Automatic laminating equipment for piezoelectric ceramic piece

Abstract

The automatic laminating equipment comprises a plurality of carriers, a turntable, a turntable driving mechanism, a feeding detection mechanism, a thickness measuring mechanism, a dispensing mechanism, a laminating mechanism, a curing mechanism and an electrical control device. The plurality of carriers are arranged on the turntable along the circumferential direction, and each carrier is used for positioning an ultrasonic sensor shell to be subjected to surface mounting; the turntable driving mechanism is used for driving the turntable to intermittently rotate; the feeding detection mechanism is used for detecting whether the carrier bears the ultrasonic sensor shell or not; the thickness measuring mechanism is used for detecting the thickness of a bottom plate of the ultrasonic sensor shell; the dispensing mechanism is used for dripping glue on a bottom plate of the ultrasonic sensor shell; the chip mounting mechanism is used for mounting the piezoelectric ceramic chip on the dispensed bottom plate; the curing mechanism is used for carrying out glue curing treatment on the pasted ultrasonic sensor shell; and the electrical control device is used for controlling the operation of the turntable driving mechanism, the thickness measuring mechanism, the dispensing mechanism, the chip mounting mechanism and the curing mechanism. The chip mounter is high in chip mounting efficiency and good in chip mounting consistency.

Description

Technical Field

[0001] The utility model relates to a manufacturing technology of an ultrasonic sensor. Background Art

[0002] Figure 1 FIG. 4 is a schematic top view of an ultrasonic sensor housing without a piezoelectric ceramic sheet installed, Figure 2 FIG. 1 shows a schematic top view of an ultrasonic sensor housing with a piezoelectric ceramic sheet assembled thereon. Figure 3 A cross-sectional view of an ultrasonic sensor housing equipped with a piezoelectric ceramic sheet is shown. Figures 1 to 3 . The ultrasonic sensor includes an ultrasonic sensor housing 201 made of metal material and a piezoelectric ceramic sheet 202. The ultrasonic sensor housing 201 includes a bottom plate 203 and a peripheral wall portion 204 connected to the periphery of the bottom plate 203. The bottom plate 203 and the peripheral wall portion 204 together define a cavity 206. The top of the peripheral wall portion 204 has an annular flange 205 protruding radially. The piezoelectric ceramic sheet 202 is arranged in the cavity 206 and is fixed to the bottom plate 203 of the ultrasonic sensor housing by glue. When current flows through the piezoelectric ceramic sheet, the piezoelectric ceramic sheet converts electrical energy into mechanical energy, driving the bottom plate 203 (the bottom plate 203 is also called a diaphragm) of the ultrasonic sensor housing to vibrate and emit ultrasonic waves.

[0003] At present, the bonding of piezoelectric ceramic sheets to the bottom plate of the ultrasonic sensor housing mainly relies on manual operation. Not only does it have disadvantages such as high labor intensity and low patch efficiency, but it also cannot ensure that the amount of glue applied and the patch pressure are completely consistent, which in turn affects the stability of the patch quality and is difficult to meet the requirements of mass production. Summary of the invention

[0004] The technical problem to be solved by the utility model is to provide a piezoelectric ceramic sheet automatic bonding device with high automation, fast bonding speed and good stability of bonding quality.

[0005] The utility model provides a piezoelectric ceramic sheet automatic bonding device, including multiple carriers, a turntable, a turntable driving mechanism, a feeding detection mechanism, a thickness measuring mechanism, a glue dispensing mechanism, a patch mechanism, a curing mechanism and an electrical control device; multiple carriers are evenly arranged on the turntable along the circumference, each carrier is used to position an ultrasonic sensor housing to be patched, the ultrasonic sensor housing includes a bottom plate and a peripheral wall portion connected to the periphery of the bottom plate, and the top of the peripheral wall portion has an annular flange protruding in the radial direction; the turntable driving mechanism is used to drive the turntable to rotate intermittently, so as to drive each carrier to pass through the feeding detection mechanism, the thickness measuring mechanism, the glue dispensing mechanism, the patch mechanism and the curing mechanism in sequence. Corresponding workstations; the loading detection mechanism is used to detect whether the carrier has taken over the ultrasonic sensor shell to be mounted, and send the detection result to the electrical control device; the thickness measuring mechanism is used to detect the thickness of the bottom plate of the ultrasonic sensor shell, and send the detection result to the electrical control device; the dispensing mechanism is used to drop glue on the bottom plate of the ultrasonic sensor shell; the mounting mechanism is used to stick the piezoelectric ceramic sheet on the bottom plate of the ultrasonic sensor shell after dispensing; the curing mechanism is used to perform glue curing treatment on the ultrasonic sensor shell after mounting; the electrical control device is used to control the operation of the turntable driving mechanism, the thickness measuring mechanism, the dispensing mechanism, the mounting mechanism and the curing mechanism.

[0006] The utility model embodiment has at least the following advantages:

[0007] 1. Compared with the prior art, the automatic piezoelectric ceramic sheet bonding equipment according to the embodiment of the utility model has a high degree of automation, reduces the workload of operators, improves the efficiency of patch bonding, and can meet the needs of large-scale production;

[0008] 2. The piezoelectric ceramic sheet automatic bonding equipment of the utility model can ensure that the glue dispensing position, the amount of glue applied, and the patch pressure are completely consistent, thereby improving the patch quality stability of ultrasonic sensor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 The schematic top view of the ultrasonic sensor housing without the piezoelectric ceramic plate is shown.

[0010] Figure 2 The schematic top view of the ultrasonic sensor housing after assembling the piezoelectric ceramic sheet is shown.

[0011] Figure 3 The figure shows a cross-sectional schematic diagram of an ultrasonic sensor housing after assembling the piezoelectric ceramic sheet.

[0012] Figures 4 to 6 The structural schematic diagrams of the automatic bonding device for piezoelectric ceramic sheets according to an embodiment of the utility model are shown from different angles.

[0013] Figure 7A structural schematic diagram of a feeding detection mechanism according to an embodiment of the utility model is shown.

[0014] Figures 8 to 10 A schematic structural diagram of a thickness measuring mechanism according to an embodiment of the utility model is shown.

[0015] Fig.11 A schematic diagram of a glue dispensing mechanism according to an embodiment of the utility model is shown.

[0016] Fig.12 and Fig.13 The structural schematic diagrams of the patch mechanism according to an embodiment of the utility model are shown from different angles respectively.

[0017] Fig.14 and Fig.15 The structural schematic diagrams of the piezoelectric ceramic sheet loading mechanism according to an embodiment of the utility model are shown from different angles respectively.

[0018] Fig.16 and Fig.17 The structural schematic diagrams of the ceramic sheet rotating tooling according to an embodiment of the utility model are shown from different angles respectively.

[0019] Fig.18 A structural schematic diagram of a bonding sub-mechanism according to an embodiment of the utility model is shown.

[0020] Fig.19 A structural schematic diagram of a curing mechanism according to an embodiment of the utility model is shown.

[0021] Fig. 20 A structural schematic diagram of a fitting position detection mechanism according to an embodiment of the utility model is shown.

[0022] Fig.21 The electrical control principle diagram of the automatic lamination device for piezoelectric ceramic sheets according to an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0023] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Please refer to Figures 4 to 20 The piezoelectric ceramic sheet automatic bonding device according to the embodiment of the utility model comprises a plurality of carriers 1, a turntable 21, a turntable driving mechanism 22, a feeding detection mechanism 3, a thickness measuring mechanism 4, a dispensing mechanism 5, a bonding mechanism 6, a curing mechanism 7, a bonding position detection mechanism 8 and an electrical control device 9.

[0025] A plurality of carriers 1 are evenly arranged on the turntable 21 along the circumferential direction, and each carrier 1 is used to position the ultrasonic sensor housing 201 to be mounted. Specifically, the carrier 1 has a step hole 11 extending along the height direction, and the step hole 11 has an upward step surface, which is used to support the annular flange 205 of the ultrasonic sensor housing 201 to be mounted placed in the step hole 11. The turntable 21 is provided with a through hole 211 penetrating along the height direction at a position corresponding to the step hole 11 of each carrier.

[0026] The turntable driving mechanism 22 is used to drive the turntable 21 to rotate intermittently, so as to drive each carrier 1 to pass through the workstations corresponding to the feeding detection mechanism 3, the thickness measuring mechanism 4, the dispensing mechanism 5, the patch mechanism 6 and the curing mechanism 7 in sequence. In this embodiment, the turntable 21 is annular, the number of carriers 1 is six, and the interval between each two adjacent carriers 1 is 60°. The turntable driving mechanism includes a turntable driving motor 221. Every time the turntable 21 rotates once, a carrier 1 runs into place at each workstation corresponding to the feeding detection mechanism 3, the thickness measuring mechanism 4, the dispensing mechanism 5, the patch mechanism 6 and the curing mechanism 7.

[0027] The feeding detection mechanism 3 is used to detect whether the carrier has received the ultrasonic sensor housing 201 to be mounted, and send the detection result to the electrical control device 9. The feeding detection mechanism 3 includes a first distance sensor 31 and a sensor fixing seat 32; the first distance sensor 31 is arranged above the turntable 21 and fixed on the sensor fixing seat 32, and is used to detect the distance between the first distance sensor 31 and the bottom plate of the ultrasonic sensor housing 201 placed in the step hole 11, compare the distance measurement result with the preset distance range, and send the comparison result to the electrical control device 9. If the preset distance range is not exceeded, it indicates that the carrier 1 has received the ultrasonic sensor housing 201, and if the preset distance range is exceeded, it indicates that the carrier 1 has not received the ultrasonic sensor housing 201. In other embodiments, if the distance sensor itself does not have the function of setting the distance range and comparing the distance measurement result with the preset distance range, the detected distance can be directly sent to the electrical control device 9, and the distance range is set by the electrical control device 9 and the distance measurement result is compared with the preset distance range to obtain the comparison result. In this embodiment, the first distance sensor 31 is an infrared distance sensor.

[0028] The thickness measuring mechanism 4 is used to detect the thickness of the bottom plate 203 of the ultrasonic sensor housing 201, and send the detection result to the electrical control device 9. The thickness measuring mechanism 4 includes a contact displacement sensor 41, a displacement sensor lifting mechanism 42 and a lifting sub-mechanism 43. The contact displacement sensor 41 includes an elastic probe 411 and a displacement sensor 412, and the elastic probe 411 is connected to the displacement sensor 412. The contact displacement sensor 41 is arranged above the turntable 21 and fixed on the displacement sensor fixing seat 44, and is used to detect the displacement amount (the displacement amount is the detected thickness of the bottom plate 203) of the ultrasonic sensor housing acting on the elastic probe 411 to cause the elastic probe 411 to undergo elastic deformation, and compare the detected displacement amount with the preset thickness range, and send the comparison result to the electrical control device 9. If the preset thickness range is not exceeded, it indicates that the ultrasonic sensor housing 201 placed on the carrier 1 meets the requirements, and if the preset thickness range is exceeded, it indicates that the ultrasonic sensor housing 201 placed on the carrier 1 does not meet the requirements, and the ultrasonic sensor housing 201 will no longer be subsequently patched. In other embodiments, if the contact displacement sensor 41 itself does not have the function of setting the thickness range and comparing the detected displacement amount with the preset thickness range, the detected displacement amount can be directly sent to the electrical control device 9, and the thickness range is set by the electrical control device 9 and the detected displacement amount is compared with the preset thickness range to obtain the comparison result. The displacement sensor lifting mechanism 42 is used to drive the contact displacement sensor 41 to rise or fall. The lifting sub-mechanism 43 is arranged below the turntable 21. The lifting sub-mechanism 43 has a push rod that can pass through the through hole 211 and the step hole 11, so as to lift the ultrasonic sensor housing 201 upward. When the ultrasonic sensor housing 201 is not placed in the step hole 11 of the carrier 1, the push rod of the lifting sub-mechanism 43 pushes upward, passes through the through hole 211 and the step hole 11 to a preset reference position, and then the elastic probe 411 of the contact displacement sensor 41 is lowered and just contacts the top of the push rod, which serves as the thickness measurement reference position of the contact displacement sensor 41. After the ultrasonic sensor housing 201 is placed in the step hole 11 of the carrier 1, when the elastic probe 411 is lowered to the aforementioned thickness measurement reference position, the displacement amount of the elastic probe 411 caused by the elastic deformation of the elastic probe 411 caused by the bottom plate 203 of the ultrasonic sensor housing is the thickness of the bottom plate 203.

[0029] In this embodiment, the displacement sensor lifting mechanism 42 includes a lifting electric cylinder 421, and the displacement sensor fixing seat 44 is connected to the lifting electric cylinder 421. The lifting sub-mechanism 43 includes an upper lifting cylinder 431, and the push rod of the upper lifting cylinder 431 constitutes the lifting rod of the lifting sub-mechanism 43.

[0030] The glue dispensing mechanism 5 is used to drop glue on the bottom plate 203 of the ultrasonic sensor housing 201. The glue dispensing mechanism includes a glue dispensing valve 51 and a three-axis displacement mechanism 52. The three-axis displacement mechanism 52 is used to drive the glue dispensing valve 51 to move along the X-axis, Y-axis and Z-axis directions, so that the glue dispensing valve 51 drops glue on the bottom plate 203 of the ultrasonic sensor housing 201.

[0031] In this embodiment, the dispensing valve 51 is fixed to the side of the dispensing valve fixing seat 53 by a positioning pin, ensuring that the consistency of the position will not change after each disassembly and assembly. The dispensing valve 51 includes a valve body and a dispensing pipe. The dispensing valve adopts a piezoelectric dispensing valve, which has the characteristics of high precision, small glue volume and strong stability. The three-axis displacement mechanism 52 includes an X-axis electric cylinder 521, a Y-axis electric cylinder 522 and a Z-axis electric cylinder 523. The Z-axis electric cylinder 523 is fixed to the electric cylinder fixing seat 54, and the dispensing valve fixing seat 53 is fixed below the Z-axis electric cylinder 523 to achieve the Z-axis displacement of the dispensing valve 51. The Z-axis electric cylinder 523 is fixed to the electric cylinder fixing seat 54, and the electric cylinder fixing seat 54 is fixed on the X-axis electric cylinder 521 to achieve the displacement of the dispensing valve in the X-axis direction. The X-axis electric cylinder 521 is fixed on the Y-axis electric cylinder 522, and the Y-axis electric cylinder 522 is fixed above the base 55 to achieve the displacement of the dispensing valve in the Y-axis direction. The dispensing mechanism 5 controls the displacement through the X, Y, and Z three-axis electric cylinders to achieve dispensing of glue on the bottom plate 203 of the ultrasonic sensor housing 201 loaded on the turntable in different positions, ensuring the consistency of the dispensing position of each product; since the dispensing valve has the characteristics of high precision and small glue volume, the consistency of the dispensing glue volume is guaranteed.

[0032] The patch mechanism 6 is used to stick the piezoelectric ceramic sheet 202 on the bottom plate 203 of the ultrasonic sensor housing after glue dispensing. In this embodiment, the patch mechanism 6 can detect the placement direction of the piezoelectric ceramic sheet 202 to be patched, and adjust the placement direction of the piezoelectric ceramic sheet 202 to match the placement direction of the ultrasonic sensor housing 201 in the carrier 1, and stick the piezoelectric ceramic sheet 202 with the adjusted placement direction on the bottom plate 203 of the ultrasonic sensor housing 201 after glue dispensing. The placement direction of the ultrasonic sensor housing 201 in the carrier 1 is realized by the bonding position detection mechanism 8, which detects the placement direction of the ultrasonic sensor housing 201 at the workstation where the patch mechanism is located, and sends the detection result to the electrical control device 9, which is used to control the operation of the bonding position detection mechanism 8.

[0033] The patch mechanism 6 includes a loading platform 61, a material storage tool 62, a ceramic sheet rotating tool 63, a piezoelectric ceramic sheet loading sub-mechanism, a transport sub-mechanism and a bonding sub-mechanism. The piezoelectric ceramic sheet loading sub-mechanism is used to transport the material storage tool placed at the feeding end of the loading platform 61 to the discharging end of the loading platform 61, and to transport the piezoelectric ceramic sheet 202 stored in the material storage tool 62 to a predetermined material picking position. The transport sub-mechanism is used to transport the piezoelectric ceramic sheet 202 placed at the predetermined material picking position to the ceramic sheet rotating tool 63, and detect the placement direction of the piezoelectric ceramic sheet placed in the ceramic sheet rotating tool; the bonding sub-mechanism is used to drive the ceramic sheet rotating tool 63 to rotate, adjust the placement direction of the piezoelectric ceramic sheet 202 to match the placement direction of the ultrasonic sensor housing 201 in the carrier 1, and stick the piezoelectric ceramic sheet 202 with the adjusted placement direction on the bottom plate 203 of the ultrasonic sensor 201 after dispensing.

[0034] The material storage tool 62 includes a base 621 and a material storage tube 622. The lower end of the material storage tube 622 is connected to the base 621. The base 621 is provided with a through hole that penetrates along the height direction of the base at a position corresponding to the central through hole of the material storage tube 622. The central through hole of the material storage tube 622 is used to stack piezoelectric ceramic sheets (the central through hole of the material storage tube 622 is set as a step hole or the through hole of the base 621 is set as a step hole). In some specific embodiments, the piezoelectric ceramic sheet used for the patch is a PZT ceramic sheet.

[0035] The piezoelectric ceramic sheet feeding mechanism includes a pushing assembly 641, a second distance sensor 642 and a lifting component 643. The pushing assembly 641 is used to push the storage tool 62 placed in the feeding end 61a of the loading platform 61 to the discharging end 61b of the loading platform 61; the second distance sensor 642 is arranged above the discharging end 62b of the loading platform, and is used to detect the distance between the second distance sensor 642 and the uppermost piezoelectric ceramic sheet in the storage tube 622, and send the detection result to the electrical control device 9. The lifting component 643 is arranged at the discharging end of the loading platform 61, and is used to lift the uppermost piezoelectric ceramic sheet in the storage tube 622 that reaches the discharging end 642b to a predetermined material taking position.

[0036] In this embodiment, the material storage fixtures 62 are arranged in two rows, and the feeding end 61a of the loading platform 61 and the discharging end 61b of the loading platform 61 are located at the same end (one end) of the loading platform 61. The pushing assembly 641 includes a first pushing cylinder 6411 to a fourth pushing cylinder 6414. The first pushing cylinder 6411 and the second pushing cylinder 6412 respectively control the movement of the material storage fixtures 62 arranged in two rows along the X-axis direction, and the pushing directions of the first pushing cylinder 6411 and the second pushing cylinder 6412 are opposite; the third pushing cylinder 6413 and the fourth pushing cylinder 6414 are respectively arranged at the two ends of the feeding platform 61, and are used to push the material storage fixture 62 to move along the Y-axis direction, and the pushing directions of the third pushing cylinder 6413 and the fourth pushing cylinder 6414 are opposite. The first push cylinder 6411 is used to push the material storage fixture 62 placed at the feeding end 61a to the other end of the loading platform 61 along the longitudinal direction of the first column (positive direction of the X axis). The third push cylinder 6413 pushes the material storage fixture 62 that reaches the other end of the loading platform 61 from the first column to the second column. The second push cylinder 6412 pushes the material storage fixture 62 at the other end of the loading platform 61 and located in the second column to the discharge end 61b of the loading platform 61 along the longitudinal direction of the second column (negative direction of the X axis). The second distance measuring sensor 642 adopts an infrared distance measuring sensor, and the lifting component 643 adopts a lifting electric cylinder. The piezoelectric ceramic piece in the storage tube 622 is pushed upward by the lifting electric cylinder, and the ejection distance is monitored by the infrared distance measuring sensor 642 to control the ejection height, so as to achieve the effect of feeding at all times. When there is no piezoelectric ceramic piece in the storage fixture 62 at the discharge end 62b of the feeding table, the fourth pushing cylinder 6414 starts to operate, and pushes the current storage fixture along the Y-axis direction from the discharge end 61b to the feed end 61a (that is, from the second column back to the first column), and the standby storage fixture is pushed along the X-axis to continue feeding, thereby realizing the function of feeding without stopping the machine.

[0037] The transport sub-mechanism includes a vacuum suction head 651, a suction head displacement mechanism 652 and a first camera 653. The suction head displacement mechanism 652 is used to drive the vacuum suction head 651 to move so as to adsorb the piezoelectric ceramic sheet 202 located at a predetermined material picking position, and place the adsorbed piezoelectric ceramic 202 into the ceramic sheet rotating fixture 63. Among them, the suction head displacement mechanism 652 includes a suction head translation mechanism and a suction head lifting mechanism. The suction head translation mechanism is connected to the suction head lifting mechanism and is used to drive the suction head lifting mechanism to translate; the suction head lifting mechanism is connected to the vacuum suction head 651 and is used to drive the vacuum suction head to rise or fall. The first camera 653 is arranged above the ceramic sheet rotating fixture 63 to detect the placement direction of the piezoelectric ceramic sheet 202 placed in the ceramic sheet rotating fixture 63, and send the detection result to the electrical control device 9.

[0038] In this embodiment, the suction head translation mechanism adopts an X-axis transport cylinder 6521, and the suction head lifting mechanism includes a Z-axis transport cylinder 6522. The X-axis transport cylinder 6521 is fixed in front of the transport base 6523 to realize the function of moving in the X-axis direction, and can be translated from the top of the lifting cylinder 643 to the top of the ceramic piece rotating tooling 63; the Z-axis transport cylinder 6522 is fixed on the X-axis transport cylinder 6521 to realize the function of moving up and down in the Z-axis. The vacuum suction head 651 can adsorb the piezoelectric ceramic sheet 202 by suctioning air; by moving the vacuum suction head 651 above the lifting cylinder 643, the Z-axis transport cylinder 6522 is lowered, and negative pressure is turned on to adsorb the piezoelectric ceramic sheet 202. After the Z-axis transport cylinder 6522 rises, the X-axis transport cylinder 6521 moves the vacuum suction head 651 above the ceramic sheet rotating tooling 63, and the Z-axis transport cylinder 6522 is lowered again. The vacuum suction head 651 uses air blowing to place the piezoelectric ceramic sheet 202 into the ceramic sheet rotating tooling 63.

[0039] The bonding sub-mechanism includes a rotary drive mechanism, a pressure head 662, a pressure sensor 663, a pressure head lifting mechanism and a pressure head translation mechanism. The rotary drive mechanism is used to drive the ceramic sheet rotating fixture 63 to rotate, so as to adjust the placement direction of the piezoelectric ceramic sheet 202 in the ceramic sheet rotating fixture 63 to match the placement direction of the ultrasonic sensor housing 201 in the carrier 1; the pressure head lifting mechanism is connected to the pressure sensor 663, and the pressure sensor 663 is connected to the pressure head 662 to send the pressure detection result to the electrical control device 9; the pressure head translation mechanism is used to drive the pressure head lifting mechanism to translate.

[0040] In this embodiment, the rotary drive mechanism includes a rotary electric cylinder 6611, and the rotating shaft 6612 of the rotary electric cylinder 6611 is connected to the ceramic sheet rotating fixture 63, which can drive the ceramic sheet rotating fixture 63 to rotate. The ceramic sheet rotating fixture 63 is in the shape of a circular tube, and the center hole of the circular tube is a step hole with a step surface facing upward, and the step surface of the step hole is used to support the piezoelectric ceramic sheet 202. The rotating shaft 6612 is provided with a bearing 6613 on the outer sleeve. The pressure head 662 is a Teflon pressure head. The pressure head lifting mechanism includes a Z-axis bonding electric cylinder 6641, and the pressure head translation mechanism includes a Y-axis translation electric cylinder 6651. The Y-axis translation electric cylinder 6651 is fixed on the bonding base 667, and is used for moving in the Y-axis direction of the bonding part to reach the top of the carrier 1. The electric cylinder fixing seat 668 is fixed to the Y-axis translation electric cylinder 6651, and the Z-axis bonding electric cylinder is fixed on the electric cylinder fixing seat 668, and is used for moving in the Z-axis direction of the bonding part. The pressure sensor 663 is fixed under the Z-axis bonding cylinder 6641, and the Teflon pressure head 662 is fixed under the pressure sensor 663. The pressure sensor 663 can detect the bonding pressure when pressing down for bonding, so as to realize the pressure monitoring of the bonding process. At the same time, the Teflon pressure head 662 is used to ensure the softness when contacting the piezoelectric ceramic sheet, thereby greatly protecting the piezoelectric ceramic sheet, avoiding cracks caused by excessive pressure during bonding, and ensuring the consistency of the bonding effect of different parts.

[0041] The curing mechanism 7 is used to perform glue curing on the ultrasonic sensor housing 201 after patching. In this embodiment, the aforementioned glue is UV glue, and the curing mechanism includes an ultraviolet light source 71 and an ultraviolet light source lifting mechanism; the ultraviolet light source 71 is arranged above the turntable 21, and is used to irradiate ultraviolet light on the ultrasonic sensor housing 201 after patching to achieve UV glue curing; the ultraviolet light source lifting mechanism is used to drive the ultraviolet light source 71 to rise or fall. In this embodiment, the ultraviolet light source lifting mechanism includes a light source lifting cylinder 721, and the ultraviolet light source 71 is fixed on the side of the light source lifting cylinder 721.

[0042] The fitting position detection mechanism 8 is used to detect the placement direction of the ultrasonic sensor housing 201 at the workstation where the patch mechanism 6 is located. The fitting position detection mechanism 8 includes a second camera 81 and a second camera translation mechanism. The second camera 81 is arranged above the turntable, and is used to detect the placement direction of the ultrasonic sensor housing at the workstation where the patch mechanism is located, and send the detection result to the electrical control device 9; the second camera translation mechanism is used to drive the second camera 81 to translate. In this embodiment, the second camera translation mechanism includes a translation cylinder 821, which is connected to a camera fixing seat 83, and the second camera 81 is fixed to the camera fixing seat 83.

[0043] The electrical control device 9 is used to control the operation of the turntable driving mechanism 22 , the thickness measuring mechanism 4 , the glue dispensing mechanism 5 , the patch mechanism 6 , the curing mechanism 7 and the bonding position detection mechanism 8 .

[0044] In this embodiment, the electrical control device 9 includes a control switch 91 and a controller 92. The output end of the first distance sensor 31, the output end of the second distance sensor 642, the output end of the contact displacement sensor 41, the output end of the first camera 653, the output end of the second camera 81, the output end of the pressure sensor 663 and the output end of the control switch 91 are respectively connected to the controller 92. The controller 92 is used to control the actions of the turntable drive motor 221, the lifting cylinder 421, the upper cylinder 431, the dispensing valve 51, the three-axis displacement mechanism 52, the push assembly 641, the lifting component 643, the suction head displacement mechanism 652, the rotating cylinder 6611, the Z-axis laminating cylinder 6641, the Y-axis translation cylinder 6651, the light source lifting cylinder 721 and the translation cylinder 821. Optionally, the control switch 91 is a button switch, and the controller 92 is a PLC controller.

[0045] In this embodiment, each carrier 1 is provided with two step holes 11, which can simultaneously accommodate two ultrasonic sensor housings 201 to be mounted. Accordingly, the number of the first distance sensor 31, the second distance sensor 642, the contact displacement sensor 41, the first camera 653, the second camera 81, the pressure sensor 663, the lifting cylinder 421, the upper cylinder 431, the dispensing valve 51, the ceramic sheet rotating tool 63, the material storage tube in the material storage tool 62, the lifting component 643, the rotating cylinder 6611, the pressure head 662, etc. is also set to two groups.

[0046] The working process of the automatic piezoelectric ceramic sheet bonding device according to the embodiment of the utility model is roughly as follows.

[0047] During operation, the first group of ultrasonic sensor housings 201 to be mounted are first placed on the carrier 1 at the corresponding station of the loading detection mechanism 3. The first distance measuring sensor 31 can detect whether the carrier 1 has received the ultrasonic sensor housing 201 to be mounted by detecting the distance between the first distance measuring sensor 31 and the bottom plate of the ultrasonic sensor housing 201 placed in the step hole 11, and comparing the distance measurement result with the preset distance range. If the ultrasonic sensor housing 201 to be mounted is received, after the operator presses the control switch 91 again, the controller 92 will control the turntable drive motor 221 to rotate clockwise, drive the turntable 21 to rotate to the station corresponding to the thickness measuring mechanism 4 and then stop. The push rod of the upper cylinder 431 of the thickness measuring mechanism 4 automatically extends upward, and the ultrasonic sensor housing 201 in the carrier 1 is pushed to the preset reference position, and the lifting electric cylinder 421 drives the contact displacement sensor 41 to descend, and the elastic probe 411 contacts the bottom plate 203 of the ultrasonic sensor housing 201, thereby detecting the thickness of the bottom plate 203. At the same time, another carrier 1 rotates to the workstation corresponding to the feeding detection mechanism 3, and the second group of ultrasonic sensor housings 201 are placed on the carrier 1 at the workstation corresponding to the feeding detection mechanism 3 by manual or mechanical arm feeding, and the aforementioned feeding detection operation is performed. If the contact displacement sensor 41 detects that the thickness of the bottom plate 203 is qualified, the operator presses the control switch 91 again, and the controller 92 controls the turntable drive motor 221 to rotate clockwise, driving the first group of ultrasonic sensor housings 201 to rotate to the workstation corresponding to the dispensing mechanism 5 and then stop. Under the control of the controller 92, the three-axis displacement mechanism 52 automatically drives the dispensing valve 51 to move above the bottom plate 203 along the X-axis, Y-axis and Z-axis directions, and then the controller 92 controls the dispensing valve 51 to drip glue on the bottom plate 203 of the ultrasonic sensor housing 201. When the first set of ultrasonic sensor housings 201 are glued, the second set of ultrasonic sensor housings 201 are rotated to the station corresponding to the thickness measuring mechanism 4 to achieve thickness measurement, and the third set of ultrasonic sensor housings 201 are placed on the carrier 1 at the corresponding station of the feeding detection mechanism 3 by manual or mechanical arm feeding to achieve feeding detection. After the glue is dispensed and the operator presses the control switch 91 again, the controller 92 controls the turntable drive motor 221 to rotate clockwise, driving the first set of ultrasonic sensor housings 201 to rotate to the station corresponding to the patch mechanism 6 and then stop.The controller 92 controls the action of the pushing assembly 641 to push the storage fixture 62 placed at the feed end 61a of the loading platform 61 to the discharge end 61b of the loading platform 61. Then the controller 92 controls the lifting cylinder 643 to lift the piezoelectric ceramic sheet in the storage tube 622 upwards. When the second distance measuring sensor 642 detects that the distance between the second distance measuring sensor 642 and the uppermost piezoelectric ceramic sheet in the storage tube 622 reaches a preset distance threshold (at this time, the predetermined material picking position is reached), the controller 92 controls the lifting cylinder 643 to stop the action, and then controls the suction head displacement mechanism 652 to drive the vacuum suction head 651 to move and adsorb the piezoelectric ceramic sheet 202 located at the predetermined material picking position, and transfer it to the ceramic sheet rotating fixture 63. The first camera 653 can determine the placement direction of the piezoelectric ceramic piece 202 by detecting the image of the piezoelectric ceramic piece 202 in the ceramic piece rotating fixture 63. During this period, the controller 92 will also control the translation cylinder 821 to drive the second camera 81 to translate to the workstation where the patch mechanism 6 is located. The second camera 81 can determine the placement direction of the ultrasonic sensor housing by detecting the image of the ultrasonic sensor housing. The controller determines the rotation angle and rotation direction of the rotary cylinder 6611 based on the detection results of the first camera 653 and the second camera 81, and controls the rotary cylinder 6611 to drive the ceramic piece rotating fixture 63 to rotate according to this rotation angle and rotation direction, so as to adjust the placement direction of the piezoelectric ceramic piece in the ceramic piece rotating fixture 63 to be consistent with the placement direction of the ultrasonic sensor housing in the carrier. Afterwards, the controller 92 controls the Z-axis bonding electric cylinder 6641 and the Y-axis translation electric cylinder 6651 to move, and the pressure head 662 absorbs the piezoelectric ceramic sheet 202 in the ceramic sheet rotating fixture 63, and places it on the bottom plate 203 of the ultrasonic sensor housing in the carrier and presses down. The pressure sensor 663 detects the bonding pressure in real time during the downward bonding and sends the pressure detection value to the controller 92. When the pressure detection value reaches the preset pressure threshold, the controller 92 controls the Z-axis bonding electric cylinder 6641 to stop descending and then rise again to complete the bonding. When the first group of ultrasonic sensor housings are bonded, the second group of ultrasonic sensor housings 201 rotate to the workstation corresponding to the dispensing mechanism 4 to complete the dispensing operation, the third group of ultrasonic sensor housings 201 rotate to the workstation corresponding to the thickness measuring mechanism 4 to perform the thickness measuring operation, and the fourth group of ultrasonic sensor housings 201 are placed on the carrier 1 at the corresponding workstation of the feeding detection mechanism 3 by manual or mechanical arm feeding to achieve feeding detection. After the dispensing is completed and the operator presses the control switch 91 again, the controller 92 controls the turntable drive motor 221 to rotate clockwise, driving the first group of ultrasonic sensor housings 201 to rotate to the position corresponding to the curing mechanism 7 and then stop. Then, the controller 92 controls the light source lifting cylinder 721 to drive the ultraviolet light source 71 to descend, irradiating the ultrasonic sensor housing 201 after the patch with ultraviolet light to achieve UV glue curing.After the irradiation time reaches the predetermined time, the controller 92 controls the light source lifting cylinder 721 to drive the ultraviolet light source 71 to rise and reset. When the first group of ultrasonic sensor shells are solidified, the second group of ultrasonic sensor shells 201 rotate to the station corresponding to the patch mechanism to implement patching, the third group of ultrasonic sensor shells 201 rotate to the station corresponding to the glue dispensing mechanism 4 to complete the glue dispensing operation, the fourth group of ultrasonic sensor shells 201 rotate to the station corresponding to the thickness measuring mechanism 4 to perform the thickness measurement operation, and the fifth group of ultrasonic sensor shells 201 are placed on the carrier 1 of the corresponding station of the feeding detection mechanism 3 by manual or mechanical arm feeding to realize feeding detection. After the curing is completed and the operator presses the control switch 91 again, the controller 92 will control the turntable drive motor 221 to rotate clockwise to the same angle as the previous steps and then stop. At this time, the cured ultrasonic sensor shells 201 can be removed by manual or mechanical arm feeding.

[0048] After the operator presses the control switch 91, the carrier 1 of the ultrasonic sensor housing 201 that is detected as not accepting the patch will also rotate to the next station with the turntable 21, but the controller 92 will control the subsequent thickness measurement mechanism 4, glue dispensing mechanism 5, patch mechanism 6 and curing mechanism 7 not to perform corresponding operations on the carrier 1. Similarly, after the operator presses the control switch 91, the ultrasonic sensor housing 201 that fails the thickness measurement test will also rotate to the next station with the turntable 21, but the controller 92 will control the subsequent glue dispensing mechanism 5, patch mechanism 6 and curing mechanism 7 not to perform corresponding operations on the ultrasonic sensor housing 201.

[0049] Compared with the prior art, the automatic piezoelectric ceramic sheet bonding equipment according to the embodiment of the utility model has a high degree of automation, which not only improves the efficiency of patching, but also has high bonding consistency and high dispensing accuracy, which can meet the needs of large-scale production. By using Teflon pressure head patching, the piezoelectric ceramic sheet after patching is free of cracks.

[0050] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A piezoelectric ceramic sheet automatic bonding device, characterized in that: It includes multiple carriers, turntables, turntable driving mechanisms, feeding detection mechanisms, thickness measuring mechanisms, dispensing mechanisms, patch mechanisms, curing mechanisms and electrical control devices; The plurality of carriers are evenly arranged on the turntable along the circumferential direction, and each carrier is used to position the ultrasonic sensor housing to be mounted, wherein the ultrasonic sensor housing comprises a bottom plate and a peripheral wall portion connected to the peripheral edge of the bottom plate, and the top of the peripheral wall portion has an annular flange protruding in the radial direction; The turntable driving mechanism is used to drive the turntable to rotate intermittently, so as to drive each of the carriers to sequentially pass through the workstations corresponding to the feeding detection mechanism, the thickness measuring mechanism, the dispensing mechanism, the patch mechanism and the curing mechanism; The loading detection mechanism is used to detect whether the carrier has received the ultrasonic sensor housing to be mounted, and send the detection result to the electrical control device; The thickness measuring mechanism is used to detect the thickness of the bottom plate of the ultrasonic sensor housing and send the detection result to the electrical control device; The glue dispensing mechanism is used to drop glue on the bottom plate of the ultrasonic sensor housing; The patch mechanism is used to stick the piezoelectric ceramic sheet on the bottom plate of the ultrasonic sensor housing after glue dispensing; The curing mechanism is used to perform glue curing on the ultrasonic sensor housing after patching; The electrical control device is used to control the operation of the turntable driving mechanism, the thickness measuring mechanism, the glue dispensing mechanism, the patch mechanism and the curing mechanism.

2. The automatic piezoelectric ceramic sheet bonding device according to claim 1, characterized in that: The carrier has a step hole extending in the height direction, and the step hole has an upward step surface, and the step surface is used to support the annular flange of the ultrasonic sensor housing to be mounted placed in the step hole.

3. The automatic piezoelectric ceramic sheet bonding device according to claim 2, characterized in that: The feeding detection mechanism includes a first distance measuring sensor; The first distance measuring sensor is arranged above the turntable to detect the distance between the first distance measuring sensor and the bottom plate of the ultrasonic sensor housing placed in the step hole, compare the distance measurement result with the preset distance range, and send the comparison result to the electrical control device.

4. The automatic piezoelectric ceramic sheet bonding device according to claim 2, characterized in that: The turntable is provided with through holes penetrating in the height direction at positions corresponding to the step holes of each carrier; The thickness measuring mechanism includes a contact displacement sensor, a displacement sensor lifting mechanism and a lifting sub-mechanism; the contact displacement sensor includes an elastic probe, and the contact displacement sensor is arranged above the turntable to detect the displacement amount of the elastic probe caused by the bottom plate of the ultrasonic sensor housing acting on the elastic probe to cause the elastic probe to undergo elastic deformation, compare the detected displacement amount with a preset thickness range, and send the comparison result to the electrical control device; the contact displacement sensor lifting mechanism is used to drive the displacement sensor to rise or fall; the lifting sub-mechanism is arranged below the turntable, and the lifting sub-mechanism has a push rod that can pass through the through hole and the step hole to lift the ultrasonic sensor housing upward.

5. The automatic piezoelectric ceramic sheet bonding device according to claim 1, characterized in that: The dispensing mechanism includes a dispensing valve and a three-axis displacement mechanism, and the three-axis displacement mechanism is used to drive the dispensing valve to move along the X-axis, Y-axis and Z-axis directions so that the dispensing valve drips glue onto the bottom plate of the ultrasonic sensor housing.

6. The automatic piezoelectric ceramic sheet bonding device according to claim 1, characterized in that: The piezoelectric ceramic sheet automatic bonding device includes a bonding position detection mechanism, which is used to detect the placement direction of the ultrasonic sensor housing at the workstation where the bonding mechanism is located, and send the detection result to the electrical control device, which is used to control the operation of the bonding position detection mechanism; The patch mechanism is used to detect the placement direction of the piezoelectric ceramic sheet to be patched, and adjust the placement direction of the piezoelectric ceramic sheet to match the placement direction of the ultrasonic sensor housing in the carrier, and stick the piezoelectric ceramic sheet with the adjusted placement direction on the bottom plate of the ultrasonic sensor after glue dispensing.

7. The automatic piezoelectric ceramic sheet bonding device according to claim 6, characterized in that: The patch mechanism includes a loading platform, a material storage tool, a ceramic sheet rotating tool, a piezoelectric ceramic sheet loading sub-mechanism, a transport sub-mechanism and a bonding sub-mechanism; The piezoelectric ceramic sheet loading mechanism is used to transport the storage tooling placed at the feeding end of the loading platform to the discharging end of the loading platform, and to transport the piezoelectric ceramic sheets stored in the storage tooling to a predetermined material taking position; The transport sub-mechanism is used to transport the piezoelectric ceramic sheet placed at the predetermined material-retrieving position to the ceramic sheet rotating fixture, and detect the placement direction of the piezoelectric ceramic sheet placed in the ceramic sheet rotating fixture; The bonding sub-mechanism is used to drive the ceramic sheet rotating tool to rotate, adjust the placement direction of the piezoelectric ceramic sheet to match the placement direction of the ultrasonic sensor housing in the carrier, and stick the piezoelectric ceramic sheet with the adjusted placement direction on the bottom plate of the ultrasonic sensor housing after glue dispensing.

8. The automatic piezoelectric ceramic sheet bonding device according to claim 7, characterized in that: The material storage tooling comprises a base and a material storage tube, the lower end of the material storage tube is connected to the base, the base is provided with a through hole penetrating along the height direction of the base at a position corresponding to the central through hole of the material storage tube, and the central through hole of the material storage tube is used for stacking piezoelectric ceramic sheets; the piezoelectric ceramic sheet material loading mechanism comprises a material pushing assembly, a second distance measuring sensor and a lifting component; The pushing assembly is used to push the material storage tooling placed at the feeding end of the loading platform to the discharging end of the loading platform; The second distance measuring sensor is arranged above the discharge end of the loading platform, and is used to detect the distance between the second distance measuring sensor and the uppermost piezoelectric ceramic sheet in the material storage tube, and send the detection result to the electrical control device; The lifting component is arranged at the discharge end of the loading platform, and is used to lift the uppermost piezoelectric ceramic sheet in the storage tube that reaches the discharge end to a predetermined material taking position.

9. The automatic piezoelectric ceramic sheet bonding device according to claim 7, characterized in that: The transport sub-mechanism includes a vacuum suction head, a suction head displacement mechanism and a first camera; The suction head displacement mechanism is used to drive the vacuum suction head to move so as to absorb the piezoelectric ceramic sheet located at the predetermined material taking position and place the absorbed piezoelectric ceramic into the ceramic sheet rotating fixture; The first camera is arranged above the ceramic sheet rotating fixture to detect the placement direction of the piezoelectric ceramic sheet placed in the ceramic sheet rotating fixture and send the detection result to the electrical control device.

10. The automatic piezoelectric ceramic sheet bonding device according to claim 7, characterized in that: The bonding sub-mechanism includes a rotation drive mechanism, a pressure head, a pressure sensor, a pressure head lifting mechanism and a pressure head translation mechanism; The rotary drive mechanism is used to drive the ceramic sheet rotary fixture to rotate, so as to adjust the placement direction of the piezoelectric ceramic sheet in the ceramic sheet rotary fixture to be consistent with the placement direction of the ultrasonic sensor housing in the carrier; The pressure head lifting mechanism is connected to a pressure sensor, and the pressure sensor is connected to the pressure head to send the pressure detection result to the electrical control device; the pressure head translation mechanism is used to drive the pressure head lifting mechanism to translate.

11. The automatic piezoelectric ceramic sheet bonding device according to claim 6, characterized in that: The fitting position detection mechanism includes a second camera and a second camera translation mechanism; The second camera is arranged above the turntable, and is used to detect the placement direction of the ultrasonic sensor housing at the workstation where the patch mechanism is located, and send the detection result to the electrical control device; The second camera translation mechanism is used to drive the second camera to translate.

12. The automatic piezoelectric ceramic sheet bonding device according to claim 1, characterized in that: The glue is UV glue, and the curing mechanism includes an ultraviolet light source and an ultraviolet light source lifting mechanism; The ultraviolet light source is arranged above the turntable and is used to irradiate ultraviolet light to the ultrasonic sensor after the patch to achieve UV glue curing; The ultraviolet light source lifting mechanism is used to drive the ultraviolet light source to rise or fall.

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