Evaporation device and evaporation equipment

Abstract

The utility model discloses an evaporation device and evaporation equipment, the evaporation device comprises an evaporation component and a cover plate, the evaporation component is provided with a containing cavity, the containing cavity is used for containing evaporation materials, the evaporation component is used for heating the evaporation materials in the containing cavity, and the cover plate is connected to the evaporation component to at least partially cover an opening of the containing cavity. The cover plate comprises a heat insulation layer and a reinforcing layer connected to the heat insulation layer, the heat insulation layer and the reinforcing layer are sequentially arranged in the first direction, the heat insulation layer is provided with receding holes penetrating through the heat insulation layer in the first direction, the reinforcing layer is provided with evaporation holes penetrating through the reinforcing layer in the first direction, the receding holes are used for receding the evaporation holes, and the evaporation holes are used for allowing evaporated evaporation materials to pass through. And the reinforcing layer is made of a hard material. By adopting the scheme of the utility model, the uniformity of a thin film formed by evaporating the evaporation material on the substrate can be improved, and the quality of the perovskite battery is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of perovskite cells, in particular to an evaporation device and a vapor deposition device. Background Art

[0002] Evaporation equipment is an experimental and production equipment used in the field of thin film preparation, and is widely used in the preparation process of perovskite cells. In the related art, the linear evaporation source used in the preparation process of perovskite cells is generally composed of a crucible. By heating the crucible, the evaporation material in the crucible is turned into vapor, which is then evaporated onto the substrate to form a thin film. However, when using a crucible as an evaporation source, the film formed by the evaporation material on the substrate is uneven due to uneven heating in the crucible, which affects the quality of the perovskite cell. Utility Model Content

[0003] The embodiment of the utility model discloses an evaporation device and a vapor deposition device, which can improve the uniformity of a thin film formed by vapor deposition of a vapor deposition material on a substrate and improve the quality of a perovskite battery.

[0004] In order to achieve the above objectives, in a first aspect, the utility model discloses an evaporation device, comprising:

[0005] An evaporation component, wherein the evaporation component is provided with a receiving cavity, the receiving cavity is used to receive the evaporation material, and the evaporation component is used to heat the evaporation material in the receiving cavity; and

[0006] a cover plate, the cover plate being connected to the evaporation component to at least partially cover the opening of the accommodating cavity, the cover plate comprising a heat insulating layer and a reinforcing layer connected to the heat insulating layer, the heat insulating layer and the reinforcing layer being arranged in sequence along a first direction, the heat insulating layer being provided with an avoidance hole penetrating the heat insulating layer along the first direction, the reinforcing layer being provided with an evaporation hole penetrating the heat insulating layer along the first direction, the avoidance hole being used to avoid the evaporation hole, and the evaporation hole being used to allow the evaporated deposition material to pass through;

[0007] Wherein, the material of the reinforcement layer is a hard material.

[0008] As an optional implementation, in an embodiment of the first aspect of the utility model, there are multiple thermal insulation layers, and the multiple thermal insulation layers are arranged in sequence along the first direction, and one of the thermal insulation layers is connected to the evaporation component to at least partially cover the opening of the accommodating cavity, and the reinforcement layer is located between the multiple thermal insulation layers.

[0009] As an optional implementation, in an embodiment of the first aspect of the utility model, the number of the evaporation holes is multiple, the reinforcement layer includes multiple split parts, the multiple split parts are located in the same plane perpendicular to the first direction, each of the split parts is provided with an evaporation hole, and each of the split parts is connected to the thermal insulation layer.

[0010] As an optional implementation, in an embodiment of the first aspect of the utility model, the material of the reinforcement layer is any one of tungsten, molybdenum and tantalum, and / or the material of the thermal insulation layer is boron nitride.

[0011] As an optional implementation, in an embodiment of the first aspect of the utility model, the thermal insulation layer is provided with a first positioning portion, and the reinforcement layer is provided with a second positioning portion, and the second positioning portion is snap-connected to the first positioning portion so that the reinforcement layer is fixed relative to the thermal insulation layer in a plane perpendicular to the first direction.

[0012] As an optional implementation, in an embodiment of the first aspect of the utility model, the accommodating chamber is arranged at the top of the evaporation component, and the top of the evaporation component is provided with a boss arranged around the first direction, and the heat insulation layer and the reinforcement layer are connected to the boss.

[0013] As an optional implementation, in an embodiment of the first aspect of the utility model, the evaporation device further comprises a baffle, and the baffle is rotatably connected to the evaporation component to adjust an angle between the baffle and the plane where the evaporation hole is located.

[0014] As an optional implementation, in an embodiment of the first aspect of the utility model, the evaporation device further includes a driving component, the driving component is connected to the baffle, and the driving component is used to drive the baffle to rotate.

[0015] As an optional implementation, in an embodiment of the first aspect of the present utility model, the number of the evaporation component, the cover plate and the baffle plate are all two, the two evaporation components are arranged at intervals along the second direction, the two evaporation components are used to heat the evaporation material, and the two baffle plates are respectively arranged on the side of the two evaporation components that are opposite to each other along the second direction;

[0016] The second direction is perpendicular to the first direction.

[0017] In a second aspect, the utility model discloses an evaporation device, which includes a container and an evaporation device as described in the first aspect above, wherein the container is used to accommodate a substrate, and the evaporation device is arranged in the container. Along the first direction, the substrate is located above the evaporation device, and the substrate is at least partially arranged corresponding to the evaporation hole.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] The evaporation device and evaporation equipment provided by the embodiment of the utility model, the evaporation component is used to heat the evaporation material in the accommodating chamber, so that the evaporation material evaporates to be evaporated onto the substrate, by setting the cover plate, the cover plate will at least partially cover the opening of the accommodating chamber, the evaporation component evaporated from the evaporation component will diffuse to the substrate through the evaporation holes of the reinforcement layer, by controlling the size of the evaporation holes, the diffusion rate of the evaporation material in the direction perpendicular to the first direction can be controlled, so that by reasonably setting the size of the evaporation holes, the uniformity of the thin film formed by the evaporation material on the substrate can be improved, thereby improving the quality of the generated perovskite battery, at the same time, the heat insulation layer of the cover plate can isolate the heat radiation generated when the evaporation component heats the evaporation material, reduce the influence of the heat radiation on the substrate, and the avoidance hole avoids the evaporation hole, which will not affect the diffusion rate of the evaporation material. In addition, the material of the reinforcement layer is a hard material, and the evaporation hole is not easy to be worn when the reinforcement layer is cleaned, and the reinforcement layer has a long service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a schematic diagram of the three-dimensional structure of the evaporation device disclosed in the first aspect of the embodiment of the present application;

[0022] Figure 2 is a schematic diagram of the three-dimensional structure of the evaporation component disclosed in the first aspect of the embodiment of the present application;

[0023] Figure 3 is a schematic diagram of the structural decomposition of the cover plate disclosed in the first aspect of the embodiment of the present application;

[0024] Figure 4 is a schematic diagram of the three-dimensional structure of the reinforcement layer disclosed in the first aspect of the embodiment of the present application;

[0025] Figure 5 It is a cross-sectional view of the evaporation equipment disclosed in the second aspect of the embodiment of the present application.

[0026] Icons: 1. Evaporation device; 10. Evaporation component; 100. Accommodating chamber; 101. Boss; 11. Cover plate; 110. Insulation layer; 1100. Avoidance hole; 1101. First positioning part; 111. Reinforcement layer; 111a. Main body; 1110. Split part; 1111. Evaporation hole; 1112. Second positioning part; 111b. Jointing part; 12. Baffle; 13. Driving component; 2. Evaporation equipment; 20. Container; 3. Substrate; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] In the related art, the linear evaporation source used in the preparation process of perovskite cells is generally composed of a crucible. By heating the crucible, the evaporation material in the crucible is turned into vapor, which is then evaporated onto the substrate to form a thin film. However, when using a crucible as an evaporation source, the film formed by the evaporation material on the substrate is uneven due to uneven heating in the crucible, which affects the quality of the perovskite cell.

[0029] Based on this, the inventors tried to use a resistive heating evaporation source, which is heated evenly and can control the diffusion rate of the evaporated material by controlling the size of the evaporation holes on the cover plate, thereby improving the uniformity of the thin film formed by the evaporated material on the substrate.

[0030] Since such an evaporation source will generate thermal radiation when heating the evaporation material, the substrate will be affected by the thermal radiation, which will in turn affect the quality of the perovskite battery. Therefore, the cover plate is usually considered to be made of boron nitride material to isolate the thermal radiation generated by the evaporation source. During the evaporation process, the evaporation material will also be deposited on the evaporation holes of the cover plate, and the evaporation holes of the cover plate need to be wiped and cleaned. However, since the hardness of the cover plate made of boron nitride material itself is relatively low, the evaporation holes will be worn during the wiping and cleaning process, causing the size of the evaporation holes to change, which in turn affects the uniformity of the thin film formed by the evaporation material evaporated onto the substrate, resulting in a shorter service life of the cover plate.

[0031] Based on this, the present application discloses an evaporation device, by setting a cover plate, the cover plate includes a heat insulation layer and a reinforcement layer, the evaporation from the evaporation part will diffuse to the substrate through the evaporation holes of the reinforcement layer, and by controlling the size of the evaporation holes, the diffusion rate of the evaporation material in the direction perpendicular to the first direction can be controlled, so that by reasonably setting the size of the evaporation holes, the uniformity of the thin film formed by the evaporation material on the substrate can be improved, thereby improving the quality of the generated perovskite battery, and at the same time, the heat insulation layer of the cover plate can isolate the heat radiation generated when the evaporation part heats the evaporation material, reduce the influence of the heat radiation on the substrate, and the avoidance hole avoids the evaporation hole, which will not affect the diffusion rate of the evaporation material. In addition, the material of the reinforcement layer is a hard material, and when the reinforcement layer is cleaned, the evaporation hole is not easy to be worn, and the reinforcement layer has a long service life.

[0032] The technical solution of the utility model will be further described below in conjunction with embodiments and drawings.

[0033] Please also read Figures 1 to 3 According to a first aspect of an embodiment of the utility model, an evaporation device 1 is provided. The evaporation device 1 includes an evaporation component 10 and a cover plate 11. The evaporation component 10 is provided with a receiving chamber 100. The receiving chamber 100 is used to receive a vapor deposition material. The evaporation component 10 is used to heat the vapor deposition material in the receiving chamber 100. The cover plate 11 is connected to the evaporation component 10 to at least partially cover the opening of the receiving chamber 100. The cover plate 11 includes a heat insulation layer 110 and a reinforcement layer 111 connected to the heat insulation layer 110. The heat insulation layer 110 and the reinforcement layer 111 are sequentially arranged along a first direction X. The heat insulation layer 110 is provided with an avoidance hole 1100 penetrating the heat insulation layer 110 along the first direction X. The reinforcement layer 111 is provided with an evaporation hole 1111 penetrating the heat insulation layer 110 along the first direction X. The avoidance hole 1100 is used to avoid the evaporation hole 1111. The evaporation hole 1111 is used to allow the evaporated vapor deposition material to pass through. The reinforcement layer 111 is made of a hard material.

[0034] The evaporation device 1 provided in the first aspect of the embodiment of the utility model, the evaporation component 10 is used to heat the evaporation material in the accommodating cavity 100, so that the evaporation material evaporates to be evaporated onto the substrate, and by setting the cover plate 11, the cover plate 11 will at least partially cover the opening of the accommodating cavity 100, and the evaporation material evaporated from the evaporation component 10 will diffuse to the substrate through the evaporation holes 1111 of the reinforcing layer 111, and by controlling the size of the evaporation holes 1111, the diffusion rate of the evaporation material in the direction perpendicular to the first direction X can be controlled, so that by reasonably setting the size of the evaporation holes 1111, the uniformity of the thin film formed by the evaporation material on the substrate can be improved, thereby improving the quality of the perovskite battery produced. At the same time, the heat insulation layer 110 of the cover plate 11 can isolate the heat radiation generated when the evaporation component 10 heats the evaporation material, reduce the influence of the heat radiation on the substrate, and the avoidance hole 1100 avoids the evaporation hole 1111, which will not affect the diffusion rate of the evaporation material. In addition, the reinforcing layer 111 is made of a hard material. When the evaporation holes 1111 of the reinforcing layer 111 are wiped and cleaned, the evaporation holes 1111 are not easily worn, thereby reducing the size of the evaporation holes 1111 that change due to wear and affecting the uniformity of the thin film formed by the evaporation material being evaporated onto the substrate, thereby allowing the reinforcing layer 111 to have a longer service life.

[0035] Optionally, the evaporation material may be one or more of cesium bromide, lead iodide, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0036] Optionally, the evaporation component 10 may be heated by resistance heating, electron beam heating, induction heating, arc heating or laser heating, etc., which may be selected according to actual conditions and are not specifically limited in this embodiment. Accordingly, the evaporation component 10 may be selected, but not limited to, for example, a resistance heater or other container that can be used with a heating function, which is not specifically limited in this embodiment.

[0037] Exemplarily, the evaporation component 10 may be, for example, a long strip-shaped resistance heater, and the accommodating cavity 100 of the evaporation component 10 extends along the length direction.

[0038] Considering that the direction of diffusion of the evaporated material is relatively disordered when it diffuses out of the evaporation hole 1111, based on this, in some embodiments, the evaporation device 1 also includes a baffle 12, and the baffle 12 is rotatably connected to the evaporation component 10 to adjust the angle between the baffle 12 and the plane where the evaporation hole 1111 is located. In this way, by controlling the angle between the baffle 12 and the plane where the evaporation hole 1111 is located, the diffusion angle of the evaporated material can be controlled when it diffuses, and the disordered diffusion of the evaporated material to the outer periphery can be reduced, thereby further improving the uniformity of the thin film formed by the evaporated material being evaporated onto the substrate, and when the evaporation component 10 is not working, the baffle 12 can also be rotated to cover the avoidance hole 1100 and the evaporation hole 1111, thereby protecting the accommodating chamber 100 of the evaporation component 10 and the evaporated material in the accommodating chamber 100 from being contaminated.

[0039] Specifically, the baffle 12 is rotatably connected to one side of the evaporation component 10 along the width direction, so that the baffle 12 can control the diffusion angle of the evaporation material in the width direction when it diffuses.

[0040] Optionally, the evaporation device 1 further comprises a driving component 13, which is connected to the baffle 12 and is used to drive the baffle 12 to rotate. The driving component 13 can provide power for the rotation of the baffle 12 and facilitate adjustment of the angle between the baffle 12 and the plane where the evaporation holes 1111 are located.

[0041] Optionally, the driving component 13 may be a motor or an electric push rod, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment. Preferably, the driving component 13 may be a servo motor, which can more accurately control the angle between the baffle 12 and the plane where the evaporation hole 1111 is located, thereby facilitating the accurate adjustment of the baffle 12 to the desired angle, thereby facilitating the improvement of the quality of the produced perovskite battery.

[0042] Optionally, the number of the evaporation component 10 , the cover plate 11 and the baffle plate 12 can be one or more, which can be selected according to actual conditions and is not specifically limited in this embodiment.

[0043] For example, the baffle 12 on one side of the evaporation component 10 may be a complete baffle 12, or may be formed by arranging a plurality of baffles 12 that are connected in sequence or arranged at intervals.

[0044] For another example, the number of the evaporation components 10, the cover plate 11 and the baffle 12 are all two, the two evaporation components 10 are arranged at intervals along the second direction Y, the two evaporation components 10 are both used to heat the evaporation material, and the two baffles 12 are respectively arranged on the sides of the two evaporation components 10 that are opposite to each other along the second direction Y, wherein the second direction Y is perpendicular to the first direction X.

[0045] In this way, the two evaporation components 10 can simultaneously evaporate the evaporation material onto the substrate. Since the substrate needs to move along the arrangement direction of the two evaporation components 10 (i.e., the second direction Y) when the two evaporation components 10 are used for evaporation, two baffles 12 are provided, and the two baffles 12 are respectively provided on the opposite sides of the two evaporation components 10 along the second direction Y. The two baffles 12 can jointly control the diffusion angle of the evaporation material in the second direction Y when the evaporation material diffuses, so that the evaporation material evaporated from the two evaporation components 10 can be evaporated onto the substrate more evenly. For example, Figure 1 As shown, in the two evaporation components 10, two baffles 12 are respectively arranged opposite to each other on one side of the evaporation component 10 in the second direction Y, so that the two baffles 12 can enclose the two evaporation components 10 in the middle, and then the two baffles 12 are used to jointly control the diffusion angle of the evaporation material.

[0046] Optionally, the two evaporation components 10 may heat the same evaporation material, or may heat two different evaporation materials respectively. For example, when the two evaporation components 10 heat two different evaporation materials, the two evaporation materials may be cesium bromide and lead iodide respectively.

[0047] See also Figure 2 In some embodiments, the accommodating chamber 100 is disposed on the top of the evaporation component 10 , and the top of the evaporation component 10 is provided with a boss 101 arranged around the first direction X, and the heat insulation layer 110 and the reinforcement layer 111 are connected to the boss 101 .

[0048] In this way, by setting the boss 101, the boss 101 can accommodate the thermal insulation layer 110 and the reinforcement layer 111, which is convenient for setting the thermal insulation layer 110 and the reinforcement layer 111 on the evaporation component 10. At the same time, the boss 101 can also play a certain positioning role for the thermal insulation layer 110 and the reinforcement layer 111, so that the evaporation hole 1111 can be close to a pre-set position, which is beneficial to ensure the uniformity of the thin film formed by the evaporation material being evaporated onto the substrate.

[0049] In some embodiments, the evaporation device 1 further includes a fixing member (not shown), which is connected between the boss 101 and the heat insulating layer 110 and the reinforcing layer 111 , so that the heat insulating layer 110 and the reinforcing layer 111 are fixed relative to the boss 101 .

[0050] In this way, by setting a fixing part between the boss 101 and the insulation layer 110 and the reinforcement layer 111, the insulation layer 110, the reinforcement layer 111 and the boss 101 are fixed to each other in a plane perpendicular to the first direction X, so that the insulation layer 110 and the reinforcement layer 111 can be prevented from moving relative to the evaporation component 10 during the use of the evaporation device 1, so that the evaporation hole 1111 can be more accurately located at a pre-set position, which is beneficial to ensure the uniformity of the thin film formed by the evaporation material being evaporated onto the substrate.

[0051] Optionally, the fixing member may be a card or a latch, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0052] Optionally, the material of the reinforcement layer 111 may be a hard material such as metal, alloy or carbon material, which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0053] In some embodiments, the material of the reinforcement layer 111 is any one of tungsten, molybdenum and tantalum. In this way, the reinforcement layer 111 has a high hardness, ensuring that the reinforcement layer 111 has a long service life, and the reinforcement layer 111 has good heat resistance, so that the reinforcement layer 111 is not easy to deform at high temperatures, and the size of the evaporation holes 1111 of the reinforcement layer 111 is reduced to change at high temperatures.

[0054] In some embodiments, the material of the heat insulating layer 110 is boron nitride, so that the heat insulating layer 110 has good heat resistance and is not easily damaged at high temperatures. At the same time, it can also isolate the heat radiation generated when the evaporation component 10 heats the evaporation material, reducing the influence of the heat radiation on the substrate.

[0055] See also Figure 3 In some embodiments, the diameter of the avoidance hole 1100 is larger than the diameter of the evaporation hole 1111. In this way, the avoidance hole 1100 can completely avoid the evaporation hole 1111 and will not block the evaporation material passing through the evaporation hole 1111, thereby ensuring that the size of the evaporation hole 1111 can control the diffusion rate of the evaporation material in the direction perpendicular to the first direction X.

[0056] Optionally, the heat insulating layer 110 may be directly connected to the evaporation component 10 , or the reinforcing layer 111 may be directly connected to the evaporation component 10 . The specific selection may be made according to actual conditions and is not specifically limited in this embodiment.

[0057] Optionally, the number of the heat insulation layer 110 may be one or more, which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0058] In some embodiments, there are multiple insulation layers 110 , which are arranged in sequence along the first direction X, and one of the insulation layers 110 is connected to the evaporation component 10 to at least partially cover the opening of the accommodating cavity 100 , and the reinforcement layer 111 is located between the multiple insulation layers 110 .

[0059] In this way, by setting up multiple thermal insulation layers 110, the isolation effect of the thermal radiation generated when the evaporation component 10 heats the vapor deposition material can be improved, and the influence of the thermal radiation on the substrate can be further reduced. At the same time, the reinforcing layer 111 is arranged between the multiple thermal insulation layers 110, and the thermal insulation layer 110 can also play a thermal insulation role for the reinforcing layer 111, thereby reducing the influence of high temperature on the reinforcing layer 111, thereby reducing the deformation of the reinforcing layer 111 caused by high temperature.

[0060] For example, the number of the heat insulation layer 110 may be two, three, or four, etc. Figure 2 As shown, when there are two heat insulation layers 110 , the reinforcement layer 111 is disposed between the two heat insulation layers 110 .

[0061] In some embodiments, the insulation layer 110 is provided with a first positioning portion 1101, and the reinforcement layer 111 is provided with a second positioning portion 1112, and the second positioning portion 1112 is snap-connected to the first positioning portion 1101 so that the reinforcement layer 111 is fixed relative to the insulation layer 110 in a plane perpendicular to the first direction X.

[0062] In this way, by setting the first positioning portion 1101 and the second positioning portion 1112, the reinforcing layer 111 can be better positioned with the thermal insulation layer 110 in a plane perpendicular to the first direction X, so that the evaporation hole 1111 can be more accurately located at a pre-set position, which is beneficial to ensuring the uniformity of the thin film formed by the evaporation material being evaporated onto the substrate.

[0063] Optionally, one of the first positioning portion 1101 and the second positioning portion 1112 may be a protrusion and the other may be a depression; or, one of the first positioning portion 1101 and the second positioning portion 1112 may be a first magnetic member and the other may be a second magnetic member, and the polarities of the first magnetic member and the second magnetic member are opposite.

[0064] Optionally, the number of the evaporation holes 1111 may be one or more, and the number of the avoidance holes 1100 is the same as the number of the evaporation holes 1111 . The number may be selected according to actual conditions and is not specifically limited in this embodiment.

[0065] In some embodiments, there are multiple evaporation holes 1111 , and the reinforcement layer 111 includes multiple split parts 1110 . The multiple split parts 1110 are located in the same plane perpendicular to the first direction X. Each split part 1110 is provided with an evaporation hole 1111 , and each split part 1110 is connected to the insulation layer 110 .

[0066] In this way, when adjusting the size of the evaporation holes 1111, if only part of the multiple evaporation holes 1111 need to be adjusted in size, only the split part 1110 of the required part needs to be replaced, and there is no need to replace the entire reinforcement layer 111, so that the cover plate 11 is more flexible to use.

[0067] In other embodiments, there may be multiple evaporation holes 1111 on the split part 1110, which may be arranged according to actual needs. It is also possible to achieve the effect of adjusting part of the evaporation holes 1111 by replacing only the required part of the split part 1110 without replacing the entire reinforcement layer 111.

[0068] See also Figure 4 In some embodiments, the reinforcing layer 111 includes a main body 111a and a splicing portion 111b, the heat insulating layer 110 and the main body 111a are sequentially arranged on the box body along the first direction X, the main body 111a is provided with an evaporation hole 1111 penetrating the main body along the first direction X, the splicing portion 111b is detachably connected to the evaporation hole 1111, and the splicing portion 111b is used to adjust the size of the evaporation hole 1111. In this embodiment, the main body 111a includes a plurality of split parts 1110.

[0069] In this way, by replacing the splicing part 111b of different sizes or not setting the splicing part 111b, the size of the evaporation hole 1111 can be adjusted, so that the evaporation device 1 can be suitable for different evaporation materials and different film thickness requirements, thereby improving the versatility of the evaporation device 1. In addition, the method of adjusting the evaporation hole 1111 is relatively simple, and there is no need to replace the entire cover plate 11, which is conducive to reducing costs.

[0070] See also Figure 5 The second aspect of the utility model discloses an evaporation device 2, which includes a container 20 and an evaporation device 1 as described in the first aspect. The container 20 is used to accommodate a substrate 3. The evaporation device 1 is arranged in the container 20. Along the first direction X, the substrate 3 is located above the evaporation device 1, and at least a portion of the substrate 3 is arranged corresponding to the evaporation hole 1111.

[0071] The evaporation device 2 provided in the second aspect of the embodiment of the utility model adopts the evaporation device 1 provided in the first aspect of the utility model. By controlling the size of the evaporation holes 1111 of the reinforcing layer 111, the diffusion rate of the evaporation material in the direction perpendicular to the first direction X can be controlled, so that by reasonably setting the size of the evaporation holes 1111, the uniformity of the thin film formed by the evaporation material on the substrate 3 can be improved, thereby improving the quality of the produced perovskite battery. At the same time, the heat insulation layer 110 of the cover plate 11 can isolate the heat radiation generated when the evaporation component 10 heats the evaporation material, reduce the influence of the heat radiation on the substrate 3, and the avoidance hole 1100 avoids the evaporation hole 1111, which will not affect the diffusion rate of the evaporation material. In addition, the reinforcing layer 111 is made of a hard material. When the evaporation holes 1111 of the reinforcing layer 111 are wiped and cleaned, the evaporation holes 1111 are not easily worn, thereby reducing the size of the evaporation holes 1111 changing due to wear and affecting the uniformity of the thin film formed by the evaporation material being evaporated onto the substrate 3, thereby allowing the reinforcing layer 111 to have a longer service life.

[0072] The evaporation device and the evaporation equipment disclosed in the embodiments of the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the evaporation device and the evaporation equipment of the present invention and their core ideas. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An evaporation device, characterized in that: include: An evaporation component, wherein the evaporation component is provided with a receiving cavity, the receiving cavity is used to receive the evaporation material, and the evaporation component is used to heat the evaporation material in the receiving cavity; as well as a cover plate, the cover plate being connected to the evaporation component to at least partially cover the opening of the accommodating cavity, the cover plate comprising a heat insulating layer and a reinforcing layer connected to the heat insulating layer, the heat insulating layer and the reinforcing layer being arranged in sequence along a first direction, the heat insulating layer being provided with an avoidance hole penetrating the heat insulating layer along the first direction, the reinforcing layer being provided with an evaporation hole penetrating the heat insulating layer along the first direction, the avoidance hole being used to avoid the evaporation hole, and the evaporation hole being used to allow the evaporated deposition material to pass through; Wherein, the material of the reinforcement layer is a hard material.

2. The evaporation device according to claim 1, characterized in that There are multiple thermal insulation layers, which are arranged in sequence along the first direction, and one of the thermal insulation layers is connected to the evaporation component to at least partially cover the opening of the accommodating cavity, and the reinforcement layer is located between the multiple thermal insulation layers.

3. The evaporation device according to claim 1, characterized in that: There are multiple evaporation holes, and the reinforcement layer includes multiple split parts. The multiple split parts are located in the same plane perpendicular to the first direction. Each of the split parts is provided with an evaporation hole, and each of the split parts is connected to the insulation layer.

4. The evaporation device according to claim 1, characterized in that: The material of the reinforcement layer is any one of tungsten, molybdenum and tantalum, and / or the material of the heat insulation layer is boron nitride.

5. The evaporation device according to claim 1, characterized in that The heat insulating layer is provided with a first positioning portion, and the reinforcing layer is provided with a second positioning portion, and the second positioning portion is snap-connected to the first positioning portion so that the reinforcing layer is fixed relative to the heat insulating layer in a plane perpendicular to the first direction.

6. The evaporation device according to claim 1, characterized in that The accommodating cavity is arranged at the top of the evaporation component. The top of the evaporation component is provided with a boss which is arranged around the first direction. The heat insulation layer and the reinforcement layer are connected to the boss.

7. The evaporation device according to any one of claims 1 to 6, characterized in that: The evaporation device further comprises a baffle, which is rotatably connected to the evaporation component to adjust an angle between the baffle and the plane where the evaporation hole is located.

8. The evaporation device according to claim 7, characterized in that The evaporation device further comprises a driving component, wherein the driving component is connected to the baffle and is used for driving the baffle to rotate.

9. The evaporation device according to claim 7, characterized in that: The number of the evaporation components, the cover plate and the baffle plate are all two, the two evaporation components are arranged at intervals along the second direction, the two evaporation components are used to heat the evaporation material, and the two baffle plates are respectively arranged on the sides of the two evaporation components that are away from each other along the second direction; The second direction is perpendicular to the first direction.

10. A vapor deposition device, characterized in that: The evaporation equipment includes a container and an evaporation device as described in any one of claims 1 to 9, wherein the container is used to accommodate a substrate, and the evaporation device is arranged in the container. Along the first direction, the substrate is located above the evaporation device, and the substrate is at least partially arranged corresponding to the evaporation hole.

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