Molybdenum substrate surface electroplating treatment device

Abstract

The utility model discloses a molybdenum substrate surface electroplating treatment device which comprises an anode metal plate arranged in an electroplating tank, a cathode connecting seat arranged on the inner side of the electroplating tank, and a power supply device arranged on one side of the electroplating tank; the metal net frame is arranged below the cover plate, a metal connecting frame is arranged above the metal net frame, a connecting rod is arranged above the metal connecting frame, and a first motor is arranged above the cover plate; the first mounting frames are arranged on the two sides of the electroplating pool, second mounting frames are arranged on the two sides of the cover plate, and a first electric push rod is arranged in the telescopic cavity. According to the electroplating device, the upper end of the electroplating pool is closed through the cover plate during electroplating, and dust and impurities can be prevented from falling into the electroplating pool easily; during electroplating, the motor drives the metal net frame to rotate, so that the molybdenum substrate in the electroplating liquid rotates, uniform electroplating of the surface of the molybdenum substrate can be ensured, and the electroplating effect of the surface of the molybdenum substrate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating treatment, in particular to a molybdenum substrate surface electroplating treatment device. Background Art

[0002] Molybdenum plate is a metal plate made of pure molybdenum, which has high heat resistance, corrosion resistance and mechanical properties. It is widely used in aerospace, chemical, electronics, medical equipment and other fields. Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. Electroplating can prevent metal oxidation, improve wear resistance, conductivity, reflectivity, corrosion resistance and enhance aesthetics.

[0003] The Chinese patent publication number is CN212505128U, and the authorization announcement date is February 9, 2021. A sheet metal surface electroplating treatment device relates to the technical field of electroplating treatment devices, in order to solve the problem that the existing sheet metal surface electroplating treatment devices are not very efficient and the electroplating solution is easy to splash. A connecting cover is installed above the electroplating pool, a stirring motor is installed at the center position above the connecting cover, and the connecting cover is connected to the stirring motor by screws, a placement port is installed on one side above the connecting cover, a heating plate is installed inside the electroplating pool, an anode connection block is installed on one side below the inside of the electroplating pool, an anode metal plate is installed inside the anode connection block, an anode bag is installed on the outside of the anode metal plate, an anti-corrosion wire connection tube is installed on one side of the anode connection block, and a cathode connection block is installed on the other side of the anti-corrosion wire connection tube.

[0004] The upper end of the existing electroplating device is in an open-air state. During electroplating, dust and impurities are easy to fall into the electroplating pool and cause pollution. The electroplated molybdenum substrate is fixed in the electroplating solution, which can easily lead to uneven electroplating on the surface of the molybdenum substrate, reduce the electroplating effect on the surface of the molybdenum substrate, and cannot meet the use requirements. Utility Model Content

[0005] The purpose of the utility model is to provide a molybdenum substrate surface electroplating processing device to solve the problem proposed in the above background technology that the upper end of the existing electroplating device is in an open-air state, dust and impurities are easily dropped into the electroplating pool during electroplating to cause pollution, and the electroplated molybdenum substrate is fixedly placed in the electroplating solution, which easily leads to uneven electroplating on the surface of the molybdenum substrate, reduces the electroplating effect of the molybdenum substrate surface, and cannot meet the use requirements.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a molybdenum substrate surface electroplating treatment device, including an electroplating pool and a cover plate, and also including:

[0007] An anode metal plate is arranged inside the electroplating cell, and the anode metal plate is fixedly connected to the electroplating cell, a cathode connection seat is arranged inside the electroplating cell, a power supply device is arranged on one side of the electroplating cell, and the power supply device is fixedly connected to the electroplating cell, corrosion-resistant wires are arranged between the anode metal plate and the cathode connection seat and the power supply device, and the anode metal plate and the cathode connection seat are electrically connected to the power supply device through the corrosion-resistant wires, an electric control panel is arranged on one side of the electroplating cell, and the electric control panel is fixedly connected to the electroplating cell;

[0008] A metal mesh frame is arranged below the cover plate, a metal connecting frame is arranged above the metal mesh frame, and the metal connecting frame is fixedly connected to the metal mesh frame, a connecting rod is arranged above the metal connecting frame, and one end of the connecting rod is fixedly connected to the metal connecting frame, a first motor is arranged above the cover plate, and the first motor is connected to the cover plate by screws, and an output end of the first motor is connected to the other end of the connecting rod;

[0009] A first mounting frame is arranged on both sides of the electroplating pool, two first mounting frames are provided, and the first mounting frames are fixedly connected to the electroplating pool, telescopic cavities are provided inside the two first mounting frames, second mounting frames are provided on both sides of the cover plate, and the second mounting frames are fixedly connected to the cover plate, one end of the second mounting frame extends to the inside of the telescopic cavity, and the second mounting frame is slidably connected to the first mounting frame, a first electric push rod is provided inside the telescopic cavity, and the first electric push rod is fixedly connected to the first mounting frame and the second mounting frame.

[0010] Preferably, a second electric push rod is provided on one side of the cathode connection seat, and the second electric push rod is fixedly connected to the electroplating cell and the cathode connection seat.

[0011] Preferably, the connecting rod comprises a metal rod and an insulating rod, the insulating rod is arranged above the metal rod, and the metal rod and the insulating rod are arranged as one body, and the metal rod is arranged corresponding to the cathode connecting seat.

[0012] Preferably, a metal mesh plate is arranged inside the metal mesh frame, at least three metal mesh plates are arranged, and the metal mesh plates are plugged into the metal mesh frame.

[0013] Preferably, a heating component is provided at the lower end of the electroplating pool, and the heating component is fixedly connected to the electroplating pool, and a temperature sensor is provided on one side of the electroplating pool, and the temperature sensor is connected to the electroplating pool as a whole.

[0014] Preferably, a second motor is provided below the electroplating pool and is connected to the electroplating pool via screws, a stirring paddle is provided at the bottom of the electroplating pool and is rotatably connected to the electroplating pool, and the stirring paddle is connected to the output end of the second motor.

[0015] Preferably, a drain valve is provided on one side of the electroplating pool, and the drain valve is connected to the electroplating pool as an integral whole, the bottom of the electroplating pool is inclined, a shock-absorbing seat is provided below the electroplating pool, four shock-absorbing seats are provided, and the shock-absorbing seat is fixedly connected to the electroplating pool, and the four shock-absorbing seats are provided at the four corners of the electroplating pool.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The utility model device is provided with a first motor, a metal mesh frame, a connecting rod, a cathode connecting seat and a second electric push rod. The second electric push rod drives the cathode connecting seat to move, and the cathode connecting seat is contacted with the metal rod part on the connecting rod. The anode metal plate and the cathode connecting seat are powered by the power supply device for electrolysis. The first motor drives the connecting rod to rotate. As the connecting rod rotates, the metal mesh frame is driven to rotate in the electroplating solution, so that the surface of the molybdenum substrate is fully electroplated, thereby improving the electroplating efficiency of the molybdenum substrate surface.

[0018] 2. The utility model device is provided with a heating component and a temperature sensor. The heating component heats the electroplating pool. The hot electroplating solution accelerates the decomposition of ions in the anode metal plate and improves the electroplating efficiency of the molybdenum substrate. The temperature sensor measures the temperature of the electroplating solution, which facilitates the control of the electroplating effect of the molybdenum substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a cross-sectional view of the utility model;

[0021] Figure 3 This is a structural diagram of a metal mesh frame of the utility model;

[0022] Figure 4 For the utility model Figure 1 A partial enlarged view of area A.

[0023] In the figure: 1. electroplating tank; 2. shock-absorbing seat; 3. electric control panel; 4. temperature sensor; 5. drain valve; 6. cover plate; 7. first motor; 8. metal mesh frame; 9. first mounting frame; 10. second mounting frame; 11. first electric push rod; 12. anode metal plate; 13. power supply equipment; 14. metal connecting frame; 15. connecting rod; 16. telescopic cavity; 17. second motor; 18. stirring paddle; 19. heating assembly; 20. metal mesh plate; 21. metal rod; 22. insulating rod; 23. cathode connecting seat; 24. corrosion-resistant wire; 25. second electric push rod. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] See also Figure 1-4 The utility model provides an embodiment: a molybdenum substrate surface electroplating treatment device, including an electroplating pool 1 and a cover plate 6, and also includes:

[0026] An anode metal plate 12 is arranged inside the electroplating tank 1, and the anode metal plate 12 is fixedly connected to the electroplating tank 1. A cathode connection seat 23 is arranged inside the electroplating tank 1. A power supply device 13 is arranged on one side of the electroplating tank 1, and the power supply device 13 is fixedly connected to the electroplating tank 1. A corrosion-resistant wire 24 is arranged between the anode metal plate 12 and the cathode connection seat 23 and the power supply device 13, and the anode metal plate 12 and the cathode connection seat 23 are electrically connected to the power supply device 13 through the corrosion-resistant wire 24. An electric control panel 3 is arranged on one side of the electroplating tank 1, and the electric control panel 3 is fixedly connected to the electroplating tank 1;

[0027] A metal mesh frame 8 is arranged below the cover plate 6, a metal connecting frame 14 is arranged above the metal mesh frame 8, and the metal connecting frame 14 is fixedly connected to the metal mesh frame 8, a connecting rod 15 is arranged above the metal connecting frame 14, and one end of the connecting rod 15 is fixedly connected to the metal connecting frame 14, a first motor 7 is arranged above the cover plate 6, and the first motor 7 is connected to the cover plate 6 by screws, and the output end of the first motor 7 is connected to the other end of the connecting rod 15;

[0028] The first mounting frame 9 is arranged on both sides of the electroplating pool 1. There are two first mounting frames 9, and the first mounting frames 9 are fixedly connected to the electroplating pool 1. A telescopic cavity 16 is arranged inside the two first mounting frames 9. Second mounting frames 10 are arranged on both sides of the cover plate 6, and the second mounting frame 10 is fixedly connected to the cover plate 6. One end of the second mounting frame 10 extends to the inside of the telescopic cavity 16, and the second mounting frame 10 is slidably connected to the first mounting frame 9. A first electric push rod 11 is arranged inside the telescopic cavity 16, and the first electric push rod 11 is fixedly connected to the first mounting frame 9 and the second mounting frame 10.

[0029] When in use: add plating solution to the electroplating pool 1, put the molybdenum substrate into the metal mesh frame 8, drive the first electric push rod 11 to drive the second mounting frame 10 to descend, immerse the metal mesh frame 8 in the plating solution, the plating solution submerges the molybdenum substrate, connect the cathode connecting seat 23 with the connecting rod 15, and power the anode metal plate 12 and the cathode connecting seat 23 through the power supply device 13 for electrolysis. Under the action of electrolysis, a thin metal layer is plated on the surface of the molybdenum substrate, and the first motor 7 is turned on to drive the connecting rod 15 to rotate. As the connecting rod 15 rotates, the metal mesh frame 8 is driven to rotate in the plating solution, so that the surface of the molybdenum substrate is fully electroplated. After the electroplating is completed, the first electric push rod 11 is driven to drive the second mounting frame 10 to rise, and the metal mesh frame 8 is lifted out of the plating solution.

[0030] See also Figure 1 and Figure 4 A second electric push rod 25 is provided on one side of the cathode connection seat 23, and the second electric push rod 25 is fixedly connected to the electroplating cell 1 and the cathode connection seat 23. The cathode connection seat 23 is moved by the second electric push rod 25 to connect the cathode connection seat 23 to the connecting rod 15.

[0031] See also Figure 1 , Figure 2 and Figure 3 The connecting rod 15 includes a metal rod 21 and an insulating rod 22 . The insulating rod 22 is arranged above the metal rod 21 , and the metal rod 21 and the insulating rod 22 are arranged as one body. The metal rod 21 and the cathode connecting seat 23 are arranged correspondingly.

[0032] See also Figure 1 , Figure 2 and Figure 3 A metal mesh plate 20 is arranged inside the metal mesh frame 8. At least three metal mesh plates 20 are arranged, and the metal mesh plates 20 are plugged into the metal mesh frame 8. The metal mesh plates 20 divide the inside of the metal mesh frame 8 into multiple spaces, which can accommodate multiple molybdenum substrates for electroplating at the same time.

[0033] See also Figure 1 and Figure 2 A heating component 19 is provided at the lower end of the electroplating pool 1, and the heating component 19 is fixedly connected to the electroplating pool 1. A temperature sensor 4 is provided on one side of the electroplating pool 1, and the temperature sensor 4 is connected to the electroplating pool 1 as a whole. The electroplating pool 1 is heated by the heating component 19, and the hot plating solution accelerates the decomposition of ions of the anode metal plate 12, thereby improving the electroplating efficiency of the molybdenum substrate. The temperature sensor 4 measures the temperature of the plating solution.

[0034] See also Figure 2A second motor 17 is provided below the electroplating pool 1, and the second motor 17 is connected to the electroplating pool 1 by screws. A stirring paddle 18 is provided at the bottom of the electroplating pool 1, and the stirring paddle 18 is rotatably connected to the electroplating pool 1. The stirring paddle 18 is connected to the output end of the second motor 17, and the stirring paddle 18 is driven to rotate by the second motor 17. As the stirring paddle 18 rotates, the plating liquid in the electroplating pool 1 is stirred to ensure that the concentration of the plating liquid is evenly distributed.

[0035] See also Figure 1 A drain valve 5 is provided on one side of the electroplating pool 1, and the drain valve 5 is connected to the electroplating pool 1 as a whole. The bottom of the electroplating pool 1 is inclined. A shock-absorbing seat 2 is provided below the electroplating pool 1. Four shock-absorbing seats 2 are provided, and the shock-absorbing seats 2 are fixedly connected to the electroplating pool 1. The four shock-absorbing seats 2 are provided at the four corners of the electroplating pool 1.

[0036] Working principle: add plating solution to the electroplating pool 1, put the molybdenum substrate into the metal mesh frame 8, drive the first electric push rod 11 to drive the second mounting frame 10 to descend, immerse the metal mesh frame 8 in the plating solution, and the plating solution submerges the molybdenum substrate. Drive the second electric push rod 25 to drive the cathode connection seat 23 to move, and make the cathode connection seat 23 contact the metal rod 21 on the connecting rod 15. The power supply device 13 supplies power to the anode metal plate 12 and the cathode connection seat 23 for electrolysis. Under the action of electrolysis, a thin metal layer is plated on the surface of the molybdenum substrate. When electroplating, turn on the first motor 7 to drive The connecting rod 15 is driven to rotate, and the rotation of the connecting rod 15 drives the metal mesh frame 8 to rotate in the electroplating solution, so that the surface of the molybdenum substrate is fully electroplated, and the heating component 19 is turned on to heat the electroplating cell 1. The hot electroplating solution accelerates the decomposition of ions of the anode metal plate 12 and improves the electroplating efficiency of the molybdenum substrate. The second motor 17 is turned on to drive the stirring paddle 18 to rotate. As the stirring paddle 18 rotates, the plating solution in the electroplating cell 1 is stirred to ensure that the concentration of the plating solution is evenly distributed. After the electroplating is completed, the first electric push rod 11 is driven to drive the second mounting frame 10 to rise, and the metal mesh frame 8 is lifted out of the electroplating solution.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A molybdenum substrate surface electroplating treatment device, comprising an electroplating pool (1) and a cover plate (6), characterized in that: Also includes: an anode metal plate (12) disposed inside the electroplating tank (1), and the anode metal plate (12) is fixedly connected to the electroplating tank (1); a cathode connection seat (23) is disposed inside the electroplating tank (1); a power supply device (13) is disposed on one side of the electroplating tank (1), and the power supply device (13) is fixedly connected to the electroplating tank (1); a corrosion-resistant wire (24) is disposed between the anode metal plate (12) and the cathode connection seat (23) and the power supply device (13), and the anode metal plate (12) and the cathode connection seat (23) are electrically connected to the power supply device (13) via the corrosion-resistant wire (24); an electric control panel (3) is disposed on one side of the electroplating tank (1), and the electric control panel (3) is fixedly connected to the electroplating tank (1); A metal mesh frame (8) is arranged below the cover plate (6); a metal connecting frame (14) is arranged above the metal mesh frame (8), and the metal connecting frame (14) is fixedly connected to the metal mesh frame (8); a connecting rod (15) is arranged above the metal connecting frame (14), and one end of the connecting rod (15) is fixedly connected to the metal connecting frame (14); a first motor (7) is arranged above the cover plate (6), and the first motor (7) is connected to the cover plate (6) by screws, and an output end of the first motor (7) is connected to the other end of the connecting rod (15); A first mounting frame (9) is arranged on both sides of the electroplating tank (1), two first mounting frames (9) are arranged, and the first mounting frames (9) are fixedly connected to the electroplating tank (1), and a telescopic cavity (16) is arranged inside the two first mounting frames (9), and a second mounting frame (10) is arranged on both sides of the cover plate (6), and the second mounting frame (10) is fixedly connected to the cover plate (6), one end of the second mounting frame (10) extends to the inside of the telescopic cavity (16), and the second mounting frame (10) is slidably connected to the first mounting frame (9), and a first electric push rod (11) is arranged inside the telescopic cavity (16), and the first electric push rod (11) is fixedly connected to the first mounting frame (9) and the second mounting frame (10).

2. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: A second electric push rod (25) is provided on one side of the cathode connection seat (23), and the second electric push rod (25) is fixedly connected to the electroplating cell (1) and the cathode connection seat (23).

3. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: The connecting rod (15) comprises a metal rod (21) and an insulating rod (22); the insulating rod (22) is arranged above the metal rod (21), and the metal rod (21) and the insulating rod (22) are arranged as one body; the metal rod (21) and the cathode connecting seat (23) are arranged correspondingly.

4. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: A metal mesh plate (20) is arranged inside the metal mesh frame (8), at least three metal mesh plates (20) are arranged, and the metal mesh plates (20) are plugged into the metal mesh frame (8).

5. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: A heating component (19) is provided at the lower end of the electroplating pool (1), and the heating component (19) is fixedly connected to the electroplating pool (1); a temperature sensor (4) is provided on one side of the electroplating pool (1), and the temperature sensor (4) is integrally connected to the electroplating pool (1).

6. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: A second motor (17) is provided below the electroplating pool (1), and the second motor (17) is connected to the electroplating pool (1) via screws; a stirring paddle (18) is provided at the bottom of the electroplating pool (1), and the stirring paddle (18) is rotatably connected to the electroplating pool (1); the stirring paddle (18) is connected to an output end of the second motor (17).

7. The molybdenum substrate surface electroplating treatment device according to claim 1, characterized in that: A drain valve (5) is provided on one side of the electroplating pool (1), and the drain valve (5) is connected to the electroplating pool (1) as a whole. The bottom of the electroplating pool (1) is arranged at an angle. A shock-absorbing seat (2) is provided below the electroplating pool (1). Four shock-absorbing seats (2) are provided, and the shock-absorbing seats (2) are fixedly connected to the electroplating pool (1). The four shock-absorbing seats (2) are arranged at the four corners of the electroplating pool (1).

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