assembly to move on the crystal ring base, the disc assembly is used to place the crystal ring, and the pin assembly is arranged on the crystal ring base and is used to eject the chip on the crystal ring.

[0017] In one embodiment, the crystal ring assembly also includes a handwheel assembly, which includes a width-adjusting bearing seat, a width-adjusting screw, a width-adjusting handwheel and a screw clamping seat. The width-adjusting bearing seat is arranged on the workbench, and the screw clamping seat is arranged on the crystal ring base. The width-adjusting screw is respectively connected to the width-adjusting bearing seat and the screw clamping seat. The width-adjusting handwheel is arranged at one end of the screw close to the width-adjusting bearing seat. The width-adjusting handwheel is rotated to adjust the distance between the width-adjusting bearing seat and the screw clamping seat.

[0018] In one embodiment, the crystal bonding module also includes a bottom camera module, which includes a camera base, a camera adjustment mechanism, a camera fixing seat and a camera body. The camera base is arranged on the crystal ring base, the camera adjustment mechanism is arranged on the crystal ring base, and the camera adjustment mechanism is also connected to the camera fixing seat. The camera body is arranged on the camera fixing seat, and the lens of the camera body is used to shoot the position of the chip on the swing arm assembly.

[0019] In one embodiment, the crystal bonding module also includes an automatic crystal ring changing module, which includes a material box switching component and a crystal ring conveying component. The material box switching component includes a material box mounting seat, a crystal ring material box and a switching motor. The material box mounting seat is arranged on the workbench. The crystal ring material box is used to hold the crystal ring. The switching motor is connected to the crystal ring material box and drives the crystal ring material box to move in a vertical direction. The crystal ring conveying component includes a linear conveying component and a clamping jaw assembly. The linear conveying component is arranged on the workbench. The clamping jaw assembly is arranged on the linear conveying component. The linear conveying component drives the clamping jaw assembly to move so that the clamping jaw assembly conveys the crystal ring in the crystal ring material box to the crystal ring assembly and conveys the crystal ring with the chip removed from the crystal ring assembly to the crystal ring material box.

[0020] The technical solution of the utility model uses the die bonding heads and chip supply modules on the left and right sides of the bracket PCB board to move the chip to the bracket PCB board. The two die bonding heads are respectively responsible for the two die bonding areas on the bracket PCB board, which can quickly complete the die bonding of a larger-sized bracket PCB board. The two double swing arm assemblies respectively bond the two die bonding areas of the bracket, effectively reducing the die bonding time and improving the die bonding efficiency. The moving assembly can drive the swing arm assembly to approach or move away from the bracket PCB board, and can be compatible with bracket PCB boards of different sizes, meeting the die bonding needs of bracket PCB boards of different sizes, and at the same time expanding the scope of application of the die bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the prior art;

[0023] Figure 2 A schematic diagram of the structure of an embodiment of a super-large platform LED die bonding machine provided by the utility model;

[0024] Figure 3 This is a structural schematic diagram of the left die bonding head of the super-large platform LED die bonding machine embodiment provided by the utility model;

[0025] Figure 4 It is a schematic diagram of an exploded structure of a bracket module of an embodiment of a super-large platform LED die bonding machine provided by the utility model;

[0026] Figure 5Another exploded structural schematic diagram of the bracket module of the super-large platform LED die bonding machine embodiment provided by the utility model;

[0027] Figure 6 A schematic structural diagram of a crystal ring assembly and an ejector pin assembly of an embodiment of an ultra-large platform LED crystal bonding machine provided by the utility model;

[0028] Figure 7 This is a structural schematic diagram of a crystal ring assembly and a bottom camera module of an embodiment of an ultra-large platform LED crystal bonding machine provided by the utility model;

[0029] Figure 8 This is a structural schematic diagram of the bottom camera module of the super-large platform LED die bonding machine embodiment provided by the utility model;

[0030] Fig. 9 A structural schematic diagram of a material box switching assembly of an embodiment of an ultra-large platform LED die bonding machine provided by the utility model;

[0031] Fig.10 This is a structural schematic diagram of the crystal ring handling assembly of the super-large platform LED crystal bonding machine embodiment provided by the utility model.

[0032] Description of Figure Numbers:

[0033] 1. Workbench;

[0034] 2. Left crystal fixing head; 21. Column; 221. Adjustment block; 222. Fixed block; 223. Adjustment rod; 231. Moving hand wheel; 232. Bearing seat; 233. Screw seat; 234. Moving screw; 235. Moving plate; 241. Sliding seat; 242. Mounting plate; 243. Pressing cylinder; 25. Crystal fixing lens; 261. Swing arm; 262. Swing arm assembly; 27. Crystal removal lens;

[0035] 3. Bracket module; 311. Vertical linear motor stator; 312. Vertical linear motor mover; 313. Vertical linear guide; 314. Vertical grating reading head; 315. Vertical grating ruler; 321. Horizontal bottom plate; 322. Horizontal linear guide; 323. Horizontal linear motor stator; 324. Horizontal linear motor mover; 325. Horizontal grating ruler; 326. Horizontal grating reading head; 331. Fixture bottom plate; 332. Fixture pad; 333. Adsorption pad; 341. Lifting cylinder; 342. Vertical plate guide seat; 343. First downward pressing vertical plate; 344. Rolling motor; 345. Install linear guide; 346. Synchronous belt; 347. Second downward pressing vertical plate; 348. Top plate; 351. Blocking cylinder; 352. Blocking block; 353. Sensor; 36. Bracket PCB board;

[0036] 4. Right die bonding head;

[0037] 5. Ejector assembly; 51. Ejector base plate; 52. Ejector voice coil; 53. Ejector body;

[0038] 6. Crystal ring assembly; 61. Crystal ring base; 621. Front-to-rear motion linear guide rail; 622. Front-to-rear motion linear motor mover; 623. Front-to-rear motion linear motor stator; 624. Front-to-rear motion photoelectric origin; 625. Front-to-rear motion photoelectric sheet; 626. Front-to-rear motion grating reading head; 627. Front-to-rear motion grating ruler; 631. Left-to-right motion bottom plate; 632. Left-to-right motion linear motor stator; 633. Left-to-right motion linear motor mover; 634 , left and right moving linear guide; 635, left and right moving grating reading head; 636, left and right moving grating ruler; 637, left and right moving photoelectric origin; 638, left and right moving photoelectric sheet; 641, disc base; 642, driving wheel; 643, rotating motor; 644, transmission belt; 645, driven wheel; 65, disc; 66, crystal ring; 671, width adjustment bearing seat; 672, width adjustment screw rod; 673, width adjustment hand wheel; 674, screw rod clamping seat;

[0039] 7. Bottom camera module; 71. Camera base; 721. Vertical adjustment rod; 722. Vertical fixing seat; 723. Vertical adjustment seat; 731. Horizontal fixing seat; 732. Horizontal adjustment rod; 733. Horizontal nut seat; 734. Horizontal adjustment seat; 74. Camera body; 75. Camera fixing seat; 76. Lens;

[0040] 8. Material box switching assembly; 81. Material box mounting seat; 82. Material box guide rail; 83. Material box switching screw rod; 84. Switching motor; 85. Basket tray; 86. Crystal ring material box;

[0041] 9. Crystal ring handling assembly; 91. Handling mounting seat; 92. Handling motor; 93. Handling screw rod; 94. Crystal ring clamping jaw seat; 95. Clamping jaw assembly.

[0042] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0046] In the prior art, the support PCB board 36 is fixed on the large workbench 1 and moves forward, backward, left and right. The support PCB board 36 is located in the middle position of the workbench 1 in the left and right directions. Figure 1 As shown, the bracket PCB board 36 is located at the rightmost end of its own stroke, and the left and right two bonding modules each occupy half of the bonding area of ​​the bracket PCB board 36. This is the best state for the operation of the bonding machine equipment. When the left and right dimensions of the bracket PCB board 36 are reduced, the bonding modules on both sides cannot evenly distribute the area on the bracket PCB board 36, resulting in the bonding completion time of the small-sized bracket PCB board 36 being the same as the bonding time of the large-sized bracket PCB board 36, or even longer than the bonding time of the large-sized bracket PCB board 36, which seriously affects the efficiency of the bonding machine and is not compatible with bracket PCB boards 36 of different sizes.

[0047] The utility model provides an ultra-large platform LED crystal bonding machine.

[0048] See also Figure 2 and Figure 3In one embodiment of the utility model, the super-large platform LED crystal bonding machine includes: a workbench 1, a bracket module 3 and two crystal bonding modules symmetrically arranged on the workbench, wherein the bracket module 3 is arranged on the workbench 1 and is used to convey the bracket PCB board 36, and the bracket PCB board 36 includes two crystal bonding areas. The two crystal bonding modules are respectively arranged on both sides of the bracket module 3, and the crystal bonding modules include a crystal bonding head and a chip supply module respectively installed on the workbench 1, and the chip supply module is used to provide chips. The crystal bonding head includes a column 21, a swing arm assembly 262 and a moving assembly, wherein the column 21 is arranged on the workbench 1, the swing arm assembly 262 is used to absorb the chip on the chip supply module and place the chip on the bracket PCB board 36, and the two swing arm assemblies 262 are arranged one by one corresponding to the two crystal bonding areas, the moving assembly is slidably connected to the column 21, the swing arm assembly 262 is fixedly connected to the moving assembly, and the moving assembly drives the swing arm assembly 262 to move, thereby approaching or moving away from the bracket PCB board 36.

[0049] In this embodiment, the super-large platform LED die bonding machine also includes a high-strength frame, and the workbench 1 adopts a large-size platform and is installed on the frame. The bracket module 3 conveys the bracket PCB board 36 to move forward, backward, left and right on the workbench 1. The bracket module 3 is installed in the middle position of the left and right direction of the workbench 1. The two die bonding modules are respectively on the left and right sides of the bracket module 3, and the chips are placed on the bracket PCB board 36 to complete the die bonding work. In this embodiment, the die bonding modules on both sides of the bracket PCB board 36 are moved toward the middle direction to realize that the two die bonding modules are evenly distributed to be responsible for the die bonding work of the two die bonding areas of the small-size bracket PCB board 36. In this way, high efficiency is guaranteed and the compatibility of the equipment is improved.

[0050] Specifically, the die bonding module includes a die bonding head and a chip supply module, wherein the chip supply module provides chips for the die bonding head, and the die bonding head is used to absorb the chips on the chip supply module and place the chips on the bracket PCB board 36. The die bonding heads on the left and right sides of the bracket PCB board 36 are responsible for the two die bonding areas on the bracket PCB board 36 respectively. Figure 2 The left and right bonding heads shown in the figure, the two chip supply modules are responsible for supplying chips to the corresponding bonding heads. The column 21 is fixed on the workbench 1 and provides support for the moving assembly. The swing arm assembly 262 is installed on the moving assembly. The swing of the swing arm assembly 262 places the chip on the chip supply module on the bracket PCB board 36. The swing arm assembly 262 is driven by the moving assembly to approach or move away from the bracket PCB board 36, so that the swing arm assembly 262 evenly distributes the two bonding areas, thereby achieving adaptation to the bracket PCB boards 36 of different sizes.

[0051] The technical solution of the utility model uses the die bonding heads and chip supply modules on the left and right sides of the bracket PCB board 36 to carry the chip to the bracket PCB board 36. The two die bonding heads are respectively responsible for the two die bonding areas on the bracket PCB board 36, which can quickly complete the die bonding of the bracket PCB board 36 of a larger size. The two double swing arm assemblies 262 respectively bond the two die bonding areas of the bracket, effectively reducing the die bonding time and improving the die bonding efficiency. The moving assembly can drive the swing arm assembly 262 to approach or move away from the bracket PCB board 36, and can be compatible with bracket PCB boards 36 of different sizes, meet the die bonding needs of bracket PCB boards 36 of different sizes, and expand the scope of application of the die bonding machine.

[0052] Furthermore, the moving assembly includes: a moving plate 235, a screw seat 233, a bearing seat 232 and a moving screw 234, wherein the swing arm assembly 262 is arranged on the moving plate 235, the column 21 is provided with a sliding seat 241, the moving plate 235 is respectively slidably connected with the column 21 and the sliding seat 241, the bearing seat 232 is provided on the column 21, the screw seat 233 is provided on the moving plate 235, the moving screw 234 is respectively connected with the bearing seat 232 and the screw seat 233, and a moving handwheel 231 is provided at one end of the moving screw 234 close to the bearing seat 232, and rotating the moving handwheel 231 drives the moving screw 234 to rotate and thereby drives the moving plate 235 to move.

[0053] In the specific implementation process, the movable plate 235 is slidably connected to the column 21, and a sliding seat 241 is installed on the column 21. The sliding seat 241 and the column 21 form a slide groove, and the movable plate 235 slides along the slide groove, and the slide groove plays a guiding role. A bearing is arranged in the bearing seat 232, and the movable screw rod 234 is connected to the bearing. The movable screw rod 234 is screwed with the screw rod seat 233, and the screw rod seat 233 is fixed on the movable plate 235. The movable screw rod 234 is supported by the bearing seat 232, and the movable screw rod 234 is driven to rotate by rotating the movable hand wheel 231, thereby converting the rotary motion into linear motion, and transmitting the power to the movable plate 235 through the screw rod seat 233, so that the movable plate 235 slides along the slide groove and approaches or moves away from the bracket PCB board 36 in the left and right directions. The column 21 is fixed on the workbench 1 and its position relative to the bracket module 3 remains unchanged. When the width of the bracket PCB board 36 changes, the position of the movable plate 235 is adjusted by driving the movable screw rod 234 to rotate, and the swing assembly is driven to move, ensuring that the left and right bonding heads 2 and 4 are responsible for the same bonding area on the bracket PCB board 36.

[0054] In one embodiment, reference Figure 3As shown, the crystal bonding head also includes a fixing component, which includes a mounting plate 242, a fixing block 222 and an adjusting rod 223, wherein the mounting plate 242 is connected to the column 21, the mounting plate 242 is provided with a clamping cylinder 243, the clamping cylinder 243 is used to clamp the movable plate 235 to the column 21, the fixing block 222 is provided on the column 21, the movable plate 235 is provided with an adjusting block 221, and the adjusting rod 223 is respectively connected to the fixing block 222 and the adjusting block 221.

[0055] In the specific implementation process, two groups of fixed components are provided, and the two groups of fixed components are respectively located on both sides of the lead screw, two fixed blocks 222 are installed on the column 21, and two adjusting blocks 221 are installed on the movable plate 235. After the movable plate 235 is adjusted to a suitable position, the fixed block 222 and the adjusting block 221 are respectively connected by the adjusting rod 223, so that the movable plate 235 is fixedly connected to the column 21 and does not move relative to the column 21. In one embodiment, the outer peripheral wall of the adjusting rod 223 is provided with a thread, and the adjusting rod 223 is respectively screwed to the fixed block 222 and the adjusting block 221, and the fixed block 222 and the adjusting block 221 are respectively connected by rotating the adjusting rod 223. It can be understood that the adjusting rod 223 can be selected from bolts, screws, etc. In another embodiment, the adjusting rod 223 can be fixedly connected to the fixed block 222 and the adjusting block 221 through a locking member.

[0056] The movable plate 235 slides on the column 21, and the mounting plate 242 is fixed on the column 21 and is located above the movable plate 235. Four pressing cylinders 243 are arranged on the mounting plate 242, and the four pressing cylinders 243 are respectively arranged at the four corners of the mounting plate 242. When the movable plate 235 is adjusted, the four pressing cylinders 243 on the mounting plate 242 are actuated and press the movable plate 235 downward to prevent the movable plate 235 from moving.

[0057] In one embodiment, continue to refer to Figure 3 As shown, the swing arm assembly 262 has a crystal absorbing position for sucking chips and a crystal fixing position for placing the chips on the bracket PCB board 36. The swing arm assembly 262 includes: a swing arm 261 motor and two swing arms 261. The angle between the two swing arms 261 is 180 degrees. The swing arm 261 motor drives the two swing arms 261 to rotate, so that one of the two swing arms 261 is in the crystal absorbing position and the other is in the crystal fixing position.

[0058] The output shaft of the swing arm 261 motor is connected to one end of the two swing arms 261, and the two swing arms 261 are provided with a suction nozzle at one end away from the swing arm 261 motor for sucking chips. It can be understood that the crystal suction position and the crystal fixing position are respectively located on the opposite sides of the swing arm 261 motor, and the swing arm 261 motor is responsible for driving the two swings to rotate, so that when one swing arm 261 is in the crystal suction position to absorb the chip, the other swing arm 261 is just in the crystal fixing position to place the chip, which doubles the efficiency relative to the single swing arm 261. Further, in this embodiment, the crystal fixing head also includes a visual mechanism installed on the mobile plate 235, and the visual mechanism includes a crystal fixing lens 25 and a crystal taking lens 27 to respectively determine the position of sucking the chip and the position of placing the chip. It can be understood that the crystal fixing lens 25 is located at the crystal fixing position, and the crystal taking lens 27 is located at the crystal taking position. When the mobile plate 235 moves, it drives the swing arm 261 motor and the visual mechanism to move, ensuring that the crystal fixing area ranges responsible for the left crystal fixing head 2 and the right crystal fixing mechanism are equal.

[0059] In one embodiment, reference Figure 4 and Figure 5 As shown, the bracket module 3 includes: a bracket conveying mechanism and a clamp mechanism, the bracket conveying mechanism is connected to the clamp mechanism and drives the clamp mechanism to move on the workbench 1, wherein the clamp mechanism includes a clamp base plate 331, a lifting assembly and a conveying line body assembly, the clamp base plate 331 is connected to the bracket conveying mechanism, the conveying line body assembly is arranged on the lifting assembly for conveying the bracket PCB board 36, the lifting assembly is arranged on the clamp base plate 331, and the clamp base plate 331 is also slidably connected with an adsorption pad 333, and the lifting assembly cooperates with the adsorption pad 333 to clamp the bracket PCB board 36.

[0060] In the specific implementation process, the bracket PCB board 36 is fixed by a clamp mechanism, and the bracket conveying mechanism conveys the clamp mechanism to move forward, backward, left and right, thereby realizing the movement of the bracket PCB board 36 to cooperate with the solid crystal head to complete the solid crystal work. In this embodiment, in the vertical direction and the horizontal direction, a high-precision high-acceleration linear motor is used as a power source, and four precision linear guides are used respectively, so that the mechanism is more stable, the accuracy is improved, and the yield of the product is improved. Specifically, the bracket conveying mechanism includes a vertical linear motor and a horizontal linear motor, the vertical linear motor is connected to the workbench 1, and the horizontal linear motor is connected to the vertical linear motor. The vertical linear motor includes a vertical linear motor stator 311, a vertical linear guide 313 and a vertical linear motor mover 312. The vertical linear motor stator 311 and the vertical linear guide 313 are arranged on the workbench 1. The vertical linear motor mover 312 slides along the vertical linear guide 313. The transverse linear motor includes a transverse linear motor stator 323, a transverse linear guide 322 and a transverse linear motor mover. The transverse linear motor mover 324 slides along the transverse linear guide 322. The support conveying mechanism also includes a transverse bottom plate 321. The transverse linear guide 322 is arranged on the transverse bottom plate 321. The transverse bottom plate 321 is connected to the vertical linear motor mover 312. In this way, the transverse linear motor is connected to the vertical linear motor through the transverse bottom plate 321. The vertical linear motor drives the transverse linear motor to move in the vertical direction. The transverse linear motor is connected to the clamp mechanism and drives the clamp mechanism to move in the transverse direction. In this way, the support conveying mechanism can drive the clamp mechanism to move in the vertical and transverse directions. It should be noted that, in this embodiment, vertical refers to Figure 1 The anteroposterior direction shown in the figure, the transverse direction refers to the Figure 1 The left and right direction.

[0061] The support conveying mechanism also has a grating positioning assembly, which includes a vertical grating reading head 314, a vertical grating ruler 315, a transverse grating ruler 325 and a transverse grating reading head 326. The vertical grating ruler 315 is arranged in parallel with the vertical linear guide 313, the vertical grating reading head 314 is arranged on the transverse bottom plate 321, and cooperates with the vertical grating ruler 315 for positioning the fixture mechanism in the vertical direction, the transverse grating ruler 325 is arranged on the transverse bottom plate 321, and the transverse grating reading head 326 is arranged on the fixture mechanism for positioning the fixture mechanism in the transverse direction.

[0062] The clamp base plate 331 is connected to the transverse linear motor mover 324 of the bracket conveying mechanism, and the jacking assembly is installed on the clamp base plate 331. Specifically, the jacking assembly includes a jacking cylinder 341, a first downward pressing vertical plate 343 and a second downward pressing vertical plate 347. A vertical plate guide seat 342 is slidably provided on the clamp base plate 331. The first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 are respectively slidably provided on the vertical plate guide seat 342 and are provided on two opposite sides of the adsorption pad 333. The first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 are both provided with a top plate 348. The conveying line body assembly is provided on the two opposite side walls of the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347. The retraction of the jacking cylinder 341 drives the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 to move downward and causes the top plate 348 and the adsorption pad 333 to clamp the bracket PCB board 36.

[0063] The conveyor assembly is used to convey the bracket PCB board 36. In this embodiment, the conveyor assembly includes a synchronous wheel and a synchronous belt 346. It can be understood that the synchronous wheel is connected to a rolling motor 344, and the rolling motor 344 drives the synchronous wheel to rotate. The first pressing plate 343 and the second pressing plate 347 are provided with synchronous wheels on both sides opposite to each other. The synchronous wheels drive the synchronous belt 346 to rotate, and the bracket PCB board 36 is transported to the lifting assembly through the synchronous belt 346. Further, the bracket module 3 also includes a blocking mechanism, which is arranged on the fixture bottom plate 331 to block the bracket PCB board 36. The blocking mechanism includes a blocking cylinder 351, a blocking block 352, and a sensor 353 arranged on the blocking block 352. The lifting cylinder 341 is connected to the sensor 353 in communication. The blocking cylinder 351 is arranged at one end of the fixture bottom plate 331. The blocking cylinder 351 drives the blocking block 352 to lift upward, and the bracket PCB board 36 is pulled by the rolling motor 344 to rotate the synchronous belt 346 and enter the bracket module 3.

[0064] During the specific implementation process, four sliding vertical plate guide seats 342 are set on the clamp base plate 331, and the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 are respectively located on the opposite sides of the clamp base plate 331 and are slidably connected to the sliding vertical plate guide seats 342. Each sliding vertical plate guide seat 342 is provided with a lifting cylinder 341. Specifically, the first downward pressing vertical plate 343, the second downward pressing vertical plate 347 and the vertical plate guide seat 342 are assembled together by four installed linear guide rails 345 to achieve stable up and down movement of the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 in the vertical direction. In addition, the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 serve as a guide groove for the movement of the bracket PCB board 36. The top plate 348 is located above the synchronous belt 346, and the bracket PCB board 36 enters the bracket module 3 through the conveying line body. When the bracket PCB board 36 contacts the blocking block 352, the sensor 353 senses that the bracket PCB board 36 is in place, and the lifting cylinder 341 retracts, pulling the first downward pressing vertical plate 343 and the second downward pressing vertical plate 347 downward. It can be understood that the line body assembly moves downward synchronously, and then the bracket PCB board 36 can be placed on the adsorption pad 333. At the same time, the top plate 348 presses the bracket PCB board 36, so that the bracket PCB board 36 is clamped and fixed by the top plate 348 and the adsorption pad 333. In addition, the adsorption pad 333 is connected to the clamp pad 332, which is arranged below the adsorption pad 333 and connected to the clamp bottom plate 331. The vertical plate guide seat 342, the adsorption pad 333 and the clamp pad 332 form a whole and are slidably connected to the clamp bottom plate 331 through sliding screws.

[0065] There are two adsorption pads 333, one adsorption pad 333 is connected to the first downward pressing plate 343, and the other adsorption pad 333 is connected to the second downward pressing plate 347, and the first downward pressing plate 343 and the second downward pressing plate 347 are respectively arranged on the sides of the two adsorption pads 333 that are opposite to each other. When the width dimension of the bracket PCB board 36 changes, the distance between the two adsorption pads 333 is adjusted to adjust the distance between the first downward pressing plate 343 and the second downward pressing plate 347 to adapt to bracket PCB boards 36 of different sizes.

[0066] In one embodiment, reference Figure 6 and Figure 7 As shown, the crystal bonding module also includes a chip supply module, which includes a pin assembly 5 and a crystal ring assembly 6. The crystal ring assembly 6 includes a crystal ring base 61, a crystal ring 66 conveying mechanism and a disc 65 assembly. The crystal ring base 61 is arranged on the workbench 1, and the crystal ring 66 conveying mechanism is arranged on the crystal ring base 61. The crystal ring 66 conveying mechanism is also connected to the disc 65 assembly and drives the disc 65 assembly to move on the crystal ring base 61. The disc 65 assembly is used to place the crystal ring 66. The pin assembly 5 is arranged on the crystal ring base 61 and is used to eject the chip on the crystal ring 66.

[0067] In this embodiment, the chip supply module provides chips for the crystal bonding head, the crystal ring assembly 6 is used to install the crystal ring 66 and drive the crystal ring 66 to rotate and move, and the ejector assembly 5 is used to eject the chip on the crystal ring 66. The ejected chip is adsorbed by the swing arm assembly 262 of the crystal bonding head and installed on the bracket PCB board 36, thereby completing the silicon crystal work. Specifically, the ejector assembly 5 includes an ejector base plate 51, an ejector voice coil 52 and an ejector body 53. The ejector base plate 51 is fixedly mounted on the crystal ring base 61. When working, the ejector voice coil 52 moves upward, driving the ejector body 53 to pierce the blue film on the crystal ring 66 upward, and eject the chip. The disc 65 assembly includes a disc base 641, on which a rotating motor 643 is arranged. The rotating motor 643 is connected to a driving wheel 642, and the driving wheel 642 is connected to a driven wheel 645 via a transmission belt 644. A disc 65 is installed above the driven wheel 645, and a crystal ring 66 is installed on the disc 65. In this way, the rotating motor 643 can drive the crystal ring 66 to rotate.

[0068] The crystal ring assembly 6 drives the crystal ring 66 to move forward, backward, left and right, and also drives the crystal ring 66 to rotate. The crystal ring 66 conveying mechanism includes a forward and backward linear guide rail 621, a forward and backward linear motor mover 622, and a forward and backward linear motor stator 623. The forward and backward linear motor mover 622 moves in the forward and backward direction along the forward and backward linear guide rails through the forward and backward linear motor stators. The crystal ring 66 conveying mechanism also includes a left and right moving base plate 631, on which a left and right moving linear motor stator 632 and a left and right moving linear guide rail 634 are arranged. The left and right moving linear motor stator 632 is connected to the left and right moving linear motor mover 633, and moves along the left and right moving linear guide rail 634.

[0069] A photoelectric origin 624 for forward and backward motion is also provided on the crystal ring base 61, and a photoelectric sheet 625 for forward and backward motion is provided on the left and right motion bottom plate 631, and cooperates with the photoelectric origin 624 for forward and backward motion positioning. It can be understood that a photoelectric origin 637 for forward and backward motion is provided on the left and right motion bottom plate 631, and a photoelectric sheet 638 for forward and backward motion is provided on the disk base 641, and cooperates with the photoelectric origin 637 for forward and backward motion positioning. Further, the crystal ring 66 conveying mechanism also includes a grating assembly. Specifically, a grating ruler 627 for forward and backward motion is also provided on the crystal ring base 61, and is parallel to the linear guide rail 621 for forward and backward motion. A grating reading head 626 for forward and backward motion is provided on the left and right motion bottom plate 631, and is used to cooperate with the grating ruler 627 for forward and backward motion positioning. A left-right motion grating ruler 636 is arranged on the left-right motion base plate 631 and is parallel to the left-right motion guide rails. A left-right motion grating reading head 635 is arranged on the disc base 641 to cooperate with the left-right motion grating ruler 636 to perform left-right motion positioning.

[0070] Furthermore, the crystal ring assembly 6 also includes a handwheel assembly, which includes a width adjustment bearing seat 671, a width adjustment screw rod 672, a width adjustment handwheel 673 and a screw clamping seat 674. The width adjustment bearing seat 671 is arranged on the workbench 1, and the screw clamping seat 674 is arranged on the crystal ring base 61. The width adjustment screw rod 672 is respectively connected to the width adjustment bearing seat 671 and the screw clamping seat 674. The width adjustment handwheel 673 is arranged at one end of the screw rod close to the width adjustment bearing seat 671. The width adjustment handwheel 673 is rotated to adjust the distance between the width adjustment bearing seat 671 and the screw clamping seat 674.

[0071] It can be understood that the crystal ring base 61 is slidably connected to the workbench 1, and rotating the width adjustment hand wheel 673 causes the width adjustment screw 672 to rotate, thereby adjusting the distance between the width adjustment bearing seat 671 and the screw clamping seat 674, thereby allowing the crystal ring base 61 to slide on the workbench 1 and adjust its position on the crystal ring 66 platform to achieve compatibility with bracket PCB boards 36 of different specifications.

[0072] In one embodiment, reference Figure 7 and Figure 8 As shown, the crystal bonding module also includes a bottom camera module 7, which includes a camera base 71, a camera adjustment mechanism, a camera fixing seat 75 and a camera body 74. The camera base 71 is arranged on the crystal ring base 61, the camera adjustment mechanism is arranged on the crystal ring base 61, and the camera adjustment mechanism is also connected to the camera fixing seat 75. The camera body 74 is arranged on the camera fixing seat 75, and the lens 76 of the camera body 74 is used to shoot the position of the chip on the swing arm assembly 262.

[0073] Specifically, the die-bonding module includes four groups of bottom camera modules 7 for detecting the position of the chip on the swing arm assembly 262, and the camera base 71 is installed on the crystal ring base 61. The camera adjustment mechanism includes a vertical adjustment rod 721, a vertical fixing seat 722, a vertical adjustment seat 723, a horizontal fixing seat 731, a horizontal adjustment rod 732, a horizontal nut seat 733 and a horizontal adjustment seat 734. Among them, the vertical fixing seat 722 is installed on the camera base 71, the vertical adjustment rod 721 passes through the vertical fixing seat 722 and is connected to the vertical adjustment seat 723, and the vertical adjustment seat 723 is slidably connected to the camera base 71. The horizontal fixing seat 731 is installed on the vertical adjustment seat 723, the horizontal adjustment rod 732 passes through the horizontal fixing seat 731 and is connected to the horizontal nut seat 733, the horizontal nut seat 733 is fixedly connected to the horizontal adjustment seat 734, the horizontal adjustment seat 734 is slidably connected to the vertical adjustment seat 723, and the camera fixing seat 75 is connected to the horizontal adjustment seat 734. Thus, the vertical and horizontal positions of the camera body 74 can be adjusted by rotating the horizontal adjustment lever 732 and the vertical adjustment lever 721. Figure 1 The anteroposterior direction shown in the figure, the transverse direction refers to the Figure 1In addition, the camera body 74 is connected to a lens 76, which faces upward to shoot. When the swing arm assembly 262 passes directly above the lens 76 with the chip, the camera body 74 shoots the position of the Jince chip and compares it with the position of the template stored in advance. The swing arm assembly 262 corrects the angle error of the chip, and the bracket module 3 corrects the horizontal and vertical position errors of the chip to improve the quality of the solid crystal. It can be understood that the camera module is adjusted as a whole with the crystal ring base 61.

[0074] In one embodiment, the crystal fixing module also includes an automatic crystal ring 66 replacement module, which includes a material box switching component 8 and a crystal ring conveying component 9. The material box switching component 8 includes a material box mounting seat 81, a crystal ring material box 86 and a switching motor 84. The material box mounting seat 81 is arranged on the workbench 1. The crystal ring material box 86 is used to hold the crystal ring 66. The switching motor 84 is connected to the crystal ring material box 86 and drives the crystal ring material box 86 to move in the vertical direction. The crystal ring conveying component 9 includes a linear conveying component and a clamping jaw component 95. The linear conveying component is arranged on the workbench 1. The clamping jaw component 95 is arranged on the linear conveying component. The linear conveying component drives the clamping jaw component 95 to move so that the clamping jaw component 95 conveys the crystal ring 66 in the crystal ring material box 86 to the crystal ring component 6 and conveys the crystal ring 66 after the chip is removed from the crystal ring component 6 to the crystal ring material box 86.

[0075] refer to Fig. 9 and Fig.10 As shown, the magazine mounting seat 81 is fixed on the fixed platform, and the crystal ring magazine 86 is provided with a plurality of storage bins spaced up and down for placing the crystal ring 66. The magazine mounting seat 81 is provided with a magazine guide rail 82 extending up and down, and the magazine guide rail 82 is slidably provided with a basket tray 85, and the basket tray 85 is connected to the crystal ring magazine 86. The switching motor 84 is fixed on the magazine mounting seat 81, and the motor is connected to the magazine switching screw rod 83, and the basket tray 85 is rotatably connected to the magazine switching screw rod 83, so that the switching motor 84 drives the screw rod to rotate and then drives the crystal ring magazine 86 to move up and down.

[0076] The linear transport assembly includes a transport mounting seat 91, a transport motor 92 and a transport screw 93. Specifically, the transport mounting seat 91 is mounted on the workbench 1, the transport motor 92 is fixed on the transport mounting seat 91 and connected to the transport screw 93, the transport screw 93 extends in the front-back direction, and the clamping jaw assembly 95 is connected to the crystal ring clamping jaw seat 94, and the crystal ring clamping jaw seat 94 is rotatably connected to the transport screw 93. When the equipment needs to take out the crystal ring 66 or replace the crystal ring 66, the transport motor 92 drives the transport screw 93 to rotate, so that the crystal ring clamping jaw seat 94 moves along the transport screw 93, and then the clamping jaw assembly 95 moves.

[0077] In the specific implementation process, when it is necessary to take out the crystal ring 66 or replace the crystal ring 66. The clamping claw assembly 95 moves to the crystal ring material box 86, and after the clamping claw assembly 95 opens to clamp the crystal ring 66, the clamping claw assembly 95 moves to the crystal ring assembly 6 and places the crystal ring 66 in the crystal ring assembly 6. When the crystal ring 66 is taken out, the clamping claw assembly 95 takes out the crystal ring 66 that has completed chip removal from the crystal ring assembly 6, and transports it to the crystal ring material box 86 of the material box switching assembly 8 through the linear transport assembly, and the clamping claw assembly 95 returns to the standby position, and then the switching motor 84 of the material box switching assembly 8 drives the crystal ring material box 86 to move up and down to the position of the next crystal ring 66, and the clamping claw assembly 95 clamps the new crystal ring 66 in the crystal ring material box 86 assembly, and transports it to the crystal ring assembly 6 to continue to take chips, and repeats the above process until all the crystal rings 66 in the crystal ring material box 86 have completed chip removal, and the personnel are notified by the alarm to replace the new crystal ring material box 86.

[0078] The crystal bonding machine provided by the utility model has a movable crystal bonding mechanism, which is compatible with bracket PCB boards 36 of different sizes. The two crystal bonding modules evenly divide the working range of the bracket PCB board 36 into two parts, which can complete the crystal bonding work of the bracket PCB board 36 of larger size with improved efficiency. The two crystal bonding machine heads also use four swing arms 261 to improve the production capacity of the equipment. At the same time, a suction nozzle is installed on the swing arm 261, and the suction nozzle is rotatable. In the process of transporting the chip, the camera module 7 at the bottom is used for photo detection, and the suction nozzle rotates to correct the angle of the chip, which can improve the accuracy of the equipment. It also uses a high-precision linear motor and grating assembly, and installs a high-precision camera lens 76 assembly to ensure the high accuracy of the crystal bonding machine.

[0079] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A super large platform LED die bonding machine, characterized in that: include: Workbench; A support module, the support module is arranged on the workbench and is used to transport a support PCB board, the support PCB board includes two die-bonding areas; as well as Two crystal bonding modules are symmetrically arranged on the workbench, and the two crystal bonding modules are respectively arranged on both sides of the bracket module. The crystal bonding modules include a crystal bonding head and a chip supply module respectively installed on the workbench, the chip supply module is used to provide chips, and the crystal bonding head includes a column, a swing arm assembly and a moving assembly, wherein the column is arranged on the workbench, the swing arm assembly is used to absorb the chip on the chip supply module and place the chip on the bracket PCB board, and the two swing arm assemblies are arranged in a one-to-one correspondence with the two crystal bonding areas, the moving assembly is slidably connected to the column, the swing arm assembly is fixedly connected to the moving assembly, and the moving assembly drives the swing arm assembly to move, thereby approaching or moving away from the bracket PCB board.

2. The ultra-large platform LED die bonding machine according to claim 1, characterized in that: The moving assembly includes: a moving plate, a screw seat, a bearing seat and a moving screw, wherein the swing arm assembly is arranged on the moving plate, the column is provided with a sliding seat, the moving plate is slidably connected to the column and the sliding seat respectively, the bearing seat is arranged on the column, the screw seat is arranged on the moving plate, the moving screw is respectively connected to the bearing seat and the screw seat, and a moving handwheel is provided at one end of the moving screw close to the bearing seat, and rotating the moving handwheel drives the moving screw to rotate and then drives the moving plate to move.

3. The ultra-large platform LED die bonding machine according to claim 2, characterized in that: The crystal bonding head also includes a fixing component, which includes a mounting plate, a fixing block and an adjusting rod, wherein the mounting plate is connected to the column, the mounting plate is provided with a clamping cylinder, the clamping cylinder is used to press the movable plate against the column, the fixing block is provided on the column, the movable plate is provided with an adjusting block, and the adjusting rod is respectively connected to the fixing block and the adjusting block.

4. The ultra-large platform LED die bonding machine according to claim 2, characterized in that: The swing arm assembly has a crystal suction position for sucking chips and a crystal fixing position for placing chips on the bracket PCB board. The swing arm assembly includes: a swing arm motor and two swing arms. The angle between the two swing arms is 180 degrees. The swing arm motor drives the two swing arms to rotate, so that one of the two swing arms is in the crystal suction position and the other is in the crystal fixing position.

5. The ultra-large platform LED die bonding machine according to any one of claims 1 to 4, characterized in that: The support module comprises: a support conveying mechanism and a clamping mechanism, wherein the support conveying mechanism is connected to the clamping mechanism and drives the clamping mechanism to move on the workbench, wherein: The clamp mechanism includes a clamp base plate, a lifting assembly and a conveyor line assembly. The clamp base plate is connected to the bracket conveying mechanism. The conveyor line assembly is arranged on the lifting assembly for conveying the bracket PCB board. The lifting assembly is arranged on the clamp base plate. The clamp base plate is also slidably connected with an adsorption pad. The lifting assembly cooperates with the adsorption pad to clamp the bracket PCB board.

6. The ultra-large platform LED die bonding machine according to claim 5, characterized in that: The support module further comprises a blocking mechanism, which is arranged on the fixture bottom plate to block the support PCB board; and / or, The jacking assembly includes a jacking cylinder, a first downward pressing plate and a second downward pressing plate, a plate guide seat is slidably provided on the clamp bottom plate, the first downward pressing plate and the second downward pressing plate are respectively slidably provided on the plate guide seats and are provided on two opposite sides of the adsorption pad, the first downward pressing plate and the second downward pressing plate are both provided with a top plate, and the conveying line body assembly is provided on two opposite side walls of the first downward pressing plate and the second downward pressing plate, and the retraction of the jacking cylinder drives the first downward pressing plate and the second downward pressing plate to move downward and enables the top plate and the adsorption pad to clamp the bracket PCB board.

7. The ultra-large platform LED die bonding machine according to any one of claims 1 to 4, characterized in that: The crystal bonding module also includes a chip supply module, which includes a pin assembly and a crystal ring assembly. The crystal ring assembly includes a crystal ring base, a crystal ring conveying mechanism and a disc assembly. The crystal ring base is arranged on the workbench, and the crystal ring conveying mechanism is arranged on the crystal ring base. The crystal ring conveying mechanism is also connected to the disc assembly and drives the disc assembly to move on the crystal ring base. The disc assembly is used to place the crystal ring, and the pin assembly is arranged on the crystal ring base and is used to eject the chip on the crystal ring.

8. The ultra-large platform LED die bonding machine according to claim 7, characterized in that: The crystal ring assembly also includes a handwheel assembly, which includes a width-adjusting bearing seat, a width-adjusting screw, a width-adjusting handwheel and a screw clamping seat. The width-adjusting bearing seat is arranged on the workbench, and the screw clamping seat is arranged on the crystal ring base. The width-adjusting screw is respectively connected to the width-adjusting bearing seat and the screw clamping seat. The width-adjusting handwheel is arranged at one end of the screw close to the width-adjusting bearing seat. The width-adjusting handwheel is rotated to adjust the distance between the width-adjusting bearing seat and the screw clamping seat.

9. The ultra-large platform LED die bonding machine according to claim 7, characterized in that: The crystal bonding module also includes a bottom camera module, which includes a camera base, a camera adjustment mechanism, a camera fixing seat and a camera body. The camera base is arranged on the crystal ring base, the camera adjustment mechanism is arranged on the crystal ring base, and the camera adjustment mechanism is also connected to the camera fixing seat. The camera body is arranged on the camera fixing seat, and the lens of the camera body is used to shoot the position of the chip on the swing arm assembly.

10. The ultra-large platform LED die bonding machine according to claim 7, characterized in that: The crystal fixing module also includes an automatic crystal ring changing module, which includes a material box switching component and a crystal ring conveying component. The material box switching component includes a material box mounting seat, a crystal ring material box and a switching motor. The material box mounting seat is arranged on the workbench. The crystal ring material box is used to hold the crystal ring. The switching motor is connected to the crystal ring material box and drives the crystal ring material box to move in a vertical direction. The crystal ring conveying component includes a linear conveying component and a clamping jaw assembly. The linear conveying component is arranged on the workbench. The clamping jaw assembly is arranged on the linear conveying component. The linear conveying component drives the clamping jaw assembly to move so that the clamping jaw assembly conveys the crystal ring in the crystal ring material box to the crystal ring assembly and conveys the crystal ring with the chip removed from the crystal ring assembly to the crystal ring material box.

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