Automatic scrubbing and inserting equipment for grinding sheets

Abstract

The utility model discloses automatic scrubbing and inserting equipment for a grinding sheet. The automatic scrubbing and inserting equipment comprises a machine table, the conveying belt is arranged at the left end of the machine table; the cleaning assembly is arranged on one side of the conveying belt; the tray loading assembly is arranged on the right portion of the machine table, and the cleaning assembly and the tray loading assembly are connected through an obliquely-arranged sliding table; the cleaning assembly comprises a plurality of first brushing sets and second brushing sets which are arranged side by side, each first brushing set comprises two flexible brushes, each second brushing set comprises two sponge brushes, conveying rolling bars are arranged on the two sides of the flexible brushes and the two sides of the sponge brushes, synchronous belt wheels are arranged on the side portions of the flexible brushes and the side portions of the sponge brushes, and the synchronous belt wheels are arranged on the conveying rolling bars. A driving device is arranged on the side portion of the machine table and drives the synchronous belt wheel to rotate through a belt. The problems that an existing grinding piece cleaning and inserting process mainly depends on manual operation, efficiency is low, and products are prone to being scratched can be solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to an automatic grinding sheet cleaning and inserting device. Background Art

[0002] In the field of semiconductor silicon wafer processing, the existing grinding wafer cleaning and inserting process mainly relies on manual operation. The process of inserting silicon wafers into the wafer basket has high requirements on the cleanliness and operation efficiency of the silicon wafers. The manual method of inserting the basket in water is inefficient and easily causes scratches and contamination of the silicon wafers; therefore, it is necessary to develop a device that can automatically complete the cleaning and inserting of grinding wafers. Utility Model Content

[0003] The utility model provides an automatic grinding sheet brushing and inserting device, which can solve the problem that the existing grinding sheet cleaning and inserting processes mainly rely on manual operation, are inefficient and easily scratch products.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an automatic brushing and inserting device for abrasive sheets, comprising a machine platform; a conveyor belt, which is arranged at the left end of the machine platform; a cleaning component, which is arranged on one side of the conveyor belt; a plate loading component, which is arranged on the right side of the machine platform, and the cleaning component and the plate loading component are connected by an inclined slide; the cleaning component comprises a plurality of brushing groups 1 and 2 arranged side by side, the brushing group 1 comprises two flexible brushes symmetrically arranged up and down, the brushing group 2 comprises two sponge brushes symmetrically arranged up and down, and both sides of the flexible brush and the sponge brush are provided with conveying rollers The upper part of the conveying roller is located in the machine and is provided with at least one flushing water pipe. The sides of the flexible brush and the sponge brush are provided with synchronous pulleys. The side of the machine is provided with a driving device, and the driving device drives the synchronous pulley to rotate through a belt; the loading assembly includes an L-shaped bracket for placing a film box, and a connecting bracket is provided on the rear side of the L-shaped bracket. A servo module is installed on the connecting bracket, and the connecting bracket is installed on a slider of the servo module. A servo motor is provided at the end of the servo module. The connecting bracket realizes linear movement through the slider of the servo module, thereby reducing labor costs and increasing the qualified rate.

[0005] Preferably, the slide has a hollow structure, a water inlet is provided on the side of the slide, and a plurality of grooves are provided on the upper surface thereof, the grooves are arranged along the forward direction of the silicon wafer, and a plurality of water outlet holes connected to the inner cavity are provided at intervals in the grooves, and water flows out from the water outlet holes through the hollow part inside the slide and forms a layer of water film, thereby reducing the friction of the silicon wafer when it slides on the slide, protecting the surface of the silicon wafer and making the silicon wafer slide more smoothly.

[0006] Preferably, baffles are provided on both sides of the conveyor belt and both sides of the slide, a conveying channel is formed between the opposite baffles and the spacing is adjustable, a cylinder is provided on the side of the baffle, the cylinder is fixedly connected to the machine, and the baffle is used to restrain the silicon wafer to prevent it from falling.

[0007] Preferably, a bracket is provided at one end of the slide table close to the tray loading assembly, and a photoelectric sensor is provided on the bracket, and the photoelectric sensor is used to sense whether the silicon wafer enters the wafer box smoothly.

[0008] Preferably, the base of the servo module is fixedly connected to the machine platform by a mounting plate arranged on its side, which has a simple structure and is easy to install.

[0009] Preferably, a plurality of water spray holes are provided at the bottom of the flushing water pipe along the length direction, and water in the water spray holes is used to wash away silicon powder and grinding liquid on the silicon wafer and the brush during operation.

[0010] Preferably, a sewage trough is provided in the machine below the cleaning component for collecting and discharging sewage generated during the scrubbing process, and a cover is provided on the upper side of the machine directly above the cleaning component to prevent liquid splashing.

[0011] Preferably, a clean water tank is provided in the machine below the tray loading assembly. After the silicon wafer is inserted into the wafer box, the wafer box will drop so that the silicon wafer is completely immersed in water to prevent water stains on the silicon wafer. The clean water tank is also designed with an overflow tank and a water inlet to prevent the liquid level from rising and overflowing when the wafer box is immersed in water.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The structure is simple, the operation is convenient, the efficiency of inserting the sheet is improved, and the labor intensity of the operator is reduced, which is helpful to improve the production efficiency and product quality. It can solve the problem that the existing grinding sheet cleaning and sheet inserting process mainly relies on manual operation, which is inefficient and easy to scratch the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0015] Figure 2 This is a three-dimensional structural diagram of the utility model when the cover plate is removed;

[0016] Figure 3 It is a three-dimensional structural diagram of the cleaning component of the utility model;

[0017] Figure 4 It is a schematic diagram of the installation structure of the slide table of the utility model;

[0018] Figure 5It is a three-dimensional structural diagram of the tray loading assembly of the utility model;

[0019] Figure 6 It is a three-dimensional structural diagram of the tray loading assembly of the utility model at different angles;

[0020] Figure 7 This is the internal structure diagram of the machine of the utility model;

[0021] Figure 8 The utility model is a schematic diagram of the flushing water pipe structure.

[0022] Reference numerals:

[0023] 1. Machine, 2. Conveyor belt, 3. Cleaning component, 31. Scrubbing group 1, 32. Scrubbing group 2, 311. Flexible brush, 321. Sponge brush, 33. Conveying roller, 34. Synchronous pulley, 35. Driving device, 36. Flushing water pipe, 361. Water spray hole, 4. Plate loading component, 41. Film box, 42. L-shaped bracket, 43. Connecting bracket, 44. Servo module, 45. Servo motor, 46. Mounting bracket, 47. Mounting plate, 5. Slide, 51. Water inlet, 52. Slot, 53. Water outlet, 6. Baffle, 7. Cylinder, 8. Bracket, 9. Photoelectric sensor, 11. Sewage tank, 12. Cover plate, 13. Clean water tank. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0025] like Figure 1-8As shown, the utility model solves the problem that the existing cleaning and inserting process of abrasive discs mainly relies on manual operation, which is inefficient and easy to scratch the product, and provides the following technical solutions: an automatic brushing and inserting device for abrasive discs, comprising a machine table 1, which is the base of the entire device; a conveyor belt 2, which is arranged at the left end of the machine table 1, and the conveyor belt 2 is composed of two PVC belts and driven by a stepper motor for conveying silicon wafers; a cleaning component 3, which is used to clean silicon wafers and is arranged on one side of the conveyor belt 2; a tray loading component 4, which A component arranged at the right part of the machine 1, used for inserting the cleaned silicon wafer into the wafer box, the cleaning component 3 and the tray loading component 4 are connected by an inclined slide 5; the cleaning component 3 includes a plurality of brushing groups 1 31 and brushing groups 2 32 arranged side by side, the brushing group 1 31 includes two flexible brushes 311 symmetrically arranged up and down, the flexible brushes 311 brush away the silicon powder and grinding liquid on the upper and lower surfaces of the silicon wafer during operation, and can be removed and replaced regularly, the brushing group 2 32 includes two sponge brushes 321 symmetrically arranged up and down The sponge brush 321 is used to brush away the silicon powder and grinding fluid on the upper and lower surfaces of the silicon wafer. It can be removed and replaced regularly. Both sides of the flexible brush 311 and the sponge brush 321 are provided with conveying rollers 33. The upper part of the conveying roller 33 is located in the machine 1 and is provided with at least one flushing water pipe 36. The sides of the flexible brush 311 and the sponge brush 321 are provided with synchronous pulleys 34. The side of the machine 1 is provided with a driving device 35. The driving device 35 drives the synchronous pulley 34 to rotate through a belt; the loading assembly Component 4 includes an L-shaped bracket 42 for placing a film box 41, a connecting bracket 43 is arranged on the rear side of the L-shaped bracket 42, the L-shaped bracket 42 and the connecting bracket 43 are connected by a mounting bracket 46, a servo module 44 is installed on the connecting bracket 43, the connecting bracket 43 is installed on a slider of the servo module 44, a servo motor 45 is arranged at the end of the servo module 44, the connecting bracket 43 realizes linear movement through the slider of the servo module 44, thereby reducing labor costs and increasing the qualified rate.

[0026] In this embodiment, if Figure 4 As shown, the slide 5 is of a hollow structure and is made of PVC plastic board with an inclination angle of 30 degrees. A water inlet 51 is provided on the side of the slide 5, and the water inlet 51 is connected to a water pipe. The upper surface of the slide 5 is provided with a plurality of 3 mm wide grooves 52, and the grooves 52 are arranged along the forward direction of the silicon wafer. A plurality of water outlet holes 53 connected to the inner cavity are provided at intervals in the grooves 52. Water flows out from the water outlet holes 53 through the hollow part inside the slide 5 and forms a layer of water film, thereby reducing the friction of the silicon wafer when sliding on the slide 5, protecting the surface of the silicon wafer and making the silicon wafer slide more smoothly.

[0027] In this embodiment, if Figure 4As shown, baffles 6 are provided on both sides of the conveyor belt 2 and both sides of the slide 5, a conveying channel is formed between the opposite baffles 6 and the spacing is adjustable, a cylinder 7 is provided on the side of the baffle 6, and the cylinder 7 is fixedly connected to the machine 1, and the baffle 6 is used to restrain the silicon wafer to prevent the silicon wafer from falling.

[0028] In this embodiment, if Figure 2 As shown, a bracket 8 is provided at one end of the slide 5 close to the tray loading assembly 4 , and a photoelectric sensor 9 is provided on the bracket 8 . The photoelectric sensor 9 is used to sense whether the silicon wafer enters the wafer box 41 smoothly.

[0029] In this embodiment, if Figure 6 As shown, the base of the servo module 44 is fixedly connected to the machine platform 1 through a mounting plate 47 arranged on its side, and has a simple structure and is easy to install.

[0030] In this embodiment, if Figure 8 As shown, a plurality of water spray holes 361 are provided at the bottom of the flushing water pipe 36 along the length direction. During operation, water in the water spray holes 361 washes the silicon powder and the grinding liquid on the silicon wafer and the brush.

[0031] In this embodiment, if Figure 7 As shown, a sewage trough 11 is provided in the machine 1 below the cleaning component 3 for collecting and discharging sewage generated during the scrubbing process, and a cover plate 12 is provided on the upper side of the machine 1 just above the cleaning component 3 to prevent liquid from splashing.

[0032] In this embodiment, if Figure 7 As shown, a clean water tank 13 is provided in the machine 1 below the tray assembly 4. After the silicon wafer is inserted into the wafer box 41, the wafer box 41 will drop so that the silicon wafer is completely immersed in water to prevent water stains on the silicon wafer. The clean water tank 13 is also designed with an overflow tank and a water inlet to prevent the liquid level from rising and overflowing when the wafer box is immersed in water.

[0033] In this embodiment, if Figure 1As shown, first, the operator places the ground silicon wafer on the top of the conveyor belt 2 by using a suction pen, and then sends the silicon wafer to the cleaning component 3 through the conveyor belt 2; the silicon wafer is brushed by the flexible brush 311 and the sponge brush 321 and rinsed by the rinse water pipe 36 to wash away most of the large particles of impurities on the surface of the silicon wafer, and then sent to the slide 5 between the baffles 6; after entering the slide 5, the silicon wafer can slide smoothly into the wafer box 41 with the help of gravitational potential energy and the water flow on the surface of the slide 5; the photoelectric sensor 9 at the exit of the slide 5 senses the silicon wafer from The signal from yes to no allows the PLC to determine whether the silicon wafer has successfully entered the wafer box 41. If it has successfully entered, the wafer box 41 will drop one position, the servo motor 45 will be activated, and the slider of the servo module 44 will drive the L-shaped bracket 42 to move downward; after the equipment counts that the wafer box 41 is full of silicon wafers, the front-end transmission part will be paused, and a voice alarm will prompt the operator to replace the wafer box 41. The operator only needs to press the operation button to activate the servo motor 45, and the L-shaped bracket 42 will rise to the origin. After the operator puts a new wafer box 41, the previous operation can be repeated.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. An automatic brushing and inserting device for abrasive sheets, characterized in that: include: Machine (1); A conveyor belt (2) arranged at the left end of the machine platform (1); A cleaning component (3) disposed on one side of the conveyor belt (2); A tray loading assembly (4) is arranged on the right side of the machine platform (1), and the cleaning assembly (3) and the tray loading assembly (4) are connected via an inclined slide (5); The cleaning assembly (3) comprises a plurality of brush groups (31) and (32) arranged side by side, wherein the brush group (31) comprises two flexible brushes (311) symmetrically arranged up and down, and the brush group (32) comprises two sponge brushes (321) symmetrically arranged up and down, and both sides of the flexible brushes (311) and the sponge brushes (321) are provided with conveying rollers (33), and the upper part of the conveying rollers (33) is located in the machine (1) and is provided with at least one flushing water pipe (36), and the sides of the flexible brushes (311) and the sponge brushes (321) are provided with synchronous pulleys (34), and the side of the machine (1) is provided with a driving device (35), and the driving device (35) drives the synchronous pulley (34) to rotate through a belt; The disk loading assembly (4) comprises an L-shaped bracket (42) for placing a film box (41); a connecting bracket (43) is arranged at the rear side of the L-shaped bracket (42); a servo module (44) is installed on the connecting bracket (43); the connecting bracket (43) is installed on a slider of the servo module (44); a servo motor (45) is arranged at the end of the servo module (44); and the connecting bracket (43) realizes linear movement through the slider of the servo module (44).

2. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: The slide (5) is of a hollow structure. A water inlet (51) is provided on the side of the slide (5). A plurality of grooves (52) are provided on the upper surface of the slide. The grooves (52) are arranged along the advancing direction of the silicon wafer. A plurality of water outlet holes (53) are provided at intervals in the grooves (52) and are in communication with the inner cavity.

3. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: Baffles (6) are provided on both sides of the conveyor belt (2) and on both sides of the slide (5), a conveying channel is formed between the opposing baffles (6) and the spacing between them is adjustable, a cylinder (7) is provided on the side of the baffle (6), and the cylinder (7) is fixedly connected to the machine (1).

4. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: A bracket (8) is provided at one end of the slide table (5) close to the tray loading assembly (4), and a photoelectric sensor (9) is provided on the bracket (8).

5. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: The base of the servo module (44) is fixedly connected to the machine platform (1) via a mounting plate (47) arranged on its side.

6. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: The bottom of the flushing water pipe (36) is provided with a plurality of water spray holes (361) along the length direction.

7. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: A sewage tank (11) is provided in the machine (1) below the cleaning component (3), and a cover plate (12) is provided on the upper side of the machine (1) directly above the cleaning component (3).

8. The automatic brushing and inserting device for abrasive sheets according to claim 1 is characterized in that: A clean water tank (13) is provided in the machine (1) below the tray loading assembly (4).

Images