TFT module aging test assembly

Abstract

The utility model discloses a TFT module aging test assembly comprising a test board and a TFT display module, the test board is provided with a test board interface and a power supply interface, the TFT display module comprises a TFT module mainboard, the TFT module mainboard is provided with a module interface and a module driving IC, the module interface is connected with the test board interface in an inserted manner, and the module driving IC is connected with the test board interface in an inserted manner. The module driving IC comprises a BIST pin, and the BIST pin is electrically connected with the potential setting switch. A program can be used for directly setting the potential setting switch of the module driving IC, the potential setting switch is set to be high potential, the BIST mode of the module driving IC is opened, the module driving IC enters the self-checking mode of the driving chip, the module driving IC sends a signal to the TFT display module for automatic testing, a testing bottom plate is not needed, and convenience and rapidness are achieved. As a test bottom plate is not needed, more test pieces can be placed in the high-temperature box, and the space can be utilized to a greater extent.

Description

Technical Field

[0001] The utility model relates to a TFT module testing tool, more specifically, to a TFT module aging testing component. Background Art

[0002] For TFT modules, especially medium and large-sized TFT modules, some customers will require 100% aging test before shipment. For medium and large-sized (7 inches or above) TFT modules, aging test will generally be carried out by ourselves to screen out defective products before shipment to avoid outflow to customers.

[0003] The existing aging test method is generally to light up the module with a test fixture, then place it in a high-temperature box, run it for 4 hours or other time, and then check the effect. The bottleneck of aging testing is generally the number of high-temperature boxes and the number of test baseboards. In the current test method, two boards are required, namely the test baseboard and the test board, in which the test board is plugged and connected to the TFT module to be tested. At the same time, the test baseboard will take up more space, which seriously restricts the test efficiency.

[0004] Chinese utility model patent document CN211148821U discloses an automatic power on / off aging TFT module device, including a switching power module and a TFT module, the switching power module including a power supply, a microprocessor unit and a relay unit, the output end of the microprocessor unit is electrically connected to the relay unit, the microprocessor unit and the relay unit are respectively connected to the power supply, and the relay unit is connected to the TFT module. The relay unit includes a plurality of relays, the plurality of relays are connected in parallel, the power supply ends of the plurality of relays are respectively connected to VDD, and the signal ends of the plurality of relays are respectively connected to AVDD. The number of the relays is eight. The microprocessor unit includes a chip and a signal output circuit, the chip is connected to the signal output circuit, and the signal output circuit is connected to the plurality of relays. The signal output circuit includes a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor and an eighth resistor, and the first to eighth resistors are respectively connected to the chip. The module device also includes a crystal oscillator circuit, and the crystal oscillator circuit is connected to the chip. The module device includes a reset circuit, and the reset circuit is connected to the chip. The module device comprises an adapter plate, and the adapter plate is connected to the relay unit.

[0005] Obviously, the patent significantly improves the detection rate of aging defects by adding an automatic power-on and power-off mode to impact the circuit with current. The TFT module can work normally without entering the green mode or sleep mode when no one is operating it. During the aging process, the power can be turned on and off regularly. However, this structure cannot solve the existing aging test efficiency problem of TFT modules. Utility Model Content

[0006] Based on this, it is necessary to provide a TFT module aging test component for the above technical problems. The TFT module aging test component includes a test board and a TFT display module. The test board is provided with a test board interface and a power supply interface. The TFT display module includes a TFT module mainboard. The TFT module mainboard is provided with a module interface and a module driver IC. The module interface is plug-connected with the test board interface. The module driver IC includes a BIST pin, and the BIST pin is electrically connected to the potential setting switch. The program can be used to directly set the potential setting switch of the module driver IC, set it to a high potential, turn on the BIST mode of the module driver IC, and the module driver IC enters the self-test mode of the driver chip. The module driver IC sends a signal to the TFT display module for automatic testing. There is no need to test the baseboard, which is convenient and fast. Since there is no need to test the baseboard, more test pieces can be placed in the high temperature box, which can maximize the use of space.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A TFT module aging test component, characterized in that the TFT module aging test component comprises a test board and a TFT display module, the test board is provided with a test board interface and a power supply interface, the TFT display module comprises a TFT module mainboard, the TFT module mainboard is provided with a module interface and a module driver IC, the module interface is plug-connected with the test board interface, the module driver IC comprises a BIST pin, and the BIST pin is electrically connected to a potential setting switch.

[0009] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is arranged inside the module driver IC.

[0010] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is a MOS switch.

[0011] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is arranged on the TFT module mainboard.

[0012] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is a jumper switch.

[0013] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is arranged on the test board, and the BIST pin is connected to one of the pins of the module interface through a connecting line.

[0014] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the potential setting switch is a jumper switch.

[0015] As a preferred implementation of the TFT module aging test assembly provided by the utility model, a status display light is provided on the test board.

[0016] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the status display light is red.

[0017] As a preferred implementation of the TFT module aging test assembly provided by the utility model, the status display light is a high temperature resistant lamp.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The utility model provides a TFT module aging test component. The potential setting switch of the module driver IC can be directly set by a program, and the potential setting switch is set to a high potential, and the BIST mode of the module driver IC is turned on. The module driver IC enters the self-test mode of the driver chip, and the module driver IC sends a signal to the TFT display module for automatic testing. The test base plate is not required, which is convenient and fast. Since the test base plate is not required, more test pieces can be placed in the high temperature box, and the space can be maximized.

[0020] In addition, the potential setting switch can be set on the TFT module mainboard. The potential setting switch is a jumper switch. Since the potential setting switch is set on the TFT module mainboard, the user can use the jumper cap to directly set the potential setting switch to a high potential, turn on the BIST mode of the module driver IC, the module driver IC enters the self-test mode of the driver chip, and the module driver IC sends a signal to the TFT display module for automatic testing, without the need to test the baseboard. Since the voltage is set directly using the jumper cap, the user can intuitively see the voltage setting state at this time, which is safe.

[0021] In addition, the potential setting switch can be set on the test board, and the BIST pin is connected to one of the pins of the module interface through the connection line Q. The potential setting switch is a jumper switch. In addition, a status display light is provided on the test board. The status display light is red. The status display light is a high temperature resistant light. Since the potential setting switch is set on the test board, it does not occupy the space on the TFT display module. The status display light can be used to display the current potential state of the potential setting switch in real time, which is eye-catching and intuitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the connection structure of the TFT module aging test assembly of the utility model;

[0024] Figure 2 This is a schematic diagram of the connection structure of the TFT module aging test assembly of the utility model, which is another implementation method;

[0025] Figure 3 This is a schematic diagram of the connection structure of the TFT module aging test assembly of the utility model, which is another implementation method;

[0026] The markings in the figure are as follows:

[0027] 1. Test board; 11. Test board interface; 12. Power interface; 13. Status indicator light; 2. TFT display module; 20. Module driver IC; 200. TFT module mainboard; 21. Module interface; Q. Connection wiring; S. Potential setting switch. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0029] As described in the background technology, in the prior art, for TFT modules, especially medium and large-sized TFT modules, some customers will require 100% aging testing before shipment. For medium and large-sized (7 inches or above) TFT modules, aging tests are generally performed by themselves to screen out defective products before shipment to avoid outflow to the client. The existing aging test method is generally to light up the module with a test fixture, and then place it in a high-temperature box, run for 4 hours or other time, and then check the effect. The bottleneck of aging testing is generally the number of high-temperature boxes and the number of test baseboards. In the current testing method, two boards are required, namely the test baseboard and the test board, wherein the test board is plugged and connected to the TFT module to be tested. At the same time, the test baseboard will take up more space, which seriously restricts the test efficiency.

[0030] In order to solve this technical problem, the utility model provides a TFT module aging test component, including a test board 1 and a TFT display module 2, the test board 1 is provided with a test board interface 11 and a power interface 12, the TFT display module 2 includes a TFT module mainboard 200, the TFT module mainboard 200 is provided with a module interface 21 and a module driver IC20, the module interface 21 is plug-connected with the test board interface 11, the module driver IC20 includes a BIST pin 201, and the BIST pin 201 is electrically connected to the potential setting switch S.

[0031] Through the above structural design, the potential setting switch S of the module driver IC20 can be directly set by the program, set to a high potential, turn on the BIST mode of the module driver IC20, and the module driver IC20 enters the self-test mode of the driver chip. The module driver IC20 sends a signal to the TFT display module 2 for automatic testing, and does not require a test base plate, which is convenient and fast. Since there is no need for a test base plate, more test pieces can be placed in the high temperature box, which can maximize the use of space.

[0032] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] like Figure 1 As shown, the TFT module aging test component includes a test board 1 and a TFT display module 2, the test board 1 is provided with a test board interface 11 and a power interface 12, the TFT display module 2 includes a TFT module mainboard 200, the TFT module mainboard 200 is provided with a module interface 21 and a module driver IC 20, the module interface 21 is plug-connected with the test board interface 11, the module driver IC 20 includes a BIST pin 201, and the BIST pin 201 is electrically connected to the potential setting switch S.

[0036] It should be noted that the potential setting switch S is disposed inside the module driving IC 20. The potential setting switch S is a MOS switch.

[0037] The working mode of this embodiment is described below.

[0038] The program can be used to directly set the potential setting switch S of the module driver IC20, set it to a high potential, turn on the BIST mode of the module driver IC20, and the module driver IC20 enters the self-test mode of the driver chip. The module driver IC20 sends a signal to the TFT display module 2 for automatic testing, and there is no need to test the base plate, which is convenient and fast. Since there is no need to test the base plate, more test pieces can be placed in the high temperature box, which can maximize the use of space.

[0039] like Figure 2 As shown, the TFT module aging test assembly provided in Example 1 is further optimized. Specifically, the potential setting switch S is set on the TFT module mainboard 200.

[0040] It should be noted that the potential setting switch S is a jumper switch.

[0041] The working mode of this embodiment is described below.

[0042] Since the potential setting switch S is set on the TFT module mainboard 200, the user can use the jumper cap to directly set the potential setting switch S to a high potential, turn on the BIST mode of the module driver IC 20, the module driver IC 20 enters the self-test mode of the driver chip, and the module driver IC 20 sends a signal to the TFT display module 2 for automatic testing, without the need to test the baseboard. Since the voltage is set directly using the jumper cap, the user can intuitively see the voltage setting state at this time, which is safe.

[0043] like Figure 3 As shown, the TFT module aging test component provided in Example 2 is further optimized. Specifically, the potential setting switch S is set on the test board 1, and the BIST pin 201 is connected to one of the pins of the module interface 21 through the connecting line Q.

[0044] It should be noted that the potential setting switch S is a jumper switch.

[0045] In addition, a status display light 13 is provided on the test board 1. The status display light 13 is red and is a high temperature resistant light.

[0046] The working mode of this embodiment is described below.

[0047] Since the potential setting switch S is set on the test board 1, the user can use a jumper cap to directly set the potential setting switch S to a high potential. Then, the wiring Q is connected to make the BIST pin 201 a high potential, and the BIST mode of the module driver IC20 is turned on. The module driver IC20 enters the self-test mode of the driver chip, and the module driver IC20 sends a signal to the TFT display module 2 for automatic testing, without the need to test the baseboard.

[0048] Since the potential setting switch S is arranged on the test board 1, it does not occupy the space on the TFT display module 2. The state display light 13 can display the current potential state of the potential setting switch S in real time, which is eye-catching and intuitive.

[0049] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A TFT module aging test assembly, characterized in that: The TFT module aging test assembly comprises a test board (1) and a TFT display module (2); the test board (1) is provided with a test board interface (11) and a power interface (12); the TFT display module (2) comprises a TFT module mainboard (200); the TFT module mainboard (200) is provided with a module interface (21) and a module driver IC (20); the module interface (21) is plug-connected to the test board interface (11); the module driver IC (20) comprises a BIST pin (201); and the BIST pin (201) is electrically connected to a potential setting switch (S).

2. The TFT module aging test assembly according to claim 1, characterized in that: The potential setting switch (S) is arranged inside the module driver IC (20).

3. The TFT module aging test assembly according to claim 2, characterized in that: The potential setting switch (S) is a MOS switch.

4. The TFT module aging test assembly according to claim 1, characterized in that: The potential setting switch (S) is arranged on the TFT module mainboard (200).

5. The TFT module aging test assembly according to claim 4, characterized in that: The potential setting switch (S) is a jumper switch.

6. The TFT module aging test assembly according to claim 1, characterized in that: The potential setting switch (S) is arranged on the test board (1), and the BIST pin (201) is connected to one of the pins of the module interface (21) via a connecting line (Q).

7. The TFT module aging test assembly according to claim 6, characterized in that: The potential setting switch (S) is a jumper switch.

8. The TFT module aging test assembly according to claim 1, characterized in that: The test board (1) is provided with a status display light (13).

9. The TFT module aging test assembly according to claim 8, characterized in that: The status display light (13) is red.

10. The TFT module aging test assembly according to claim 9, characterized in that: The status display lamp (13) is a high temperature resistant lamp.

Images